CN219610361U - Luminous chip transfer mechanism and transfer system - Google Patents
Luminous chip transfer mechanism and transfer system Download PDFInfo
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- CN219610361U CN219610361U CN202320027916.0U CN202320027916U CN219610361U CN 219610361 U CN219610361 U CN 219610361U CN 202320027916 U CN202320027916 U CN 202320027916U CN 219610361 U CN219610361 U CN 219610361U
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- expansion device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a light-emitting chip transfer mechanism and a transfer system, wherein the light-emitting chip transfer mechanism comprises: a substrate; a plurality of reversible expansion devices disposed at the bottom of the substrate; the reversible expansion devices are arranged in an array; the reversible expansion devices are used for being in one-to-one correspondence with the light emitting chips; the pressure detection device is arranged in the reversible expansion device and is close to the bottom of the reversible expansion device; the control device is electrically connected with the pressure detection device; and one end of the heat conducting wire is connected with the control device, and the other end of the heat conducting wire is connected with the reversible expansion device. According to the utility model, the control device detects pressure through the pressure detection device to obtain the light-emitting chips with abnormal heights, and controls the corresponding heat conducting wires to be electrified and heated, so that the micro-deformation during expansion of the reversible expansion device is realized, one-to-one micro-adjustment is carried out on the light-emitting chips with abnormal heights, meanwhile, the light-emitting chips or temporary storage substrates are prevented from being crushed, and the transfer efficiency of the light-emitting chips is improved.
Description
Technical Field
The present utility model relates to the field of light emitting chip transfer technologies, and in particular, to a light emitting chip transfer mechanism and a light emitting chip transfer system.
Background
At present, a Laser Lift-Off (LLO) mode is commonly used for carrying out mass transfer of the light-emitting chips; however, because the size of the light emitting chip is too small, gas generated in the laser peeling process can have adverse effects on the transfer of the light emitting chip, for example, the light emitting chip is skewed when transferred to the temporary storage substrate, which leads to the fact that the common seal cannot be picked up well, and the transfer efficiency of the light emitting chip is greatly reduced; there is a risk of crushing the light emitting chip if the pressure pick-up is increased.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
Aiming at the defects in the prior art, the light-emitting chip transfer mechanism and the light-emitting chip transfer system are provided, and the aim of improving the light-emitting chip transfer efficiency is achieved.
The technical scheme adopted for solving the technical problems is as follows:
a light emitting chip transfer mechanism, comprising:
a substrate;
a plurality of reversible expansion devices disposed at the bottom of the substrate; the reversible expansion devices are arranged in an array; the reversible expansion devices are used for being in one-to-one correspondence with the light emitting chips;
the pressure detection device is arranged in the reversible expansion device and is close to the bottom of the reversible expansion device;
the control device is electrically connected with the pressure detection device;
and one end of the heat conducting wire is connected with the control device, and the other end of the heat conducting wire is connected with the reversible expansion device.
By the scheme, the control device detects the pressure through the pressure detection device, so that whether the height of the light-emitting chip corresponding to the pressure detection device is abnormal or not can be judged; when the height of the light-emitting chip is abnormal, the corresponding heat conducting wire is controlled to be electrified and heated so as to expand the corresponding reversible expansion device
Expanding and pressing down the light emitting chip with abnormal height until the pressure detecting device obtains the pressure value in the preset 5 range, so as to adjust the light emitting chip with abnormal height to make the height normal,
the realization is as follows: through the micro deformation when the reversible expansion device expands, the light-emitting chips with abnormal heights are subjected to one-to-one micro adjustment, so that the light-emitting chips or temporary storage substrates are prevented from being crushed, all the light-emitting chips are normal in height before being picked up, and the transfer efficiency of the light-emitting chips is improved.
Optionally, the bottom surface of the reversible expansion device is an adhesive surface for adhering the light emitting chip.
0 through the proposal, after the height of the light emitting chip is regulated to be normal, the substrate can be directly moved downwards,
thereby bonding all the light emitting chips through the reversible expansion device, and picking up and transferring the light emitting chips;
without evacuating the substrate and picking up and transferring the light emitting chips by other transfer substrates.
Optionally, a plurality of accommodating grooves are formed in the bottom of the substrate;
the reversible expansion devices are in one-to-one correspondence with the accommodating grooves and are positioned in the accommodating grooves.
5 through the scheme, the accommodating groove can position the reversible expansion device so as to lift
Raising the stability of the positioning of the reversible expansion device at the bottom of the substrate; meanwhile, the accommodating groove can limit the reversible expansion device, so that the reversible expansion device can expand downwards when being heated, and the efficiency of the reversible expansion device for adjusting the light-emitting chip with abnormal height is improved.
Optionally, the bottom of the reversible expansion device protrudes out of the receiving groove.
0 through the scheme, the problem that the substrate produces bad dryness on the picked-up light-emitting chip can be effectively avoided
To increase the efficiency of the reversible expansion device to pick up the light emitting chip.
Optionally, the substrate is provided with a plurality of mounting holes; the mounting holes are in one-to-one correspondence with the accommodating grooves and are communicated with the corresponding accommodating grooves;
the heat conducting wire passes through the mounting hole and is connected with the reversible expansion device.
5 optionally, the mounting hole extends downwardly from the top of the base plate.
Through the scheme, the stroke of the heat conducting wire penetrating through the substrate to be connected with the reversible expansion device is shortest, so that the efficiency of connection between the heat conducting wire and the reversible expansion device is improved.
Optionally, the depth of the heat conducting wire immersed in the reversible expansion device is greater than or equal to 1/2 of the thickness of the reversible expansion device in a natural state.
Through the scheme, the heat conducting wire is closer to the bottom of the reversible expansion device, so that the bottom of the reversible expansion device is heated at a higher speed, and the bottom expansion efficiency of the reversible expansion device is improved.
Optionally, the bottom area of the reversible expansion device is larger than the top area of the light emitting chip.
Through the scheme, when the substrate is moved to the state that the reversible expansion device corresponds to the light-emitting chip, the projection of the reversible expansion device in the direction of the light-emitting chip can be enabled to completely cover the light-emitting chip, and the efficiency of the reversible expansion device for picking up the light-emitting chip is improved.
Optionally, the control device includes:
the microcontroller is electrically connected with the pressure detection device;
a plurality of electronic switches; the electronic switch is electrically connected with the microcontroller and is connected with the heat conducting wires in a one-to-one correspondence manner.
According to the scheme, when the microcontroller controls the electronic switch to be turned on, the heat conducting wire is heated, so that the corresponding reversible expansion device can be controlled to expand; when the microcontroller controls the electronic switch to be closed, the heat conducting wires lose heat, and the corresponding reversible expansion device can be controlled to recover.
Optionally, the pressure detection device comprises a pressure sensor.
A light emitting chip transfer system comprising the light emitting chip transfer mechanism of any one of the above and a back plate; the backboard is used for supporting the light-emitting chips transferred by the light-emitting chip transfer mechanism.
In the utility model, the control device detects the pressure through the pressure detection device, so as to judge whether the height of the light-emitting chip corresponding to the pressure detection device is abnormal; when the height of the light-emitting chip is abnormal, the corresponding heat conducting wire is controlled to be electrified and heated so as to enable the corresponding reversible expansion device to expand, the light-emitting chip with abnormal height is pressed down until the pressure detection device obtains a pressure value in a preset range, and therefore the light-emitting chip with abnormal height is adjusted, the height of the light-emitting chip is normal, and the purposes of: through the micro deformation when the reversible expansion device expands, the light-emitting chips with abnormal heights are subjected to one-to-one micro adjustment, so that the light-emitting chips or temporary storage substrates are prevented from being crushed, all the light-emitting chips are normal in height before being picked up, and the transfer efficiency of the light-emitting chips is improved.
Drawings
FIG. 1 is a schematic diagram of a prior art light emitting chip laser stripped from a growth substrate to a temporary substrate;
FIG. 2 is a schematic diagram showing a reference state when the light emitting chip transferring mechanism is shifted to above the temporary storage substrate;
FIG. 3 is a schematic diagram showing a reference state when the light emitting chip transferring mechanism of the present utility model contacts with a light emitting chip with abnormal height;
FIG. 4 is a schematic diagram of a reference state of the light emitting chip transferring mechanism after the light emitting chip with abnormal height is adjusted and the corresponding reversible expansion device is not restored;
FIG. 5 is a schematic diagram showing a reference state when the light emitting chip transfer mechanism of the present utility model picks up the light emitting chip;
FIG. 6 is a schematic diagram of a light emitting chip transfer system according to the present utility model;
FIG. 7 is a functional block diagram of a light emitting chip transfer mechanism according to the present utility model;
fig. 8 is a longitudinal sectional view of a substrate according to the present utility model.
Reference numerals illustrate:
10-growing a substrate; 20-a light emitting chip; 201-an electrode; 30-temporarily storing the substrate; 1-a substrate; 101-a receiving groove; 102-mounting holes; 2-a reversible expansion device; 3-a pressure detection device; 4-a control device; 41-a microcontroller; 42-electronic switch; 5-a heat conducting wire; 6-backboard.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more clear and clear, the present utility model will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
The inventors have found that, as shown in fig. 1, when the light emitting chip 20 is transferred from the growth substrate 10 to the temporary storage substrate 30, the light emitting chip 20 is transferred in a huge amount by a Laser Lift-Off (LLO) method; however, the laser stripping process generates gas, and after the light emitting chips 20 are transferred onto the temporary storage substrate 30 under the action of the air flow, the light emitting chips 20 will have abnormal heights such as tilting, so that the top surfaces of a large number of light emitting chips 20 carried on the temporary storage substrate 30 are uneven, which results in that the ordinary seal cannot directly pick up the light emitting chips 20 for further transfer.
In the prior art, for a large number of uneven light emitting chips 20, the stamp is directly pressed down, so that the light emitting chips 20 with abnormal heights are pressed down by means of the pressing force of the stamp, and are not in a tilting state any more. However, since the volume of the light emitting chip 20 is too small, the tilting height of the light emitting chip 20 is different, and the moving height of the stamp cannot be controlled in a micro amount, the stamp often moves down too much/has too much pressing force, which results in the light emitting chip 20 being crushed, and even the temporary storage substrate 30 is sunk and deformed, so that the light emitting chip 20 cannot be reused, and the transfer efficiency of the light emitting chip 20 is greatly reduced.
In order to solve the above technical problems, the present utility model provides a light emitting chip transfer mechanism, as shown in fig. 2 to 5, which includes: a base plate 1, a plurality of reversible expansion devices 2, a pressure detection device 3, a control device 4 and a heat conducting wire 5. The substrate 1 is used for being connected with an external moving mechanism, so that the position of the substrate is adjusted by the external moving mechanism, and the substrate moves to the position right above the temporary storage substrate 30, so that the substrate corresponds to the temporary storage substrate 30; wherein, the top of the temporary storage substrate 30 carries the light emitting chips 20 to be transferred.
A plurality of reversible expansion devices 2 are disposed at the bottom of the substrate 1, so that the reversible expansion devices 2 can face the light emitting chips 20 when the substrate 1 moves above the temporary storage substrate 30. The plurality of reversible expansion devices 2 are arranged in an array and are in one-to-one correspondence with the light emitting chips 20. The pressure detection device 3 is arranged in the reversible expansion device 2 and is electrically connected with the control device 4; since the light emitting chip 20 is located below the reversible expansion device 2 when the light emitting chip 20 is transferred in large quantity, the pressure detecting device 3 is disposed in the reversible expansion device 2 and is close to the bottom of the reversible expansion device 2, so as to detect the pressure born by the bottom of the reversible expansion device 2, and the detected pressure data is transmitted to the control device 4, so that the control device 4 compares the pressure data with a preset range, and whether the pressure data is qualified is determined.
It should be noted that, when the light emitting chip 20 is not picked up and the bottom of the reversible expansion device 2 is in full contact with the top of the light emitting chip 20 (as shown in fig. 4), the pressure data acquired by the pressure detecting device 3 is within the preset range.
Specifically, when the light emitting chip 20 with abnormal height exists, as shown in fig. 3, the light emitting chip 20 with abnormal height contacts the corresponding reversible expansion device 2 and generates a certain pressure to the bottom of the reversible expansion device 2 along with the downward movement of the substrate 1, and at this time, the pressure detecting device 3 in the reversible expansion device 2 acquires the pressure data and transmits the pressure data to the control device 4; while the remaining highly normal light emitting chips 20 correspond to a pressure data of 0. Since the top of the light emitting chip 20 cannot be completely released from the bottom of the reversible expansion device 2 when the height of the light emitting chip 20 is abnormal, the pressure data is necessarily outside the preset range and less than the minimum value of the preset range. The control device 4 can determine that the height of the light emitting chip 20 is abnormal according to the pressure data.
One end of the heat conducting wire 5 is connected with the control device 4, and the other end of the heat conducting wire is connected with the reversible expansion device 2, so that the control device 4 controls the heat receiving and losing of the heat conducting wire 5 to realize the expansion and recovery of the reversible expansion device 2. For the light emitting chips 20 with abnormal heights, the control device 4 controls the corresponding heat conducting wires 5 to be electrified and heated, so that the reversible expansion device 2 connected with the heat conducting wires 5 expands, and the light emitting chips 20 with abnormal heights are pressed downwards, so that the heights of the light emitting chips are gradually normal. With the expansion of the reversible expansion device 2 and the pressing down of the light emitting chip 20, the contact area between the light emitting chip 20 and the reversible expansion device 2 is gradually increased, the obtained pressure data is gradually increased until the pressure data is within the preset range (as shown in fig. 4), the control device 4 controls the heating wire 5 to lose electricity, the volume of the reversible expansion device 2 is restored (as shown in fig. 6), and the height of the light emitting chip 20 is adjusted to be normal.
In the present utility model, the control device 4 detects the pressure by the pressure detection device 3, so as to determine whether the light emitting chip 20 corresponding to the pressure detection device 3 has abnormal height; when the height of the light emitting chip 20 is abnormal, the corresponding heat conducting wire 5 is controlled to be electrified and heated so as to enable the corresponding reversible expansion device 2 to expand, and the light emitting chip 20 with abnormal height is pressed down until the pressure detection device 3 obtains a pressure value in a preset range, so that the light emitting chip 20 with abnormal height is adjusted to enable the height to be normal, and the following effects are achieved: through the micro deformation of the reversible expansion device 2 during expansion, the light emitting chips 20 with abnormal heights are subjected to one-to-one micro adjustment, so that the light emitting chips 20 or the temporary storage substrate 30 are prevented from being crushed, the heights of all the light emitting chips 20 are normal before the light emitting chips 20 are picked up, and the transfer efficiency of the light emitting chips 20 is improved.
In an embodiment of the present utility model, after the adjustment of the light emitting chip 20 with abnormal height by the reversible expansion device 2 is completed, the external moving mechanism moves out the substrate 1, and picks up and transfers the light emitting chip 20 by using a stamp in the prior art.
In another embodiment of the present utility model, the bottom surface of the reversible expansion device 2 is an adhesive surface for adhering the light emitting chip. The reversible expansion device 2 has an adhesive property to adhere the light emitting chip 20, so that the light emitting chip 20 is picked up by the reversible expansion device 2. Specifically, after the substrate 1 moves to a suitable position above the temporary storage substrate 30, the reversible expansion device 2 adjusts the light emitting chips 20 with abnormal heights one to one; when the reversible expansion device 2 is powered off, as shown in fig. 4, the light emitting chips 20 with the height adjusted are bonded with the reversible expansion device 2, and the rest of the light emitting chips 20 with the height adjusted are still in an unbonded state with the corresponding reversible expansion devices 2; the substrate 1 continues to move downwards until all the light emitting chips 20 are adhered to the bottom of the corresponding reversible expansion device 2 (as shown in fig. 5), and then the pickup of all the light emitting chips 20 on the temporary storage substrate 30 is completed, and the substrate 1 is further moved to the next station by an external moving mechanism.
After the height of the light emitting chips 20 is regulated to be normal, the substrate 1 can be directly moved downwards, so that all the light emitting chips 20 are bonded through the reversible expansion device 2, and the light emitting chips 20 are picked up and transferred; without the need to withdraw the substrate 1 and pick up and transfer the light emitting chips 20 by other transfer means.
The light-emitting chip transferring mechanism further comprises a containing groove 101, as shown in fig. 8, a plurality of containing grooves 101 are formed in the bottom of the substrate 1; the reversible expansion devices 2 are in one-to-one correspondence with the accommodating grooves 101 and are positioned in the accommodating grooves 101.
The accommodating groove 101 can position the reversible expansion device 2 so as to improve the stability of positioning the reversible expansion device 2 at the bottom of the substrate 1; meanwhile, the accommodating groove 101 may limit the reversible expansion device 2, so that the reversible expansion device 2 may expand downwards when heated, so as to improve the efficiency of the reversible expansion device 2 in adjusting the light emitting chip 20 with abnormal height.
In an embodiment of the present utility model, the bottom of the reversible expansion device 2 protrudes out of the accommodating groove 101, that is, the bottom of the reversible expansion device 2 protrudes with respect to the bottom of the substrate 1, so that the problem that the light emitting chip 20 is not easily attached to the reversible expansion device 2 when the light emitting chip 20 is picked up due to poor interference of the substrate 1 to the light emitting chip 20 can be effectively avoided, and the efficiency of the reversible expansion device 2 for picking up the light emitting chip 20 is further improved.
The light-emitting chip transferring mechanism further comprises mounting holes 102, as shown in fig. 8, a plurality of mounting holes 102 are provided on the substrate 1; the mounting holes 102 are in one-to-one correspondence with the accommodating grooves 101 and are communicated with the corresponding accommodating grooves 101, and the heat conducting wires 5 penetrate through the mounting holes 102 and are connected with the reversible expansion device 2. Specifically, the mounting hole 102 extends downward from the top of the base plate 1.
After the heat conducting wires 5 pass through the mounting holes 102 downwards from the top of the substrate 1, the heat conducting wires are inserted into the reversible expansion devices 2 in the corresponding accommodating grooves 101, so that the stroke of the heat conducting wires 5 passing through the substrate 1 to be connected with the reversible expansion devices 2 is shortest, and the efficiency of connection between the heat conducting wires 5 and the reversible expansion devices 2 is improved.
In an embodiment of the present utility model, the depth of the heat conducting wire 5 immersed in the reversible expansion device 2 is greater than or equal to 1/2 of the thickness of the reversible expansion device 2 in a natural state, so that the heat conducting wire 5 is closer to the bottom of the reversible expansion device 2, and the bottom of the reversible expansion device 2 is heated at a higher speed, thereby improving the bottom expansion efficiency of the reversible expansion device 2.
In an embodiment of the present utility model, the bottom area of the reversible expansion device 2 is larger than the top area of the light emitting chip 20, so that when the substrate 1 is moved to the position where the reversible expansion device 2 corresponds to the light emitting chip 20, the projection of the reversible expansion device 2 in the direction of the light emitting chip 20 completely covers the light emitting chip 20, thereby improving the efficiency of the reversible expansion device 2 in picking up the light emitting chip 20, and effectively avoiding the occurrence of a phenomenon that the light emitting chip 20 fails in picking up due to the occurrence of micro dislocation between the reversible expansion device 2 and the light emitting chip 20.
As shown in fig. 7, the control device 4 includes a microcontroller 41 and a plurality of electronic switches 42; the microcontroller 41 is electrically connected with the pressure detection device 3; the electronic switch 42 is electrically connected with the microcontroller 41 and is connected with the heat conducting wires 5 in a one-to-one correspondence. The microcontroller 41 is configured to acquire pressure data transmitted by the pressure detecting device 3, and compare the pressure data with the preset range, so as to determine whether to turn on the corresponding electronic switch 42 according to a comparison result.
When the microcontroller 41 is used for controlling the electronic switch 42 to be turned on, the heat conducting wire 5 is heated, so that the corresponding reversible expansion device 2 can be controlled to expand; when the microcontroller 41 controls the electronic switch 42 to be turned off, the heat conducting wire 5 loses heat, and the corresponding reversible expansion device 2 can be controlled to be restored.
In one embodiment of the present utility model, the pressure detecting device 3 includes a pressure sensor.
The utility model also provides a light-emitting chip transfer system, as shown in fig. 6, which comprises the light-emitting chip transfer mechanism and a back plate 6 according to any one of the above; the back plate 6 is used for receiving the light emitting chip 20 transferred by the light emitting chip transfer mechanism.
After the plurality of reversible expansion devices 2 pick up the light emitting chips 20 which are in one-to-one correspondence, an external moving mechanism moves the substrate 1 to the upper part of the backboard 6 and presses down the substrate 1 until the electrodes 201 of the light emitting chips 20 are in contact with the driving electrodes of the backboard 6; pressurizing and heating the whole light-emitting chip transfer system, so that the electrode 201 of the light-emitting chip 20 is bonded with the driving electrode of the backboard 6; finally, the substrate 1 is shifted by an external moving mechanism, so that the reversible expansion device 2 is separated from and far away from the light-emitting chip 20, and the huge transfer of the light-emitting chip 20 is completed.
In summary, the present utility model provides a light emitting chip transfer mechanism and a transfer system, wherein the light emitting chip transfer mechanism includes: a substrate; a plurality of reversible expansion devices disposed at the bottom of the substrate; the reversible expansion devices are arranged in an array; the reversible expansion devices are used for being in one-to-one correspondence with the light emitting chips; the pressure detection device is arranged in the reversible expansion device and is close to the bottom of the reversible expansion device; the control device is electrically connected with the pressure detection device; and one end of the heat conducting wire is connected with the control device, and the other end of the heat conducting wire is connected with the reversible expansion device. According to the utility model, the control device detects pressure through the pressure detection device to obtain the light-emitting chips with abnormal heights, and controls the corresponding heat conducting wires to be electrified and heated, so that the micro-deformation during expansion of the reversible expansion device is realized, one-to-one micro-adjustment is carried out on the light-emitting chips with abnormal heights, meanwhile, the light-emitting chips or temporary storage substrates are prevented from being crushed, and the transfer efficiency of the light-emitting chips is improved.
It is to be understood that the utility model is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.
Claims (10)
1. A light emitting chip transfer mechanism, comprising:
a substrate;
a plurality of reversible expansion devices disposed at the bottom of the substrate; the reversible expansion devices are arranged in an array; the reversible expansion devices are used for being in one-to-one correspondence with the light emitting chips;
the pressure detection device is arranged in the reversible expansion device and is close to the bottom of the reversible expansion device;
the control device is electrically connected with the pressure detection device;
and one end of the heat conducting wire is connected with the control device, and the other end of the heat conducting wire is connected with the reversible expansion device.
2. The light-emitting chip transfer mechanism of claim 1, wherein the bottom surface of the reversible expansion device is an adhesive surface for adhering the light-emitting chip.
3. The light-emitting chip transfer mechanism according to claim 1 or 2, wherein a plurality of accommodating grooves are formed in the bottom of the substrate;
the reversible expansion devices are in one-to-one correspondence with the accommodating grooves and are positioned in the accommodating grooves.
4. A light emitting chip transfer mechanism as recited in claim 3, wherein a bottom portion of the reversible expansion device protrudes out of the receiving slot.
5. The light-emitting chip transfer mechanism according to claim 3, wherein a plurality of mounting holes are provided on the substrate, the mounting holes being in one-to-one correspondence with the accommodation grooves and communicating with the corresponding accommodation grooves;
the heat conducting wire passes through the mounting hole and is connected with the reversible expansion device.
6. The light-emitting chip transfer mechanism according to claim 5, wherein a depth of the heat conductive wire immersed in the reversible expansion device is greater than or equal to 1/2 of a thickness of the reversible expansion device in a natural state.
7. The light-emitting chip transfer mechanism of claim 1 or 2 or 4 or 5 or 6, wherein a bottom area of the reversible expansion device is greater than a top area of the light-emitting chip.
8. The light-emitting chip transfer mechanism according to claim 1 or 2 or 4 or 5 or 6, wherein the control means comprises:
the microcontroller is electrically connected with the pressure detection device;
a plurality of electronic switches; the electronic switch is electrically connected with the microcontroller and is connected with the heat conducting wires in a one-to-one correspondence manner.
9. The light-emitting chip transfer mechanism according to claim 1 or 2 or 4 or 5 or 6, wherein the pressure detecting means comprises a pressure sensor.
10. A light emitting chip transfer system comprising the light emitting chip transfer mechanism according to any one of claims 1 to 9 and a back plate; the backboard is used for supporting the light-emitting chips transferred by the light-emitting chip transfer mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320027916.0U CN219610361U (en) | 2023-01-05 | 2023-01-05 | Luminous chip transfer mechanism and transfer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320027916.0U CN219610361U (en) | 2023-01-05 | 2023-01-05 | Luminous chip transfer mechanism and transfer system |
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| Publication Number | Publication Date |
|---|---|
| CN219610361U true CN219610361U (en) | 2023-08-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320027916.0U Active CN219610361U (en) | 2023-01-05 | 2023-01-05 | Luminous chip transfer mechanism and transfer system |
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| Country | Link |
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| CN (1) | CN219610361U (en) |
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2023
- 2023-01-05 CN CN202320027916.0U patent/CN219610361U/en active Active
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