CN219520321U

CN219520321U - Pin bending device for electronic component

Info

Publication number: CN219520321U
Application number: CN202320793714.7U
Authority: CN
Inventors: 倪寒松; 何书娟; 陈镭中
Original assignee: Xinyi Hongxiang Electronics Co ltd
Current assignee: Xinyi Hongxiang Electronics Co ltd
Priority date: 2023-04-11
Filing date: 2023-04-11
Publication date: 2023-08-15
Anticipated expiration: 2033-04-11

Abstract

The utility model relates to the technical field of electronic component processing, in particular to a pin bending device for an electronic component, which comprises an operation table, a die assembly and a processing assembly, wherein the die assembly is connected to the middle of the upper end of the operation table, a feeding seat is connected to one end of the upper end of the operation table, which is close to the die assembly, a processing assembly is connected to the back of the upper end of the operation table, a receiving groove is arranged on one side of the operation table, a downward turning door is connected to the front of the receiving groove, the die assembly consists of a first electric linear slide rail and a lower die mechanism arranged at the upper end of the first electric linear slide rail, the lower die mechanism consists of a moving seat, a lower die, a bending groove and a limiting groove, and the processing assembly consists of a mounting plate, a second electric linear slide rail, a first lifting cylinder, a second lifting cylinder and a third lifting cylinder.

Description

Pin bending device for electronic component

Technical Field

The utility model relates to the technical field of electronic component processing, in particular to a pin bending device for an electronic component.

Background

When bending the bending pin of the electronic component by using the machine, the bending pin is easy to break in place by one-time bending, the integral quality is affected, and single operation is time-consuming and labor-consuming when bending, and the processing efficiency is low.

Therefore, it is necessary to design a pin bending device for electronic components to solve the above-mentioned problems in the related art.

Disclosure of Invention

The utility model aims to solve the problems that in the prior art, when bending a bent pin of an electronic component by using a machine, the bent pin is easy to break at one time, the whole quality is affected, and single operation is time-consuming and labor-consuming and the processing efficiency is low.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the pin bending device for the electronic component comprises an operation table, a mold assembly and a processing assembly, wherein the middle of the upper end of the operation table is connected with the mold assembly, one end of the upper end of the operation table, which is close to the mold assembly, is connected with a feeding seat, and the back of the upper end of the operation table, which is close to the mold assembly, is connected with the processing assembly;

a receiving groove is formed in one side of the operating platform, and a downward turning door is connected to the front side of the receiving groove;

the die assembly consists of a first electric linear slide rail and a lower die mechanism arranged at the upper end of the first electric linear slide rail;

the lower die mechanism consists of a movable seat, a lower die, bending grooves and limiting grooves, wherein the upper end of the movable seat is connected with a plurality of groups of lower dies, the middle of the upper end of each lower die is provided with the limiting groove, and the upper end of each lower die is provided with the bending grooves close to the front surface and the back surface;

the processing assembly comprises mounting panel, second electronic linear slide rail, first lift cylinder, second lift cylinder and third lift cylinder, just mounting panel openly upper portion both sides all are connected with the electronic linear slide rail of second, the positive department of second electronic linear slide rail is connected with first lift cylinder, the positive middle department in mounting panel upper portion is connected with multiunit second lift cylinder and third lift cylinder, first lift cylinder and second lift cylinder lower extreme all are connected with the sucking disc seat, sucking disc seat openly department is equipped with multiunit air pump interface, sucking disc seat lower extreme is equipped with multiunit sucking disc, third lift cylinder lower extreme is connected with the mould.

As a preferable scheme of the utility model, the depths of the bending grooves on the plurality of groups of lower dies are gradually increased from right to left.

As a preferable scheme of the utility model, the lower end of the upper die is provided with a pressing groove matched with the lower die.

As a preferable scheme of the utility model, a plurality of groups of third lifting cylinders, the first lifting cylinders and the second lifting cylinders are distributed in a staggered manner.

As a preferable scheme of the utility model, one end of the feeding seat far away from the die assembly is connected with a vibration disc feeder.

As a preferable scheme of the utility model, the air pump interface is connected with an air pump.

In summary, the technical effects and advantages of the present utility model are: this bending device for electronic components, the degree of depth in the groove of bending on the multiunit bed die is the setting of increasing gradually from right to left, goes up the mould lower extreme and is equipped with the indent that matches with the bed die, forms the multiple bending structure for electronic components, and the bending of electronic components can be progressively buckled to the bending of shallow to deep groove that sets up, forms progressive bending, avoids once only bending to cause the damage of bending, during the use, can circulate bending operation through multiunit third lift cylinder, first lift cylinder and second lift cylinder, has improved machining efficiency.

Drawings

FIG. 1 is an overall block diagram of the present utility model;

FIG. 2 is a block diagram of a tooling assembly of the present utility model;

FIG. 3 is a block diagram of a mold assembly of the present utility model;

fig. 4 is a structural view of the lower die mechanism of the present utility model.

In the figure: 1. an operation table; 101. a material collecting groove; 102. a down-turned door; 2. a mold assembly; 201. the first electric linear slide rail; 202. a lower die mechanism; 2021. a movable seat; 2022. a lower die; 2023. a bending groove; 2024. a limit groove; 3. processing the assembly; 301. a mounting plate; 302. the second electric linear slide rail; 303. a first lifting cylinder; 304. a second lifting cylinder; 305. a third lifting cylinder; 306. an upper die; 307. an air pump interface; 308. a suction cup; 309. a sucker seat; 4. and a feeding seat.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-4, a pin bending device for electronic components comprises an operation table 1, a mold assembly 2 and a processing assembly 3, wherein the middle of the upper end of the operation table 1 is connected with the mold assembly 2, one end of the upper end of the operation table 1, which is close to the mold assembly 2, is connected with a feeding seat 4, and the back of the upper end of the operation table 1, which is close to the mold assembly 2, is connected with the processing assembly 3; a receiving groove 101 is arranged on one side of the operating platform 1, and a downward-turning door 102 is connected to the front side of the receiving groove 101; the die assembly 2 consists of a first electric linear slide rail 201 and a lower die mechanism 202 arranged at the upper end of the first electric linear slide rail 201; the lower die mechanism 202 consists of a movable base 2021, a lower die 2022, bending grooves 2023 and limiting grooves 2024, wherein the upper end of the movable base 2021 is connected with a plurality of groups of lower dies 2022, the middle of the upper end of the lower die 2022 is provided with the limiting grooves 2024, and the upper end of the lower die 2022 is provided with the bending grooves 2023 close to the front and the back; the processing assembly 3 comprises a mounting plate 301, a second electric linear sliding rail 302, a first lifting cylinder 303, a second lifting cylinder 304 and a third lifting cylinder 305, wherein the two sides of the front upper part of the mounting plate 301 are respectively connected with the second electric linear sliding rail 302, the front position of the second electric linear sliding rail 302 is connected with the first lifting cylinder 303, the middle position of the front upper part of the mounting plate 301 is connected with a plurality of groups of second lifting cylinders 304 and the third lifting cylinder 305, the lower ends of the first lifting cylinder 303 and the second lifting cylinder 304 are respectively connected with a sucker seat 309, a plurality of groups of air pump interfaces 307 are arranged at the front position of the sucker seat 309, a plurality of groups of suckers 308 are arranged at the lower end of the sucker seat 309, and the lower end of the third lifting cylinder 305 is connected with an upper die 306.

Referring to fig. 1, 3 and 4, when bending the bending feet of the electronic component by using a machine, the bending feet are easy to be broken in place by one time bending, the overall quality is affected, the depths of the bending grooves 2023 on the plurality of groups of lower dies 2022 are gradually increased from right to left, the lower end of the upper die 306 is provided with pressing grooves matched with the lower dies 2022, a multiple bending foot structure for the electronic component is formed, the bending feet of the electronic component can be gradually bent by the bending grooves 2023 from shallow to deep, progressive bending is formed, and the bending loss caused by one time bending is avoided.

Referring to fig. 1, 2 and 3, when bending, single operation is time-consuming and labor-consuming, machining efficiency is low, multiple groups of third lifting cylinders 305, first lifting cylinders 303 and second lifting cylinders 304 are distributed in a staggered mode, an air pump is connected to an air pump interface 307, one end, far away from a die assembly 2, of a feeding seat 4 is connected with a vibration disc feeder, and when the bending machine is used, circulating bending operation can be performed through multiple groups of third lifting cylinders 305, first lifting cylinders 303 and second lifting cylinders 304, so that machining efficiency is improved.

Working principle: the bending device for the electronic component is characterized in that the depths of bending grooves 2023 on a plurality of groups of lower dies 2022 are gradually increased from right to left, pressing grooves matched with the lower dies 2022 are formed in the lower end of an upper die 306, a multiple bending structure for the electronic component is formed, the bending grooves 2023 arranged from shallow to deep can gradually bend the bending of the electronic component, progressive bending is formed, bending loss caused by disposable bending is avoided, and during use, circulating bending operation can be performed through a plurality of groups of third lifting cylinders 305, first lifting cylinders 303 and second lifting cylinders 304, so that the processing efficiency is improved.

When in use, the electronic components are fed through the vibrating disc feeder and the feeding seat 4;

when the electronic component moves to the first lifting cylinder 303 close to the feeding seat 4, the electronic component is sucked by the sucking disc 308 on the first lifting cylinder 303 and then moves to the first lower die 2022 along the second electric linear sliding rail 302, then moves downwards to be placed on the lower die 2022, the lower die mechanism 202 moves to the lower end of the first third lifting cylinder 305 along the first electric linear sliding rail 201, and the first bending is completed by pressing downwards the upper die 306;

then the lower die mechanism 202 moves to the first second lifting cylinder 304 along the first electric linear slide rail 201, after the sucker 308 absorbs the electronic components, the second lower die 2022 on the lower die mechanism 202 moves to the lower end of the sucker 308, the sucker 308 moves downwards to place the electronic components after the first bending on the second lower die 2022, the second lower die 2022 moves to the lower end of the second third lifting cylinder 305, and the second bending is completed by pressing down the upper die 306;

repeating the above operation, moving the electronic component after the second bending to the third lower die 2022 under the action of the second lifting cylinder 304, and pressing down the upper die 306 on the third lifting cylinder 305 to complete the third bending;

then, the electronic components on the third lower die 2022 are moved into the material receiving groove 101 under the action of the second first lifting cylinder 303;

when the operation is performed, the whole unit is circularly operated, and bending processing can be continuously performed.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a bending device for electronic components, includes operation panel (1), mould subassembly (2) and processing subassembly (3), its characterized in that: the middle of the upper end of the operating table (1) is connected with a die assembly (2), one end of the upper end of the operating table (1) close to the die assembly (2) is connected with a feeding seat (4), and the back of the upper end of the operating table (1) close to the die assembly (2) is connected with a processing assembly (3);

a receiving groove (101) is formed in one side of the operating platform (1), and a downward turning door (102) is connected to the front of the receiving groove (101);

the die assembly (2) consists of a first electric linear slide rail (201) and a lower die mechanism (202) arranged at the upper end of the first electric linear slide rail (201);

the lower die mechanism (202) consists of a movable base (2021), a lower die (2022), bending grooves (2023) and limiting grooves (2024), wherein a plurality of groups of lower dies (2022) are connected to the upper end of the movable base (2021), the limiting grooves (2024) are formed in the middle of the upper end of the lower die (2022), and the bending grooves (2023) are formed in the positions, close to the front surface and the back surface, of the upper end of the lower die (2022);

the processing assembly (3) comprises a mounting plate (301), a second electric linear sliding rail (302), a first lifting cylinder (303), a second lifting cylinder (304) and a third lifting cylinder (305), wherein two sides of the front upper portion of the mounting plate (301) are connected with the second electric linear sliding rail (302), the front position of the second electric linear sliding rail (302) is connected with the first lifting cylinder (303), the front middle position of the upper portion of the mounting plate (301) is connected with a plurality of groups of second lifting cylinders (304) and the third lifting cylinder (305), the lower ends of the first lifting cylinder (303) and the second lifting cylinder (304) are respectively connected with a sucker seat (309), a plurality of groups of air pump interfaces (307) are arranged at the front position of the sucker seat (309), a plurality of groups of suckers (308) are arranged at the lower end of the sucker seat (309), and the lower end of the third lifting cylinder (305) is connected with an upper die (306).

2. The bending apparatus for electronic components according to claim 1, wherein: the depths of the bending grooves (2023) on the plurality of groups of lower dies (2022) are gradually increased from right to left.

3. The bending apparatus for electronic components according to claim 1, wherein: the lower end of the upper die (306) is provided with a pressing groove matched with the lower die (2022).

4. The bending apparatus for electronic components according to claim 1, wherein: the third lifting cylinders (305), the first lifting cylinders (303) and the second lifting cylinders (304) are distributed in a staggered mode.

5. The bending apparatus for electronic components according to claim 1, wherein: one end of the feeding seat (4) far away from the die assembly (2) is connected with a vibration disc feeder.

6. The bending apparatus for electronic components according to claim 1, wherein: an air pump is connected to the air pump interface (307).