CN219574294U

CN219574294U - High-current crimping capacitor quick-changing device for testing high-power semiconductor module

Info

Publication number: CN219574294U
Application number: CN202320932055.0U
Authority: CN
Inventors: 任春茂; 周水明; 王伟群; 董冰萧; 丁志龙
Original assignee: Shenzhen Yuanlichuang Technology Co ltd
Current assignee: Shenzhen Yuanlichuang Technology Co ltd
Priority date: 2023-04-21
Filing date: 2023-04-21
Publication date: 2023-08-22
Anticipated expiration: 2033-04-21

Abstract

The high-current crimping capacitor quick-change device for testing the high-power semiconductor module comprises a module jig and a capacitor supporting plate which can move up and down relative to the module jig, wherein the module jig is used for placing a power semiconductor module to be tested, a packaging capacitor which is electrically connected with the power semiconductor module is arranged on the capacitor supporting plate, the packaging capacitor and the power semiconductor module are respectively provided with a high-voltage positive and negative copper bar and a module positive and negative high-voltage power terminal which are vertically corresponding, and the packaging capacitor is driven by the capacitor supporting plate to realize the compression and electrical contact of the high-voltage positive and negative copper bar and the module positive and negative high-voltage power terminal; the capacitor support plate is provided with a plurality of groups of screw holes for fixedly connecting the packaging capacitors, and different screw holes are used for fixedly connecting the packaging capacitors with different sizes. The utility model can more flexibly match the packaging of the power semiconductor module, and the packaging capacitance changes along with the module packaging change without repeated design and increase of system material number, thereby improving the testing efficiency and reducing the testing cost.

Description

High-current crimping capacitor quick-changing device for testing high-power semiconductor module

Technical Field

The utility model relates to the field of reactive automatic testing equipment, in particular to a high-current crimping capacitor quick-changing device for testing a high-power semiconductor module, which is used for realizing quick change of a capacitor in a main loop of the power semiconductor module testing equipment.

Background

At present, a main loop of the automatic testing equipment for the high-power semiconductor module is generally connected with a high-voltage positive terminal and a high-voltage negative terminal of the tested power semiconductor module in a crimping manner after adopting a direct-current link filter capacitor positive and negative terminals, and has the following advantages and disadvantages: the advantage is that the wireless cable is connected, the main loop is short, and the noise is low; the system has the defects that the system cannot be compatible with various packaging modules, needs repeated design, increases design workload, increases system material number, causes test assembly trouble and has high cost.

Disclosure of Invention

Based on the above, the utility model provides a high-current crimping capacitor quick-change device for testing a high-power semiconductor module.

In order to achieve the above purpose, the utility model provides a high-current crimping capacitor quick-change device for testing a high-power semiconductor module, which comprises a module jig and a capacitor support plate capable of moving up and down relative to the module jig, wherein the module jig is used for placing a power semiconductor module to be tested, the capacitor support plate is used for placing a packaging capacitor electrically connected with the power semiconductor module, the packaging capacitor and the power semiconductor module are respectively provided with a high-voltage positive and negative copper bar and a module positive and negative high-voltage power terminal which are vertically corresponding, and the packaging capacitor is driven by the capacitor support plate to realize the compression and the electrical contact between the high-voltage positive and negative copper bar and the module positive and negative high-voltage power terminal;

the packaging capacitor is fixedly connected to the capacitor support plate through screws, a plurality of groups of screw holes used for fixedly connecting the packaging capacitor are formed in the capacitor support plate, and different screw holes are used for fixedly connecting the packaging capacitors in different sizes.

As a further preferable technical scheme of the utility model, the bottom of the capacitor support plate is connected with a power device, and the capacitor support plate is driven by the power device to move up and down.

As a further preferable technical scheme of the utility model, the power device is any one of a cylinder, a hydraulic cylinder or an electric cylinder.

As a further preferable technical scheme of the utility model, the capacitor support plate is connected with a guide component, and the capacitor support plate is guided by the guide component when moving up and down.

As a further preferable technical scheme of the utility model, the guide assembly comprises a guide post which is vertically arranged, the top end of the guide post is fixedly connected with the capacitor support plate, a sliding sleeve is sleeved on the guide post, and the sliding sleeve is used for being connected with an external support device.

As a further preferable technical scheme of the utility model, the front side edge of the capacitor support plate is provided with a copper bar support row, and the high-voltage positive and negative copper bars of the packaging capacitor are placed on the copper bar support row.

As a further preferable technical scheme of the utility model, the front side of the capacitor support plate is provided with a discharge resistor through a bracket.

The high-current crimping capacitor quick-change device for testing the high-power semiconductor module can achieve the following beneficial effects by adopting the technical scheme: the packaging capacitor moves up and down under the drive of the capacitor support plate to realize the electrical connection between the packaging capacitor and the power semiconductor module, and meanwhile, a plurality of groups of screw holes are formed in the capacitor support plate to match the packaging capacitors with different sizes, so that the packaging capacitor can be more flexibly matched with the packaging of the power semiconductor module, and the packaging capacitor changes along with the packaging change of the module (the power semiconductor module), so that repeated design and increase of system material numbers are not needed, the testing efficiency is improved, and the testing cost is reduced.

Drawings

The utility model will be described in further detail with reference to the drawings and the detailed description.

Fig. 1 is a schematic structural diagram of a high-current crimping capacitor quick-change device for testing a high-power semiconductor module, which is matched with a package capacitor with a large size.

Fig. 2 is a schematic structural diagram of a high-current crimping capacitor quick-change device for testing a high-power semiconductor module, which is matched with a small-size packaging capacitor.

In the figure: 1. a capacitor supporting plate, 2, a packaging capacitor, 3, a discharge resistor, 4, high-voltage positive and negative copper bars, 5, a guide component, 6, an air cylinder, 7, a module jig, 8, a power semiconductor module, 9 and positive and negative high-voltage power terminals of the module.

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The utility model will be further described with reference to the drawings and detailed description. The terms such as "upper", "lower", "left", "right", "middle" and "a" in the preferred embodiments are merely descriptive, but are not intended to limit the scope of the utility model, as the relative relationship changes or modifications may be otherwise deemed to be within the scope of the utility model without substantial modification to the technical context.

As shown in fig. 1 and 2, the utility model provides a high-current crimping capacitor quick-change device for testing a high-power semiconductor module, which comprises a module jig and a capacitor support plate 1 capable of moving up and down relative to the module jig, wherein the module jig is used for placing a power semiconductor module 8 to be tested, the capacitor support plate 1 is used for placing a packaging capacitor 2 electrically connected with the power semiconductor module 8, the packaging capacitor 2 and the power semiconductor module 8 are respectively provided with a high-voltage positive and negative copper bar 4 and a module positive and negative high-voltage power terminal 9 which are vertically corresponding, and the packaging capacitor 2 is driven by the capacitor support plate 1 to realize the compression and the electrical contact between the high-voltage positive and negative copper bar 4 and the module positive and negative high-voltage power terminal 9;

the bottom of the capacitor support plate 1 is connected with a power device, the capacitor support plate 1 is driven by the power device to move up and down, and preferably, the power device is any one of a cylinder 6, a hydraulic cylinder or an electric cylinder. The power means in this embodiment is a cylinder 6.

The capacitor support plate 1 is connected with a guide assembly 5, and the capacitor support plate 1 is guided by the guide assembly 5 when moving up and down. Preferably, the guide assembly 5 comprises a guide pillar arranged vertically, the top end of the guide pillar is fixedly connected with the capacitor support plate 1, a sliding sleeve is sleeved on the guide pillar, and the sliding sleeve is used for being connected with an external support device.

The packaging capacitor 2 is fixedly connected to the capacitor support plate 1 through screws, a plurality of groups of screw holes used for fixedly connecting the packaging capacitor 2 are formed in the capacitor support plate 1, and different screw holes are used for fixedly connecting the packaging capacitors 2 in different sizes. The package capacitor 2 in fig. 1 is a large-size package capacitor 2, the package capacitor 2 in fig. 2 is a small-size package capacitor 2, and the two sizes of package capacitors 2 are fixed on the capacitor support plate 1 through different screw holes, so that in the testing process, the package capacitors 2 with different sizes can be selected and installed on the capacitor support plate 1 according to requirements so as to realize matching with the tested power semiconductor module 8.

In an implementation, a copper bar support bar is arranged at the front edge of the capacitor support plate 1, and the high-voltage positive and negative copper bars 4 of the packaged capacitor 2 are placed on the copper bar support bar.

In another implementation, the front side of the capacitor support plate 1 is also provided with a discharge resistor 3 through a bracket.

While particular embodiments of the present utility model have been described above, it will be appreciated by those skilled in the art that these are merely illustrative, and that many variations or modifications may be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined only by the appended claims.

Claims

1. The high-current crimping capacitor quick-change device for testing the high-power semiconductor module is characterized by comprising a module jig and a capacitor supporting plate which can move up and down relative to the module jig, wherein the module jig is used for placing a power semiconductor module to be tested, the capacitor supporting plate is used for placing a packaging capacitor which is electrically connected with the power semiconductor module, the packaging capacitor and the power semiconductor module are respectively provided with a high-voltage positive and negative copper bar and a module positive and negative high-voltage power terminal which are vertically corresponding, and the packaging capacitor is driven by the capacitor supporting plate to realize the compression and the electrical contact of the high-voltage positive and negative copper bar and the module positive and negative high-voltage power terminal;

2. The high-current crimping capacitor quick-change device for testing the high-power semiconductor module according to claim 1, wherein a power device is connected to the bottom of the capacitor support plate, and the capacitor support plate moves up and down under the driving of the power device.

3. The high-current crimping capacitor quick-change device for testing the high-power semiconductor module according to claim 2, wherein the power device is any one of an air cylinder, a hydraulic cylinder or an electric cylinder.

4. The high-current crimping capacitor quick-change device for testing a high-power semiconductor module according to claim 1, wherein the capacitor support plate is connected with a guide assembly, and the capacitor support plate is guided by the guide assembly when moving up and down.

5. The high-current crimping capacitor quick-change device for testing the high-power semiconductor module according to claim 4, wherein the guide assembly comprises a guide pillar which is vertically arranged, the top end of the guide pillar is fixedly connected with the capacitor support plate, a sliding sleeve is sleeved on the guide pillar, and the sliding sleeve is used for being connected with an external support device.

6. The high-current crimping capacitor quick-change device for testing a high-power semiconductor module according to claim 1, wherein a copper bar support bar is arranged on the front side edge of the capacitor support plate, and high-voltage positive and negative copper bars of the packaging capacitor are placed on the copper bar support bar.

7. The high-current crimping capacitor quick-change device for testing a high-power semiconductor module according to claim 1, wherein a discharge resistor is mounted on the front side of the capacitor support plate through a bracket.