CN219591377U - Intelligent power module and equipment - Google Patents

Abstract

The disclosure provides an intelligent power module and equipment, wherein the intelligent power module comprises a package body, a power chip, a control IC chip, a power pin, a control pin and an insulating heat dissipation substrate, wherein the power chip is arranged above the insulating heat dissipation substrate, and the bottom surface of the insulating heat dissipation substrate is level with the bottom surface of the package body and exposed outside the package body; the power pin and one part of the control pin are led out of the package body, the other part of the power pin and the other part of the control pin are positioned in the package body, the power pin is electrically connected with the power chip, and the control pin is electrically connected with the control IC chip; the package body has a first step recessed toward the inside of the package body between a lower side of the power pin lead-out portion to a bottom surface of the package body. The intelligent power module and the intelligent power device can reduce displacement of the insulating heat dissipation substrate and further reduce flash risk when the packaging resin is injected.

Description

Intelligent power module and equipment

Technical Field

The disclosure relates to the field of semiconductor technology, and in particular, to an intelligent power module and a device.

Background

For smart power modules comprising an insulating heat sink substrate, such as a DBC (Direct Bonding Copper, copper-clad ceramic substrate) structure, as shown in fig. 1, the insulating heat sink substrate 10 'is typically disposed near the bottom of the module and the underlying copper-clad layer is exposed from the bottom of the module, while the injection ports for injecting resin during packaging are typically disposed on the sides of the module leading out power pins 20' and at a height above the upper surface of the insulating heat sink substrate 10', as at a' in fig. 1, approximately corresponding to the locations of the resin injection ports. The space between the insulating heat dissipating substrate 10' and the power pin side surface is relatively large as shown in fig. 1C ', and a large amount of the encapsulating resin is easily accumulated, and further, the resin is easily overflowed from the bottom surface of the insulating heat dissipating substrate 10', and burrs are easily generated.

Disclosure of Invention

The present disclosure is directed to solving at least one of the technical problems existing in the prior art. Accordingly, it is an object of the present disclosure to provide an intelligent power module that can reduce burr defects generated by resin overflowing from the bottom surface of an insulating heat dissipating substrate when resin is injected.

A second object of the present disclosure is to propose an apparatus.

An intelligent power module according to an embodiment of the first aspect of the present disclosure includes: a package; the power chip is arranged above the insulating heat dissipation substrate, and the bottom surface of the insulating heat dissipation substrate is level with the bottom surface of the packaging body and exposed outside the packaging body; the power pin and one part of the control pin are led out of the package body, the other part of the power pin and the other part of the control pin are positioned in the package body, the power pin is electrically connected with the power chip, and the control pin is electrically connected with the control IC chip; the package body is provided with a first step which is recessed towards the inside of the package body from the lower part of the power pin leading-out part to the bottom surface of the package body, and the distance from the end part of the insulating heat dissipation substrate, which is close to the power pin, to the side surface of the first step is smaller than 1.5 times the thickness of the insulating heat dissipation substrate.

According to the intelligent power module disclosed by the embodiment of the disclosure, the space between the insulating heat dissipation substrate and the side surface of the power pin of the corresponding module of the cavity is reduced by arranging the first step, so that the amount of accumulated resin at the position can be reduced when resin is injected, the defect that resin overflows from the bottom surface of the insulating heat dissipation substrate to generate burrs during injection is reduced, and further, the distance from the end part of the insulating heat dissipation substrate, which is close to the power pin, to the side surface of the first step is smaller than 1.5 times of the thickness of the insulating heat dissipation substrate, the phenomenon that resin is accumulated easily due to overlarge space at the position can be avoided, and the burr defect generated during resin injection is further reduced.

In some embodiments, the insulating heat dissipation substrate has a thickness that is greater than 0.5 times the distance from the end of the insulating heat dissipation substrate near the power pin to the side of the first step, so that resin void defects during resin injection can be reduced.

In some embodiments, a height of the mesa of the first step from the bottom surface of the package is less than a distance of the molding resin injection port from the bottom surface of the package.

In some embodiments, a height of the mesa of the first step from the bottom surface of the package is less than a distance of the top surface of the power chip from the bottom surface of the package. Therefore, when the resin is injected, the resin tends to horizontally alleviate the flow direction of the resin to the insulating heat dissipation substrate, so that the impact force of the resin to the insulating heat dissipation substrate is greatly reduced, and the displacement caused by the impact force of the resin to the insulating heat dissipation substrate is further reduced.

In some embodiments, the smart power module further includes a molding resin injection port that is spaced from the bottom surface of the package by a distance greater than a distance from the top surface of the power chip to the bottom surface of the package. Therefore, when resin is injected, the injected resin can be ensured to submerge the power chip, and the power chip is better packaged in the package body.

In some embodiments, the package body has a second step recessed inward of the package body between a lower side of the control pin lead-out portion to a bottom surface of the package body. The bottom surface of the end part of the control pin side is provided with the second step, so that the resin accumulation amount of the control side space can be reduced, and the burr defect that the resin overflows the insulating heat dissipation substrate is reduced.

In some embodiments, the package body has a third step recessed inward of the package body between an upper side of the control pin lead-out portion to a top surface of the package body.

The control pin side is provided with two steps up and down, so that the die flow speed of the control pin side can be adjusted, the whole die flow speed is balanced, gaps are avoided, and the punching time can be shortened.

In some embodiments, a flow guide is provided at a corner of a side surface of at least one of the first step, the second step, and the third step. Resin can be pushed to flow through the flow guide part, so that resin gaps are avoided from being generated due to stagnation and accumulation of the resin at corners when the resin is injected.

In some embodiments, the flow guide is a chamfer or a fillet or a groove.

In some embodiments, a molding resin injection port is provided at or adjacent to a side of the package body from which the power pin exits, and the molding resin injection port is provided near the resin parting surface. The arrangement can facilitate the processing of the die.

In some embodiments, the insulating heat dissipating substrate includes: the double-sided copper-clad ceramic plate is positioned in the package body, the power chip is arranged on the copper layer on the double-sided copper-clad ceramic plate, the power pin is connected with the copper layer on the double-sided copper-clad ceramic plate, and the copper layer below the double-sided copper-clad ceramic plate is flush with the bottom surface of the package body and exposed out of the package body.

In some embodiments, the insulating heat dissipating substrate includes: the single-sided copper-clad ceramic plate is positioned in the package body, the power chip is arranged on the copper layer on the single-sided copper-clad ceramic plate, the power pin is connected with the copper layer on the single-sided copper-clad ceramic plate, and the bottom surface of the ceramic layer of the single-sided copper-clad ceramic plate is flush with the bottom surface of the package body and exposed out of the package body.

In some embodiments, the insulating heat dissipating substrate includes: the power chip is arranged on the power pin and positioned on the upper surface of the part in the package body, and the bottom surface of the ceramic substrate is flush with the bottom surface of the package body and exposed out of the package body.

To achieve the above object, an apparatus according to an embodiment of a second aspect of the present disclosure includes a controller and the smart power module described in the above embodiment, where the smart power module is connected to the controller.

According to the device of the embodiment of the disclosure, by adopting the intelligent power module of the embodiment, the insulation voltage resistance and the insulation reliability are improved, and the electrical safety of the device is improved.

Additional aspects and advantages of the disclosure will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the disclosure.

Drawings

The foregoing and/or additional aspects and advantages of the present disclosure will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic diagram of a related art smart power module;

FIG. 2 is a cross-sectional view of a smart power module along a width direction according to one embodiment of the present disclosure;

FIG. 3 is a cross-sectional view of a smart power module along a width direction according to another embodiment of the present disclosure;

FIG. 4 is a cross-sectional view of a smart power module along a width direction according to another embodiment of the present disclosure;

FIG. 5 is a cross-sectional view of a smart power module along a width direction according to another embodiment of the present disclosure;

FIG. 6 is a side view of a smart power module according to one embodiment of the present disclosure;

FIG. 7 is a top view of a molding resin injection port corresponding placement location according to one embodiment of the present disclosure;

FIG. 8 is a side view of a molding resin injection port corresponding placement location according to one embodiment of the present disclosure;

FIG. 9 is a cross-sectional view of a smart power module along a width direction according to one embodiment of the present disclosure;

FIG. 10 is a perspective view of a smart power module according to one embodiment of the present disclosure;

FIG. 11 is a perspective view of a smart power module according to another embodiment of the present disclosure;

fig. 12 is a block diagram of an apparatus according to one embodiment of the present disclosure.

Detailed Description

The following describes an intelligent power module of an embodiment of the present disclosure with reference to the accompanying drawings.

Fig. 2 is a cross-sectional view of a smart power module along a width direction according to one embodiment of the present disclosure. As shown in fig. 2, the smart power module 100 includes a package body 10, a power chip 20, a control IC chip 30, power pins 40, control pins 50, and an insulating heat dissipation substrate 60.

Wherein, the power chip 20 and the control IC chip 30 are disposed in the package body 10, the power chip 20 is connected with the control IC chip 30, and the control IC chip 30 is used for driving the power chip 20.

A part of the power pin 40 and the control pin 50 are led out of the package body 10, the other part of the power pin 40 and the control pin 50 is positioned in the package body 10, the power pin 40 is electrically connected with the power chip 20, the power pin 40 is used for realizing the electrical connection between the power chip 20 and an external driving component, the control pin 50 is electrically connected with the control IC chip 30, and the control pin 50 is used for realizing the connection between the control IC chip 30 and an external controller.

The insulating heat dissipation substrate 60 is located in the package body 10, the power chip 20 is disposed above the insulating heat dissipation substrate 60, and the bottom surface 60B of the insulating heat dissipation substrate 60 is flush with the bottom surface 10B of the package body 10 and exposed outside the package body 10. The insulating heat dissipation substrate 60 is used for dissipating heat from the power chip 20 to ensure normal operation of the power chip 20. The bottom surface of the package body 10 is a heat dissipation surface of the intelligent power module 100.

In the embodiment of the present disclosure, the insulating heat dissipation substrate 60 may employ a double-sided copper-clad ceramic plate or a single-sided copper-clad ceramic plate or a ceramic substrate only or an insulating heat dissipation copper sheet, without being particularly limited thereto.

As shown in fig. 2, the insulating heat sink substrate 60 is a double-sided copper-clad ceramic plate, i.e., comprising a middle ceramic plate 61 and its upper and lower copper layers 62 and 63. The double-sided copper-clad ceramic plate is located in the package body 10, the copper layer 62 on the double-sided copper-clad ceramic plate can be provided with a power pad, the power chip 20 is arranged on the copper layer 62 on the double-sided copper-clad ceramic plate through the power pad, the power pin 40 is connected with the copper layer 62 on the double-sided copper-clad ceramic plate, and the copper layer 63 under the double-sided copper-clad ceramic plate is flush with the bottom surface of the package body 10 and exposes out of the package body 10. In this embodiment, the double-sided copper-clad ceramic plate can realize both the conductive connection to the power chip 20 and the heat conduction to the power chip 20.

Fig. 3 is a cross-sectional view of an intelligent power module according to an embodiment of the present disclosure along a width direction, as shown in fig. 3, an insulating heat dissipation substrate 60 is a single-sided copper-clad ceramic board, the single-sided copper-clad ceramic board includes a ceramic layer 61 and a copper layer 62 thereon, the copper layer 62 on the single-sided copper-clad ceramic layer may be provided with a power pad, a power chip 20 is provided with the copper layer 62 on the single-sided copper-clad ceramic board through the power pad, a power pin 40 is connected with the copper layer 62 on the single-sided copper-clad ceramic board, and a bottom surface of the ceramic layer 61 of the single-sided copper-clad ceramic board is flush with a bottom surface of a package body 10 and is exposed outside the package body 10. In this embodiment, the single-sided copper-clad ceramic board can realize both the conductive connection to the power chip 20 and the heat conduction to the power chip 20.

Fig. 4 is a cross-sectional view of an intelligent power module according to an embodiment of the present disclosure, as shown in fig. 4, an insulating heat dissipation substrate 60 is a ceramic substrate, an upper surface of the ceramic substrate is attached to a lower surface of a portion of the power pins 40 located in the package body 10, the power chip 20 is disposed on an upper surface of a portion of the power pins 40 located in the package body 10, and a bottom surface of the ceramic substrate is flush with a bottom surface of the package body 10 and is exposed outside the package body 10. That is, in the present embodiment, the portion of the power pin 40 located in the package body 10 is used as a power pad frame to realize the electrical connection of the power chip 20, and the ceramic substrate is combined to realize the heat conduction to the power chip 20. The ceramic substrate can be a whole block or can be formed by arranging a plurality of ceramic plates with uniform height on the bottom surface of the power pad frame.

As described in the foregoing background, for the intelligent power module provided with the insulating heat dissipation substrate 60, the space between the insulating heat dissipation substrate 60 and the power pin side surface is relatively large at risk of flash generation, and therefore, the intelligent power module 100 of the embodiment of the present disclosure improves the package body 10.

It is understood that the cavity wall shape of the cavity enclosed by the plastic molding die should be matched with the external shape of the package body 10 of the intelligent power module 100 according to the embodiment of the disclosure, in other words, the cavity of the plastic molding die should also have the external shape structure corresponding to the package body 10. When packaging, the main structure of the intelligent power module 100 is placed in the cavity of the plastic packaging mold, resin is injected through the molding resin injection port, and the resin is filled between the main structure of the intelligent power module 100 and the cavity wall of the cavity, so that the resin is cured, and the intelligent power module 100 comprising the package body 10 is formed.

As shown in fig. 2-4, in the embodiment of the present disclosure, the package body 10 has a first step 11 recessed toward the inside of the package body 10 between the lower side of the power pin extraction portion to the bottom surface 10B of the package body 10, and as shown in fig. 2, the first step 11 has a mesa 11A and a side surface 11B. Accordingly, the cavity of the molding die has a structure corresponding to the first step 11, thereby reducing the space between the insulating heat dissipation substrate 60 and the power side cavity wall, where a large amount of resin is not accumulated when the encapsulation resin is injected, and reducing the risk of flash.

That is, in the smart power module 100 of the present disclosure, by providing the first step 11, the space between the insulating heat dissipation substrate 60 and the side surface of the cavity corresponding to the power pin side of the module is reduced, so that the amount of accumulated resin at the position can be reduced at the time of resin injection, and the defect that burrs are generated by the resin overflowing from the bottom surface of the insulating heat dissipation substrate 60 at the time of injection is reduced.

Further, as shown in fig. 5, when the distance S from the end of the insulating heat dissipation substrate 60 close to the power pin 40 to the side 11B of the first step 11 is too large, the resin tends to overflow from the outside of the insulating heat dissipation substrate 60; if S is too small, the resin is not likely to fill the space, and resin void defects are likely to occur. Therefore, in the embodiment of the present disclosure, the distance S is defined, for example, the distance S from the end of the insulating heat dissipation substrate 60 near the power pin 40 to the side 11B of the first step 11 satisfies: the thickness of the insulating heat dissipating substrate 60 is 0.5 times < S <1.5 times the thickness of the insulating heat dissipating substrate 60.

Specifically, when s+.s1, where s1=0.5 times the thickness H3 of the insulating heat dissipating substrate 60, the space between the end of the insulating heat dissipating substrate 60 close to the power pin 40 and the first step 11 side 11B, i.e., the module power side, is formed as a thin narrow slit, which is not easily filled with resin when the resin is injected, and resin void defects are easily caused. When S is equal to or greater than S2, where s2=1.5 times the thickness H3 of the insulating heat dissipation substrate 60, the space between the end of the insulating heat dissipation substrate 60 close to the power pin 40 and the side 11B of the first step 11 is large, and resin is easily accumulated there when the resin is injected, and burr defects are generated in which the resin overflows from the outside of the insulating heat dissipation substrate 60. For example, assuming that the thickness H3 of the insulating heat dissipation substrate 60 is 1.05mm, if s=0.518 mm, it is not easy to fill the resin in this place; if s=2.0 mm, flash risk is liable to occur.

Therefore, the limiting distance S is between 0.5 and 1.5 times the thickness H3 of the insulating and heat dissipating substrate 60, for example, s=0.5×h3 or s=1.0×h3 or s=1.5×h3, for example, s=0.869 mm or 1.2mm is specifically set, which can not only fill the resin more easily, but also reduce burr defects and resin void defects generated when the resin is injected, ensure insulation stability of the intelligent power module 100, and improve electrical safety thereof.

Fig. 6 is a side view of a smart power module according to one embodiment of the present disclosure, showing the location of a corresponding molding resin injection port 70, the distance from the molding resin injection port 70 to the bottom surface 10B of the package body 10 being denoted as H0.

In some embodiments of the present disclosure, fig. 7 is a top view of a corresponding arrangement position of the molding resin injection port according to one embodiment of the present disclosure, and the molding resin injection port 70 may be disposed at a side corresponding to the package body 10 from which the power pin 40 is drawn or a side adjacent to the power pin 40, as shown at a right side in the drawing in fig. 7, but may be disposed at a left side in the drawing as well.

Also, in some embodiments, fig. 8 is a side view of a molding resin injection port corresponding arrangement position according to one embodiment of the present disclosure, as shown in fig. 8, the molding resin injection port 70 is arranged near the resin parting plane F. For example, the molding resin injection port 70 is provided above or below the resin parting plane F or in correspondence to the resin parting plane F, or near the lower side of the parting plane and near the bottom surface of the frame, which can facilitate the mold processing.

Fig. 9 is a cross-sectional view of a smart power module in a width direction according to an embodiment of the present disclosure, as shown in fig. 9 in combination with fig. 6, a height H1 of a mesa 11A of a first step 11 to a bottom surface 10B of a package body 10 is smaller than a distance H0 from a molding resin injection port to the bottom surface of the package body 10.

Wherein the molding resin injection port 70 is disposed at the corresponding power pin side, and in the present utility model, the package body 10 has a first step 11 recessed toward the inside of the package body 10 between the lower side of the power pin extraction portion and the bottom surface 10B of the package body 10, and the position of the cavity corresponding to the first step 11 is below the molding resin injection port 70, so that when resin is injected from the molding resin injection port 70, the height of the resin to the insulating heat dissipation substrate 60 is reduced by the structure of the cavity corresponding to the first step 11, which can play a role of buffering, the impact force of the resin to the insulating heat dissipation substrate 60 downward is reduced, and the displacement of the insulating heat dissipation substrate 60 can be reduced.

In some embodiments, as shown in fig. 9, a height H1 of the mesa 11A of the first step 11 to the bottom surface 10B of the package 10 is smaller than a distance H2 of the top surface of the power chip 20 to the bottom surface 10B of the package 10. Correspondingly, the height from the position of the mold cavity corresponding to the first step 11 to the bottom surface of the cavity is smaller than the distance from the top surface of the power chip 20 to the bottom surface of the cavity. Specifically, when the resin is injected from the molding resin injection port 70, the resin flows to the insulating heat dissipating substrate 60 and the power chip 20 via the position of the cavity corresponding to the first step 11, and at this time, the resin tends to horizontally alleviate the flow to the insulating heat dissipating substrate 60, greatly reducing the impact force of the resin on the insulating heat dissipating substrate 60, and further reducing the displacement caused by the impact force of the resin on the insulating heat dissipating substrate 60.

In addition, when the height H1 from the mesa 11A of the first step 11 to the bottom surface 10B of the package 10 is small, that is, the space between the insulating heat dissipation substrate 60 and the power side surface of the module is also reduced, the amount of resin accumulation, that is, the amount of the package 10 is further reduced, and the burr defect that the resin overflows outside the bottom surface of the insulating heat dissipation substrate 60 is reduced.

In some embodiments, the distance H0 of the molding resin injection port 70 to the bottom surface 10B of the package body 10 is greater than the distance H2 of the top surface of the power chip 20 to the bottom surface 10B of the package body 10. So that the injected resin can be ensured to flood the power chip 20 when the resin is injected, and the power chip 20 is better encapsulated in the package body 10.

In some embodiments, as shown in fig. 2-4, the package body 10 has a second step 12 recessed toward the inside of the package body 10 between the lower side of the lead-out portion of the control pin 50 and the bottom surface 10B of the package body 10, and as shown in fig. 2, the second step 12 has a mesa 12A and a side 12B, and the second step 12 and the first step 11 may be symmetrically disposed in the width direction of the smart power module 100. The second step 13 is arranged on the bottom surface of the end part of the control pin side, so that the resin accumulation amount of the control side space can be reduced, and the burr defect of the resin overflowing the insulating heat dissipation substrate 70 can be reduced.

As shown in fig. 2, the package body 10 has a third step 13 recessed toward the inside of the package body 10 between the upper side of the lead-out portion of the control pin 50 and the top surface 10T of the package body 10, the third step 13 having a mesa 13A and a side surface 13B. By providing steps on both the upper and lower sides of the control pin 50 side, the control pin side die flow rate can be adjusted so that the overall die flow rate is relatively uniform, void generation is avoided, and the injection time can be increased.

Further, at the corner corners of the step sides, resin stagnates and accumulates there due to the blocking of the cavity walls of the cavity, thereby causing resin voids. To solve this problem, in some embodiments of the present disclosure, a flow guide is provided at a corner of a side surface of at least one of the first step 11, the second step 12, and the third step 13. In particular, in an embodiment, the flow guiding portion may be a chamfer or a fillet or a groove, or may be a structure that can achieve a resin flow guiding effect. Resin can be pushed to flow through the flow guide part, so that resin gaps are avoided from being generated due to stagnation and accumulation of the resin at corners when the resin is injected.

For example, as shown in fig. 10, a corner of the side 11B of the first step 11 is provided with a first flow guiding portion 111, and the first flow guiding portion 111 may be a chamfer or a rounded corner facing the outside of the package body 10 in an arc shape, as shown in fig. 10, the first flow guiding portion 111 is a chamfer, as shown in fig. 11, and the first flow guiding portion 111 is a rounded corner. When the resin is injected, a component force directing the resin to the opposite side can be generated at the first guide portion 111, so that stagnation and accumulation of the resin at the position can be avoided, and generation of resin voids can be reduced.

As another example, as shown in fig. 10, a second guide portion 112 is provided at a corner of the side face 12B of the second step 12. In some embodiments, the second flow guide 112 may be provided as a chamfer or a fillet or a groove. The corner is provided with the chamfer or the round angle to generate a component force to the middle, so that the packaging resin flowing to the chamfer can flow to the middle, stagnation and accumulation at the corner are avoided, and resin gaps are reduced.

It should be noted that, the corner of the step side in the above embodiment may be provided with a flow guiding portion as required, for example, a flow guiding portion may be provided at each corner, or a flow guiding portion may be provided at some corners selectively, which is not particularly limited herein.

Based on the intelligent power module of the above embodiment, an embodiment of the second aspect of the present disclosure further proposes an apparatus.

Fig. 12 is a block diagram of an apparatus according to one embodiment of the present disclosure, and as shown in fig. 12, an apparatus 1000 includes a controller 200 and the smart power module 100 of the above embodiment, the smart power module 100 being connected with the controller 200.

In an embodiment, the intelligent power module 10 may be one or more, and the device 1000 may include, but is not limited to, an inverter device or a rectifier device, and specifically may be, for example, a motor drive controller.

Specifically, the controller 200 may generate a control signal according to a user instruction and send the power control signal to the intelligent power module 100, and the intelligent power module 100 generates a driving signal according to the control signal and outputs the driving signal to a corresponding driving element to implement driving control, inversion, rectification, and the like.

According to the apparatus 1000 of the embodiment of the present disclosure, by adopting the intelligent power module 100 of the above embodiment, the insulation voltage resistance, the insulation reliability, and the electrical safety of the apparatus are improved.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

While embodiments of the present disclosure have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined by the claims and their equivalents.

Claims (12)

1. An intelligent power module, comprising:

a package;

the power chip is arranged above the insulating heat dissipation substrate, and the bottom surface of the insulating heat dissipation substrate is level with the bottom surface of the packaging body and exposed outside the packaging body;

the power pin and one part of the control pin are led out of the package body, the other part of the power pin and the other part of the control pin are positioned in the package body, the power pin is electrically connected with the power chip, and the control pin is electrically connected with the control IC chip;

the package body is provided with a first step which is recessed towards the inside of the package body from the lower part of the power pin leading-out part to the bottom surface of the package body, and the distance from the end part of the insulating heat dissipation substrate, which is close to the power pin, to the side surface of the first step is smaller than 1.5 times the thickness of the insulating heat dissipation substrate.

2. The intelligent power module of claim 1, wherein a distance from an end of the insulating heat dissipating substrate adjacent to the power pin to the first step side is greater than 0.5 times a thickness of the insulating heat dissipating substrate.

3. The smart power module of claim 1 wherein a height of the mesa of the first step from the bottom surface of the package is less than a distance of the molding resin injection port from the bottom surface of the package.

4. The intelligent power module of claim 1, wherein a height of the mesa of the first step from the bottom surface of the package is less than a distance of the top surface of the power chip from the bottom surface of the package.

5. The intelligent power module according to claim 1, wherein the package body has a second step recessed inward of the package body between a lower side of the control pin lead-out portion to a bottom surface of the package body.

6. The intelligent power module according to claim 5, wherein the package body has a third step recessed inward of the package body between an upper side of the control pin extraction portion to a top surface of the package body.

7. The intelligent power module according to claim 6, wherein a corner of a side surface of at least one of the first step, the second step and the third step is provided with a flow guiding portion, and the flow guiding portion is a chamfer or a round angle or a groove.

8. The smart power module of claim 1 further comprising a molding resin injection port disposed at or adjacent to a side of the package body from which the power pins are routed, and the molding resin injection port is disposed proximate to a resin parting plane.

9. The intelligent power module of claim 1, wherein the insulating heat dissipating substrate comprises:

the double-sided copper-clad ceramic plate is positioned in the package body, the power chip is arranged on the copper layer on the double-sided copper-clad ceramic plate, the power pin is connected with the copper layer on the double-sided copper-clad ceramic plate, and the copper layer below the double-sided copper-clad ceramic plate is flush with the bottom surface of the package body and exposed out of the package body.

10. The intelligent power module of claim 1, wherein the insulating heat dissipating substrate comprises:

the single-sided copper-clad ceramic plate is positioned in the package body, the power chip is arranged on the copper layer on the single-sided copper-clad ceramic plate, the power pin is connected with the copper layer on the single-sided copper-clad ceramic plate, and the bottom surface of the ceramic layer of the single-sided copper-clad ceramic plate is flush with the bottom surface of the package body and exposed out of the package body.

11. The intelligent power module of claim 1, wherein the insulating heat dissipating substrate comprises:

the power chip is arranged on the power pin and positioned on the upper surface of the part in the package body, and the bottom surface of the ceramic substrate is flush with the bottom surface of the package body and exposed out of the package body.

12. An apparatus comprising a controller and the smart power module of any one of claims 1-11, the smart power module being coupled to the controller.