CN210470111U

CN210470111U - Heat dissipation device for electronic product

Info

Publication number: CN210470111U
Application number: CN201921142724.4U
Authority: CN
Inventors: 徐澄琬
Original assignee: Wuxi Chengda Technology Co Ltd
Current assignee: Wuxi Chengda Technology Co Ltd
Priority date: 2019-07-20
Filing date: 2019-07-20
Publication date: 2020-05-05
Anticipated expiration: 2029-07-20

Abstract

The utility model discloses a be used for electronic product heat abstractor, including the radiating seat, two installation cavities have been seted up to the inside of radiating seat, and the internal face fixedly connected with backup pad of installation cavity, two air inlet chambers have been seted up in the backup pad, one side of radiating seat is provided with the absorber plate, and one side surface of absorber plate is provided with heat conduction silica gel pad, a plurality of fin of opposite side surface fixedly connected with of absorber plate, adjacent two the top and the bottom of fin all are fixed with the connection piece, one side of connection piece is provided with hexagon nut, be provided with hexagon bolt on the radiating seat, and the opposite side of radiating seat is provided with the apron, two exhaust chambers have been seted up on the apron, the inside of installation cavity is provided with radiator fan. The utility model discloses simple structure, the noise that produces when can effectual reduction radiator fan moves is favorable to keeping the stability of whole device structure, and the device's dismouting is simple simultaneously, and the practicality is strong.

Description

Heat dissipation device for electronic product

Technical Field

The utility model relates to an electronic product technical field especially relates to a be used for electronic product heat abstractor.

Background

The electronic product is a related product based on electric energy, and mainly comprises: watches, smart phones, telephones, televisions, video disc players, video recorders, camcorders, radios, radio recorders, combination speakers, compact disc players, computers, game consoles, mobile communication products, and the like, since early products were primarily electronic products based on electronic tubes.

The cooling fan of the existing cooling device for electronic products can generate certain vibration due to the operation of an internal motor when in operation, so that noise can be generated, noise pollution is caused, and the actual use is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art, and provides a heat dissipation device for an electronic product.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat dissipation device for electronic products comprises a heat dissipation seat, wherein two installation cavities are formed in the heat dissipation seat, a supporting plate is fixedly connected to the inner wall surface of each installation cavity, two air inlet cavities are formed in the supporting plate, a heat absorption plate is arranged on one side of the heat dissipation seat, a heat conduction silica gel pad is arranged on the outer surface of one side of the heat absorption plate, a plurality of heat dissipation fins are fixedly connected to the outer surface of the other side of the heat absorption plate, connecting pieces are fixed to the tops and the bottoms of every two adjacent heat dissipation fins, a hexagon nut is arranged on one side of each connecting piece, a hexagon bolt is arranged on the heat dissipation seat, a cover plate is arranged on the other side of the heat dissipation seat, two air exhaust cavities are formed in the cover plate, a heat dissipation fan is arranged in the installation cavity, a plurality of first buffer springs are symmetrically arranged on the outer, and the inside of first recess is provided with second buffer spring, the internal surface of installation cavity seted up with first recess assorted second recess, the apron all is fixed with the flexure strip near one side top bottom of radiating seat, two all be fixed with first screens piece on two opposite sides of flexure strip, the third recess has all been seted up at the upper and lower both ends of radiating seat, and the internally mounted of third recess has a plurality of second screens pieces.

Preferably, inclined planes are arranged on the first clamping block and the second clamping block, and the inclined plane inclination angle of the first clamping block is equal to that of the second clamping block.

Preferably, the hexagonal bolt penetrates through the heat dissipation seat and is in threaded connection with the connecting piece and the hexagonal nut.

Preferably, one end of the first buffer spring is fixed to the heat dissipation fan, and the other ends of the first buffer springs are respectively in contact with the support plate and the cover plate.

Preferably, the outer surface of one side of the supporting plate is flush with the outer surface of one side of the heat radiating seat, and the input end of the heat radiating fan is electrically connected with the output end of the external power supply.

Preferably, one end of the second buffer spring is fixed inside the first groove, and the other end of the second buffer spring is in contact with the inner surface of the second groove.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in through setting up the radiating seat, the installation cavity, a supporting plate, the chamber of admitting air, hexagon nut, hexagon bolt, the apron, the exhaust chamber, radiator fan, first buffer spring, first recess, second buffer spring and second recess, utilize first buffer spring and second buffer spring's cushioning effect and the damping effect who produces between each other, can carry out effectual buffering to the vibrations that produce when radiator fan moves, avoid on its vibrations transmit the radiating seat to the effectual noise that produces when radiator fan moves that has reduced.

2. The utility model discloses in through setting up flexure strip, first screens piece, third recess and second screens piece, utilize the joint effect of each other of first screens piece and second screens piece, made things convenient for apron and radiator fan's installation and dismantlement, the in-service use is effectual.

To sum up, the utility model discloses the noise that produces when can effectual reduction radiator fan moves is favorable to keeping the stability of whole device structure, and the device's dismouting is simple simultaneously, and the practicality is strong.

Drawings

Fig. 1 is a schematic view of an overall structure of a heat dissipation device for electronic products according to the present invention;

fig. 2 is an enlarged cross-sectional view of a portion a in fig. 1 of a heat dissipation device for electronic products according to the present invention;

fig. 3 is a side view of a heat sink seat for a heat dissipation device of an electronic product according to the present invention;

fig. 4 is a side view of a cover plate for a heat dissipation device of an electronic product according to the present invention;

fig. 5 is a side view of an absorber plate for a heat dissipation device of an electronic product according to the present invention.

In the figure: the heat radiation device comprises a heat radiation seat 1, a mounting cavity 2, a support plate 3, an air inlet cavity 4, a heat absorption plate 5, a heat conduction silica gel pad 6, a heat radiation fin 7, a connecting sheet 8, a hexagon nut 9, a hexagon bolt 10, a cover plate 11, an air exhaust cavity 12, a heat radiation fan 13, a first buffer spring 14, a first groove 15, a second buffer spring 16, a second groove 17, an elastic sheet 18, a first clamping block 19, a third groove 20 and a second clamping block 21.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-5, a heat dissipation device for electronic products, comprising a heat dissipation base 1, two installation cavities 2 are formed inside the heat dissipation base 1, a supporting plate 3 is fixedly connected to the inner wall surface of the installation cavity 2, two air inlet cavities 4 are formed on the supporting plate 3, a heat absorption plate 5 is arranged on one side of the heat dissipation base 1, a heat conductive silicone pad 6 is arranged on the outer surface of one side of the heat absorption plate 5, a plurality of heat dissipation fins 7 are fixedly connected to the outer surface of the other side of the heat absorption plate 5, connecting sheets 8 are fixed to the top and the bottom of two adjacent heat dissipation fins 7, a hexagon nut 9 is arranged on one side of each connecting sheet 8, a hexagon bolt 10 is arranged on the heat dissipation base 1, a cover plate 11 is arranged on the other side of the heat dissipation base 1, two air exhaust cavities 12 are formed on the cover plate 11, a heat dissipation fan 13 is arranged, a plurality of first grooves 15 have been seted up to radiator fan 13's terminal surface, and the inside of first groove 15 is provided with second buffer spring 16, the internal surface of installation cavity 2 is seted up with first groove 15 assorted second recess 17, apron 11 all is fixed with flexure strip 18 near one side top bottom of radiating seat 1, all be fixed with first screens piece 19 on two opposite sides of two flexure strips 18, third recess 20 has all been seted up at the upper and lower both ends of radiating seat 1, and the internally mounted of third recess 20 has a plurality of second screens pieces 21.

Inclined planes are respectively arranged on the first clamping block 19 and the second clamping block 21, the inclined plane inclination angle of the first clamping block 19 is equal to that of the second clamping block 21, the hexagonal bolt 10 penetrates through the heat radiating seat 1 and the connecting piece 8 to be in threaded connection with the hexagonal nut 9, one end of the first buffer spring 14 is fixed with the heat radiating fan 13, the other ends of the first buffer springs 14 are respectively in contact with the supporting plate 3 and the cover plate 11, the outer surface of one side of the supporting plate 3 is parallel and level with the outer surface of one side of the heat radiating seat 1, the input end of the heat radiating fan 13 is electrically connected with the output end of the external power supply, one end of the second buffer spring 16 is fixed inside the first groove 15, and the other end of the second buffer spring 16 is in contact with the inner surface of the second groove 17.

The working principle is as follows: when the heat-absorbing plate is used, the heat-absorbing plate 5 is installed on an electronic product by utilizing installation structures such as bolts, and then the heat-radiating fan 13 is started to radiate the electronic product, specifically as follows: the heat on the electronic product can be firstly transferred to the heat absorbing plate 5 through the heat conducting silica gel pad 6 and then transferred to the plurality of heat radiating fins 7, and at the moment, the operation of the heat radiating fan 13 can enable the air in the external environment to enter the mounting cavity 2 through the gaps among the plurality of heat radiating fins 7 and the air inlet cavity 4 and then be exhausted from the air exhaust cavity 12, in the process, the heat gathered on the heat radiating fins 7 and the heat absorbing plate 5 can be taken away by the air, so that the rapid heat radiation is realized, the vibration generated by the heat radiating fan 13 can be buffered by the plurality of first buffer springs 14 and the plurality of second buffer springs 16, so that the vibration amplitude of the heat radiating fan 13 is reduced, the noise is reduced, and because the number of the first buffer springs 14 and the second buffer springs 16 is large and the distribution mode is special, a certain damping force can be generated between the first buffer springs and the second buffer springs for preventing the, when the device is overhauled to needs dismantlement, direct outside pulling flexure strip 18 for first screens piece 19 and the separation of second screens piece 21 can pull down apron 11, then pull down radiator fan 13 can again, hexagon nut 9 cooperation hexagon bolt 10 is used for installing connection piece 8 with radiating seat 1 on, heat conduction silica gel pad 6 can make absorber plate 5 carry out inseparable connection with the electronic product, is favorable to the quick transmission of heat amount, and second recess 17 is used for fixing a position second buffer spring 16, the utility model discloses simple structure, the noise that produces when can effectual reduction radiator fan 13 operation, be favorable to keeping the stability of whole device structure, the device's dismouting is simple simultaneously, and the practicality is strong.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A heat dissipation device for an electronic product comprises a heat dissipation seat (1) and is characterized in that two installation cavities (2) are formed in the heat dissipation seat (1), a supporting plate (3) is fixedly connected to the inner wall surface of each installation cavity (2), two air inlet cavities (4) are formed in the supporting plate (3), a heat absorption plate (5) is arranged on one side of the heat dissipation seat (1), a heat conduction silica gel pad (6) is arranged on the outer surface of one side of the heat absorption plate (5), a plurality of heat dissipation fins (7) are fixedly connected to the outer surface of the other side of the heat absorption plate (5), connecting pieces (8) are fixed to the tops and the bottoms of two adjacent heat dissipation fins (7), a hexagon nut (9) is arranged on one side of each connecting piece (8), a hexagon bolt (10) is arranged on the heat dissipation seat (1), and a cover plate (11) is arranged on the, two exhaust cavities (12) are arranged on the cover plate (11), a heat radiation fan (13) is arranged inside the mounting cavity (2), and a plurality of first buffer springs (14) are symmetrically arranged on the outer surfaces of the two sides of the heat dissipation fan (13), a plurality of first grooves (15) are arranged on the end surface of the heat dissipation fan (13), a second buffer spring (16) is arranged in the first groove (15), a second groove (17) matched with the first groove (15) is formed in the inner surface of the mounting cavity (2), elastic pieces (18) are fixed at the top bottom of one side of the cover plate (11) close to the heat radiating seat (1), first clamping blocks (19) are fixed on two opposite side surfaces of the two elastic pieces (18), the upper end and the lower end of the heat radiation seat (1) are both provided with third grooves (20), and a plurality of second clamping blocks (21) are arranged in the third groove (20).

2. The heat dissipation device for electronic products of claim 1, wherein the first locking block (19) and the second locking block (21) are both provided with an inclined surface, and an inclination angle of the inclined surface of the first locking block (19) is equal to an inclination angle of the inclined surface of the second locking block (21).

3. The heat sink for electronic products as claimed in claim 1, wherein the hexagonal bolt (10) passes through the heat sink (1) and is in threaded connection with the connecting piece (8) and the hexagonal nut (9).

4. The heat sink for electronic products as claimed in claim 1, wherein one end of the first buffer spring (14) is fixed to the heat sink (13), and the other ends of the first buffer springs (14) are respectively in contact with the support plate (3) and the cover plate (11).

5. The heat dissipation device for electronic products as claimed in claim 1, wherein the outer surface of one side of the supporting plate (3) is flush with the outer surface of one side of the heat dissipation base (1), and the input end of the heat dissipation fan (13) is electrically connected to the output end of an external power supply.

6. A heat sink for electronic products according to claim 1, wherein one end of the second buffer spring (16) is fixed inside the first recess (15), and the other end of the second buffer spring (16) contacts with the inner surface of the second recess (17).