CN219577351U - High-efficient heat dissipation type integrated circuit board - Google Patents

High-efficient heat dissipation type integrated circuit board Download PDF

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Publication number
CN219577351U
CN219577351U CN202320195272.6U CN202320195272U CN219577351U CN 219577351 U CN219577351 U CN 219577351U CN 202320195272 U CN202320195272 U CN 202320195272U CN 219577351 U CN219577351 U CN 219577351U
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CN
China
Prior art keywords
circuit board
shell
integrated circuit
collision plate
spring
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Active
Application number
CN202320195272.6U
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Chinese (zh)
Inventor
侯惠美
廖健昌
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Suzhou Industrial Park Hongqi Technology Co ltd
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Suzhou Industrial Park Hongqi Technology Co ltd
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Priority to CN202320195272.6U priority Critical patent/CN219577351U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a high-efficiency heat dissipation type integrated circuit board, which comprises: the anti-collision device comprises a shell, wherein the bottom end of the shell is movably connected with a circuit board, the bottom end of the circuit board is provided with a bottom anti-collision plate, the top end of the bottom anti-collision plate is fixedly connected with a bottom limiting block, the top end of the bottom anti-collision plate is provided with a first spring, the first spring is arranged in the circuit board, the top end of the shell is provided with a top anti-collision plate, the bottom end of the top anti-collision plate is fixedly connected with a top limiting block, the top end of the top anti-collision plate is provided with a second spring, and the second spring is arranged in the top end of the shell; according to the utility model, through improvement of the high-efficiency heat-dissipation type integrated circuit board, the anti-collision plates are arranged at the top end and the bottom end of the shell, and the anti-collision plates can reduce the impact force after being buffered by the springs, so that the internal integrated circuit board is protected, and the high-efficiency heat-dissipation type integrated circuit board has the advantage of reducing the maintenance cost, thereby effectively solving the problems and the defects of the traditional device.

Description

High-efficient heat dissipation type integrated circuit board
Technical Field
The utility model relates to the field of integrated circuit boards, in particular to a high-efficiency heat dissipation type integrated circuit board.
Background
The integrated circuit board is a carrier for carrying integrated circuits, but often the integrated circuit board is also carried on the integrated circuit board, and the integrated circuit board is mainly composed of silica gel, so the integrated circuit board is green in general, the integrated circuit board is manufactured by adopting a semiconductor manufacturing process, a plurality of components such as transistors, resistors, capacitors and the like are manufactured on a small monocrystalline silicon wafer, and the components are combined into a complete electronic circuit according to a multilayer wiring or tunnel wiring method.
However, the high-efficiency heat dissipation type integrated circuit board used at present has no good anti-collision performance and often fails due to collision, so that maintenance is needed, and the use cost is increased.
In view of this, research and improvement are carried out to current problem, provide a high-efficient heat dissipation type integrated circuit board, through set up crashproof board in top and the bottom of shell, crashproof board can reduce the dynamics of striking after the buffering of spring to protect inside integrated circuit board, have the advantage that reduces cost of maintenance, aim at through this technique, reach the purpose of solving the problem and improving practical value nature.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a high-efficiency heat-dissipation type integrated circuit board.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a high-efficient heat dissipation type integrated circuit board, includes the shell, the bottom swing joint of shell has the circuit board, the bottom of circuit board is provided with the bottom anticollision board, the top fixedly connected with bottom limiting block of bottom anticollision board, the top of bottom anticollision board is provided with first spring, first spring setting is in the inside of circuit board, the top of shell is provided with the top layer anticollision board, the bottom fixedly connected with top layer limiting block of top layer anticollision board, the top of top layer anticollision board is provided with the second spring, the second spring sets up the inside on the shell top.
As a further description of the above technical solution:
the inside of shell is provided with the fan protective housing, the inside of fan protective housing is provided with the fan.
As a further description of the above technical solution:
the bottom of shell one side is provided with the jack, the jack is provided with two altogether.
As a further description of the above technical solution:
the bottom swing joint of circuit board has connecting bolt, connecting bolt's surface is provided with the external screw thread, connecting bolt is provided with four altogether.
As a further description of the above technical solution:
the inside of circuit board is provided with the internal thread, the inside of shell bottom is provided with the internal thread, the internal thread cooperates with the external screw thread on connecting bolt surface, connecting bolt is the state of running through with circuit board and shell.
As a further description of the above technical solution:
the first springs and the second springs are arranged in total, and insulating paint is smeared on the outer surfaces and the inner surfaces of the shell, the top-layer anti-collision plate and the bottom-layer anti-collision plate.
The utility model has the following beneficial effects: the fan has good radiating effect, can protect the circuit board can not take place a series of dangers such as short circuit because of the high temperature, and connecting bolt can be with circuit board and shell separately, makes things convenient for maintainer to maintain or maintain the circuit board, and cooperation between inside and outside bolt also makes maintainer conveniently demolish, has saved the time, and insulating varnish can play insulating effect, prevents that the circuit board that takes place the short circuit from causing the injury to maintainer, has the effect of protection.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a high-efficiency heat dissipation type integrated circuit board according to the present utility model;
fig. 2 is a schematic diagram illustrating the structural disassembly of an integrated circuit board with high heat dissipation efficiency according to the present utility model;
fig. 3 is a cross-sectional view of a housing and a circuit board of a high-efficiency heat dissipation type.
Legend description:
1. a housing; 2. a circuit board; 3. a jack; 4. a top layer anti-collision plate; 5. a bottom layer anti-collision plate; 6. a fan protective case; 7. a fan; 8. a connecting bolt; 9. an external thread; 10. an internal thread; 11. a first spring; 12. a bottom layer restriction block; 13. a second spring; 14. the top layer limits the blocks.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," "third," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally coupled, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-3, one embodiment provided by the present utility model is: the utility model provides a high-efficient heat dissipation type integrated circuit board, including shell 1, the bottom swing joint of shell 1 has circuit board 2, the bottom of circuit board 2 is provided with bottom anticollision board 5, the top fixedly connected with bottom limiting block 12 of bottom anticollision board 5, the top of bottom anticollision board 5 is provided with first spring 11, first spring 11 sets up in the inside of circuit board 2, the top of shell 1 is provided with top layer anticollision board 4, the bottom fixedly connected with top layer limiting block 14 of top layer anticollision board 4, the top of top layer anticollision board 4 is provided with second spring 13, second spring 13 sets up the inside on the top of shell 1.
Specifically, the fan protection shell 6 is arranged in the casing 1, the fan 7 is arranged in the fan protection shell 6, the fan 7 has good heat dissipation effect, and a series of dangers such as short circuit and the like can be prevented from occurring due to overhigh temperature of the circuit board 2.
Specifically, the bottom of shell 1 one side is provided with jack 3, and jack 3 is provided with two altogether, and jack 3 makes things convenient for circuit board 2 to cooperate other electrical apparatus to use.
Specifically, connecting bolt 8 is movably connected to the bottom end of circuit board 2, external threads 9 are arranged on the surface of connecting bolt 8, four connecting bolts 8 are arranged, and connecting bolt 8 can separate circuit board 2 from casing 1, so that maintenance personnel can conveniently maintain or repair circuit board 2.
Specifically, the inside of circuit board 2 is provided with internal thread 10, and the inside of shell 1 bottom is provided with internal thread 10, and internal thread 10 cooperates with external screw thread 9 on connecting bolt 8 surface, and connecting bolt 8 is the state of running through with circuit board 2 and shell 1, and internal thread 10 can make things convenient for the maintenance personal to demolish it with external screw thread 9's cooperation, has the effect of save time.
Specifically, the first spring 11 and the second spring 13 are provided with two, and insulating paint is smeared on the outer surface and the inner surface of the shell 1, the top-layer anti-collision plate 4 and the bottom-layer anti-collision plate 5, and can play an insulating role, prevent the short circuit of the circuit board 2 from damaging maintenance personnel, and have a protective role.
Working principle: firstly, assemble shell 1, circuit board 2, fan 7, then throw in connecting bolt 8 from the bottom of circuit board 2, under the cooperation between internal thread 10 and external screw thread 9, connecting bolt 8 can be with shell 1 and circuit board 2 connection and fixed, then connect external power supply, let fan 7 start to work, then connect other electrical apparatus and jack 3 and work, when receiving the striking in the in-process of removal or transport, top layer anticollision board 4 and bottom anticollision board 5 can inwards be sunken, then after the buffering of first spring 11 and second spring 13, top layer anticollision board 4 and bottom anticollision board 5 can rebound, thereby play the effect of anticollision.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims (6)

1. The utility model provides a high-efficient heat dissipation type integrated circuit board, includes shell (1), its characterized in that: the novel anti-collision device is characterized in that a circuit board (2) is movably connected to the bottom of the shell (1), a bottom anti-collision plate (5) is arranged at the bottom of the circuit board (2), a bottom limiting block (12) is fixedly connected to the top of the bottom anti-collision plate (5), a first spring (11) is arranged at the top of the bottom anti-collision plate (5), the first spring (11) is arranged inside the circuit board (2), a top anti-collision plate (4) is arranged at the top of the shell (1), a top limiting block (14) is fixedly connected to the bottom of the top anti-collision plate (4), a second spring (13) is arranged at the top of the top anti-collision plate (4), and the second spring (13) is arranged inside the top of the shell (1).
2. The high-efficiency heat-dissipating integrated circuit board of claim 1, wherein: a fan protection shell (6) is arranged in the shell (1), and a fan (7) is arranged in the fan protection shell (6).
3. The high-efficiency heat-dissipating integrated circuit board of claim 1, wherein: the bottom of shell (1) one side is provided with jack (3), jack (3) are provided with two altogether.
4. The high-efficiency heat-dissipating integrated circuit board of claim 1, wherein: the bottom swing joint of circuit board (2) has connecting bolt (8), the surface of connecting bolt (8) is provided with external screw thread (9), connecting bolt (8) are provided with four altogether.
5. The high-efficiency heat-dissipating integrated circuit board of claim 1, wherein: the inside of circuit board (2) is provided with internal thread (10), the inside of shell (1) bottom is provided with internal thread (10), internal thread (10) and connecting bolt (8) surface's external screw thread (9) mutually support, connecting bolt (8) are run through state with circuit board (2) and shell (1).
6. The high-efficiency heat-dissipating integrated circuit board of claim 1, wherein: the two first springs (11) and the two second springs (13) are arranged in total, and insulating paint is smeared on the outer surfaces and the inner surfaces of the shell (1), the top-layer anti-collision plate (4) and the bottom-layer anti-collision plate (5).
CN202320195272.6U 2023-02-13 2023-02-13 High-efficient heat dissipation type integrated circuit board Active CN219577351U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320195272.6U CN219577351U (en) 2023-02-13 2023-02-13 High-efficient heat dissipation type integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320195272.6U CN219577351U (en) 2023-02-13 2023-02-13 High-efficient heat dissipation type integrated circuit board

Publications (1)

Publication Number Publication Date
CN219577351U true CN219577351U (en) 2023-08-22

Family

ID=87648496

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320195272.6U Active CN219577351U (en) 2023-02-13 2023-02-13 High-efficient heat dissipation type integrated circuit board

Country Status (1)

Country Link
CN (1) CN219577351U (en)

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