CN219535383U - Direct current first cabinet of row convenient to heat dissipation - Google Patents

Abstract

The utility model discloses a direct-current column head cabinet convenient for heat dissipation, and relates to the field of column head cabinets. Including the first cabinet body of row, the front surface movable mounting who is listed as first cabinet body has the cabinet door main part, is equipped with the door handle in the cabinet door main part, is listed as first cabinet body bottom fixed mounting and is equipped with the equipment base, is listed as first cabinet body upper end fixed mounting and has the cooling mechanism, and the cooling mechanism includes first heat conduction fin, butt joint screw, semiconductor refrigeration piece, butt joint screw and second heat conduction fin, is listed as first cabinet body upper end and is located first heat conduction fin department fixed mounting and have cooling mechanism, and cooling mechanism includes location stabilizer blade, cooling fan, heat shield body, locating screw and locating screw. When the semiconductor refrigerator is used, the semiconductor refrigerator can be started, the cold end of the semiconductor refrigerator can enable the temperature of the second heat conduction fin to be reduced after the semiconductor refrigerator is started, the second heat conduction fin can exchange heat with high-temperature gas in the column head cabinet body after the temperature of the second heat conduction fin is reduced, so that heat is dissipated for components in the column head cabinet, and dust can be prevented from entering the cabinet body in the whole heat dissipation process.

Description

Direct current first cabinet of row convenient to heat dissipation

Technical Field

The utility model relates to the field of column head cabinets, in particular to a direct-current column head cabinet convenient for heat dissipation.

Background

The column header cabinets provide network wiring transmission services or power distribution management equipment for cabinets arranged in rows or divided by functional areas. The column head cabinet is generally divided into a strong current column head cabinet and a weak current column head cabinet. The strong current column cabinet is equipment for managing and distributing commercial power or UPS electricity, and is usually positioned at the end of a column cabinet. For a machine room with fault tolerance requirements, the strong current train head cabinets are usually positioned at two ends of a train of cabinets so as to achieve the purpose of fault tolerance. The weak current train head cabinet is mainly used for distributing cables in network wiring. The existing column head cabinet generally dissipates heat through the internal cooling fan, however, dust easily enters the column head cabinet when the cooling fan is used for dissipating heat, and the dust is conductive due to damp, so that components in the column head cabinet are short-circuited.

Disclosure of Invention

The utility model mainly aims to provide a direct-current column head cabinet convenient for heat dissipation, which can effectively solve the problems in the background technology.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a be convenient for heat dissipation direct current is listed as first cabinet, is including listed as first cabinet body, it has cabinet door main part to list first cabinet body front surface movable mounting, be equipped with the door handle in the cabinet door main part, it has the equipment base to list first cabinet body bottom fixed mounting, it has cooling mechanism to list first cabinet body upper end fixed mounting, cooling mechanism includes first heat conduction fin, butt joint screw, semiconductor refrigeration piece, butt joint screw, second heat conduction fin, semiconductor refrigeration piece fixed mounting is in listed as first cabinet body upper end, semiconductor refrigeration piece upper surface fixed mounting has first heat conduction fin, semiconductor refrigeration piece lower surface fixed mounting has second heat conduction fin, butt joint screw has all been seted up in first heat conduction fin and the second heat conduction fin four corners position, be equipped with the butt joint screw in the butt joint screw, it has cooling mechanism to list first cabinet body upper end in first heat conduction fin department fixed mounting, cooling mechanism includes positioning leg, cooling fan, heat-proof housing body, positioning screw and positioning screw, heat-proof housing body fixed mounting is in first heat conduction fin top, heat-proof housing both sides fixed mounting has the second heat conduction fin, positioning leg fixed mounting has the positioning screw, the positioning leg has the positioning screw.

Furthermore, the upper end of the column head cabinet body is provided with a mounting groove, and the semiconductor refrigerating sheet is mounted on the column head cabinet body through the mounting groove.

Furthermore, the butt-joint screw is connected to the first heat conduction fin and the second heat conduction fin through the butt-joint screw hole, and the first heat conduction fin and the second heat conduction fin are fixed on the semiconductor refrigerating sheet through the butt-joint screw.

Furthermore, the upper end of the column head cabinet body is provided with a screw hole, and the positioning screw is connected to the column head cabinet body through the screw hole.

Furthermore, the locating support leg is fixed on the row head cabinet body through a locating screw, the heat insulation cover body is fixed at the upper end of the row head cabinet body through the locating support leg, and the cooling fan is fixed at the front end of the heat insulation cover body through a screw.

Further, a hinge is arranged on the cabinet door main body, and the cabinet door main body is movably arranged on the row-head cabinet body through the hinge.

Compared with the prior art, the utility model has the following beneficial effects:

when in use, the semiconductor refrigerating sheet can be started, the cold end of the semiconductor refrigerating sheet can reduce the temperature of the second heat conduction fin, the second heat conduction fin can exchange heat with high-temperature gas in the column header cabinet body after the temperature of the second heat conduction fin is reduced, thereby radiating components in the column header cabinet, and the whole radiating process can prevent dust from entering the cabinet body, meanwhile, the cooling fan can be started in the use process, the first heat conduction fin at the hot end of the semiconductor refrigerating sheet can be cooled after the cooling fan is started,

drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of a partial structure of the present utility model;

FIG. 3 is a schematic diagram of a cooling mechanism according to the present utility model;

fig. 4 is a schematic view of a heat dissipation mechanism according to the present utility model.

In the figure: 1. a column head cabinet body; 2. a cabinet door main body; 3. a door handle; 4. an equipment base; 5. a cooling mechanism; 501. positioning support legs; 502. a cooling fan; 503. a heat shield body; 504. positioning screw holes; 505. a set screw; 6. a heat dissipation mechanism; 601. a first heat conduction fin; 602. a butt joint screw hole; 603. a semiconductor refrigeration sheet; 604. a butt joint screw; 605. and a second heat conduction fin.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

As shown in fig. 1 to 4, a direct current column head cabinet convenient for heat dissipation comprises a column head cabinet body 1, wherein a cabinet door main body 2 is movably arranged on the front surface of the column head cabinet body 1, a door handle 3 is arranged on the cabinet door main body 2, an equipment base 4 is fixedly arranged at the bottom of the column head cabinet body 1, a heat dissipation mechanism 6 is fixedly arranged at the upper end of the column head cabinet body 1, a cooling mechanism 5 is fixedly arranged at the position of a first heat conduction fin 601 at the upper end of the column head cabinet body 1, a hinge is arranged on the cabinet door main body 2, and the cabinet door main body 2 is movably arranged on the column head cabinet body 1 through the hinge.

The heat dissipation mechanism 6 is fixedly arranged at the upper end of the column head cabinet body 1, the heat dissipation mechanism 6 comprises a first heat conduction fin 601, a butt joint screw hole 602, a semiconductor refrigerating piece 603, a butt joint screw 604 and a second heat conduction fin 605, the semiconductor refrigerating piece 603 is fixedly arranged at the upper end of the column head cabinet body 1, the first heat conduction fin 601 is fixedly arranged on the upper surface of the semiconductor refrigerating piece 603, the second heat conduction fin 605 is fixedly arranged on the lower surface of the semiconductor refrigerating piece 603, the butt joint screw holes 602 are respectively formed in four corners of the first heat conduction fin 601 and the second heat conduction fin 605, the butt joint screw 604 is arranged in the butt joint screw hole 602, the semiconductor refrigerating piece 603 is also called a heat pump, the cold end of the semiconductor refrigerating piece 603 can enable the temperature of the second heat conduction fin 605 to be reduced after the temperature of the second heat conduction fin 605 is reduced, heat exchange with high-temperature gas in the column head cabinet body 1, therefore heat is dissipated to components in the column head cabinet, and dust can be prevented from entering the cabinet body in the whole heat dissipation process.

The upper end of the column head cabinet body 1 is fixedly provided with a cooling mechanism 5 at the first heat conducting fin 601, the cooling mechanism 5 comprises a positioning support leg 501, a cooling fan 502, a heat insulation cover body 503, positioning screw holes 504 and positioning screws 505, the heat insulation cover body 503 is fixedly provided with the positioning support leg 501 above the first heat conducting fin 601, the two sides of the heat insulation cover body 503 are fixedly provided with the positioning support leg 501, the positioning screw holes 504 are formed in the positioning support leg 501, the positioning screws 505 are arranged in the positioning screw holes 504, the cooling fan 502 is fixedly arranged at the front end of the heat insulation cover body 503, the cooling fan 502 can be started in the use process, and the first heat conducting fin 601 at the hot end of the semiconductor cooling fin 603 can be cooled after the cooling fan 502 is started.

It should be noted that, in practical use, the semiconductor refrigeration piece 603 is firstly installed at the upper end of the column head cabinet body 1, and the cold end of the semiconductor refrigeration piece 603 is ensured to be located at the column head cabinet body 1, then the semiconductor refrigeration piece 603 can be started, because the upper end of the column head cabinet body 1 is provided with the installation groove, the semiconductor refrigeration piece 603 is installed on the column head cabinet body 1 through the installation groove, the docking screw 604 is connected to the first heat conduction fin 601 and the second heat conduction fin 605 through the docking screw hole 602, the first heat conduction fin 601 and the second heat conduction fin 605 are fixed on the semiconductor refrigeration piece 603 through the docking screw 604, so that the cold end of the semiconductor refrigeration piece 603 can enable the temperature of the second heat conduction fin 605 to be reduced, and after the temperature of the second heat conduction fin 605 is reduced, the semiconductor refrigeration piece 603 can exchange heat with high-temperature gas in the column head cabinet body 1, thereby radiating components in the column head cabinet, meanwhile, the low-temperature gas outside after the cooling fan 502 is started can flow through the first heat conduction fin 601, and therefore the first heat conduction fin 601 is cooled by the semiconductor refrigeration fin 601.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (6)

1. Direct current first cabinet of row convenient to heat dissipation, its characterized in that: including row first cabinet body (1), row first cabinet body (1) front surface movable mounting has cabinet door main part (2), be equipped with door handle (3) on cabinet door main part (2), row first cabinet body (1) bottom fixed mounting has equipment base (4), row first cabinet body (1) upper end fixed mounting has heat dissipation mechanism (6), heat dissipation mechanism (6) are including first heat conduction fin (601), butt joint screw (602), semiconductor refrigeration piece (603), butt joint screw (604) and second heat conduction fin (605), semiconductor refrigeration piece (603) fixed mounting is in row first cabinet body (1) upper end, semiconductor refrigeration piece (603) upper surface fixed mounting has first heat conduction fin (601), semiconductor refrigeration piece (603) lower surface fixed mounting has second heat conduction fin (605), butt joint screw (602) have all been seted up in first heat conduction fin (601) and second heat conduction fin (605) four corners position, be equipped with butt joint screw (604) in butt joint screw (602), row first cabinet body (1) upper end (603) fixed mounting has first heat conduction fin (601), fan (5) fixed mounting screw (503), cooling setting screw (5) and cooling setting screw (5), the heat insulation cover body (503) is fixedly arranged above the first heat conduction fins (601), positioning support legs (501) are fixedly arranged on two sides of the heat insulation cover body (503), positioning screw holes (504) are formed in the positioning support legs (501), positioning screws (505) are arranged in the positioning screw holes (504), and cooling fans (502) are fixedly arranged at the front ends of the heat insulation cover body (503).

2. A direct current cabinet with convenient heat dissipation according to claim 1, characterized in that: the upper end of the column head cabinet body (1) is provided with a mounting groove, and the semiconductor refrigerating sheet (603) is mounted on the column head cabinet body (1) through the mounting groove.

3. A direct current cabinet with convenient heat dissipation according to claim 2, characterized in that: the butt joint screw (604) is connected to the first heat conduction fin (601) and the second heat conduction fin (605) through the butt joint screw hole (602), and the first heat conduction fin (601) and the second heat conduction fin (605) are fixed on the semiconductor refrigerating sheet (603) through the butt joint screw (604).

4. A direct current cabinet according to claim 3, wherein: screw holes are formed in the upper end of the column head cabinet body (1), and the positioning screws (505) are connected to the column head cabinet body (1) through the screw holes.

5. The direct current cabinet with convenient heat dissipation according to claim 4, wherein: the positioning support leg (501) is fixed on the row head cabinet body (1) through a positioning screw (505), the heat insulation cover body (503) is fixed at the upper end of the row head cabinet body (1) through the positioning support leg (501), and the cooling fan (502) is fixed at the front end of the heat insulation cover body (503) through a screw.

6. The direct current cabinet with convenient heat dissipation according to claim 5, wherein: the cabinet door is characterized in that a hinge is arranged on the cabinet door main body (2), and the cabinet door main body (2) is movably arranged on the row-head cabinet body (1) through the hinge.