CN219532005U - Large-size wafer orientation device - Google Patents
Large-size wafer orientation device Download PDFInfo
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- CN219532005U CN219532005U CN202320188770.8U CN202320188770U CN219532005U CN 219532005 U CN219532005 U CN 219532005U CN 202320188770 U CN202320188770 U CN 202320188770U CN 219532005 U CN219532005 U CN 219532005U
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- positioning
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- 238000000605 extraction Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of wafer orientation and discloses a large-size wafer orientation device, which comprises a positioning box, wherein a rotating shaft is rotatably arranged at the center of the inside of the positioning box, a motor is fixedly arranged at the bottom of the positioning box, the lower end of the rotating shaft is fixedly connected with the output end of the motor, an opening is formed in the top of the positioning box, a rotating platform is arranged at the opening, the lower surface of the rotating platform is fixedly connected with the upper end of the rotating shaft, and angle sensors are arranged at the top of the positioning box and around the rotating platform; the inside of locating box and the both sides that are located the pivot are all fixed and are equipped with the slide, and the inside of two slides is all elasticity and is equipped with the slide bar, and the one end that two slide bars are relative is all fixed and is equipped with splint, and the one end that two slide bars deviate from mutually is fixed and is equipped with same stay cord, and the fixed rotator that is equipped with of axle wall of pivot. The utility model has the structure of positioning the rotary platform, so that the rotary platform is not easy to rotate, the directional stability of the wafer is improved, and the accuracy of the wafer measurement is improved.
Description
Technical Field
The utility model relates to the technical field of wafer orientation, in particular to a large-size wafer orientation device.
Background
The semiconductor wafer is mainly made of silicon materials, the external shape of the semiconductor wafer is of a circular structure, the semiconductor wafer is widely used in an integrated circuit, a specific circuit structure can be formed by mounting corresponding circuit elements on the external surface, the use effect of the wafer is directly affected by the crystal orientation of the silicon materials in the semiconductor wafer, the measurement of the crystal orientation is carried out by using a special crystal orientation measuring instrument, the crystal orientation distribution condition of the silicon crystal is observed in a directional projection irradiation mode, and therefore the crystal orientation index is judged.
The patent number is CN111947616A, a large-size wafer orienting device system is disclosed, and the large-size wafer orienting device system comprises a positioning box, a rotating platform which is arranged in the positioning box and used for placing a wafer, a reference position orienting system which is arranged on the upper end face of the rotating platform, and an angle sensor which is arranged on the back face of the rotating platform.
In the above scheme, after the wafer is rotationally positioned through the rotary platform, the rotary platform still can rotate, so that the orientation effect of the wafer is poor, and the measurement accuracy is affected. For this purpose, a large-sized wafer orientation apparatus is proposed.
Disclosure of Invention
The utility model aims to solve the problems of the background technology and provides a large-size wafer orientation device.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the large-size wafer orientation device comprises a positioning box, wherein a rotating shaft is rotationally arranged at the center of the inside of the positioning box, a motor is fixedly arranged at the bottom of the positioning box, the lower end of the rotating shaft is fixedly connected with the output end of the motor, an opening is formed in the top of the positioning box, a rotating platform is arranged at the opening, the lower surface of the rotating platform is fixedly connected with the upper end of the rotating shaft, and angle sensors are arranged at the top of the positioning box and around the rotating platform;
the inside of box and the both sides that are located the pivot are all fixed and are equipped with the slide, two the inside of slide is all elasticity is equipped with the slide bar, two the slide bar is relative one end is all fixed and is equipped with splint, two the one end that the slide bar deviates from mutually is fixed and is equipped with same stay cord, and the stay cord is located the below setting of box, the fixed rotator that is equipped with of axle wall of pivot, splint and rotator contact setting.
Preferably, the fixed ring that is equipped with of the pole wall of slide bar, and the pole wall cover of slide bar is equipped with the spring, the both ends of spring are respectively with the lateral wall fixed connection of fixed ring and the lateral wall fixed connection of slide.
Preferably, a supporting frame is fixedly arranged at the bottom of the positioning box, and the pull rope is positioned between the positioning box and the supporting frame.
Preferably, fixed pulleys are fixedly arranged on two sides of the bottom of the positioning box, and the pull ropes penetrate through the wheel walls of the fixed pulleys.
Preferably, the fixing hole is formed in one end, away from the clamping plate, of the sliding rod, and one end of the pull rope is fixedly arranged in the fixing hole.
Preferably, the clamping plate adopts an arc-shaped plate, the rotating body adopts a hemisphere, and the radian of the clamping plate is matched with the side wall of the rotating body.
Preferably, the upper surface of the rotary platform is provided with a positioning groove, and the outer part of the upper surface of the rotary platform, which is positioned in the positioning groove, is provided with a plurality of uniformly distributed taking-out grooves.
Preferably, the pull rope is a steel wire rope.
Preferably, the motor and the angle sensor are electrically connected with an external computer system.
Compared with the prior art, the utility model provides a large-size wafer orientation device, which has the following beneficial effects:
1. this jumbo size wafer orienting device, through motor, revolving platform and the angle sensor that is equipped with, the motor work can drive the pivot rotation, and the pivot can drive revolving platform rotation to can make the wafer rotatory angular orientation adjustment that carries out.
2. This jumbo size wafer orienting device, through slide, the slide bar that is equipped with, the splint, the stay cord, the rotator, solid fixed ring and spring, the spring can apply elasticity for the slide bar, make the one end of slide bar drive splint remove, can make splint and rotator's lateral wall contact, thereby make the position of pivot obtain fixing, make rotary platform can not rotate taking place at will, improved the directional steadiness to the wafer, the precision of measurement has been promoted, the stay cord is pulled simultaneously, make the pulling of stay cord stimulate two slide bars respectively and remove, thereby can make splint and rotator separation, the fixing to rotary platform has been relieved at this moment.
The device has the structure for positioning the rotating platform, so that the rotating platform is not easy to rotate, the directional stability of the wafer is improved, and the accuracy of measuring the wafer is improved.
Drawings
FIG. 1 is a schematic diagram of a large-sized wafer orienting device according to the present utility model;
FIG. 2 is a schematic view of the connection between the slider and the slide bar in FIG. 1;
FIG. 3 is a schematic view of the structure of the rotator of FIG. 1;
fig. 4 is a top view of the rotary platform of fig. 1.
In the figure: 1. a positioning box; 2. a rotating shaft; 3. a motor; 4. rotating the platform; 5. an angle sensor; 6. a slide; 7. a slide bar; 8. a clamping plate; 9. a pull rope; 10. a rotating body; 11. a fixing ring; 12. a spring; 13. a support frame; 14. a fixed pulley; 15. a positioning groove; 16. and taking out the groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1
Referring to fig. 1, the large-size wafer orienting device comprises a positioning box 1, a rotating shaft 2 is rotationally arranged at the center of the inside of the positioning box 1, a motor 3 is fixedly arranged at the bottom of the positioning box 1, the lower end of the rotating shaft 2 is fixedly connected with the output end of the motor 3, an opening is formed in the top of the positioning box 1, a rotating platform 4 is arranged at the opening, the lower surface of the rotating platform 4 is fixedly connected with the upper end of the rotating shaft 2, angle sensors 5 are mounted on the top of the positioning box 1 and around the rotating platform 4, the motor 3 and the angle sensors 5 are electrically connected with an external computer system, the computer system controls the motor 3 to work, the motor 3 can drive the rotating shaft 2 to rotate, the rotating shaft 2 can drive the rotating platform 4 to rotate, so that the wafer can rotate to conduct angle orientation adjustment, and the angle sensors 5 can detect the inclination angle in the rotating process, so that the wafer angle can be automatically adjusted.
Example 2
Referring to fig. 1-3, slide bases 6 are fixedly arranged in the positioning box 1 and positioned on two sides of a rotating shaft 2, slide bars 7 are elastically arranged in the two slide bases 6, clamping plates 8 are fixedly arranged at opposite ends of the two slide bars 7, one pull rope 9 is fixedly arranged at the opposite ends of the two slide bars 7, the pull rope 9 is positioned below the positioning box 1, a steel wire rope is adopted for the pull rope 9, a fixing hole is formed at one end, far away from the clamping plates 8, of the slide bars 7 is fixedly arranged in the fixing hole, a rotating body 10 is fixedly arranged on the shaft wall of the rotating shaft 2, the clamping plates 8 are in contact with the rotating body 10, the clamping plates 8 are arc-shaped plates, the rotating body 10 is hemispheres, and the radian of each clamping plate 8 is matched with the side wall of the rotating body 10; the rod wall of the slide rod 7 is fixedly provided with a fixed ring 11, the rod wall of the slide rod 7 is sleeved with a spring 12, and two ends of the spring 12 are fixedly connected with the side wall of the fixed ring 11 and the side wall of the slide seat 6 respectively; the bottom of the positioning box 1 is fixedly provided with a supporting frame 13, and a pull rope 9 is positioned between the positioning box 1 and the supporting frame 13; fixed pulleys 14 are fixedly arranged on two sides of the bottom of the positioning box 1, and the pull ropes 9 penetrate through the wheel walls of the fixed pulleys 14.
Example 3
Referring to fig. 4, the upper surface of the rotary platform 4 is provided with a positioning groove 15, the upper surface of the rotary platform 4 is provided with a plurality of uniformly distributed taking-out grooves 16 located outside the positioning groove 15, and the positioning groove 15 can automatically position and place the wafer, so that the wafer is located at the center of the rotary platform 4, and meanwhile, the taking-out grooves 16 are arranged, so that the wafer can be taken out from the inside of the positioning groove 15 manually.
In the utility model, when the wafer alignment device is used, a worker pulls the pull rope 9 downwards, so that the pull rope 9 can respectively drive the two slide bars 7 to move, one ends of the two slide bars 7 respectively drive the clamping plates 8 to move and separate from the rotating body 10, clamping and fixing of the rotating shaft 2 are eliminated, then the motor 3 is controlled by the computer system to work, the motor 3 can drive the rotating shaft 2 to rotate, the rotating shaft 2 can drive the rotating platform 4 to rotate, thereby enabling the wafer to rotate for angle alignment adjustment, the angle sensor 5 of the rotating platform 4 can detect the inclination angle in the rotating process, thereby automatically adjusting the wafer angle, after the wafer alignment is finished, the hand of the worker releases the pull rope 9, the spring 12 can apply elastic force to the slide bars 7, so that one ends of the slide bars 7 drive the clamping plates 8 to move, the clamping plates 9 are contacted with the side wall of the rotating body 20, the position of the rotating shaft 2 is fixed, the rotating platform 4 can not rotate randomly, the wafer alignment stability is improved, and the measurement accuracy is improved.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (9)
1. The large-size wafer orientation device comprises a positioning box (1), and is characterized in that a rotating shaft (2) is rotationally arranged at the center of the inside of the positioning box (1), a motor (3) is fixedly arranged at the bottom of the positioning box (1), the lower end of the rotating shaft (2) is fixedly connected with the output end of the motor (3), an opening is formed in the top of the positioning box (1), a rotating platform (4) is arranged at the opening, the lower surface of the rotating platform (4) is fixedly connected with the upper end of the rotating shaft (2), and angle sensors (5) are respectively arranged at the top of the positioning box (1) and around the rotating platform (4);
the inside of box (1) and the both sides that are located pivot (2) are all fixed and are equipped with slide (6), two the inside of slide (6) is all elastically equipped with slide bar (7), two slide bar (7) are relative one end is all fixed and is equipped with splint (8), two slide bar (7) are deviating from one end and are fixed and are equipped with same stay cord (9), and stay cord (9) are located the below setting of box (1), the fixed rotator (10) that is equipped with of shaft wall of pivot (2), splint (8) and rotator (10) contact setting.
2. The large-size wafer orientation device according to claim 1, wherein a fixing ring (11) is fixedly arranged on the rod wall of the sliding rod (7), a spring (12) is sleeved on the rod wall of the sliding rod (7), and two ends of the spring (12) are fixedly connected with the side wall of the fixing ring (11) and the side wall of the sliding seat (6) respectively.
3. The large-size wafer orientation device according to claim 1, wherein a supporting frame (13) is fixedly arranged at the bottom of the positioning box (1), and the pull rope (9) is positioned between the positioning box (1) and the supporting frame (13).
4. The large-size wafer orientation device according to claim 1, wherein fixed pulleys (14) are fixedly arranged on two sides of the bottom of the positioning box (1), and the pull ropes (9) penetrate through wheel walls of the fixed pulleys (14).
5. The large-size wafer orientation device according to claim 1, wherein a fixing hole is formed at one end of the sliding rod (7) far away from the clamping plate (8), and one end of the pull rope (9) is fixedly arranged in the fixing hole.
6. The large-sized wafer orienting device according to claim 1, wherein the clamping plate (8) is an arc-shaped plate, the rotator (10) is a hemisphere, and the radian of the clamping plate (8) is matched with the side wall of the rotator (10).
7. The large-size wafer orientation device according to claim 1, wherein the upper surface of the rotating platform (4) is provided with a positioning groove (15), and a plurality of evenly distributed extraction grooves (16) are formed in the upper surface of the rotating platform (4) and located outside the positioning groove (15).
8. The large-sized wafer orientation apparatus according to claim 1, wherein the pull string (9) is a wire rope.
9. The large-sized wafer orientation apparatus according to claim 1, wherein the motor (3) and the angle sensor (5) are electrically connected to an external computer system.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320188770.8U CN219532005U (en) | 2023-02-13 | 2023-02-13 | Large-size wafer orientation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320188770.8U CN219532005U (en) | 2023-02-13 | 2023-02-13 | Large-size wafer orientation device |
Publications (1)
Publication Number | Publication Date |
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CN219532005U true CN219532005U (en) | 2023-08-15 |
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Family Applications (1)
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CN202320188770.8U Active CN219532005U (en) | 2023-02-13 | 2023-02-13 | Large-size wafer orientation device |
Country Status (1)
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CN (1) | CN219532005U (en) |
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2023
- 2023-02-13 CN CN202320188770.8U patent/CN219532005U/en active Active
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP02 | Change in the address of a patent holder |
Address after: 5-1 High tech Innovation and Excellence Valley, No. 1188 Jinqiao Road, High tech Industrial Development Zone, Nantong City, Jiangsu Province, 226000 Patentee after: Jiangsu Meilun photoelectric Co.,Ltd. Address before: 211600 No. 7, Xinglou Road, Jinhu County Economic Development Zone, Huai'an City, Jiangsu Province Patentee before: Jiangsu Meilun photoelectric Co.,Ltd. |
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CP02 | Change in the address of a patent holder |