CN219625856U - Radiating structure of projection equipment and projection equipment - Google Patents

Abstract

The utility model provides a radiating structure of projection equipment and the projection equipment, and relates to the technical field of projection equipment. The heat radiation structure of the projection device can improve the heat radiation efficiency of the heating element in the projection device under the condition of not increasing the volume of the projection device. The heat radiation structure of the projection device includes: the heat transfer element is connected with the heat transfer element, and the heat transfer element is used for being abutted with a heating element in the projection equipment, and can be cooled through the heat transfer element so as to cool the heating element in the projection equipment. The heat dissipation structure of the projection device is used in the projection device.

Description

Radiating structure of projection equipment and projection equipment

Technical Field

The present disclosure relates to projection devices, and particularly to a heat dissipation structure for a projection device.

Background

As projection devices have evolved toward miniaturization and intellectualization, demands for structural space of projection devices have become increasingly stringent. Meanwhile, increasing the brightness of the projection device is also an important research direction, and increasing the brightness requires increasing the power density and increasing the heat carrying capacity of the optical devices in the projection device.

Digital light processing (Digital Light Processing, DLP) techniques are to digitally process an image signal and then project the processed light. The DLP technology is a technology for implementing a digital optical process using a digital micromirror element (Digital Micromirror Device, DMD) to accomplish visual digital information display through the DMD. The DMD is an array of high-speed digital light reflecting mirrors, and is specifically composed of a plurality of small aluminum mirrors, the number of which is determined by the display resolution, and one aluminum mirror corresponds to one pixel. When the DMD works, an object is imaged on the DMD, and each image point is scanned onto the detector in sequence through the controllable characteristic of the pixel level of the DMD and the high-speed turnover frequency of the DMD, so that the high-speed passive point scanning imaging of the object under the condition of visible light is realized.

With the increase in brightness of projection devices, the heat dissipation of the DMD becomes a large bottleneck point. In the related art, the problem of heat dissipation of the DMD is solved by providing a fan to the DMD. However, the provision of a fan in the projection device increases costs on the one hand and requires a certain space volume on the other hand, which is disadvantageous for the miniaturization of the projection device.

Disclosure of Invention

The utility model provides a heat radiation structure of a projection device and the projection device, which can improve the heat radiation efficiency of a heating element in the projection device under the condition of not increasing the volume of the projection device.

In one aspect, the present utility model provides a heat dissipation structure of a projection device, including: the projection equipment comprises a heat transfer element and a heat conduction element, wherein the heat transfer element is used for conducting heat generated by a heating element in the projection equipment and is provided with a containing cavity; the heat conducting piece is provided with a connecting section matched with the accommodating cavity, the connecting section is inserted into the accommodating cavity and connected with the heat conducting piece, and the heat conducting piece is used for cooling the heat conducting piece.

According to the radiating structure of the projection equipment, due to the fact that the heat transfer element is arranged, heat generated by the heat element can be conducted by the heat transfer element in a mode of abutting the heat transfer element with the heat element in the projection equipment, so that the heat element is radiated and cooled; and be provided with the holding chamber on the heat transfer piece, can insert the holding intracavity with the linkage segment on the heat transfer piece, with linkage segment and heat transfer piece with embedded mode connection, make the heat transfer piece extend to the heat transfer piece inside, can reduce the thermal resistance between heat transfer piece and the heat transfer piece, thereby can reduce the thermal resistance between heating element and the heat transfer piece, in the in-process of cooling down the heat transfer piece through the heat transfer piece, can reduce the temperature of heat transfer piece fast, with the temperature of reducing heating element fast, and need not increase other direct or indirectly to heat dissipation cooling's element, also need not increase projection equipment's volume. Therefore, the heat radiation structure of the projection device provided by the embodiment of the utility model can improve the heat radiation efficiency of the heating element in the projection device without increasing the volume of the projection device.

In one possible implementation of the utility model, the heat transfer element comprises a protrusion, on which a receiving cavity is formed, through which the heat transfer element abuts against the heating element.

In one possible embodiment of the utility model, the wall thickness of the projection in the axial direction of the receiving space is 0.4mm or less.

In one possible implementation of the utility model, the heat transfer element further comprises a fixing portion connected to the protruding portion and located at an end of the protruding portion near the opening of the accommodating cavity.

In one possible implementation of the utility model, the fixing portion has a fixing hole thereon, and the heat transfer member is fixed in the projection apparatus through the fixing hole.

In one possible embodiment of the utility model, the connecting section is fixedly connected to the receiving space by welding.

In one possible implementation of the utility model, the connecting section is integrally formed with the receiving chamber.

In one possible implementation of the present utility model, the heat conducting member includes a heat pipe, the heat pipe includes a housing and a wick located in the housing, and a distance between the wick and an inner wall of the accommodating cavity is 1mm or less.

In another aspect, the present utility model provides a projection apparatus comprising: the light modulator and the heat radiation structure of the projection device provided by any one of the above, wherein the light modulator is used for modulating the light field distribution of the light rays; the heat transfer member abuts against the optical modulator.

In one possible implementation manner of the present utility model, the projection device further includes a heat dissipation member, and an end of the heat conduction member away from the connection section is connected to the heat dissipation member, where the heat dissipation member is used for cooling the heat conduction member.

The projection equipment provided by the utility model has the same technical effect as the heat radiation structure of the projection equipment, namely, the heat conduction piece and the heat transfer piece are connected in an embedded mode, so that the heat radiation efficiency of the heating element in the projection equipment can be improved under the condition of not increasing the volume of the projection equipment.

Drawings

FIG. 1 is a schematic diagram of a heat dissipation structure of a projection device according to the present utility model;

FIG. 2 is a schematic diagram of a heat dissipation structure of a projection device according to the present utility model;

FIG. 3 is a cross-sectional view of a heat dissipating structure of a projection device provided by the present utility model;

FIG. 4 is an assembly diagram of a heat dissipating structure of a projection device according to the present utility model;

FIG. 5 is a schematic diagram showing the heat distribution of a heat dissipation structure of a projection apparatus according to the related art;

FIG. 6 is an enlarged view of a portion A of FIG. 5;

FIG. 7 is a schematic diagram showing the heat distribution of a heat dissipation structure of a projection device according to the present utility model;

FIG. 8 is an enlarged view of a portion B of FIG. 7 in accordance with the present utility model;

FIG. 9 is an assembly diagram of a heat dissipating structure of a projection device according to the present utility model;

FIG. 10 is a partial cross-sectional view of a heat dissipating structure of a projection device provided by the present utility model;

FIG. 11 is a schematic diagram illustrating a heat distribution of a heat dissipation structure of a projection device according to the present utility model;

fig. 12 is an enlarged view of a portion C of fig. 11 provided by the present utility model.

Reference numerals illustrate:

1-a heat transfer element; 11-a boss; 111-a receiving cavity; 12-a fixing part; 121-fixing holes; 2-a heat conducting member; 21-a connecting segment; 22-a cooling section; 3-a heat sink; 31-connecting holes; 32-fixing lugs; 4-heating element.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the specific technical solutions of the present utility model will be described in further detail below with reference to the accompanying drawings in the embodiments of the present utility model. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.

In embodiments of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

Furthermore, in the embodiments of the present utility model, the terms "upper," "lower," "left," and "right," etc., are defined with respect to the orientation in which the components in the drawings are schematically disposed, and it should be understood that these directional terms are relative terms, which are used for descriptive and clarity with respect to each other, and which may vary accordingly with respect to the orientation in which the components in the drawings are disposed.

In embodiments of the present utility model, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, and for example, "connected" may be either a fixed connection, a removable connection, or an integral unit; can be directly connected or indirectly connected through an intermediate medium.

In embodiments of the present utility model, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In embodiments of the utility model, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." in an embodiment of the present utility model is not to be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

An embodiment of the present utility model provides a heat dissipation structure of a projection device, and referring to fig. 1 and fig. 2, fig. 1 and fig. 2 are schematic diagrams of the heat dissipation structure of the projection device provided by the present utility model. The heat radiation structure of the projection device includes: a heat transfer member 1 and a heat conduction member 2, wherein the heat transfer member 1 is used for conducting heat generated by a heating element in the projection apparatus, and a receiving chamber 111 is provided on the heat transfer member 1; the heat conducting piece 2 is provided with a connecting section 21 matched with the accommodating cavity 111, the connecting section 21 is inserted into the accommodating cavity 111 and connected with the heat conducting piece 1 so as to connect the heat conducting piece 2 and the heat conducting piece 1 in an embedded mode, and heat conducted from the heating element to the heat conducting piece 1 is conducted to other positions through the heat conducting piece 2, so that the heat conducting piece 2 cools the heat conducting piece 1.

According to the heat radiation structure of the projection equipment, due to the fact that the heat transfer element 1 is arranged, heat generated by the heat element can be conducted by the heat transfer element 1 in a mode that the heat transfer element 1 is abutted against the heat element in the projection equipment, so that the heat of the heat element can be radiated and cooled; and be provided with the holding chamber 111 on heat transfer piece 1, can insert the linkage segment 21 on the heat conduction piece 2 in holding chamber 111, with linkage segment 21 and heat transfer piece 1 with embedded mode connection, make heat conduction piece 2 extend to heat transfer piece 1 inside, can reduce the thermal resistance between heat conduction piece 2 and the heat transfer piece 1, thereby can reduce the thermal resistance between heating element and the heat conduction piece 2, in the in-process of cooling down heat transfer piece 1 through heat conduction piece 2, can reduce the temperature of heat transfer piece 1 fast, in order to reduce the temperature of heating element fast, and need not increase other direct or indirect cooling down elements that dispel the heat to the heating element, just does not need to increase projection equipment's volume yet. Therefore, the heat radiation structure of the projection device provided by the embodiment of the utility model can improve the heat radiation efficiency of the heating element in the projection device without increasing the volume of the projection device.

In some possible implementations, referring to fig. 3, fig. 3 is a cross-sectional view of a heat dissipation structure of a projection device provided by the present utility model. As shown in fig. 2 and 3, the heat transfer member 1 includes a boss 11, a receiving cavity 111 is formed on the boss 11, and the heat transfer member 1 abuts against a heat generating element in the projection apparatus through the boss 11 to conduct heat generated by the heat generating element.

For example, in the case where the heat generating element in the projection apparatus is a light modulator, the light modulator may employ a digital micromirror element (Digital Micromirror Device, DMD), and the boss 11 may be provided in a structure in which the boss 11 is adapted to an abutment surface on the DMD. For example, the protruding portion 11 is provided in the form of a quadrangular prism in which the accommodating chamber 111 is formed, the accommodating chamber 111 may be formed in the form of a circular blind hole, and correspondingly, the connection section 21 of the heat conductive member 2 is provided as a cylindrical section adapted to the circular blind hole, and the cylindrical section is inserted into the circular blind hole to connect the heat conductive member 2 and the heat conductive member 1.

As another example, in order to reduce the thermal resistance between the connection section 21 and the receiving chamber 111, the connection section 21 and the receiving chamber 111 may be fixed by welding. For example, the connecting section 21 and the accommodating chamber 111 are fixed by soldering using solder paste. Through the mode of brazing, the molten liquid brazing filler metal can be filled in the tiny gap between the connecting section 21 and the accommodating cavity 111, so that the connecting area between the connecting section 21 and the accommodating cavity 111 can be increased, the gap between the connecting section 21 and the accommodating cavity 111 is reduced, the heat conducting performance between the protruding part 11 and the connecting section 21 can be improved, and the heat radiating efficiency of the heat radiating structure of the projection equipment to the heating element can be improved.

When the heat radiation structure of the projection device is used, the end face of the protruding portion 11 is abutted against the DMD along the axial direction of the accommodating cavity 111 so as to conduct heat generated by the DMD to the protruding portion 11, and the protruding portion 11 is cooled by the heat conducting piece 2 in the accommodating cavity 111 on the protruding portion 11 so as to radiate and cool the DMD.

As yet another example, the wall thickness of the boss 11 may be processed to a thickness of 0.4mm or less in the axial direction of the accommodation chamber 111. For example, the heat transfer member 1 may be manufactured using a copper material, and the machining feed amount of the machine tool may be controlled so that the bottom wall thickness of the boss 11 is at least equal to 0.4mm or thinner than 0.4mm when the accommodating chamber 111 is manufactured on the copper block. In this way, when the boss 11 abuts against the heat generating element in the projection apparatus, the distance between the accommodating chamber 111 and the heat generating element is only 0.4mm, or the distance therebetween is smaller, that is, the distance between the heat conducting member 2 located in the accommodating chamber 111 and the heat generating element can be made smaller, so that the thermal resistance between the heat conducting member 2 and the heat generating element can be reduced better. After the heat generated by the heating element is conducted to the protruding portion 11, the temperature of the protruding portion 11 is increased, and meanwhile the heat conducting member 2 cools the heat conducting member 1, so that the heat generated by the heating element can be conducted to the protruding portion 11 rapidly and continuously. By setting the thickness of the bottom wall of the boss 11 to 0.4mm or less, the thermal resistance between the heating element and the heat conductive member 2 can be reduced, and the heat radiation efficiency of the heating element can be improved.

In this embodiment, since the accommodating cavity 111 is provided in the boss 11 abutting against the heat generating element on the heat transfer element 1, the connection section 21 of the heat conducting element 2 can be inserted into the accommodating cavity 111, so that the thickness of the heat transfer element 1 between the heat conducting element 2 and the heat generating element can be reduced, the thermal resistance between the heat conducting element 2 and the heat generating element can be reduced, and the conduction efficiency of heat generated by the heat generating element to the heat conducting element 2 through the heat conducting element 1 can be improved in the process of cooling the heat conducting element 2, and the heat dissipation efficiency of the heat dissipation structure of the projection device to the heat generating element in the projection device can be improved.

Referring to fig. 4, fig. 4 is an assembly diagram of a heat dissipation structure of a projection device according to the present utility model. As shown in fig. 1, 2 and 4, in order to facilitate the fixed connection of the heat transfer member 1, a fixing portion 12 may be provided on the heat transfer member 1, the fixing portion 12 is connected to the boss 11, and the fixing portion 12 is located at an end of the boss 11 near the opening of the accommodating chamber 111.

Illustratively, the fixing portion 12 may be formed to extend from a side wall of the boss 11, the thickness of the fixing portion 12 is smaller than that of the boss 11 in the axial direction of the accommodating chamber 111, and the fixing portion 12 is located at an end of the boss 11 near the opening of the accommodating chamber 111.

As another example, the protruding portion 11 may be formed to protrude from one side wall surface of the fixing portion 12, and the accommodating chamber 111 may be formed to extend into the protruding portion 11 from the other side wall surface of the fixing portion 12. The embodiment of the present utility model is not limited to the manner of forming the boss 11 and the fixing portion 12.

As yet another example, at least one fixing hole 121 may be provided on the fixing portion 12, and an axial direction of each fixing hole 121 coincides with an axial direction of the receiving chamber 111. The fixing hole 121 may be provided as a countersunk hole so that a screw may be used, through which the heat transfer member 1 is fixed at a position corresponding to the heating element in the projection apparatus.

Referring to fig. 5 and 6, fig. 5 is a heat distribution simulation view of a heat radiation structure of a projection apparatus in the related art, and fig. 6 is a partial enlarged view of a portion a in fig. 5. In the related art, the surface of the heat conductive member 2 is connected to the surface of the fixing portion 12 of the heat transfer member 1, that is, the heat conductive member 2 and the heat transfer member 1 are connected in an abutting manner. The convex part 11 on the heat transfer element 1 is abutted with the heating element 4, and the heat conducted to the convex part 11 by the heating element 4 is conducted to the fixed part 12 through the whole convex part 11 and then is conducted to the heat conducting element 2 by the fixed part 12, so that the heat conduction path between the heating element 4 and the heat conducting element 2 is longer. As shown in fig. 5 and 6, when the temperature of the heating element 4 is 55.7 ℃, the temperature of the portion of the boss 11 abutting against the heating element 4 is 36.9 ℃, the temperature of the portion of the boss 11 connected to the fixing portion 12 is 36 ℃, and the temperature of the fixing portion 12 connected to the heat conductive member 2 is 34.2 ℃, so that the temperature difference only across the heat conductive member 1 is 2.7 ℃, so that after the heat conductive member 2 cools down the heat conductive member 1, the efficiency of heat dissipation and cooling down of the heating element 4 by the heat conductive member 1 is relatively low, and the heat generated by the heating element 4 cannot be conducted to the heat conductive member 2 at a faster speed across the heat conductive member 1.

Referring to fig. 7 and 8, fig. 7 is a simulation diagram of heat distribution of a heat dissipation structure of a projection device provided by the present utility model, and fig. 8 is a partial enlarged diagram of a portion B in fig. 7 provided by the present utility model. As shown in fig. 7 and 8, when the heat dissipation structure of the projection apparatus provided in the embodiment of the present utility model, in which the heat conducting member 2 and the heat conducting member 1 are connected in an embedded manner, is simulated, it is known that, in the case where the temperature of the heat generating element 4 is 52.1 ℃, the temperature of the portion of the boss 11 abutting against the heat generating element 4 is 32.9 ℃, the temperature of the portion of the boss 11 connected to the fixing portion 12 is 32.7 ℃, the temperature of the fixing portion 12 is 32.5 ℃, and the temperature difference across the heat conducting member 1 is only 0.4 ℃. That is, compared with the heat dissipation structure of the projection device in the related art, the heat dissipation structure of the projection device provided by the embodiment of the utility model can reduce the temperature of the heating element by at least 3.6 ℃. In this way, since the accommodating cavity 111 is provided on the heat transfer element 1, the connecting section 21 of the heat conducting element 2 is inserted into the accommodating cavity 111, so that the heat conducting element 2 is connected with the heat transfer element 1 in an embedded manner, the thermal resistance between the heat generating element 4 and the heat conducting element 2 can be reduced, that is, the heat generated by the heat generating element 4 is not required to be conducted through the whole heat transfer element 1 and then conducted to the heat conducting element 2, but only after passing through the bottom of the accommodating cavity 111 on the protruding part 11, the heat can be conducted to the heat conducting element 2, thereby improving the heat dissipation efficiency of the heat dissipation structure of the projection device to the heat generating element 4.

In other possible implementations, referring to fig. 9 and fig. 10, fig. 9 is an assembly diagram of a heat dissipation structure of a projection device provided by the present utility model, and fig. 10 is a partial cross-sectional view of the heat dissipation structure of the projection device provided by the present utility model. The connection section 21 of the heat conductive member 2 and the accommodating chamber 111 of the heat transfer member 1 may be provided as an integral structure, that is, the connection section 21 and the accommodating chamber 111 are integrally formed such that the side walls and the bottom wall of the accommodating chamber 111 of the boss 11 become a part of the connection section 21.

Illustratively, in the case where the heat-conducting member 2 includes a heat pipe, that is, the heat-conducting member 2 employs a heat pipe that includes a sealed housing and a wick located inside the housing, and is filled with an appropriate amount of working liquid inside the housing. For example, when the heat pipe and the heat transfer material 1 are processed, the accommodating chamber 111 is processed in the heat transfer material 1, and one end of the housing of the heat pipe is inserted into the accommodating chamber 111 as the connecting section 21, and the boss 11 of the heat transfer material 1 and the housing of the heat pipe can be integrally molded by sintering, so that the chamber wall of the accommodating chamber 111 of the heat transfer material 1 can be made a part of the housing of the heat pipe.

As another example, the distance between the wick in the heat pipe and the inner wall of the accommodating chamber 111 on the heat transfer member 1 may be set to 1mm or less, that is, 1.4mm or less from the wick in the housing of the heat pipe to the wall surface on the boss 11 abutting against the heating element 4 after the boss 11 of the heat transfer member 1 is integrally formed with the housing of the heat pipe by sintering.

In this embodiment, since the connection section 21 and the accommodating cavity 111 are integrally formed, the protruding portion 11 and the connection section 21 are integrated, compared with the connection of the connection section 21 and the accommodating cavity 111 by welding, the thermal resistance between the connection section 21 and the protruding portion 11 is smaller, which is more beneficial for conducting the heat generated by the heating element 4 to the heat conducting member 2; in addition, in the case that the heat conducting member 2 is a heat pipe, the distance between the wick in the heat pipe and the inner wall of the accommodating chamber 111 is set to 1mm or less, so that the thermal resistance between the heat pipe and the heating element 4 can be further reduced, and the heat dissipation efficiency of the heat dissipation structure of the projection apparatus to the heating element 4 can be better improved.

Referring to fig. 11 and 12, fig. 11 is a simulation diagram of heat distribution of a heat dissipation structure of a projection device provided by the present utility model, and fig. 12 is an enlarged partial view of a portion C in fig. 11 provided by the present utility model. As shown in fig. 11 and 12, when the heat dissipation structure of the projection device provided in the embodiment of the present utility model, in which the connection section 21 of the heat conducting member 2 and the accommodating chamber 111 of the heat conducting member 1 are integrally formed, is subjected to heat distribution simulation, it is known that, when the temperature of the heat generating element 4 is 51.5 ℃, the temperature of the portion of the boss 11 abutting against the heat generating element 4 is 32.5 ℃, the temperature of the portion of the boss 11 connected to the fixing portion 12 is 32.5 ℃, and the temperature of the fixing portion 12 is also 32.5 ℃, and the temperature difference across the heat conducting member 1 is 0. In this way, the accommodating cavity 111 on the heat transfer element 1 and the connecting section 21 of the heat conducting element 2 are integrally formed, so that the thermal resistance between the heating element 4 and the heat conducting element 2 can be better reduced, and the heat generated by the heating element 4 can be directly conducted to the heat conducting element 2 without being conducted through the protruding part 11 and the fixing part 12 of the heat transfer element 1, thereby better radiating and cooling the heating element 4.

The embodiment of the utility model also provides a projection device, which comprises a light modulator and the heat dissipation structure of the projection device provided by any one of the embodiments, wherein the light modulator is used for modulating the light field distribution of light rays, and the heat transfer element 1 is abutted with the light modulator so as to conduct heat generated by the light modulator through the heat transfer element 1.

In some possible implementations, as shown in fig. 1, 2, 3 and 4, a heat dissipation member 3 may be disposed at an end of the heat conduction member 2 away from the connection section 21, that is, the heat dissipation member 3 is connected to the cooling section 22 on the heat conduction member 2, and the heat dissipation member 3 cools the heat conduction member 2.

Illustratively, the heat dissipation member 3 may be a fin, the fin is provided with a connection hole 31, the cooling section 22 of the heat conduction member 2 is inserted into the connection hole 31 of the fin, so that the heat dissipation area of the heat conduction member 2 can be increased by the heat dissipation member 3, so that the heat conducted from the heat generating element 4 to the heat conduction member 2 can be rapidly dissipated, and the heat generating element 4 can be rapidly dissipated and cooled under the condition of reducing the temperature of the heat conduction member 2.

As another example, fixing lugs 32 may also be provided on the heat sink 3 to fix the heat sink 3 in the projection device by the fixing lugs 32.

The foregoing description is only of the preferred embodiments of the present utility model, and is not intended to limit the scope of the utility model, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.

Claims (10)

1. A heat dissipation structure of a projection device, comprising:

a heat transfer element (1), the heat transfer element (1) being for conducting heat generated by a heat generating element in a projection device, the heat transfer element (1) having a receiving cavity (111);

the heat conduction piece (2), heat conduction piece (2) have with changeover portion (21) of holding chamber (111) adaptation, changeover portion (21) insert in holding chamber (111), with heat transfer piece (1) are connected, heat conduction piece (2) are used for to heat transfer piece (1) is cooled down.

2. The heat radiation structure of the projection apparatus according to claim 1, wherein the heat transfer member (1) includes a boss portion (11), the accommodating chamber (111) is formed on the boss portion (11), and the heat transfer member (1) abuts against the heat generating element through the boss portion (11).

3. A heat radiation structure of a projection apparatus according to claim 2, wherein the wall thickness of the protruding portion (11) is 0.4mm or less in an axial direction along the accommodation chamber (111).

4. The heat radiation structure of the projection apparatus according to claim 2, wherein the heat transfer member (1) further includes a fixing portion (12), the fixing portion (12) being connected to the protruding portion (11) and located at an end of the protruding portion (11) near the opening of the accommodating chamber (111).

5. The heat radiation structure of the projection apparatus according to claim 4, wherein the fixing portion (12) has a fixing hole (121) thereon, and the heat transfer member (1) is fixed in the projection apparatus through the fixing hole (121).

6. The heat dissipation structure of a projection device according to any one of claims 1 to 5, characterized in that the connection section (21) and the accommodation chamber (111) are fixedly connected by welding.

7. The heat dissipation structure of a projection device according to claim 1, wherein the connection section (21) is integrally formed with the accommodation chamber (111).

8. The heat radiation structure of the projection apparatus according to claim 7, wherein the heat conductive member (2) comprises a heat pipe including a housing and a wick located in the housing, and a distance between the wick and an inner wall of the accommodation chamber (111) is 1mm or less.

9. A projection device, comprising:

the optical modulator is used for modulating the optical field distribution of the light rays;

the heat dissipation structure of a projection device of any one of claims 1 to 8, the heat transfer member (1) being in abutment with the light modulator.

10. Projection apparatus according to claim 9, further comprising a heat sink (3), wherein an end of the heat conducting member (2) remote from the connecting section (21) is connected to the heat sink (3), and the heat sink (3) is adapted to cool the heat conducting member (2).