CN219592911U

CN219592911U - Uniform temperature plate

Info

Publication number: CN219592911U
Application number: CN202320002489.0U
Authority: CN
Inventors: 徐巍
Original assignee: Dongguan Ruijia New Material Co ltd
Current assignee: Dongguan Ruijia New Material Co ltd
Priority date: 2023-01-03
Filing date: 2023-01-03
Publication date: 2023-08-25
Anticipated expiration: 2033-01-03

Abstract

The utility model relates to a temperature equalization plate which comprises an upper cover, a lower cover, a first capillary structure, a second capillary structure, a third capillary structure and a support column. After the upper cover and the lower cover are welded, a vacuum chamber is formed in the upper cover and the lower cover; the vacuum chamber is filled with a cooling liquid for transferring a cooling medium. The support column is welded between the upper cover and the lower cover, so that the temperature equalization plate can be effectively prevented from being expanded and deformed by heating. The strip-shaped second capillary structures are arranged between the third capillary structure and the first capillary structure at intervals, so that cooling liquid can quickly flow back to the first capillary structure through the third capillary structure and the second capillary structure after the upper cover is condensed, and then heat absorption is continued to be carried out, and circulation is continued. The strip-shaped second capillary structure and the vertically arranged support columns can not block the back flow of the cooling liquid, and meanwhile, the first capillary structure, the second capillary structure and the third capillary structure are combined to form a composite capillary structure, so that the back flow effect is better, the heat conduction efficiency is higher, and the heat dissipation efficiency is better.

Description

Uniform temperature plate

Technical Field

The utility model relates to the technical field of heat dissipation devices, in particular to a temperature equalizing plate.

Background

With the increasing progress of technology, the operation speed of electronic devices is faster and the volume and weight of electronic devices are reduced, so that the electronic devices are developed towards the light, thin and small design direction, and meanwhile, with the development of electronic technology, the performance of electronic devices is improved relatively, and the heat generated by the electronic devices in unit time is increased.

The temperature equalizing plate is a heat dissipating device and is widely used for heat dissipation of chips. Patent number: CN202021305553. X discloses a samming plate, disclosing: the temperature equalizing plate comprises a first cover plate, a second cover plate and a supporting middle frame, wherein the first cover plate and the second cover plate are oppositely arranged, the supporting middle frame is clamped between the first cover plate and the second cover plate, a plurality of through holes are formed in the supporting middle frame in a penetrating mode, and the first cover plate and the second cover plate respectively cover the through holes and jointly enclose the supporting middle frame to form a closed space; and a supporting middle frame is arranged between the first cover plate and the second cover plate, and the supporting function of the supporting middle frame is achieved. The capillary structure can be arranged between the first cover plate and the supporting middle frame, can be arranged between the second cover plate and the supporting middle frame, and can be respectively arranged between the first cover plate and the supporting middle frame and between the second cover plate and the supporting middle frame. Preferably, the capillary structure is disposed between the first cover plate and the support center and between the second cover plate and the support center, respectively. In other words, the upper and lower capillary structures are separated by the supporting middle frame, although the supporting middle frame is provided with a plurality of through holes, the supporting middle frame still can obstruct the backflow of the working liquid, and the heat dissipation efficiency of the working liquid is affected.

Disclosure of Invention

In view of the above, the present utility model aims at overcoming the drawbacks of the prior art, and its primary objective is to provide a temperature equalizing plate, in which the cooling liquid flows smoothly, and the heat dissipation efficiency is higher, so as to overcome the drawbacks of the prior art.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model relates to a temperature equalization plate, which comprises a lower cover, wherein the edge of the lower cover is bent to form a lower welding edge; an upper welding edge is formed on the edge of the upper cover; the upper welding edge and the lower welding edge are welded together; after the upper cover and the lower cover are welded, a vacuum chamber is formed in the upper cover and the lower cover; the vacuum chamber is filled with cooling liquid;

the middle part of the lower cover is provided with a groove; the outer wall of the groove protrudes outwards to form a heat absorption seat; the first capillary structure is closely arranged on the bottom wall of the vacuum chamber; the third capillary structure is closely arranged on the top wall of the vacuum chamber; the strip-shaped second capillary structures are arranged between the third capillary structure and the first capillary structure at intervals;

the support column is arranged in the vacuum chamber and welded with the upper cover and the lower cover.

Preferably, the third capillary structure and the first capillary structure are copper mesh.

Preferably, the second capillary structure is a strip capillary structure sintered by copper powder.

Preferably, the second capillary structure has at least two groups; one or more second capillary structures are connected in a T-shape or a bifurcation.

Preferably, a part of the support columns are sleeved with fourth capillary structures.

Preferably, the fourth capillary structure is a copper mesh or copper powder sintered ring structure.

Preferably, the lower cover is of a structure with a low middle part and a high edge; a plurality of reflux grooves are formed in the inner wall of the lower cover; the reflux groove is communicated with the groove.

Preferably, the inner walls of the upper cover and the lower cover are provided with limiting holes, and the upper end and the lower end of the support column are inserted into the limiting holes.

Compared with the prior art, the temperature equalizing plate has obvious advantages and beneficial effects, and particularly, the temperature equalizing plate comprises an upper cover, a lower cover, a first capillary structure, a second capillary structure, a third capillary structure and a support column. After the upper cover and the lower cover are welded, a vacuum chamber is formed in the upper cover and the lower cover; the vacuum chamber is filled with a cooling liquid for transferring a cooling medium. And a support column is welded between the upper cover and the lower cover to prevent the temperature equalization plate from thermal expansion deformation. The strip-shaped second capillary structures are arranged between the third capillary structure and the first capillary structure at intervals, so that cooling liquid can quickly flow back to the first capillary structure through the third capillary structure and the second capillary structure after the upper cover is condensed, and then heat absorption is continued to be carried out, and circulation is continued. The strip-shaped second capillary structure and the vertically arranged support columns can not block the back flow of the cooling liquid, and meanwhile, the first capillary structure, the second capillary structure and the third capillary structure are combined to form a composite capillary structure, so that the back flow effect is better, the heat conduction efficiency is higher, and the heat dissipation efficiency is better.

Drawings

FIG. 1 is an exploded view of a first embodiment of the present utility model.

Fig. 2 is a schematic perspective view of a first embodiment of the present utility model.

FIG. 3 is a schematic cross-sectional view of A-A in FIG. 2, in accordance with a first embodiment of the present utility model.

Fig. 4 is an enlarged partial schematic view of fig. 3 according to a first embodiment of the present utility model.

Fig. 5 is a schematic top view of a bottom cover according to a second embodiment of the utility model.

FIG. 6 is a schematic diagram showing a second embodiment of a combination of a support column and a fourth capillary structure.

The attached drawings are used for identifying and describing:

10. lower cover 11, groove

12. Lower welding edge 13, first capillary structure

14. Second capillary structure 15, support column

16. Fourth capillary structure 17, reflux groove

18. Heat absorbing seat 19 and limiting hole

20. Upper cover 21, upper welded edge

22. Vacuum chamber 23, third capillary structure

Detailed Description

In order to further describe the technical means and effects adopted by the present utility model for achieving the intended purpose, the following detailed description will refer to the specific implementation, structure, characteristics and effects according to the present utility model with reference to the accompanying drawings and preferred embodiments.

Example 1

Referring to fig. 1 to 4, a specific structure of a first preferred embodiment of the present utility model is shown, which is a temperature equalizing plate.

The strip-shaped second capillary structures 14 are arranged between the third capillary structure 23 and the first capillary structure 13 at intervals to form a composite capillary structure, and the cooling liquid can quickly flow back to the first capillary structure 13 through the third capillary structure 23 and the second capillary structure 14 after being condensed on the upper cover 20, and then continues to absorb heat, so that the heat conduction efficiency is higher. The strip-shaped second capillary structure 14 and the vertically arranged supporting columns 15 can not block the back flow of the cooling liquid, and the back flow effect is better, so that the heat conduction efficiency is higher, and the heat dissipation efficiency is better.

The utility model relates to a temperature equalization plate, which comprises a lower cover 10, wherein the edge of the lower cover 10 is bent to form a lower welding edge 12; an upper welding edge 21 is formed on the edge of the upper cover 20; the upper welding edge 21 and the lower welding edge 12 are welded together; after the upper cover 20 and the lower cover 10 are welded, a vacuum chamber 22 is formed inside; the vacuum chamber 22 is filled with a cooling liquid; the middle part of the lower cover 10 is provided with a groove 11; the outer wall of the groove 11 protrudes outwards to form a heat absorbing seat 18; the first capillary structure 13 is closely arranged on the bottom wall of the vacuum chamber 22; the third capillary structure 23 is closely arranged on the top wall of the vacuum chamber 22; a plurality of strip-shaped second capillary structures 14 are arranged between the third capillary structure 23 and the first capillary structure 13 at intervals; the support column 15 is disposed within the vacuum chamber 22 and welded to the upper and lower covers 20 and 10. Preferably, the third capillary structure 23 and the first capillary structure 13 are copper mesh. Preferably, the second capillary structure 14 is a copper powder sintered strip capillary structure. The heat absorbing seat 18 contacts the heat source to absorb heat, the cooling liquid is heated and vaporized, moves to the lower cover 10 to dissipate heat and is condensed into liquid, and the condensed cooling liquid returns to the position of the heat absorbing seat 18 along the third capillary structure 23, the second capillary structure 14 and the first capillary structure 13 to continuously absorb heat, and is circulated continuously. The cooling liquid is preferably one of water, alcohol and acetone, and may be other cooling medium, without particular limitation. The strip-shaped second capillary structure 14 and the vertically arranged support columns 15 can not block the back flow of the cooling liquid, namely the cooling liquid can smoothly move from bottom to top to the upper cover 20 for heat dissipation after being heated and vaporized, the process is very smooth, and the heat conduction is very fast. Meanwhile, the first capillary structure 13, the second capillary structure 14 and the third capillary structure 23 are combined to form a composite capillary structure, the backflow effect is better, and the condensed cooling liquid can quickly return to the heat source position, so that the heat conduction efficiency is higher, and the heat dissipation efficiency is better. Wherein the upper cover 20 and the lower cover 10 are heat-radiating.

Preferably, the second capillary structure 14 has at least two groups; one or more second capillary structures 14 are connected in a T-shape or a bifurcation. The second capillary structure 14 may have two or more groups, and is disposed at the outer circumference of the groove 11, left and right, or circumferentially. The second capillary structure 14 has sufficient gap, and the cooling liquid can quickly move from bottom to top after being heated and vaporized, and then the upper cover 20 dissipates heat, so that the heat dissipation efficiency is high. The welding in this embodiment mainly adopts welding technologies such as brazing, reflow soldering, laser welding, resistance welding, and the like, and may be other welding technologies without specific limitation. It should be noted that the capillary structure has at least the following functions: the capillary structure has other functions, such as heat conduction and drainage (diversion), and will not be described in detail.

Example two

The second embodiment has the following features in addition to the features of the first embodiment:

referring to fig. 5-6, a fourth capillary structure 16 is preferably disposed on a portion of the support columns 15. Preferably, the fourth capillary structure 16 is a copper mesh or a copper powder sintered ring structure. The fourth capillary structure 16 can make the cooling liquid after the upper cover 20 is condensed return to the heat source area more quickly, and the heat circulation effect is better.

Preferably, the inner walls of the upper cover 20 and the lower cover 10 are provided with limiting holes 19, and the upper and lower ends of the supporting column 15 are inserted into the limiting holes 19. The limiting aperture 19 is preferably formed by stamping and milling. The support column 15 passes through the first capillary structure 13, the second capillary structure 14, the third capillary structure 23 and the fourth capillary structure 16, and then two ends of the support column are inserted into the limit holes 19 punched by the inner walls of the upper cover 20 and the lower cover 10 and welded with the upper cover 20 and the lower cover 10, so that the temperature equalizing plate is prevented from being deformed when heated. In particular, the inner walls of the upper cover 20 and the lower cover 10 are provided with limiting holes 19, which is more beneficial to positioning the support column 15, so that the assembly of the support column 15 is simpler and more convenient. The fourth capillary structure 16 is arranged on part of the supporting columns 15, so that the backflow effect is better, and the heat conduction and circulation efficiency is higher. The fourth capillary structure 16 is preferably annular, and the center, middle and edge positions of the preferred temperature equalizing plate are all provided with the fourth capillary structure 16. The fourth capillary structure 16 is preferably a copper powder sintered capillary structure or a copper mesh.

Preferably, the lower cover 10 has a structure with a low middle part and a high edge; a plurality of reflux grooves 17 are arranged on the inner wall of the lower cover 10; the reflux groove 17 is communicated with the groove 11. This design allows the coolant to return to the heat source faster by gravity as it liquefies back to the lower cover 10. The circulation groove 17 accelerates the flow of the cooling liquid. The return groove 17 is preferably punched from the lower cover 10, so that the outside of the lower cover 10 has a protruding portion so as to increase the heat dissipation area of the lower cover 10 and increase the heat dissipation efficiency.

In summary, the design of the present utility model focuses on that the strip-shaped second capillary structure 14 and the vertically arranged support columns 15 do not block the back flow of the cooling liquid, and the first capillary structure 13, the second capillary structure 14 and the third capillary structure 23 are combined to form a composite capillary structure, so that the back flow effect is better, and therefore, the thermal circulation efficiency of the temperature equalizing plate is very high, and the heat dissipation efficiency is better.

The present utility model is not limited to the above embodiments, but is capable of modification and variation in detail, and other modifications and variations can be made by those skilled in the art without departing from the scope of the present utility model.

Claims

1. The utility model provides a samming board which characterized in that: the device comprises a lower cover, wherein the edge of the lower cover is bent to form a lower welding edge; an upper welding edge is formed at the edge of the upper cover; the upper welding edge and the lower welding edge are welded together; after the upper cover and the lower cover are welded, a vacuum chamber is formed in the upper cover and the lower cover; the vacuum chamber is filled with cooling liquid;

2. The temperature uniformity plate according to claim 1, wherein: the third capillary structure and the first capillary structure are copper nets.

3. The temperature equalization plate according to claim 1 or 2, characterized in that: the second capillary structure is a strip capillary structure sintered by copper powder.

4. A temperature equalization plate as set forth in claim 3 wherein: the second capillary structure has at least two groups; one or more second capillary structures are connected in a T-shape or a bifurcation.

5. The temperature uniformity plate according to claim 1, wherein: and a fourth capillary structure is sleeved on part of the support columns.

6. The temperature uniformity plate according to claim 5, wherein: the fourth capillary structure is a copper net or copper powder sintered annular structure.

7. The temperature uniformity plate according to claim 1, wherein: the lower cover is of a structure with a low middle part and a high edge; a plurality of reflux grooves are formed in the inner wall of the lower cover; the reflux groove is communicated with the groove.

8. The temperature equalization plate according to claim 1 or 4, wherein: the inner walls of the upper cover and the lower cover are provided with limiting holes, and the upper end and the lower end of the support column are inserted into the limiting holes.