CN219591346U - Semiconductor packaging mechanism for axial lead wire of rectifier - Google Patents
Semiconductor packaging mechanism for axial lead wire of rectifier Download PDFInfo
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- CN219591346U CN219591346U CN202223527564.XU CN202223527564U CN219591346U CN 219591346 U CN219591346 U CN 219591346U CN 202223527564 U CN202223527564 U CN 202223527564U CN 219591346 U CN219591346 U CN 219591346U
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Abstract
The utility model discloses a rectifier axial lead semiconductor packaging mechanism which comprises a cavity strip and a cavity strip fixing block, wherein a cavity strip placing groove and a cavity strip fixing screw counter bore are formed in the cavity strip fixing block, a cavity strip locating surface and a cavity strip fixing threaded hole are formed in the cavity strip, a main runner, a main gate and a sub gate are formed in the cavity strip fixing block, and a cavity and a pin groove are formed in the cavity strip. According to the utility model, the die cavity strip is arranged on the die cavity strip fixing block, the die cavity strip positioning surface is attached to the die cavity strip placing groove, and the die cavity strip is connected with the die cavity strip fixing threaded hole through the die cavity strip fixing screw counter bore by using the screw, so that the die cavity strip and the die cavity strip fixing block are integrated, the single property of the conventional product is eliminated, the manufactured product is multifunctional, the multi-purpose of one machine of equipment is realized, the compatibility and the utilization rate of the equipment are improved, and the purposes of high efficiency, safety, stability and high compatibility of the equipment operation are achieved.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging mechanism for axial leads of a rectifier.
Background
The schottky diode is a metal-semiconductor device which is made by using a noble metal (gold, silver, aluminum, platinum, etc.) a as a positive electrode, an N-type semiconductor B as a negative electrode, and a barrier formed on a contact surface of the two as a rectifying characteristic. The existing notebook computers, smart phones and tablet personal computer chargers also have the statues. Schottky diodes are mainly used in two areas:
1. rectification, i.e. alternating current to direct current conversion inside a switching power supply (switch mode power supply, SMPS) or power supply rectifier, and direct current voltage conversion.
2. Preventing reverse flow of direct current and direct current of opposite polarity, for example when the battery is inserted incorrectly.
Because of its relatively high switching speed, it is mainly used for high frequency applications up to the microwave range. This is also due to their low saturation capacity. They are therefore often used in switching power supplies in the form of freewheeling diodes or rectifier diodes as protection diodes for reducing the induced voltage and also as demodulators for detection circuits.
The prior art has the following defects: when the existing semiconductor packaging technology is used for packaging semiconductors, cavities with different sizes cannot be manufactured according to different production requirements, workers cannot replace cavity strips according to different requirements, packaging mechanisms cannot rapidly perform packaging operation on different diodes, and therefore packaging equipment is single in structure function and low in semiconductor packaging efficiency.
The above information disclosed in the background section is only for enhancement of understanding of the background of the disclosure and therefore it may include information that does not form the prior art that is already known to a person of ordinary skill in the art.
Disclosure of Invention
The utility model aims to provide a semiconductor packaging mechanism with axial leads of a rectifier, which is provided with independent cavity bars and cavity bar fixing blocks, wherein the cavity bars are provided with cavity bar positioning surfaces, the cavity bar fixing blocks are provided with cavity bar placing grooves, the cavity bars are placed on the cavity bar fixing blocks, and the cavity bar positioning surfaces are tightly attached to the cavity bar placing grooves. The cavity strip is provided with a cavity strip fixing threaded hole, and a cavity strip fixing screw counter bore is formed in the cavity strip fixing block. The cavity strip and the cavity strip fixing block are integrated by connecting the cavity strip fixing screw counter bores with the cavity strip fixing screw holes through screws. The mold cavities on the mold cavity strips can be mirror surfaces or other roughness surfaces with different requirements, mold cavities with different sizes can be manufactured according to requirements, product diversification can be realized, and the mold cavity strips can be replaced quickly. The single use of the prior equipment is eliminated, the equipment is multifunctional, the equipment is more conducive to realizing multiple functions, the compatibility and the utilization rate of the equipment are improved, and the purposes of high efficiency, safety, stability and high compatibility of the equipment operation are achieved so as to solve the defects in the technology.
In order to achieve the above object, the present utility model provides the following technical solutions: the axial lead semiconductor packaging mechanism of the rectifier comprises a device body and further comprises:
the fixing mechanism is arranged at the outer side of the device body and used for fixing the device body;
the device body comprises a cavity strip, a plurality of cavities are formed in the top of the cavity strip, a plurality of pin grooves are formed in the top of the cavity strip, the pin grooves are respectively arranged at gaps between two adjacent cavities, and a plurality of cavity strip fixing threaded holes are formed in the inner wall of the bottom of the cavity strip;
the fixing mechanism comprises a cavity strip fixing block, a plurality of main runners are arranged at the top of the cavity strip fixing block, a plurality of main gates are arranged on the inner wall of the main runner, a plurality of cavity strip placing grooves are arranged at the top of the cavity strip fixing block, a plurality of sub gates are arranged at the top of a gap between every two adjacent cavity strip placing grooves, and a plurality of cavity strip fixing screw counter bores are arranged on the inner wall of the bottom of the cavity strip fixing block.
Preferably, the device body comprises a cavity strip positioning surface, the cavity strip positioning surface is arranged at the top of the outer walls at two ends of the cavity strip, and the cavity strip positioning surface is attached to the inner wall of the cavity placing groove.
Preferably, a fixing bolt is arranged between the cavity bar fixing screw counter bore and the cavity bar fixing threaded hole and is fixedly connected through the fixing bolt, so that the cavity bar and the cavity bar fixing block are integrated.
Preferably, the semiconductor lead frame may be placed on the lead slots.
Preferably, the filled epoxy resin package material passes through the main runner on the cavity bar fixed block, through the main gate, into the cavity and then into the next group of cavities through the sub gate.
Preferably, two cavity strip placing grooves are formed in the left end and the right end of the main flow channel, each two cavity strip placing grooves are arranged in a group, and the cavity strip placing grooves are arranged in an equidistant mode.
In the technical scheme, the utility model has the technical effects and advantages that:
through being equipped with independent die cavity strip and die cavity strip fixed block, set up die cavity strip locating surface on the die cavity strip, set up die cavity strip standing groove on the die cavity strip fixed block, die cavity strip locating surface is closely laminated with die cavity strip standing groove, is connected with die cavity strip fixed screw hole through die cavity strip fixed screw counter bore with the screw for die cavity strip becomes an organic wholely with die cavity strip fixed block. The mold cavities on the mold cavity strips can be mirror surfaces or other roughness surfaces with different requirements, mold cavities with different sizes can be manufactured according to requirements, product diversification can be realized, and the mold cavity strips can be replaced quickly. The single use of the traditional equipment is eliminated, the equipment is multifunctional, the multi-purpose of the equipment is realized, the compatibility and the utilization rate of the equipment are improved, and the purposes of high efficiency, safety, stability and high compatibility of the equipment operation are achieved; the method realizes localization, diversification, safety, stability and high compatibility of the surface Schottky rectifier axial lead semiconductor package, so that the surface Schottky rectifier axial lead semiconductor component can be rapidly manufactured and can be utilized in wider industries.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
Fig. 1 is a schematic diagram of the overall structure of the present utility model.
Fig. 2 is a schematic diagram of the front surface of the molding cavity bar of the present utility model.
FIG. 3 is a schematic view of the back side of the molding cavity bar of the present utility model.
Fig. 4 is a schematic diagram of the front structure of the cavity bar fixing block of the present utility model.
Fig. 5 is a schematic view of the back of the cavity bar mounting block of the present utility model.
Reference numerals illustrate:
a device body; 101. a cavity strip; 102. a cavity; 103. a pin slot; 104. a cavity strip positioning surface; 105. a cavity bar fixing threaded hole;
2. a fixing mechanism; 201. a cavity strip fixing block; 202. a main flow passage; 203. a main gate; 204. separating a pouring gate; 205. a cavity strip placing groove; 206. and the cavity strip is fixed with a screw counter bore.
Description of the embodiments
The utility model provides a semiconductor packaging mechanism for axial leads of a rectifier, which is shown in fig. 1-5, and comprises a device body 1 and further comprises:
a fixing mechanism 2, which is arranged outside the device body 1 and is used for fixing the device body 1;
the device body 1 comprises a cavity bar 101, wherein a plurality of cavities 102 are formed in the top of the cavity bar 101, a plurality of pin grooves 103 are formed in the top of the cavity bar 101, the pin grooves 103 are respectively arranged at gaps between two adjacent cavities 102, and a plurality of cavity bar fixing threaded holes 105 are formed in the inner wall of the bottom of the cavity bar 101;
the fixing mechanism 2 comprises a cavity strip fixing block 201, a plurality of main runners 202 are formed in the top of the cavity strip fixing block 201, a plurality of main gates 203 are formed in the inner wall of the main runner 202, a plurality of cavity strip placing grooves 205 are formed in the top of the cavity strip fixing block 201, a plurality of sub-gates 204 are formed in the tops of gaps between two adjacent cavity strip placing grooves 205, and a plurality of cavity strip fixing screw counter bores 206 are formed in the bottom inner wall of the cavity strip fixing block 201.
Further, the device body 1 includes a cavity strip positioning surface 104, the cavity strip positioning surface 104 is disposed at the top of the outer walls of the two ends of the cavity strip 101, the cavity strip positioning surface 104 is attached to the inner wall of the cavity placing groove 205, and the cavity strip 101 can be stably connected with the cavity strip placing groove 205 through the attachment between the cavity strip positioning surface 104 and the inner wall of the cavity placing groove 205.
Further, a fixing bolt is arranged between the cavity bar fixing screw counter bore 206 and the cavity bar fixing threaded hole 105 and is fixedly connected with the cavity bar fixing threaded hole 105 through the fixing bolt, so that the cavity bar 101 and the cavity bar fixing block 201 are integrated, and the cavity bar 101 can be tightly connected with the cavity bar placing groove 205 through the fixing bolt penetrating through the cavity bar fixing screw counter bore 206 and being connected with the cavity bar fixing threaded hole 105.
Further, the cavity 102 may be a mirror surface or other roughness surface with different requirements, and the semiconductor lead frame may be placed on the lead groove 103, and the surface of the cavity 102 may be manufactured according to different requirements, so that the cavity 102 may be adapted to the packaging operation of different diodes.
Further, the filled epoxy resin packaging material enters the next group of cavities 102 from the split gate 204 through the main runner 202 on the cavity strip fixing block 201, flows through the main gate 203, enters the next group of cavities 102, gets rid of the singleness of the prior equipment use, enables the molded product to be multifunctional, is more conducive to realizing one machine for multiple purposes, improves the compatibility and the utilization rate of the equipment, and achieves the purposes of high efficiency, safety, stability and high compatibility of the equipment operation.
Further, two cavity strip placing grooves 205 are respectively formed in the left end and the right end of the main runner 202, each two cavity strip placing grooves 205 are arranged in one group, multiple groups of cavity strip placing grooves 205 are arranged at equal intervals, and multiple groups of cavity strip placing grooves 205 arranged at equal intervals enable epoxy resin packaging materials in the main runner 202 to uniformly perform packaging operation on the diodes on the cavity 102.
The implementation mode specifically comprises the following steps: through placing die cavity strip 101 into die cavity strip standing groove 205 for die cavity strip locating surface 104 can be laminated with the die cavity strip standing groove 205 inner wall, simultaneously make die cavity strip fixed screw hole 105 can be aligned with the die cavity strip fixed screw counter bore 206 of die cavity strip fixed block 201 inner wall, use fixing bolt run through die cavity strip fixed screw counter bore 206 make its and die cavity strip fixed screw hole 105 inner wall threaded connection, make die cavity strip 101 and die cavity strip fixed block 201 zonulae occludens, and then place the diode inside die cavity 102, make the pin of diode can fix in the pin groove 103, and then empty the epoxy material of flow through sprue 202, make it flow to the die cavity 102 at both ends through sprue 203, then through the drainage effect of runner 204, make unnecessary epoxy material can get into the die cavity 102 inside of next group, and then make the epoxy material can carry out the encapsulation operation to the diode of die cavity 102 inside, and then make the encapsulation mechanism can be quick carry out the encapsulation operation to a plurality of diodes, can be according to the different encapsulation demands and produce the surface of die cavity 102 and produce the different and can be different to the different production demands of die cavity strip 101 through the different production demands, can be met in the different production demands of the different encapsulation mechanism of die cavity strip is realized, can't be satisfied with the present demand of the die cavity 101.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.
Claims (6)
1. The axial lead semiconductor packaging mechanism of the rectifier comprises a device body (1), and is characterized by further comprising:
the fixing mechanism (2) is arranged at the outer side of the device body (1) and is used for fixing the device body (1);
the device body (1) comprises a cavity strip (101), wherein a plurality of cavities (102) are formed in the top of the cavity strip (101) and are used for placing and fixing diodes;
a plurality of pin grooves (103) are formed in the top of the cavity strip (101), the pin grooves (103) are respectively arranged at gaps between two adjacent cavities (102), and a plurality of cavity strip fixing threaded holes (105) are formed in the inner wall of the bottom of the cavity strip (101);
the fixing mechanism (2) comprises a cavity strip fixing block (201), a plurality of main runners (202) are arranged at the top of the cavity strip fixing block (201), a plurality of main gates (203) are arranged on the inner wall of the main runner (202), a plurality of cavity strip placing grooves (205) are arranged at the top of the cavity strip fixing block (201), a plurality of sub-gates (204) are arranged at the top of a gap between two adjacent cavity strip placing grooves (205), and a plurality of cavity strip fixing screw counter bores (206) are arranged on the inner wall of the bottom of the cavity strip fixing block (201).
2. The rectifier axial lead semiconductor package mechanism of claim 1, wherein: the device body (1) comprises a cavity strip positioning surface (104), the cavity strip positioning surface (104) is arranged at the top parts of the outer walls of the two ends of the cavity strip (101), and the cavity strip positioning surface (104) is attached to the inner wall of the cavity placing groove (205).
3. The rectifier axial lead semiconductor package mechanism of claim 1, wherein: and a fixing bolt is arranged between the cavity bar fixing screw counter bore (206) and the cavity bar fixing threaded hole (105) and is fixedly connected through the fixing bolt, so that the cavity bar (101) and the cavity bar fixing block (201) are integrated.
4. The rectifier axial lead semiconductor package mechanism of claim 1, wherein: the semiconductor lead frame may be placed on the lead slots (103).
5. The rectifier axial lead semiconductor package mechanism of claim 1, wherein: the filled epoxy resin packaging material passes through a main runner (202) on a cavity strip fixing block (201), flows through a main gate (203), enters the cavities (102) and then enters the next group of cavities (102) through sub-gates (204).
6. The rectifier axial lead semiconductor package mechanism of claim 1, wherein: two cavity strip placing grooves (205) are formed in the left end and the right end of the main flow channels (202), each two cavity strip placing grooves (205) are arranged in a group, and the cavity strip placing grooves (205) are arranged in an equidistant mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223527564.XU CN219591346U (en) | 2022-12-29 | 2022-12-29 | Semiconductor packaging mechanism for axial lead wire of rectifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223527564.XU CN219591346U (en) | 2022-12-29 | 2022-12-29 | Semiconductor packaging mechanism for axial lead wire of rectifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219591346U true CN219591346U (en) | 2023-08-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223527564.XU Active CN219591346U (en) | 2022-12-29 | 2022-12-29 | Semiconductor packaging mechanism for axial lead wire of rectifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219591346U (en) |
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2022
- 2022-12-29 CN CN202223527564.XU patent/CN219591346U/en active Active
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