CN218181025U

CN218181025U - Cantilever large-size large-current measurement probe card testing device

Info

Publication number: CN218181025U
Application number: CN202221777925.3U
Authority: CN
Inventors: 张磊
Original assignee: Wuxi Proka Technology Co ltd
Current assignee: Wuxi Proka Technology Co ltd
Priority date: 2022-07-11
Filing date: 2022-07-11
Publication date: 2022-12-30
Anticipated expiration: 2032-07-11

Abstract

The utility model discloses a cantilever jumbo size heavy current measurement probe card testing arrangement, belong to semiconductor testing arrangement field, including the locating support and set up the arm on the locating support, a plurality of slots have been seted up to the lower extreme of locating support, the upper wall of slot is provided with buffer gear, the inside of slot is pegged graft and is had the probe card, the mounting groove has been seted up to one side of slot, the upper wall fixed mounting of mounting groove has the signal output jack, the one end fixed mounting of probe card has the adapter plug with signal output jack looks adaptation, slot opening keeps away from one side of mounting groove and is provided with locking mechanism, one side fixed mounting of locating support has square pipe, the leading-out terminal of signal output jack extends inside the square inlet, the outside fixed mounting of arm has total spool, it can realize practicing thrift the operating procedure of chip one by one, can detect the chip in batches greatly, conveniently improve testing arrangement's measuring volume, it tests fast to be convenient for big batch chip.

Description

Cantilever jumbo size heavy current measurement probe card testing arrangement

Technical Field

The utility model relates to a semiconductor testing arrangement field, more specifically say, relate to a cantilever jumbo size heavy current measurement probe card testing arrangement.

Background

The probe card is a test interface, is often set up on the assembly line, is used for the chip test, especially when the chip is produced and tested in batches, integrate multiple probe cards on a cantilever, and put through the heavy current, facilitate testing multiple chips at the same time;

through patent retrieval, the chinese patent with publication number CN212845774U discloses a probe card testing device, which comprises a detection bin, a probe card unit, a chip unit, a detection unit, an adjusting and positioning mechanism, a probe card fixture, a bearing table, a chip accommodating groove, a telescopic supporting member, a limiting structure, a return spring, a clamping block and a bump, wherein although the probe card unit is clamped by the probe card fixture, the relative position of the probe card fixture and the chip to be tested is adjustable, the use is convenient, and meanwhile, the position of the chip to be tested is limited by the limiting structure, so that the displacement of the chip to be tested in the accommodating groove is prevented, and the reliability of the test is ensured;

however, the problem that the conventional probe card testing device detects chips one by clamping a single probe card unit through a probe card clamp in the process of testing a large number of chips is not solved, the testing amount is small, the chip units need to be clamped one by one, and the large number of chips are inconvenient to test quickly, so that the cantilever large-size large-current measuring probe card testing device is provided.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved

To the problem that exists among the prior art, the utility model aims to provide a cantilever jumbo size heavy current measurement probe card testing arrangement, it can realize practicing thrift the operating procedure of clamping chip one by one, can detect the chip in batches greatly, conveniently improves testing arrangement's test volume, and the big batch chip of being convenient for carries out the high-speed test.

2. Technical scheme

In order to solve the above problems, the utility model adopts the following technical proposal.

The utility model provides a cantilever jumbo size heavy current measurement probe card testing arrangement, includes locating support and the arm of setting on locating support, a plurality of slots have been seted up to locating support's lower extreme, the top of slot is provided with buffer gear, the inside grafting of slot has the probe card, the mounting groove has been seted up to one side of slot, the top fixed mounting of mounting groove has the signal output jack, the one end fixed mounting of probe card has the patchplug with signal output jack looks adaptation, the slot opening is kept away from one side of mounting groove and is provided with locking mechanism.

Further, one side fixed mounting of locating support has square pipe, the leading-out terminal of signal output jack extends into square intraduct, the outside fixed mounting of arm has the bus pipe.

Furthermore, buffer gear is including a plurality of springs of fixed mounting in the slot inner wall, the one end fixed mounting of spring has the insulation board.

Furthermore, locking mechanism is including articulating at slot open-ended apron, the equal fixed mounting in both sides of apron has the magnetite, the slot that staggers of magnetite.

Furthermore, a plurality of pressure bars are fixedly arranged at one end of the cover plate far away from the slot, and the pressure bars are respectively staggered with the probe end of the probe card.

Furthermore, the width of the slot is larger than that of the mounting groove, and the signal output jacks and the insulating plate are staggered in the horizontal direction.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages of:

(1) When the scheme works, the adapter plug is inserted into the signal output jack, the probe card is inserted into the slot, the locking mechanism is used for fixing, a large number of chips are placed on the conveying belt in an orderly arrangement mode, the positioning support is driven to move along the vertical direction through the mechanical arm, when the positioning support descends, the probe cards are respectively contacted into a row of chips, when the positioning support ascends, the probe card leaves the chips, the conveying belt intermittently drives the large number of chips to advance, the chips which are not tested move to the position under the probe card, the operation steps of clamping the chips one by one are saved, the chips can be detected in a large scale, the test quantity of the test device is conveniently improved, the large number of chips can be rapidly tested conveniently, when a single probe card is damaged, the probe card can be replaced by pulling out the adapter plug in the signal output jack, the operation steps of detaching the whole test device and replacing the circuit where the probe card is located are saved, and the cost required by maintaining the probe card during the test of the large number of chips is reduced.

(2) When the probe card needs to be assembled, the cover plate with the opening of the slot is rotated forwards, the magnet leaves the positioning support, the probe card is inserted into the slot, the cover plate is rotated backwards again until the magnet is tightly attached to the positioning support, the positioning support and the cover plate are tensioned by the magnet under the action of a magnetic field, so that the probe card in the slot is compressed by the cover plate, the probe card can be locked, and when the probe card needs to be disassembled, the probe card can be taken out by opening the cover plate with the opening of the slot, the probe card is convenient to disassemble and assemble quickly, and the working time consumed by maintaining the probe card during large-batch chip testing is reduced.

Drawings

Fig. 1 is a schematic structural view of the front view of the present invention;

fig. 2 is a schematic structural view of the present invention viewed from the bottom;

fig. 3 is a schematic sectional view of the positioning bracket of the present invention;

fig. 4 is an enlarged schematic structural diagram of a point a in fig. 2 according to the present invention.

The reference numbers in the figures illustrate:

1. positioning the bracket; 2. a mechanical arm; 3. a slot; 4. a probe card; 5. mounting grooves; 6. a signal output jack; 7. a patch plug; 8. a square tube; 9. a bus pipe; 10. a spring; 11. an insulating plate; 12. a cover plate; 13. a magnet; 14. a pressure lever.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.

Example (b):

referring to fig. 1-4, a cantilever large-size large-current measurement probe card testing device comprises a positioning bracket 1 and a mechanical arm 2 arranged on the positioning bracket 1, wherein one end of the mechanical arm 2 away from the positioning bracket 1 is hinged with a conveyor belt, the technical scheme is the prior art, not shown in the figures, the lower end of the positioning bracket 1 is provided with a plurality of slots 3, the top of each slot 3 is provided with a buffer mechanism, a probe card 4 is inserted into each slot 3, the probe end of the probe card 4 extends out of each slot 3, one side of each slot 3 is provided with a mounting groove 5, the width of each slot 3 is larger than that of each mounting groove 5, the top of each mounting groove 5 is fixedly provided with a signal output jack 6, one end of each signal output jack 6 away from each slot 3 is electrically connected to a host through a cable, one end of each probe card 4 is fixedly provided with an adapter plug 7 matched with the signal output jack 6, the side of the opening of the slot 3, which is far away from the mounting groove 5, is provided with a locking mechanism, when in work, an adapter plug 7 is inserted into a signal output jack 6, then a probe card 4 is inserted into the slot 3, the probe cards 4 are fixed by the locking mechanism to be distributed at the lower end of the positioning bracket 1 in order, a large batch of chips are placed on a conveyor belt in order, the positioning bracket 1 is driven by the mechanical arm 2 to move along the vertical direction, when the positioning bracket 1 descends, the probe cards 4 are respectively contacted into a row of chips, when the positioning bracket 1 ascends, the probe cards 4 leave the chips, the conveyor belt drives the large batch of chips to move intermittently, so that the chips which are not tested are moved to the right below the probe cards 4, the operation steps of clamping the chips one by one are saved, the chips can be detected in a large batch, the test quantity of the test device is conveniently improved, and the large batch of chips can be tested quickly, when a single probe card 4 is damaged, the probe card 4 can be replaced by pulling out the adapter plug 7 in the signal output jack 6, so that the operation steps of disassembling the whole testing device and replacing the circuit of the probe card 4 are saved, and the cost required by maintaining the probe card 4 during large-scale chip testing is reduced.

Referring to fig. 1 and 3, the locking mechanism includes a cover plate 12 hinged to an opening of the slot 3, a gap is left between the cover plate 12 and a probe end of the probe card 4, magnets 13 are fixedly mounted on both sides of the cover plate 12, the positioning support 1 is made of magnetic metal, the magnets 13 attract the positioning support 1 conveniently, the magnets 13 stagger the slot 3, when the probe card 4 needs to be mounted, the cover plate 12 with the opening of the slot 3 is rotated forward, the magnets 13 leave the positioning support 1, the probe card 4 is inserted into the slot 3, and then the cover plate 12 is rotated backward until the magnets 13 cling to the positioning support 1, under the action of a magnetic field, the magnets 13 strain the positioning support 1 and the cover plate 12, so that the cover plate 12 presses the probe card 4 in the slot 3 to lock the probe card 4, when the probe card 4 needs to be dismounted, the probe card 4 can be taken out by opening the cover plate 12 with the opening of the slot 3, the probe card 4 is convenient to be dismounted quickly, and the working time consumed for maintaining the probe card 4 in a large-scale chip test is reduced.

Referring to fig. 3, the buffer mechanism includes a plurality of springs 10 fixedly installed on the inner wall of the slot 3, an insulating plate 11 is fixedly installed at one end of each spring 10, the signal output jacks 6 and the insulating plate 11 are staggered along the horizontal direction, when the probe end of the probe card 4 contacts with a chip, the insulating plate 11 is pushed to extrude the springs 10, the springs 10 are compressed and the elastic potential energy is increased, a margin is conveniently reserved for the lifting movement of the positioning support 1, the extrusion action applied to the chip by the probe end of the probe card 4 can be buffered, and the chip extruded and deformed by the probe card 4 is reduced.

Referring to fig. 3 and 4, a plurality of pressing rods 14 are fixedly installed at one end of the cover plate 12 away from the slot 3, the plurality of pressing rods 14 are distributed along a horizontal array, the plurality of pressing rods 14 are respectively staggered with a probe end of the probe card 4, and the length of the cover plate 12 is extended by the pressing rods 14, so that the contact area between the cover plate 12 and the probe card 4 is conveniently increased, and a larger area of the probe card 4 is pressed.

Referring to fig. 2 and 4, one side fixed mounting of locating support 1 has square pipe 8, the leading-out terminal of signal output jack 6 extends inside square pipe 8, the outside fixed mounting of arm 2 has bus pipe 9, the cable on the signal output jack 6 is accomodate through square pipe 8 and bus pipe 9, bus pipe 9 is the bellows, when probe card 4's probe end contacts the chip pin, the heavy current is carried for probe card 4 through the cable, until reaching on the chip, protect the cable through square pipe 8 and bus pipe 9 simultaneously, can arrange the cable, reduce the cable that drops on the chip.

The working principle is as follows: when the test device works, the adapter plugs 7 are inserted into the signal output jacks 6, the probe cards 4 are inserted into the slots 3 and are fixed through the locking mechanism, the probe cards 4 are distributed to the lower end of the positioning support 1 in order, a large number of chips are placed on the conveying belt in order, the positioning support 1 is driven to move in the vertical direction through the mechanical arm 2, when the positioning support 1 descends, the probe cards 4 are respectively contacted into a row of chips, when the positioning support 1 ascends, the probe cards 4 leave the chips, the conveying belt intermittently drives the large number of chips to advance, the chips which are not tested move to the position under the probe cards 4, the operation steps of clamping the chips one by one are saved, the chips can be detected in a large scale, the test quantity of the test device is conveniently improved, the large number of chips can be rapidly tested, when a single probe card 4 is damaged, the probe card 4 can be replaced by pulling out the adapter plugs 7 in the signal output jacks 6, the probe cards 4 are saved, and the operation steps of detaching the whole test device and replacing the circuits of the probe cards 4 are saved, and the cost required by maintaining the chips in the large number of chips during the test is reduced.

When the probe card 4 needs to be installed, the cover plate 12 with the opening of the slot 3 is rotated forward, the magnet 13 leaves the positioning support 1, the probe card 4 is inserted into the slot 3, the cover plate 12 is rotated backward again until the magnet 13 is tightly attached to the positioning support 1, and under the action of a magnetic field, the magnet 13 tensions the positioning support 1 and the cover plate 12, so that the cover plate 12 presses the probe card 4 in the slot 3, the probe card 4 can be locked, when the probe card 4 needs to be disassembled, the probe card 4 can be taken out by opening the cover plate 12 with the opening of the slot 3, the rapid disassembly and assembly of the probe card 4 are facilitated, and the working time consumed by maintaining the probe card 4 during large-scale chip testing is reduced.

The foregoing is only a preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. The utility model provides a cantilever jumbo size heavy current measurement probe card testing arrangement, includes locating support (1) and sets up arm (2) on locating support (1), its characterized in that: the lower end of the positioning support (1) is provided with a plurality of slots (3), the top of each slot (3) is provided with a buffer mechanism, a probe card (4) is inserted into the slots (3), one side of each slot (3) is provided with a mounting groove (5), the top of each mounting groove (5) is fixedly provided with a signal output jack (6), one end of each probe card (4) is fixedly provided with a patch plug (7) matched with the signal output jack (6), and one side, away from the mounting grooves (5), of the opening of each slot (3) is provided with a locking mechanism.

2. The cantilever large-size large-current measurement probe card testing device of claim 1, wherein: one side fixed mounting of locating support (1) has square pipe (8), the leading-out terminal of signal output jack (6) extends inside square pipe (8), the outside fixed mounting of arm (2) has total spool (9).

3. The cantilever large-size large-current measurement probe card testing device of claim 1, wherein: buffer gear includes a plurality of springs (10) of fixed mounting in slot (3) inner wall, the one end fixed mounting of spring (10) has insulation board (11).

4. The cantilever large-size large-current measurement probe card testing device of claim 1, wherein: locking mechanism is including articulating at slot (3) open-ended apron (12), the equal fixed mounting in both sides of apron (12) has magnetite (13), slot (3) are stagger in magnetite (13).

5. The cantilever large-size large-current measurement probe card testing device of claim 4, wherein: one end, far away from the slot (3), of the cover plate (12) is fixedly provided with a plurality of pressing rods (14), and the pressing rods (14) are staggered with the probe end of the probe card (4) respectively.

6. The cantilever large-size large-current measurement probe card testing device of claim 3, wherein: the width of the slot (3) is larger than that of the mounting groove (5), and the signal output jack (6) and the insulating plate (11) are staggered in the horizontal direction.