CN219626479U

CN219626479U - Ceramic capacitor

Info

Publication number: CN219626479U
Application number: CN202320622470.6U
Authority: CN
Inventors: 倪天伟; 刘华艳; 王志祥
Original assignee: Hunan Jingwei Electronic Technology Co ltd
Current assignee: Hunan Jingwei Electronic Technology Co ltd
Priority date: 2023-03-27
Filing date: 2023-03-27
Publication date: 2023-09-01
Anticipated expiration: 2033-03-27

Abstract

The utility model discloses a ceramic capacitor, which belongs to the field of ceramic capacitors and comprises a ceramic chip, two silver electrodes, two metal wires and an epoxy resin encapsulation layer, wherein the two silver electrodes are respectively arranged at two ends of the ceramic chip, and the two metal wires are respectively welded with the corresponding silver electrodes. The periphery of the ceramic chip and the two silver electrodes are coated with a heat shrinkage film, and the epoxy resin encapsulation layer is coated on the whole periphery of the heat shrinkage film and one end part of the two metal wires. The heat shrinkage film is coated on the peripheries of the ceramic chip and the silver electrode in the ceramic capacitor, and the heat shrinkage film can shrink under a certain temperature atmosphere, so that the heat shrinkage film is tightly attached to the outer walls of the ceramic chip and the silver electrode, the waterproof effect is achieved, and the ceramic capacitor hardly occupies extra space and has no influence on the performance of the ceramic capacitor. The process of peripheral cladding and heating is simple to operate and low in production cost.

Description

Ceramic capacitor

Technical Field

The utility model belongs to the field of ceramic capacitors, and particularly relates to a ceramic capacitor.

Background

Ceramic capacitors are capacitors using ceramics as dielectrics, and various processing forms are derived according to different application scenes. The most widely used ceramic capacitor is that a silver electrode is attached to two sides of a ceramic chip, each silver electrode is welded with a metal lead, the outside is solidified by an epoxy resin encapsulation layer to form a shell, and the parts of the two metal leads outside the epoxy resin encapsulation layer are connected with circuits or other elements when the circuits are assembled.

Due to the material characteristics of the epoxy resin, a plurality of through air holes can be remained after curing, the epoxy resin is easy to wet after long-term aging, and water vapor cannot be blocked from entering the internal ceramic chip, so that the insulation resistance of the ceramic capacitor is reduced, the withstand voltage is poor, and the two silver electrodes can be completely short-circuited when serious, so that the capacitor breaks down.

Disclosure of Invention

The utility model aims to provide a ceramic capacitor, which solves the problem that the capacitor is easy to be wetted due to insufficient sealing performance of an external epoxy resin encapsulation layer of the ceramic capacitor in the prior art.

Provided is a ceramic capacitor including:

the device comprises a ceramic chip, two silver electrodes, two metal wires and an epoxy resin encapsulation layer, wherein the two silver electrodes are respectively arranged at two ends of the ceramic chip, and the two metal wires are respectively welded with the corresponding silver electrodes;

the periphery of the ceramic chip and the two silver electrodes are coated with a heat shrinkage film, and the epoxy resin encapsulation layer is coated on the whole periphery of the heat shrinkage film and one end part of the two metal wires.

Further, the heat-shrinkable film is a PE heat-shrinkable film or a PET heat-shrinkable film.

Further, the heat shrinkage film is arranged at the contact part of the two metal wires and the epoxy resin encapsulation layer, and extends out of the exposed part of the two metal wires by 0.5 mm-1.5 mm.

Further, an electronic potting adhesive layer is arranged on the part, extending out of the epoxy resin encapsulation layer, of the heat shrinkage film.

Further, the coating thickness of the heat shrinkage film is 30-60 microns.

Further, the number of coating layers of the heat shrinkage film is 2-4.

Compared with the prior art, the utility model has the beneficial effects that:

the heat shrinkage film is coated on the peripheries of the ceramic chip and the silver electrode in the ceramic capacitor, and the heat shrinkage film can shrink under a certain temperature atmosphere, so that the heat shrinkage film is tightly attached to the outer walls of the ceramic chip and the silver electrode, the waterproof effect is achieved, and the ceramic capacitor hardly occupies extra space and has no influence on the performance of the ceramic capacitor. The process of peripheral cladding and heating is simple to operate and low in production cost.

Drawings

The present utility model is further described below with reference to the accompanying drawings for the convenience of understanding by those skilled in the art.

Fig. 1 is a schematic diagram of the overall structure of a ceramic capacitor.

In the figure: 1. a ceramic chip; 2. a silver electrode; 3. a metal wire; 4. an epoxy encapsulating layer; 5. a heat-shrinkable film; 6. an electronic potting adhesive layer.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the particular embodiments described herein are illustrative only and are not intended to limit the utility model, i.e., the embodiments described are merely some, but not all, of the embodiments of the utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are intended to be within the scope of the present utility model.

Referring to fig. 1, in an embodiment of the present utility model, a ceramic capacitor includes a ceramic chip 1, two silver electrodes 2, two metal wires 3 and an epoxy encapsulation layer 4, wherein the two silver electrodes 2 are respectively disposed at two ends of the ceramic chip 1, and the two metal wires 3 are respectively welded with the corresponding silver electrodes 2. The periphery of the ceramic chip 1 and the two silver electrodes 2 are coated with a heat shrinkage film 5, and the whole periphery of the heat shrinkage film 5 and one end part of the two metal wires 3 are coated with an epoxy resin encapsulation layer 4.

The heat-shrinkable film 5 is a film which has a shrinking effect in a high temperature state, and after being coated on the surface of an object and heated, the whole heat-shrinkable film 5 shrinks, the film maintains the body state by the toughness of the film without tearing, and the object can be tightly wrapped after the shrinkage. The heat shrinkage film 5 has certain waterproof performance and can effectively keep the ceramic chip 1 and the silver electrode 2 dry. The heat-shrinkable film 5 has good bonding with the epoxy resin and high sealing property of connection.

The heat-shrinkable film 5 is a PE heat-shrinkable film or a PET heat-shrinkable film, has better waterproof effect compared with other shrink films, has the characteristics of dampproof property, high toughness, high shrinkage rate and the like, and has mature processing technology and higher popularization rate.

The heat shrink film 5 is arranged at the contact part of the two metal wires 3 and the epoxy resin encapsulation layer 4, and extends out of the exposed part of the two metal wires 3 by 0.5 mm-1.5 mm. With this arrangement, moisture can be prevented from entering from the connection portion of the metal wire 3 and the silver electrode 2, since there is a welded portion between the metal wire 3 and the silver electrode 2. And there is typically no protection between the exposed portion of the metal wire 3 and the epoxy encapsulating layer 4 from where moisture is more likely to enter. Therefore, the heat-shrinkable film 5 needs to extend 0.5mm to 1.5mm beyond the exposed portions of the two metal wires 3, and the heat-shrinkable film 5 is ensured to be airtight without interfering with the connection of the metal wires 3 with other elements.

Further, the electronic potting adhesive layer 6 is arranged at the part of the heat-shrinkable film 5 extending out of the epoxy resin encapsulation layer 4, so that the sealing performance of the heat-shrinkable film 5 is further enhanced, and the heat-shrinkable film 5 is prevented from aging and losing efficacy when exposed to air. The electronic pouring sealant used by the electronic pouring sealant 6 has dampproof and anti-corrosion properties and vibration-proof functions, and can enhance the connectivity between the heat shrinkage film 5 and the metal wire 3 and prevent the falling off.

The coating thickness of the thermal shrinkage film 5 is 30-60 micrometers, so that the thermal shrinkage film 5 has enough thickness to keep moisture resistance, and meanwhile, the advantage of small volume per se is lacking because the volume of the ceramic capacitor is prevented from increasing too much.

The number of coating layers of the heat shrinkage film 5 is 2-4, so that the loss of moisture-proof capability after the single-layer heat shrinkage film 5 is damaged is avoided. The thickness of the single-layer heat-shrinkable film 5 may be as small as possible, and may be 15 to 30. Mu.m.

The foregoing is merely illustrative of the structures of this utility model and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the utility model or from the scope of the utility model as defined in the accompanying claims.

Claims

1. A ceramic capacitor, comprising: the ceramic chip (1), two silver electrodes (2), two metal wires (3) and an epoxy resin encapsulation layer (4), wherein the two silver electrodes (2) are respectively arranged at two ends of the ceramic chip (1), and the two metal wires (3) are respectively welded with the corresponding silver electrodes (2);

the periphery of the ceramic chip (1) and the two silver electrodes (2) are coated with a heat shrinkage film (5), and the epoxy resin encapsulation layer (4) is coated on the whole periphery of the heat shrinkage film (5) and one end part of the two metal wires (3).

2. Ceramic capacitor according to claim 1, characterized in that the heat-shrinkable film (5) is a PE heat-shrinkable film or a PET heat-shrinkable film.

3. A ceramic capacitor according to claim 1, wherein the heat-shrinkable film (5) is provided at a contact portion of the two metal wires (3) with the epoxy resin encapsulating layer (4), and extends from 0.5mm to 1.5mm at an exposed portion of the two metal wires (3).

4. A ceramic capacitor according to claim 3, characterized in that the part of the heat shrink film (5) extending beyond the epoxy encapsulating layer (4) is provided with an electronic potting adhesive layer (6).

5. A ceramic capacitor according to claim 1, characterized in that the coating thickness of the heat-shrinkable film (5) is 30-60 μm.

6. A ceramic capacitor according to claim 5, characterized in that the number of coating layers of the heat-shrinkable film (5) is 2-4.