CN219513093U

CN219513093U - Semiconductor chip structure

Info

Publication number: CN219513093U
Application number: CN202320438698.XU
Authority: CN
Inventors: 刘伟锋
Original assignee: Shanghai Jinghou Electronic Technology Co ltd
Current assignee: Shanghai Jinghou Electronic Technology Co ltd
Priority date: 2023-03-09
Filing date: 2023-03-09
Publication date: 2023-08-11
Anticipated expiration: 2033-03-09

Abstract

The utility model discloses a semiconductor chip structure which comprises a mounting plate and a semiconductor chip body, wherein two sides of the top of the mounting plate are fixedly connected with a shell, an inner cavity of the shell is movably connected with a moving plate, one side of the moving plate is fixedly connected with a clamping plate, and the front surface and the back surface of the clamping plate are fixedly connected with limiting plates. According to the utility model, firstly, a user clamps the bottom of the semiconductor chip body with the inner cavity of the groove, meanwhile, in the placing process, the semiconductor chip body drives the clamping plate to move to one side, the clamping plate drives the moving plate to move to one side, the moving plate extrudes the telescopic rod and the first spring, the fixed rod is driven to move to one side, the fixed rod drives the movable plate to move to one side, the movable plate extrudes the second spring, and the semiconductor chip body is clamped by the aid of the reverse force generated by the second spring, the telescopic rod and the first spring under the cooperation of the clamping plate and the limiting plate.

Description

Semiconductor chip structure

Technical Field

The utility model relates to the technical field of semiconductor chips, in particular to a semiconductor chip structure.

Background

Semiconductor chips are etched and wired on semiconductor wafers to produce semiconductor devices capable of performing a function, not only silicon chips, but also gallium arsenide (gallium arsenide is toxic and therefore some poor circuit boards do not have to decompose it), germanium, and other semiconductor materials. Semiconductors also resemble motor vehicles with a trend. In the seventies of the twentieth century, U.S. enterprises, intel, and the like, have been winded on the dynamic random access memory (D-RAM) market. However, due to the advent of mainframe computers, high performance D-RAM was required in the eighties of the twentieth century, the japanese company, the forepart of the name.

The utility model provides a semiconductor chip structure, which comprises a semiconductor device structure region and a Peltier refrigeration structure region, wherein a device side first semiconductor layer of the semiconductor device structure region and a refrigeration side first semiconductor layer of the Peltier refrigeration structure region share the same semiconductor layer, and further, the working structure of the semiconductor device structure region directly dissipates heat through the Peltier refrigeration structure region, so that the internal heat accumulation effect of the semiconductor device structure region is reduced, and the working performance of the semiconductor chip structure is improved.

The existing semiconductor chip does not have a limiting structure, is easy to fall off in the using process, is inconvenient to assemble and disassemble, and is time-consuming and labor-consuming in the disassembling and assembling mode when the semiconductor chip is damaged and needs to be replaced or maintained, so that the subsequent maintenance efficiency is greatly reduced.

Disclosure of Invention

The utility model aims to provide a semiconductor chip structure, which has the advantage of convenient disassembly and assembly, and solves the problems that the existing semiconductor chip is not provided with a limiting structure, is easy to fall off in the use process, is inconvenient in disassembly and assembly, and is time-consuming and labor-consuming when the semiconductor chip is damaged and needs to be replaced or maintained, and the subsequent maintenance efficiency is greatly reduced.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor chip structure, includes mounting panel and semiconductor chip body, the equal fixedly connected with casing in both sides at mounting panel top, the inner chamber swing joint of casing has the movable plate, one side fixedly connected with splint of movable plate, the equal fixedly connected with limiting plate in front surface and the back of splint, the equal fixedly connected with telescopic link in top and the bottom of movable plate opposite side, the surface winding of telescopic link has first spring.

Preferably, the top and the bottom of the inner cavity of the shell are provided with second sliding grooves, and the top and the bottom of the moving plate are in sliding connection with the inner cavity of the second sliding grooves.

Preferably, one side of the inner cavity of the shell is fixedly connected with a fixed box, the inner cavity of the fixed box is movably connected with a movable plate, one side of the movable plate is fixedly connected with a second spring, and the other side of the movable plate is fixedly connected with a fixed rod.

Preferably, the periphery of the inner cavity of the mounting plate is connected with mounting bolts in a threaded manner, and the number of the mounting bolts is four.

Preferably, a protecting shell is arranged on the surface of the fixed box, and the protecting shell is fixedly connected with the fixed box through a fastening bolt.

Preferably, the top of the mounting plate is provided with a groove, and the size of the groove is matched with the bottom of the semiconductor chip body.

Preferably, the top and the bottom of the inner cavity of the fixed box are provided with first sliding grooves, and the top and the bottom of the movable plate are in sliding connection with the first sliding grooves.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, firstly, a user clamps the bottom of the semiconductor chip body with the inner cavity of the groove, meanwhile, in the placing process, the semiconductor chip body drives the clamping plate to move to one side, the clamping plate drives the moving plate to move to one side, the moving plate extrudes the telescopic rod and the first spring, the fixed rod is driven to move to one side, the fixed rod drives the movable plate to move to one side, the movable plate extrudes the second spring, and the semiconductor chip body is clamped by the aid of the reverse force generated by the second spring, the telescopic rod and the first spring under the cooperation of the clamping plate and the limiting plate.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a cross-sectional view of the housing of the present utility model;

FIG. 3 is a cross-sectional view of a stationary box of the present utility model;

fig. 4 is a schematic perspective view of the mounting plate of the present utility model.

In the figure: 1. a mounting plate; 2. a groove; 3. a housing; 4. a moving plate; 5. a clamping plate; 6. a limiting plate; 7. a telescopic rod; 8. a first spring; 9. a fixed box; 10. a fixed rod; 11. a movable plate; 12. a second spring; 13. a second chute; 14. a semiconductor chip body; 15. installing a bolt; 16. and (5) protecting the shell.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, embodiments of the present utility model are further described below with reference to the accompanying drawings.

Example 1

The utility model provides a semiconductor chip structure, includes mounting panel 1 and semiconductor chip body 14, the equal fixedly connected with casing 3 in both sides at mounting panel 1 top, and the inner chamber swing joint of casing 3 has movable plate 4, and one side fixedly connected with splint 5 of movable plate 4, the equal fixedly connected with limiting plate 6 in the front surface and the back of splint 5, the equal fixedly connected with telescopic link 7 in top and the bottom of movable plate 4 opposite side, the surface winding of telescopic link 7 has first spring 8.

The bottom of the semiconductor chip body 14 and the inner cavity of the groove 2 are clamped by a user, meanwhile, in the placing process, the clamping plate 5 is driven to move to one side through the semiconductor chip body 14, the moving plate 4 is driven to move to one side through the clamping plate 5, the telescopic rod 7 and the first spring 8 are extruded through the moving plate 4, the fixing rod 10 is driven to move to one side, the movable plate 11 is driven to move to one side through the fixing rod 10, the second spring 12 is extruded through the movable plate 11, and the semiconductor chip body 14 is clamped under the cooperation of the clamping plate 5 and the limiting plate 6 by utilizing the reverse force generated by the second spring 12, the telescopic rod 7 and the first spring 8.

Example 2

The top and the bottom of casing 3 inner chamber have all been seted up second spout 13, the top and the bottom of movable plate 4 all with the inner chamber sliding connection of second spout 13, one side fixedly connected with fixed box 9 of casing 3 inner chamber, the inner chamber swing joint of fixed box 9 has fly leaf 11, one side fixedly connected with second spring 12 of fly leaf 11, the opposite side fixedly connected with dead lever 10 of fly leaf 11, the equal threaded connection all around of mounting panel 1 inner chamber has mounting bolt 15, the quantity of mounting bolt 15 is four, through the setting of mounting bolt 15, the convenience is dismantled and assembled to mounting panel 1, the efficiency of dismouting has been improved greatly, the surface of fixed box 9 is equipped with protecting crust 16, pass through fastening bolt fixed connection between protecting crust 16 and the fixed box 9, recess 2 has been seted up at the top of mounting panel 1, the size of recess 2 and the bottom looks adaptation of semiconductor chip body 14, through the setting of recess 2, the convenience carries out the joint to semiconductor chip body 14, the function of limiting is also reached simultaneously to semiconductor chip body 14, the top and bottom of fixed box 9 inner chamber all has seted up first spout, the top and bottom of fly leaf 11 all with first spout are four, the setting up through the setting up of mounting panel 15, the stability is greatly increased when the fly leaf 11 is moved to the fly leaf 11, the limit 11 is carried out to the movable plate is greatly by the setting up, the movable plate 11, the stability is greatly increased when the moving panel is moved, and is moved

When the clamping device is used, firstly, a user clamps the bottom of the semiconductor chip body 14 and the inner cavity of the groove 2, meanwhile, in the placing process, the semiconductor chip body 14 drives the clamping plate 5 to move to one side, the clamping plate 5 drives the moving plate 4 to move to one side, the moving plate 4 extrudes the telescopic rod 7 and the first spring 8, the fixed rod 10 is driven to move to one side, the fixed rod 10 drives the movable plate 11 to move to one side, the movable plate 11 extrudes the second spring 12, the telescopic rod 7 and the first spring 8 are utilized to generate reverse force, the semiconductor chip body 14 is clamped under the cooperation of the clamping plate 5 and the limiting plate 6, and after clamping is completed, the user installs the clamping device at a designated position through the mounting bolt 15, so that the aim of convenient installation is achieved.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor chip structure comprising a mounting board (1) and a semiconductor chip body (14), characterized in that: the utility model discloses a flexible electric motor, including mounting panel (1), inner chamber, movable plate (4), limiting plate (6) are all fixedly connected with casing (3) in both sides at mounting panel (1) top, inner chamber swing joint of casing (3) has movable plate (4), one side fixedly connected with splint (5) of movable plate (4), the equal fixedly connected with limiting plate (6) in front surface and the back of splint (5), the equal fixedly connected with telescopic link (7) in top and the bottom of movable plate (4) opposite side, the surface winding of telescopic link (7) has first spring (8).

2. A semiconductor chip structure according to claim 1, wherein: the top and the bottom of the inner cavity of the shell (3) are respectively provided with a second chute (13), and the top and the bottom of the moving plate (4) are respectively connected with the inner cavity of the second chute (13) in a sliding way.

3. A semiconductor chip structure according to claim 1, wherein: one side fixedly connected with fixed case (9) of casing (3) inner chamber, the inner chamber swing joint of fixed case (9) has fly leaf (11), one side fixedly connected with second spring (12) of fly leaf (11), the opposite side fixedly connected with dead lever (10) of fly leaf (11).

4. A semiconductor chip structure according to claim 1, wherein: the four sides of the inner cavity of the mounting plate (1) are connected with mounting bolts (15) in a threaded mode, and the number of the mounting bolts (15) is four.

5. A semiconductor chip structure according to claim 3, wherein: the surface of the fixed box (9) is provided with a protective shell (16), and the protective shell (16) is fixedly connected with the fixed box (9) through a fastening bolt.

6. A semiconductor chip structure according to claim 1, wherein: the top of mounting panel (1) has seted up recess (2), the size of recess (2) and the bottom looks adaptation of semiconductor chip body (14).

7. A semiconductor chip structure according to claim 3, wherein: the top and the bottom of the inner cavity of the fixed box (9) are provided with first sliding grooves, and the top and the bottom of the movable plate (11) are in sliding connection with the first sliding grooves.