CN219533281U

CN219533281U - Millimeter wave power density measuring device

Info

Publication number: CN219533281U
Application number: CN202320151219.6U
Authority: CN
Inventors: 朱靖松
Original assignee: Mrt Technology Suzhou Co ltd
Current assignee: Mrt Technology Suzhou Co ltd
Priority date: 2023-01-31
Filing date: 2023-01-31
Publication date: 2023-08-15
Anticipated expiration: 2033-01-31

Abstract

The utility model discloses a millimeter wave power density measuring device, which comprises a workbench; the mechanical arm is fixed on the workbench, and the output end of the mechanical arm is detachably connected with a probe; place the subassembly, place the subassembly including the fixed station, place the platform and be located leveling subassembly between the two, the fixed station is placed on the workstation, leveling subassembly sets up on the fixed station and is used for placing the levelness regulation of platform, place the platform and be used for the placing of workpiece to be measured. The flatness of the product to be tested can be guaranteed, and the testing requirements of different products to be tested are met.

Description

Millimeter wave power density measuring device

Technical Field

The utility model relates to the technical field of millimeter wave testing, in particular to a millimeter wave power density measuring device.

Background

The commercial use of 5G communication systems has been more and more recent, and unlike previous 2G, 3G and 4G, 5G communication systems employ a frequency band above 10GHz for information transmission, which is commonly referred to in the industry as the millimeter wave frequency band. For electromagnetic radiation in the millimeter wave band, power Density (Power Density) will be used as an evaluation unit, and thus millimeter wave Power Density measurement of the product is required. In the measuring process, the millimeter wave probe collects electromagnetic radiation at each position on the product, and finally, the power density is obtained. When the millimeter wave probe collects, the requirement on the flatness of a workpiece is high, and the flatness of a product needs to be ensured, so that a measuring device is needed, and millimeter wave power density measurement of different products can be met.

Disclosure of Invention

In order to overcome the defects, the utility model aims to provide the millimeter wave power density measuring device which can ensure the flatness of products to be measured and meet the testing requirements of different products to be measured.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a millimeter wave power density measuring device comprises a workbench; the mechanical arm is fixed on the workbench, and the output end of the mechanical arm is detachably connected with a probe; place the subassembly, place the subassembly including the fixed station, place the platform and be located leveling subassembly between the two, the fixed station is placed on the workstation, leveling subassembly sets up on the fixed station and is used for placing the levelness regulation of platform, place the platform and be used for the placing of workpiece to be measured.

The utility model has the beneficial effects that: aiming at a workpiece to be detected working in a frequency range of 6-300G, the power density at the position of the minimum 2mm is measured through the vector field intensity probe, and the mechanical arm moves the probe to a position 2mm higher than the workpiece to be detected for detection and drives the probe to move. When the workpiece to be measured is placed, in order to facilitate the movement of the probe in the horizontal plane, the flatness of the plane to be measured needs to be ensured, so that a leveling component is arranged between the fixed table and the placing table, the workpiece to be measured can be leveled, and the test requirement is met.

Furthermore, the leveling component comprises four leveling pieces which are distributed in a rectangular mode, each leveling piece comprises a fixing portion and an abutting portion, the fixing portions are in threaded connection with the fixing table, the distance between the abutting portions and the fixing table can be adjusted in the rotation process of the fixing portions, and the lower end face of the placing table abuts against the fixing portions. The leveling pieces distributed in a rectangular shape support the placing table, and when the leveling pieces are rotated, the leveling pieces can generate relative displacement between the vertical direction and the fixed table. Each leveling piece moves independently, adjusts the flatness of the placing table, and then adjusts the flatness of the workpiece to be measured.

Furthermore, one end of the abutting part far away from the fixing part is further extended upwards to form a limiting part, and the lower end surface of the placing table is provided with a limiting groove for inserting the limiting part. The limit part is matched with the limit groove, so that stability between the leveling piece and the placing table is improved.

Further, the placing table is of a rectangular structure, and the upper end face of the placing table is marked with a position mark. The position mark comprises two central lines which are arranged vertically and are emphasized through the upper end face of the placing table, the two central lines are cross-shaped, the upper end face of the placing table is divided into four areas with the same size, and the marking codes are distributed in each area in an array mode. The workpiece to be measured is placed at the center line position, and the position information of the workpiece to be measured is read through the mark code.

Furthermore, the workbench is provided with a placing groove, a part of the fixed table is embedded in the placing groove, and the height position of the upper end surface of the fixed table is higher than that of the workbench. The stability of the fixed table placed on the workbench is improved.

Furthermore, the abutting part and the limiting part are of cylindrical structures, and the limiting groove is matched with the limiting part. The cylindrical structure ensures that even if the limiting part is inserted into the limiting groove, the leveling piece can still rotate, so that the leveling piece can observe the flatness of the placing table when being adjusted. And the diameter of the abutting part is larger than that of the limiting groove, so that the abutting part can not enter the limiting groove, and the supporting is provided for the placing table.

Furthermore, the output end of the mechanical arm is also provided with a wave absorbing plate which is arranged around the probe, the wave absorbing plate is wedge-shaped, and the end part of the probe extends out of the wave absorbing plate. The wave absorbing performance is good, the field intensity distortion is avoided, and the testing precision is improved.

Further, the wave absorbing plate and the placing table are both made of polyurethane foam.

Further, the probe is connected with a data collector through a radio frequency line. The structure measured by the probe is displayed on the data collector, and millimeter wave power density measurement of the workpiece to be measured is completed.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present utility model;

FIG. 2 is a schematic structural view of a fixing table according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a structure of a placement table according to an embodiment of the present utility model;

fig. 4 is a cross-sectional view of a placement assembly in the present novel embodiment of use.

In the figure:

1. a work table; 2. a mechanical arm; 3. a fixed table; 4. a placement table; 41. a limit groove; 42. a position mark; 5. a leveling member; 51. a fixing part; 52. an abutting portion; 53. a limit part; 6. a wave absorbing plate; 7. a probe.

Detailed Description

The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model.

Referring to fig. 1, the millimeter wave power density measuring device comprises a workbench 1, a mechanical arm 2 and a placement component, wherein the mechanical arm 2 is arranged on the workbench 1, the mechanical arm 2 is fixed on the workbench 1, and a probe 7 is detachably connected with an output end of the mechanical arm 2. The probe 7 is connected with a data acquisition device through a radio frequency wire. The placing component is detachably placed on the workbench 1 and used for placing a workpiece to be tested.

Aiming at a workpiece to be detected working at a frequency range of 6-300G, the power density at the position of the minimum 2mm is measured through the vector field intensity probe 7, namely, the manipulator is a multi-axis manipulator, the movement of the probe 7 in space is realized, the probe 7 is moved to a position higher than the position of the workpiece to be detected by 2mm for detection, the positioning precision of the manipulator is 0.2mm, and the probe 7 is accurately driven to move. The structure measured by the probe 7 is displayed on a data collector, and millimeter wave power density measurement of the workpiece to be measured is completed.

The leveling assembly comprises a fixing table 3, a placing table 4 and a leveling assembly located between the fixing table 3 and the placing table 4, wherein the fixing table 3 is placed on the workbench 1, the leveling assembly is arranged on the fixing table 3 and used for leveling adjustment of the placing table 4, and the placing table 4 is used for placing a workpiece to be tested. When the workpiece to be measured is placed, in order to facilitate the movement of the probe 7 in the horizontal plane, the flatness of the plane to be measured needs to be ensured, so that a leveling component is arranged between the fixed table 3 and the placing table 4, the workpiece to be measured can be leveled, and the test requirement is met.

Referring to fig. 2, the leveling assembly includes four leveling members 5 distributed in a rectangular shape, each leveling member 5 includes a fixing portion 51 and an abutting portion 52, the fixing portion 51 is in threaded connection with the fixing table 3, the fixing portion 51 can adjust a distance between the abutting portion 52 and the fixing table 3 during rotation, and a lower end surface of the placement table 4 abuts against the fixing portion 51.

The leveling members 5 are arranged in a rectangular shape to support the placement table 4, and when the leveling members 5 are rotated, the leveling members 5 are displaced relative to the fixed table 3 in the vertical direction. Each leveling member 5 moves independently to adjust the flatness of the placing table 4, thereby adjusting the flatness of the workpiece to be measured.

In one embodiment, referring to fig. 2 and fig. 4, in order to improve stability between the leveling component 5 and the placement platform 4 and avoid the placement platform 4 from being deviated, an end of the abutting portion 52 away from the fixing portion 51 is further extended upwards to form a limiting portion 53, and a limiting groove 41 into which the limiting portion 53 is inserted is formed in a lower end surface of the placement platform 4.

The abutting portion 52 and the limiting portion 53 are both in cylindrical structures, and the limiting groove 41 is matched with the limiting portion 53. The cylindrical structure ensures that even if the limiting part 53 is inserted into the limiting groove 41, the leveling member 5 can still rotate, so that the leveling member can observe the flatness of the placement table 4 during adjustment. The diameter of the abutting portion 52 is larger than that of the limiting groove 41, so that the abutting portion 52 cannot enter the limiting groove 41, and support is provided for the placement table 4.

Referring to fig. 3, the placement table 4 has a rectangular structure, and the upper end surface of the placement table 4 is marked with a position mark 42. The position mark 42 comprises two central lines which are arranged vertically and are emphasized through the upper end face of the placing table 4, the two central lines are cross-shaped, the upper end face of the placing table 4 is divided into four areas with the same size, and the marking codes are distributed in each area in an array mode. The workpiece to be measured is placed at the center line position, and the position information of the workpiece to be measured is read through the mark code.

In one embodiment, in order to improve the stability of the fixed table 3 placed on the workbench 1, a placing groove is formed in the workbench 1, a part of the fixed table 3 is embedded in the placing groove, and the height position of the upper end surface of the fixed table 3 is higher than that of the workbench 1.

The output end of the mechanical arm 2 is also provided with a wave absorbing plate 6 which is arranged around the probe 7, the wave absorbing plate 6 is wedge-shaped, and a plurality of sharp corner structures are arranged on the lower end face of the wedge-shaped wave absorbing plate 6. The end of the probe 7 extends out of the wave absorbing plate 6. The wave absorbing plate 6 and the placing table 4 are made of polyurethane foam, so that wave absorbing performance is good, field intensity distortion is avoided, and testing precision is improved.

The specific working procedure of this embodiment is as follows: the fixed table 3 is placed on the workbench 1, the leveling piece 5 is adjusted according to the workpiece to be measured, the leveling piece 5 is rotated, and the flatness of the placing table 4, namely the flatness of the workpiece to be measured, is adjusted. And then the mechanical arm 2 drives the probe 7 to approach the workpiece to be tested and move along the workpiece to be tested, so that the test is completed.

The above embodiments are only for illustrating the technical concept and features of the present utility model, and are intended to enable those skilled in the art to understand the content of the present utility model and to implement the same, but are not intended to limit the scope of the present utility model, and all equivalent changes or modifications made according to the spirit of the present utility model should be included in the scope of the present utility model.

Claims

1. The millimeter wave power density measuring device is characterized in that: comprising

A work table;

the mechanical arm is fixed on the workbench, and the output end of the mechanical arm is detachably connected with a probe;

place the subassembly, place the subassembly including the fixed station, place the platform and be located leveling subassembly between the two, the fixed station is placed on the workstation, leveling subassembly sets up on the fixed station and is used for placing the levelness regulation of platform, place the platform and be used for the placing of workpiece to be measured.

2. The millimeter wave power density measurement device according to claim 1, wherein: the leveling assembly comprises four leveling pieces which are distributed in a rectangular mode, each leveling piece comprises a fixing portion and an abutting portion, the fixing portions are in threaded connection with the fixing table, the fixing portions can adjust the distance between the abutting portions and the fixing table in the rotating process, and the lower end face of the placing table abuts against the fixing portions.

3. The millimeter wave power density measurement device according to claim 2, wherein: the one end that the fixed part was kept away from to the butt portion still upwards extends there is spacing portion, the lower terminal surface of placing the platform has seted up and has supplied spacing portion male spacing groove.

4. The millimeter wave power density measurement device according to claim 1, wherein: the placing table is of a rectangular structure, and the upper end face of the placing table is marked with a position mark.

5. The millimeter wave power density measurement device according to claim 1, wherein: the workbench is provided with a placing groove, a part of the fixing table is embedded in the placing groove, and the height position of the upper end face of the fixing table is higher than that of the workbench.

6. A millimeter wave power density measurement device according to claim 3, characterized in that: the abutting portion and the limiting portion are of cylindrical structures, the limiting groove is matched with the limiting portion, and the diameter of the abutting portion is larger than that of the limiting groove.

7. The millimeter wave power density measurement device according to any one of claims 1-6, wherein: the output end of the mechanical arm is also provided with a wave absorbing plate which is arranged around the probe, the wave absorbing plate is wedge-shaped, and the end part of the probe extends out of the wave absorbing plate.

8. The millimeter wave power density measurement device according to claim 7, wherein: the wave absorbing plate and the placing table are made of polyurethane foam.

9. The millimeter wave power density measurement device according to claim 1, wherein: the probe is connected with a data acquisition device through a radio frequency line.