CN111323730B - Automated optical sensor test equipment - Google Patents

Abstract

The invention relates to the technical field of test equipment, in particular to automatic optical sensor test equipment, which comprises a frame and a workbench, wherein the workbench is provided with a carrier module, a probe module, a compression power mechanism, a test module, a scanning module and a scanning power mechanism; the invention has high automation degree in the whole test process, not only can reduce the labor cost, but also can improve the test efficiency and the test stability.

Description

Automated optical sensor test equipment

Technical field:

The present invention relates to the technical field of testing equipment, and in particular to an automated optical sensor testing equipment.

Background technology:

The popularity of smart devices such as smartphones, smart watches, and tablets has made market competition particularly fierce, and the requirements for delivery timeliness are particularly strong. At the same time, users' quality requirements for electronic consumer products are gradually increasing. These two factors have led manufacturers to have higher requirements for the delivery speed and assembly yield of electronic consumer products. Therefore, it is necessary to improve the delivery yield of electronic products and shorten the delivery time. This has led to new requirements for automated testing equipment.

When conducting incoming material testing on optical sensors, it is necessary to connect the microneedle module to the connector of the device under test to test the open circuit, short circuit, and capacitance value, and use black and white cards to test the performance of the optical sensor in the device under test. However, most of the current tests are still performed manually, which is not only cumbersome to operate, but also inefficient.

Summary of the invention:

The purpose of the present invention is to provide an automated optical sensor testing device to address the deficiencies in the prior art, which can not only reduce labor costs but also improve test efficiency and enhance test stability.

In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: automated optical sensor testing equipment, including a frame and a workbench arranged on the frame, the workbench is provided with a carrier module for clamping the device under test, a probe module for connecting the connector of the device under test and exporting signals, a clamping module for plugging the device under test on the probe module, a clamping power mechanism for driving the clamping module to move above the device under test and press down, a test module for testing the device under test, a scanning module for scanning the two-dimensional code information of the device under test, and a scanning power mechanism for driving the scanning module to move above the device under test, the probe module is located inside the carrier module, the clamping power mechanism drives the clamping module to connect, the test module is located at the bottom of the carrier module, and the scanning power mechanism drives the scanning module to connect.

A further improvement to the above scheme is that the carrier module includes a carrier base arranged on the workbench, and an adsorption device arranged at the bottom of the carrier base. The top of the carrier base is provided with a mounting slot matching the device under test and a positioning hole for assisting the pressing module to press down. The bottom surface of the mounting slot is provided with a suction hole for adsorbing and fixing the device under test, and the suction hole is connected to the adsorption device through an air pipe.

A further improvement to the above scheme is that the clamping module includes a clamping base plate arranged on the workbench, two clamping support plates respectively arranged on both sides of the clamping base plate, two groups of clamping slide rails respectively arranged on the two clamping support plates, two slide plates respectively slidably connected to the two groups of clamping slide rails, and a clamping plate assembly, the two clamping support plates are respectively provided with guide grooves, the two slide plates are respectively provided with inclined holes along the inclined direction, guide shafts are respectively connected between the two slide plates and the clamping support plates on the corresponding side, one end of each guide shaft is rolled in the guide groove, and the other end of each guide shaft is inserted into the clamping plate assembly through the inclined hole, and the two slide plates are connected to the output end of the clamping power mechanism.

A further improvement to the above solution is that the guide groove is an L-shaped structure.

A further improvement to the above scheme is that the pressure plate assembly includes a cover plate, a clamping needle plate, and a pressure plate from top to bottom, the two sides of the cover plate are respectively connected to the guide shaft on the corresponding side, a probe is provided on the clamping needle plate, and a buffer spring is provided between the clamping needle plate and the cover plate.

A further improvement to the above solution is that a positioning pin is provided on the bottom surface of the pressing plate.

A further improvement to the above scheme is that the scanning module includes a scanning slide rail arranged on the workbench, a scanning slide slidably connected to the scanning slide rail, a scanning support plate vertically arranged on the scanning slide, a height adjustment block arranged on the scanning support plate, a scanning fixed block, and a scanning module, the scanning support plate is connected to the output end of the scanning power mechanism, and the scanning module is connected to the height adjustment block through the scanning fixed block.

A further improvement to the above scheme is that the scanning support plate and the height adjustment block are connected by screws, and the scanning support plate is provided with a height adjustment mounting hole along the vertical direction, and the height adjustment mounting hole is a waist-shaped hole, and one end of the screw with a thread passes through the height adjustment block mounting hole and is threadedly connected to the height adjustment block, the scanning fixing block and the height adjustment block are connected by screws, the scanning fixing block is a U-shaped structure and its opening direction is toward one side of the scanning support plate, and angle adjustment holes are provided at both front and rear ends of the scanning fixing block, and the angle adjustment holes are arc-shaped holes, and one end of the screw with a thread passes through the angle adjustment hole and is threadedly connected to the height adjustment block, the scanning module and the scanning fixing block are connected by screws, and the scanning fixing block is provided with a scanning module mounting hole, and the scanning module mounting hole is a waist-shaped hole, and one end of the screw with a thread passes through the scanning module mounting hole and is threadedly connected to the scanning module.

A further improvement to the above scheme is that the test module includes a black card fixing plate arranged at the bottom of the carrier module, a black card arranged on the black card fixing plate, a white card fixing plate slidably connected to the workbench, a white card arranged on the white card fixing plate, and a test power mechanism that drives the white card fixing plate to move to the bottom of the device under test and above the black card, and the black card is located below the device under test.

A further improvement to the above scheme is that the probe module includes a floating needle plate, an upper needle plate, a lower needle plate, an adapter plate, and a wire pressing plate from top to bottom, a probe is provided between the upper needle plate and the lower needle plate, and the wire pressing plate is arranged inside the carrier base.

The beneficial effects of the present invention are as follows: the automated optical sensor testing equipment provided by the present invention comprises a frame and a workbench arranged on the frame, the workbench is provided with a carrier module for clamping a device under test, a probe module for connecting a connector of the device under test and deriving a signal, a clamping module for plugging the device under test on the probe module, a clamping power mechanism for driving the clamping module to move above the device under test and press down, a test module for testing the device under test, a scanning module for scanning the two-dimensional code information of the device under test, and a scanning power mechanism for driving the scanning module to move above the device under test, the probe module is located inside the carrier module, the clamping power mechanism drives the clamping module to be connected, the test module is located at the bottom of the carrier module, and the scanning power mechanism drives the scanning module to be connected; the present invention uses a clamping power mechanism to connect the clamping module to the test module; The force mechanism drives the clamping module to plug the connector of the device under test onto the probe module, and the test module performs black card and white card tests on the device under test. The scanning power mechanism drives the scanning component to scan the two-dimensional code information of the device under test. The entire test process has a high degree of automation, which can not only reduce labor costs, but also improve test efficiency and enhance test stability. In addition, the present invention can adjust the height of the scanning module by adjusting the installation position of the height adjustment block on the scanning support plate and the installation position of the scanning module on the scanning fixed block, and can adjust the angle of the scanning module by adjusting the installation positions of the scanning fixed block and the height adjustment block, thereby ensuring the scanning effect and being applicable to a variety of usage scenarios. In addition, the probe module of the present invention not only occupies a small proportion, but also has high test accuracy.

Description of the drawings:

FIG1 is a schematic structural diagram of the present invention.

FIG. 2 is a schematic structural diagram of a carrier module of the present invention.

FIG. 3 is a schematic diagram of the structure of the probe module of the present invention.

FIG. 4 is a schematic structural diagram of the compression module of the present invention.

FIG. 5 is a schematic structural diagram of a test module of the present invention.

FIG. 6 is a schematic structural diagram of a scanning module of the present invention.

Description of the accompanying drawings: frame 1, workbench 2, carrier module 3, carrier base 31, mounting slot 32, positioning hole 33, suction hole 34, air pipe 35, positioning copper sleeve 36, probe module 4, floating needle plate 41, upper needle plate 42, lower needle plate 43, adapter plate 44, wire pressing plate 45, pressing module 5, pressing bottom plate 51, pressing support plate 52, guide groove 521, pressing slide rail 53, slide plate 54, inclined hole 541, pressing plate assembly 55, cover plate 551, pressing needle plate 552, pressing plate 553, Probe 554, positioning pin 555, guide shaft 56, bearing 57, clamping power mechanism 6, test module 7, black card fixing plate 71, black card 72, white card fixing plate 73, white card 74, test power mechanism 75, scanning module 8, scanning slide rail 81, scanning slide 82, scanning support plate 83, height adjustment mounting hole 831, height adjustment block 84, scanning fixing block 85, angle adjustment hole 851, scanning module mounting hole 852, scanning module 86, protective shell 87, scanning power mechanism 9.

Specific implementation method:

The present invention is further described below in conjunction with the accompanying drawings. As shown in Figures 1 to 6, the present invention includes a frame 1, a workbench 2 arranged on the frame 1, the workbench 2 is provided with a carrier module 3 for clamping a device under test, a probe module 4 for connecting a connector of the device under test and deriving a signal, a clamping module 5 for plugging the device under test on the probe module 4, a clamping power mechanism 6 for driving the clamping module 5 to move above the device under test and press down, a test module 7 for testing the device under test, a scanning module 8 for scanning the two-dimensional code information of the device under test, and a scanning power mechanism 9 for driving the scanning module 8 to move above the device under test, the probe module 4 is located inside the carrier module 3, the clamping power mechanism 6 drives the connection clamping module 5, the test module 7 is located at the bottom of the carrier module 3, and the scanning power mechanism 9 drives the connection scanning module 8.

The carrier module 3 includes a carrier base 31 arranged on the workbench 2, and an adsorption device arranged at the bottom of the carrier base 31. The top of the carrier base 31 is provided with a mounting groove 32 matching the device under test, and a positioning hole 33 for assisting the pressing module 5 to press down. The positioning hole 33 is plugged with a positioning copper sleeve 36. The bottom surface of the mounting groove 32 is provided with a suction hole 34 for adsorbing and fixing the device under test, and the suction hole 34 is connected to the adsorption device through an air pipe 35.

The clamping module 5 includes a clamping base plate 51 arranged on the workbench 2, two clamping support plates 52 respectively arranged on both sides of the clamping base plate 51, two sets of clamping slide rails 53 respectively arranged on the two clamping support plates 52, two slide plates 54 respectively slidably connected to the two sets of clamping slide rails 53, and a clamping plate assembly 55. The two clamping support plates 52 are respectively provided with guide grooves 521, and the guide grooves 521 are L-shaped structures. The clamping power mechanism 6 drives the clamping plate assembly 55 to move forward to the top of the device under test and then press down. The two slide plates 54 are respectively provided with inclined holes 541 along the inclined direction, and guide shafts 56 are respectively connected between the two slide plates 54 and the clamping support plate 52 on the corresponding side. One end of each guide shaft 56 is rolled in the guide groove 521, and the other end of each guide shaft 56 passes through the inclined hole 541 and is inserted into the pressure plate assembly 55. Each of the guide shafts 56 is sleeved with two bearings 57, one of which is rolled in the guide groove 521, and the other is rolled in the inclined hole 541. The two slide plates 54 are connected to the output end of the clamping power mechanism 6.

The pressure plate assembly 55 includes a cover plate 551, a clamping needle plate 552, and a pressure plate 553 from top to bottom. The two sides of the cover plate 551 are respectively connected to the guide shaft 56 on the corresponding side. A probe 554 is provided on the clamping needle plate 552. A buffer spring is provided between the clamping needle plate 552 and the cover plate 551, which can play a buffering role during the pressing process, thereby protecting the probe 554 on the clamping needle plate. A positioning pin 555 is provided on the bottom surface of the pressure plate 553. During the pressing process, the positioning pin 555 is inserted into the positioning copper sleeve 36, which can ensure the pressing accuracy, thereby ensuring the accuracy of inserting the connector of the device under test into the probe module 4.

The scanning module 8 includes a scanning rail 81 arranged on the workbench 2, a scanning slide 82 slidably connected to the scanning rail 81, a scanning support plate 83 vertically arranged on the scanning slide 82, a height adjustment block 84 arranged on the scanning support plate 83, a scanning fixed block 85, and a scanning module 86. The scanning support plate 83 is connected to the output end of the scanning power mechanism 9, and the scanning module 86 is connected to the height adjustment block 84 through the scanning fixed block 85. The scanning module 8 can quickly and accurately scan the two-dimensional code information of the device under test, which can not only reduce a lot of workload but also improve the scanning efficiency.

The scanning support plate 83 is connected to the height adjustment block 84 by screws. The scanning support plate 83 is provided with a height adjustment mounting hole 831 in the vertical direction. The height adjustment mounting hole 831 is a waist-shaped hole. One end of the screw with a thread passes through the mounting hole of the height adjustment block 84 and is threadedly connected to the height adjustment block 84. The scanning fixed block 85 is connected to the height adjustment block 84 by screws. The scanning fixed block 85 is a U-shaped structure and its opening direction faces one side of the scanning support plate 83. The front and rear ends of the scanning fixed block 85 are provided with angle adjustment holes 851. The angle adjustment hole 851 is an arc-shaped hole. One end of the screw with a thread passes through the angle adjustment hole 851 and is threadedly connected to the height adjustment block 84. The scanning module 86 is connected to the scanning fixed block 85 by screws. The scanning fixed block 85 is provided with a scanning module mounting hole 852. The scanning module mounting hole 852 is a waist-shaped hole. One end of the screw with a thread passes through the scanning module mounting hole 852 and is threadedly connected to the scanning module 86. The height of the scanning module 86 can be adjusted by adjusting the mounting position of the height adjustment block 84 on the scanning support plate 83 and the mounting position of the scanning module 86 on the scanning fixed block 85. The angle of the scanning module 86 can be adjusted by adjusting the mounting position of the scanning fixed block 85 and the height adjustment block 84, thereby ensuring the scanning effect and being applicable to a variety of usage occasions.

The scanning module 86 is covered with a protective shell 87 , and the front and rear ends of the protective shell 87 are respectively connected to the front and rear ends of the scanning fixed block 85 , which can prevent the scanning module 86 from being damaged, thereby ensuring the normal operation of the scanning module 86 .

The test module 7 includes a black card fixing plate 71 arranged at the bottom of the carrier module 3, a black card 72 arranged on the black card fixing plate 71, a white card fixing plate 73 slidably connected to the workbench 2, a white card 74 arranged on the white card fixing plate 73, and a test power mechanism 75 that drives the white card fixing plate 73 to move to the bottom of the device under test and above the black card 72. The black card 72 is located below the device under test, and can quickly and accurately test the performance of the optical sensor in the device under test.

The probe module 4 includes a floating needle plate 41, an upper needle plate 42, a lower needle plate 43, an adapter plate 44, and a wire pressing plate 45 from top to bottom. A probe 554 is provided between the upper needle plate 42 and the lower needle plate 43. The wire pressing plate 45 is arranged inside the carrier base 31. The probe module 4 of the present invention not only has a small occupancy, but also has high test accuracy. The floating needle plate 41 can float with the device under test, which can reduce the risk of damaging the connector of the device under test.

The pressing power mechanism 6, the scanning power mechanism 9, the testing power mechanism 75 and the adsorption device are all cylinders.

Working principle:

The device under test is placed in the loading slot 32 of the carrier module 3, and the device under test is adsorbed and fixed on the loading slot 32 by the adsorption device; the scanning module 8 is moved to the top of the device under test by the scanning power mechanism 9, and the height position between the height adjustment block 84 on the scanning module 8 and the scanning support plate 83 and the height position between the scanning module 86 and the scanning fixed block 85 are adjusted to a height suitable for scanning the two-dimensional code information of the device under test, and the scanning module 86 is adjusted to an angle suitable for scanning the two-dimensional code information of the device under test by adjusting the angle between the scanning fixed block 85 and the height adjustment block 84, and the two-dimensional code information of the device under test is scanned; after the scanning is completed, the scanning power mechanism 9 drives the scanning module 8 Return; the clamping power mechanism 6 drives the pressure plate assembly 55 to move to the top of the device under test and presses down. When pressing down, the positioning pin 555 on the pressure plate 553 is inserted into the positioning copper sleeve 36 on the carrier module 3 to complete the positioning, and the probe 554 on the pressure plate assembly 55 contacts the wiring point on the device under test, and the connector of the device under test contacts the probe 554 of the probe module 4; when performing the white card 74 test, the test power mechanism 75 drives the white card fixing plate 73 to move to the bottom of the device under test. After the white card 74 test is completed, the test power mechanism 75 pulls back the white card 74 mounting plate. At this time, the black card 72 is located below the device under test, and the black card 72 test is performed; after the test is completed, the adsorption device is cut off, and the device under test is put back into the tray to complete the entire test process.

Of course, the above is only a preferred embodiment of the present invention, so all equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the scope of the patent application of the present invention.

Claims (7)

1. An automated optical sensor testing device, characterized in that it comprises a frame (1), a workbench (2) arranged on the frame (1), the workbench (2) being provided with a carrier module (3) for mounting a device under test, a probe module (4) for connecting a connector of the device under test and deriving a signal, a clamping module (5) for plugging the device under test onto the probe module (4), a clamping power mechanism (6) for driving the clamping module (5) to move to the top of the device under test and press downward, a test module (7) for testing the device under test, a scanning module (8) for scanning a two-dimensional code information of the device under test, and a scanning power mechanism (9) for driving the scanning module (8) to move to the top of the device under test, the probe module (4) being located on the carrier module (3), and a plurality of scanning modules (5) for scanning two-dimensional code information of the device under test. Inside the module (3), a clamping power mechanism (6) is driven to connect to the clamping module (5), a test module (7) is located at the bottom of the carrier module (3), and a scanning power mechanism (9) is driven to connect to the scanning module (8); the carrier module (3) comprises a carrier base (31) arranged on the workbench (2), and an adsorption device arranged at the bottom of the carrier base (31); the top of the carrier base (31) is provided with a mounting groove (32) matching the device under test, and a positioning hole (33) for assisting the clamping module (5) to press down; the bottom surface of the mounting groove (32) is provided with a suction hole (34) for adsorbing and fixing the device under test, and the suction hole (34) is connected to the adsorption device through an air pipe (35); the clamping module ( 5) comprises a clamping base plate (51) arranged on a workbench (2), two clamping support plates (52) respectively arranged on both sides of the clamping base plate (51), two sets of clamping slide rails (53) respectively arranged on the two clamping support plates (52), two slide plates (54) respectively slidably connected to the two sets of clamping slide rails (53), and a clamping plate assembly (55), wherein the two clamping support plates (52) are respectively provided with guide grooves (521), the two slide plates (54) are respectively provided with inclined holes (541) along the inclined direction, and guide shafts (56) are respectively connected between the two slide plates (54) and the clamping support plates (52) on the corresponding side, one end of each guide shaft (56) is rolled in the guide groove (521), and each guide shaft (55) is provided with a plurality of guide shafts (56) and a plurality of guide shafts (56) connected to the two clamping support plates (52). 6) passes through the inclined hole (541) and is inserted into the pressure plate assembly (55), and the two slides (54) are both connected to the output end of the pressing power mechanism (6); the scanning module (8) comprises a scanning slide rail (81) arranged on the workbench (2), a scanning slide seat (82) slidably connected to the scanning slide rail (81), a scanning support plate (83) vertically arranged on the scanning slide seat (82), a height adjustment block (84) arranged on the scanning support plate (83), a scanning fixed block (85), and a scanning module (86), the scanning support plate (83) is connected to the output end of the scanning power mechanism (9), and the scanning module (86) is connected to the height adjustment block (84) through the scanning fixed block (85). 2. The automated optical sensor testing equipment according to claim 1, characterized in that the guide groove (521) is an L-shaped structure. 3. The automated optical sensor testing equipment according to claim 1 is characterized in that: the pressure plate assembly (55) includes a cover plate (551), a clamping needle plate (552), and a pressure plate (553) from top to bottom, the two sides of the cover plate (551) are respectively connected to the guide shaft (56) on the corresponding side, a probe (554) is provided on the clamping needle plate (552), and a buffer spring is provided between the clamping needle plate (552) and the cover plate (551). 4. The automated optical sensor testing device according to claim 3, characterized in that a positioning pin (555) is provided on the bottom surface of the pressing plate (553). 5. The automated optical sensor testing device according to claim 1 is characterized in that: the scanning support plate (83) is connected to the height adjustment block (84) by screws, the scanning support plate (83) is vertically provided with a height adjustment mounting hole (831), the height adjustment mounting hole (831) is a waist-shaped hole, one end of the screw with a thread passes through the mounting hole of the height adjustment block (84) and is threadedly connected to the height adjustment block (84), the scanning fixing block (85) is connected to the height adjustment block (84) by screws, the scanning fixing block (85) is a U-shaped structure and its opening direction is toward the scanning On one side of the support plate (83), both front and rear ends of the scanning fixed block (85) are provided with angle adjustment holes (851), the angle adjustment hole (851) is an arc-shaped hole, one end of a screw with a thread passes through the angle adjustment hole (851) and is threadedly connected to the height adjustment block (84), the scanning module (86) and the scanning fixed block (85) are connected by screws, the scanning fixed block (85) is provided with a scanning module mounting hole (852), the scanning module mounting hole (852) is a waist-shaped hole, one end of a screw with a thread passes through the scanning module mounting hole (852) and is threadedly connected to the scanning module (86). 6. The automated optical sensor testing equipment according to claim 1 is characterized in that: the test module (7) includes a black card fixing plate (71) arranged at the bottom of the carrier module (3), a black card (72) arranged on the black card fixing plate (71), a white card fixing plate (73) slidably connected to the workbench (2), a white card (74) arranged on the white card fixing plate (73), and a test power mechanism (75) that drives the white card fixing plate (73) to move below the device under test and above the black card (72), and the black card (72) is located below the device under test. 7. The automated optical sensor testing equipment according to claim 1 is characterized in that: the probe module (4) includes a floating needle plate (41), an upper needle plate (42), a lower needle plate (43), an adapter plate (44), and a wire pressing plate (45) from top to bottom, a probe (554) is provided between the upper needle plate (42) and the lower needle plate (43), and the wire pressing plate (45) is arranged inside the carrier base (31).