CN219534516U - Semiconductor refrigerator - Google Patents

Abstract

The utility model discloses a semiconductor refrigerator, which comprises a butt joint, a cooling bin and a butt joint structure sleeved at the top end of the butt joint, wherein the top end of the butt joint is provided with a communicating pipe, the other end of the communicating pipe is connected with the cooling bin, the inside of the butt joint is provided with a heat conducting structure, the cooling bin is provided with a heat radiating structure, the butt joint is matched with the cooling bin, the bottom end of the butt joint is provided with a semiconductor refrigerating sheet, when the heat emitted by the hot end of the semiconductor refrigerating sheet in the semiconductor refrigerator is transmitted by the heat radiating fin, the heat is transferred in a conduction way, a plurality of groups of fans are utilized to cool the cooling bin, and then a water pump is used for accelerating the circulation of cold and hot water, so that the heat radiating effect of the hot end of the semiconductor refrigerating sheet is enhanced.

Description

Semiconductor refrigerator

Technical Field

The utility model belongs to the technical field of refrigeration, and particularly relates to a semiconductor refrigerator.

Background

In the current society, the importance of semiconductors is very great from the viewpoint of technological or economic development, and most of electronic products, such as computers, mobile phones or digital recorders, have very close association with semiconductors, while semiconductors are widely used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion and the like, and meanwhile, the semiconductors need to use semiconductor refrigeration sheets for controlling the temperature during the use;

in the prior art, the semiconductor refrigerating sheet can control the temperature of the semiconductor, but the semiconductor refrigerating sheet can generate heat, if the heat of the semiconductor refrigerating sheet cannot be timely emitted, the whole work of the semiconductor refrigerating sheet can be influenced, and the semiconductor refrigerating sheet can conduct and emit the heat rapidly through the semiconductor refrigerating sheet, so that the semiconductor refrigerating sheet is not influenced when the semiconductor is subjected to temperature control, the existing semiconductor refrigerating device has lower heat conduction rate, and the semiconductor refrigerating device is more complicated and inconvenient to install and maintain in the later period;

in patent document CN106546032a, a semiconductor refrigerator is disclosed, in which the cold end of a semiconductor refrigeration sheet is connected to a cold guide fin, and then cold air emitted from the cold guide fin is blown onto a semiconductor by a fan, so that the semiconductor is cooled, and according to practical situations, the effect of controlling the temperature of the semiconductor is weaker, because the cold air is affected by various factors, the efficiency of controlling the temperature is higher compared with the effect that the cold end of the semiconductor refrigeration sheet is directly contacted with a heating source, the steps are more convenient, in the patent document, a cooling liquid is also utilized to flow in a through pipe, and then the through pipe is attached to the hot end of the semiconductor refrigeration sheet, so that the temperature of the semiconductor refrigeration sheet is cooled.

Disclosure of Invention

The present utility model is directed to a semiconductor refrigerator to solve the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor refrigerator comprises a butt joint, a cooling bin and a butt joint structure sleeved at the top end of the butt joint, wherein the top end of the butt joint is provided with a communicating pipe, the other end of the communicating pipe is connected with the cooling bin, the bottom end of the butt joint is provided with a semiconductor refrigerating sheet, the inside of the butt joint is provided with a heat conducting structure, the cooling bin is provided with a heat radiating structure, and the butt joint and the cooling bin are mutually matched;

the heat conduction structure comprises a second heat conduction fin and a water pump, wherein the second heat conduction fin is arranged at the bottom end of the inner wall of the butt joint, and the water pump is arranged at the top end of the inner wall of the butt joint;

preferably, the heat dissipation structure comprises a fan and first heat conduction fins, wherein the fan is arranged at the top end of the cooling bin, and the first heat conduction fins are arranged in the cooling bin;

preferably, three groups of fans are arranged at the top end of the cooling bin, and the three groups of fans are arranged in a straight shape at the top end of the cooling bin;

preferably, the butt joint structure comprises a shell, the shell is sleeved at the top end of the butt joint, clamping teeth are arranged in the shell, threaded rods are installed on two sides of the shell, a knob is fixedly connected to the top end of each threaded rod, and a spring is sleeved on the surface of the top end of each threaded rod;

preferably, the knob and the threaded rod are welded integrally, and the threaded rod is symmetrically distributed on two sides of the central line of the shell;

preferably, one end of the communicating pipe extends to the inside of the butt joint, and both ends of the communicating pipe are provided with protective rubber rings.

The utility model has the technical effects and advantages that: in the semiconductor refrigerator, when the heat end of the semiconductor refrigerating sheet radiates heat, the heat transfer is quickened by a heat radiation fin conduction mode, a plurality of groups of fans are used for cooling the cooling bin, and then the water pump quickens the circulation of cold and hot water, so that the heat radiation effect of the heat end of the semiconductor refrigerating sheet is strengthened;

the butt joint and the semiconductor refrigerating sheet are fixedly installed with the outside in a screwing mode, meanwhile, the cold end of the semiconductor refrigerating sheet is directly contacted with the semiconductor, so that the refrigerating effect of the semiconductor refrigerator is enhanced, and the semiconductor refrigerator is more convenient to assemble and disassemble.

Drawings

FIG. 1 is a schematic top view of the present utility model;

FIG. 2 is a schematic top view of a cooling bin according to the present utility model;

FIG. 3 is an enlarged schematic view of the utility model at A in FIG. 1;

fig. 4 is a schematic side cross-sectional view of an abutment of the present utility model.

In the figure: 1. a semiconductor refrigeration sheet; 2. butt joint; 3. a communicating pipe; 4. cooling bin; 5. a blower; 6. a butt joint structure; 601. a housing; 602. a knob; 603. a spring; 604. a threaded rod; 605. latch teeth; 7. a first heat conducting fin; 8. a second heat conducting fin; 9. a water pump; 10. and a protective rubber ring.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a semiconductor refrigerator as shown in figures 1 and 4, which comprises a butt joint 2, a cooling bin 4 and a butt joint structure 6 sleeved at the top end of the butt joint 2, wherein the top end of the butt joint 2 is provided with a communicating pipe 3, the other end of the communicating pipe 3 is connected with the cooling bin 4, liquid is filled in the butt joint 2, the communicating pipe 3 and the cooling bin 4 when being installed, the liquid can be water or refrigerating liquid, a semiconductor refrigerating sheet 1 is installed at the bottom end of the butt joint 2, the butt joint 2 is adhered with the semiconductor refrigerating sheet 1 through silicone grease, meanwhile, the bottom of the semiconductor refrigerating sheet 1 is adhered with an external semiconductor through silicone grease, and the butt joint 2 is matched with the cooling bin 4;

specifically, a heat conduction structure is arranged in the butt joint 2, the heat conduction structure comprises a second heat conduction fin 8 and a water pump 9, the second heat conduction fin 8 is arranged at the bottom end of the inner wall of the butt joint 2, and the water pump 9 is arranged at the top end of the inner wall of the butt joint 2;

furthermore, the liquid in the butt joint 2 and the liquid in the cooling bin 4 can be circulated through the self characteristics of the water pump 9, the heat emitted by the hot end of the semiconductor refrigerating sheet 1 is conducted by the second heat conducting fins 8, and the second heat conducting fins 8 can be made of copper or metal with strong heat conductivity.

As shown in fig. 1 and 2, the cooling bin 4 is provided with a heat dissipation structure;

specifically, the heat dissipation structure comprises a fan 5 and first heat conduction fins 7, the first heat conduction fins 7 are made of the same material as the second heat conduction fins 8, the fan 5 is arranged at the top end of the cooling bin 4, and the first heat conduction fins 7 are arranged in the cooling bin 4;

further, three groups of fans 5 and the top ends of the first heat conduction fins 7 are arranged, the three groups of fans 5 and the top ends of the first heat conduction fins 7 are arranged in a straight line shape, and heat on the first heat conduction fins 7 is quickly dissipated through the arrangement of the plurality of groups of fans 5, so that the heat dissipation effect of the cooling bin 4 is improved.

As shown in fig. 1 and fig. 4 in fig. 3, the docking structure 6 includes a housing 601, the housing 601 is sleeved on the top end of the docking head 2, the inside of the housing 601 is provided with a latch 605, the latch 605 is designed to enable the docking head 2 to be clamped tightly inside the housing 601, a threaded rod 604 is installed on two sides of the housing 601, the top end of the threaded rod 604 is fixedly connected with a knob 602, and the knob 602 is designed to enable the threaded rod 604 to be operated by hands when being docked with the outside, so that the operation is more convenient, a spring 603 is sleeved on the surface of the top end of the threaded rod 604, the spring 603 has a certain elastic potential energy by virtue of the design of the spring 603 on the top end of the threaded rod 604, and further the threaded rod 604 is clamped tightly when being docked with the outside, so as to avoid the phenomenon of loosening;

specifically, the knob 602 and the threaded rod 604 are welded together, and the threaded rod 604 is distributed at equal intervals on two sides of the center line of the casing 601;

further, one end of communicating pipe 3 extends to the inside of butt joint 2, and protection rubber ring 10 is all installed at the both ends of communicating pipe 3, through the setting of protection rubber ring 10, has avoided communicating pipe 3 to be connected with butt joint 2 and cooling storehouse 4 when probably appearing the cracked phenomenon of joint, and then has strengthened communicating pipe 3's life.

Working principle: firstly, the butt joint 2 is clamped into the shell 601, then the semiconductor refrigeration piece 1 is adhered to the bottom of the butt joint 2 through silicone grease, then the butt joint 2 is contacted with the hot end of the semiconductor refrigeration piece 1, and then the knob 602 is twisted to drive the threaded rod 604 to rotate, so that the semiconductor refrigerator is connected with the outside, meanwhile, the cold end of the semiconductor refrigeration piece 1 is contacted with the outside semiconductor, and the semiconductor refrigeration piece 1 starts to work to control the temperature of the outside semiconductor;

secondly, the heat emitted by the hot end of the semiconductor refrigerating sheet 1 is transferred through the second heat conduction fins 8, meanwhile, the heat heats the liquid in the butt joint 2, and the liquid heated in the butt joint 2 circulates through the communicating pipe 3 and the unheated liquid in the cooling bin 4 by utilizing the self characteristic of the water pump 9;

finally, the heat of the warmed liquid is absorbed through the first heat conduction fins 7 in the cooling bin 4, so that the temperature of the warmed liquid is reduced, the heat absorbed by the first heat conduction fins 7 is dissipated through the rotation of the fan 5, the temperature of the first heat conduction fins 7 is reduced, and finally the whole work of the semiconductor refrigerator is completed.

Finally, it should be noted that: the foregoing description of the preferred embodiments of the present utility model is not intended to be limiting, but rather, it will be apparent to those skilled in the art that the foregoing description of the preferred embodiments of the present utility model can be modified or equivalents can be substituted for some of the features thereof, and any modification, equivalent substitution, improvement or the like that is within the spirit and principles of the present utility model should be included in the scope of the present utility model.

Claims (6)

1. The utility model provides a semiconductor refrigerator, includes butt joint (2), cooling storehouse (4) and cover and locate butt joint structure (6) on butt joint (2) top, its characterized in that: the semiconductor cooling device is characterized in that communicating pipes (3) are arranged at the top ends of the butt joints (2), the other ends of the communicating pipes (3) are connected with cooling bins (4), heat conducting structures are arranged in the butt joints (2), heat radiating structures are arranged on the cooling bins (4), the butt joints (2) are matched with the cooling bins (4), and semiconductor cooling sheets (1) are arranged at the bottom ends of the butt joints (2);

the heat conduction structure comprises a second heat conduction fin (8) and a water pump (9), wherein the second heat conduction fin (8) is arranged at the bottom end of the inner wall of the butt joint (2), and the water pump (9) is arranged at the top end of the inner wall of the butt joint (2).

2. A semiconductor refrigerator according to claim 1, wherein: the heat radiation structure comprises a fan (5) and first heat conduction fins (7), wherein the fan (5) is arranged at the top end of the cooling bin (4), and the first heat conduction fins (7) are arranged in the cooling bin (4).

3. A semiconductor refrigerator according to claim 2, wherein: three groups of fans (5) are arranged at the top ends of the cooling bin (4), and the three groups of fans (5) are arranged in a straight shape at the top end of the cooling bin (4).

4. A semiconductor refrigerator according to claim 1, wherein: the butt joint structure (6) comprises a shell (601), the top of butt joint head (2) is arranged on the shell (601) in a sleeved mode, clamping teeth (605) are arranged in the shell (601), threaded rods (604) are arranged on two sides of the shell (601), knobs (602) are fixedly connected to the top ends of the threaded rods (604), and springs (603) are arranged on the surface of the top ends of the threaded rods (604) in a sleeved mode.

5. A semiconductor refrigerator according to claim 4 wherein: the knob (602) and the threaded rod (604) are welded integrally, and the threaded rod (604) is symmetrically distributed on two sides of the central line of the shell (601).

6. A semiconductor refrigerator according to claim 1, wherein: one end of the communicating pipe (3) extends to the inside of the butt joint (2), and the two ends of the communicating pipe (3) are provided with protective rubber rings (10).