CN219513050U

CN219513050U - Semiconductor device testing device

Info

Publication number: CN219513050U
Application number: CN202223462329.9U
Authority: CN
Inventors: 李维繁星; 沈红星; 王悦; 李北印
Original assignee: Hongrun Semiconductor Suzhou Co ltd
Current assignee: Hongrun Semiconductor Suzhou Co ltd
Priority date: 2022-12-24
Filing date: 2022-12-24
Publication date: 2023-08-11
Anticipated expiration: 2032-12-24

Abstract

The utility model relates to the technical field of semiconductor testing, and provides a semiconductor device testing device. Through the technical scheme, the transmission bevel gear and the follow-up bevel gear are meshed for transmission, so that an operator can adjust and drive from the lower part of the objective table, contact and butt-close limiting treatment is carried out on the left side and the right side of the semiconductor chip positioned on the surface of the objective table, the stability of the semiconductor chip to be detected in optical microscopic detection can be further ensured, the labor consumption of detection personnel in detection is reduced, and the problem of a semiconductor device testing device in the prior art is solved.

Description

Semiconductor device testing device

Technical Field

The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor device testing device.

Background

When the semiconductor chip is manufactured, a large number of wafers made of polysilicon materials are arranged on the surface of the semiconductor chip, the quality of the wafers also determines the quality of the semiconductor chip, and when the semiconductor chip is inspected and tested, the production quality of the semiconductor chip is inspected and tested after the chips placed on the surface of the test bench are subjected to microscopic amplification by using the corresponding probe bench due to the fact that the autogenous volume of the wafers is too small.

When the semiconductor chip is placed and limited by the probe station used at present, the semiconductor chip is required to be manually held under the probe to move, and the wafer arranged on the surface of the semiconductor chip is observed and checked by using the optical probe, and the number of wafers arranged on the surface of the single semiconductor chip is large, so that the single detection time is long, and in the detection process, an operator is required to manually press down the chip to limit the semiconductor chip all the time, so that the labor consumption required by the operator for detection is increased, and the damage to the chip caused by excessive friction contact on the object stage in the long-time pressing process is also caused, and the subsequent detection quality is influenced.

Disclosure of Invention

The utility model provides a semiconductor device testing device, which solves the problem of a semiconductor device testing device in the related art.

The technical scheme of the utility model is as follows: the utility model provides a semiconductor device testing arrangement, includes places the platform, place bench top side fixed surface and install the erection column, erection column side fixed surface installs the mounting panel, erection column side slidable mounting has the objective table, objective table top both ends surface equal slidable mounting has to tightly the board, objective table bottom middle-end fixed surface installs the installing frame, the inboard both ends of installing frame all rotate through the bearing and install the rotation lead screw, every rotation lead screw side surface equal fixed sleeve has followed the awl tooth, install the frame bottom middle-end and run through the rotation through damping bearing and install the dwang, dwang top fixed surface installs transmission awl tooth

The pressure sensor is fixedly mounted on the top surface of the side edge of the abutting plate, the controller is fixedly mounted on the surface of the side edge of the top of the objective table, the sliding groove is formed in the middle end of the side edge of the mounting plate, the sliding blocks are fixedly mounted on the surfaces of the two ends of the side edge of the objective table, the electromagnet is fixedly mounted on the inner two ends of the sliding groove, and the two ends of the outer side of the sliding block are in sliding fit with the inner surface of the electromagnet.

The optical probe is characterized in that an adjusting frame is sleeved on the top surface of the mounting upright in a sliding manner, adjusting bolts are screwed at two ends of the outer side of the adjusting frame, a probe arm is rotatably mounted at the top end of each side edge of each adjusting bolt, and an optical probe is mounted at the bottom of each probe arm.

Every the activity sleeve has all been cup jointed to the equal activity of rotation lead screw outside surface, every the equal fixed mounting in activity sleeve outside top surface has the transmission piece, and transmission piece top and support tight board bottom stationary phase and be connected, the spacing groove has been seted up to the objective table middle-end, and transmission piece slidable mounting is inside the spacing groove.

And each propping plate is fixedly adhered with a protective soft cushion on the inner side surface, and sweat-proof gloves are adhered and sleeved on the outer side surface of the bottom of the rotating rod.

The signal output end of the pressure sensor is electrically connected with the signal input end of the controller, and the signal output end of the controller is electrically connected with the signal input end of the electromagnet.

The working principle and the beneficial effects of the utility model are as follows:

1. according to the utility model, through the meshing transmission of the transmission bevel gear and the follow-up bevel gear, an operator can drive the transmission bevel gear to rotate in the mounting frame after holding the rotating rod under the object stage, and the rotating screw rods on two sides of the transmission bevel gear can be synchronously and equidirectionally driven by the rotation driving force of the transmission bevel gear, so that the movable sleeve arranged in the mounting frame is driven to synchronously and oppositely drive the abutting plate on the top of the movable sleeve to horizontally move under the rotation driving action of the rotating screw rods, the left side and the right side of the semiconductor chip on the surface of the object stage can be contacted and abutted to limit, the stability of the semiconductor chip to be detected in optical microscopic detection can be ensured, and the labor consumption of detection personnel can be reduced.

2. According to the utility model, the pressure sensor detects the pressure information of the inner side of the abutting plate contacting the outer side surface of the semiconductor chip, the collected pressure information is transmitted to the inside of the controller, and the controller is combined to control the start and stop of the electromagnet, so that whether the sliding block can move in the sliding groove or not is controlled, whether the inner side of the electromagnet has magnetism or not can be controlled, the horizontal mobility of the objective table can be controlled, the influence on the abutting adjustment operation of detection personnel caused by the arbitrary movement of the objective table when the abutting reinforcement is not carried out on the two sides of the semiconductor chip is avoided, and the limit and reinforcement stability of the chip is further ensured

Drawings

The utility model will be described in further detail with reference to the drawings and the detailed description.

FIG. 1 is a schematic view of the overall three-dimensional structure of the present utility model;

FIG. 2 is a schematic diagram of the overall cross-sectional elevation of the present utility model;

FIG. 3 is a schematic diagram of the overall side view of the present utility model;

fig. 4 is a schematic perspective view of an object carrying plate according to the present utility model.

In the figure: 1. a placement table; 2. installing an upright post; 3. a mounting plate; 4. an objective table; 5. a mounting frame; 6. rotating the screw rod; 7. a movable sleeve; 8. a rotating lever; 9. driving bevel gear; 10. follow-up bevel gear; 11. sweat-proof gloves; 12. a transmission block; 13. a pressing plate; 14. a pressure sensor; 15. a controller; 16. a guide plate; 17. a sliding block; 18. a sliding groove; 19. an electromagnet; 20. an adjusting frame; 21. an adjusting bolt; 22. a probe arm; 23. an optical probe; 24. a protective cushion; 25. and a limit groove.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In embodiment 1, the pressure sensor 14 is fixedly installed on the top surface of the side edge of the abutting plate 13, the corresponding signal conversion element and control element are arranged in the controller 15, so that the pressure information collected and conveyed by the pressure sensor 14 can be converted and the starting and stopping of the electromagnet 19 can be controlled, the controller 15 is fixedly installed on the side edge surface of the top of the objective table 4, the sliding groove 18 is formed in the middle end of the side edge of the mounting plate 3, the sliding blocks 17 are fixedly installed on the surfaces of the two ends of the side edge of the objective table 4, the electromagnets 19 are fixedly installed on the two ends of the inner side of the sliding groove 18, the synchronous control on whether the electromagnets 19 have corresponding adsorption magnetism or not is realized under the starting and stopping control on the electromagnets 19, the two ends of the outer side of the sliding blocks 17 are in sliding fit with the inner side surface of the electromagnets 19, the signal output end of the pressure sensor 14 is electrically connected with the signal input end of the controller 15, and the signal output end of the controller 15 is electrically connected with the signal input end of the electromagnets 19.

As shown in fig. 1-4, this embodiment provides that the mounting plate 3 side slidable mounting has the objective table 4, objective table 4 bottom middle-end fixed surface installs the installation frame 5, the rotation lead screw 6 has all been installed through the bearing rotation to installation frame 5 inboard both ends, every rotation lead screw 6 side surface all fixed sleeve has the follow-up awl tooth 10, installation frame 5 bottom middle-end runs through the rotation through damping bearing and installs dwang 8, under damping bearing's damping effect, make dwang 8 only provide corresponding drive force after it manually at the inspector, dwang 8 can only rotate, and in the testing process, receive the damped effect and make dwang 8 unable arbitrary carry out rotation, dwang 8 top fixed surface installs transmission awl tooth 9, every rotation lead screw 6 outside surface all movable sleeve 7 has been cup jointed, every movable sleeve 7 outside top surface all fixed mounting has driving block 12, spacing groove 25 has been seted up to objective table 4 middle-end, and driving block 12 slidable mounting is in spacing groove 25 inside, and driving block 12 top and support tight 13 bottom connection, 4 stationary phase both ends surface sliding mounting objective table 13 supports tightly.

As shown in fig. 1 to 4, the embodiment further provides that the surface of the side edge of the top of the placing table 1 is fixedly provided with an installation upright post 2, the surface of the top of the installation upright post 2 is in sliding sleeve connection with an adjusting frame 20, two ends of the outer side of the adjusting frame 20 are all screwed with adjusting bolts 21 through threads, the top end of the side edge of the adjusting bolt 21 is rotatably provided with a probe arm 22, and the bottom of the probe arm 22 is provided with an optical probe 23.

As shown in fig. 1 to 4, this embodiment also proposes that the inner side surface of each abutting plate 13 is fixedly bonded with a protective soft pad 24, and the outer side surface of the bottom of the rotating rod 8 is bonded and sleeved with an anti-sweat glove 11.

When in operation, the controller 15 is opened by an external control switch, the electromagnet 19 is started to have adsorption magnetism to the sliding block 17 under the action of the signal conversion element and the control element in the controller 15, the sliding block 17 is adsorbed and limited in the sliding groove 18, then the semiconductor chip to be detected is horizontally placed on the surface of the objective table 4, then a inspector holds the anti-sweat glove 11 by hand, applies force to the rotating rod 8 to drive the transmission bevel 9 to rotate in the installation frame 5, the rotating screw rods 6 positioned at two sides in the installation frame 5 are driven to synchronously and equidirectionally rotate under the meshing transmission action of the transmission bevel 9 and the follow-up bevel 10, the movable sleeve 7 arranged in the installation frame is driven to synchronously and oppositely drive the abutting plates 13 at the top of the movable sleeve to horizontally move under the rotation driving action of the rotating screw rods 6, the contact and tight limit treatment can be further carried out on the left side and the right side of the semiconductor chip positioned on the surface of the objective table 4, after the two sides of the semiconductor chip are fully abutted and tightly contacted on the inner side of the abutting plate 13, the corresponding contact pressure information is transmitted into the controller 15 after the pressure sensor 14 detects the corresponding contact pressure information, the control signal is transmitted into the electromagnet 19 through the signal conversion element and the control element in the controller 15, the electromagnet 19 is controlled to be closed, the sliding block 17 can horizontally move in the sliding groove 18 to drive the semiconductor chip to be detected placed on the surface to horizontally move under the optical probe 23 together with the objective table 4, then an operator screws the adjusting bolt 21 to realize the position adjustment of the adjusting frame 20, so that the optical probe 23 can optically inspect the wafer disposed on the surface of the semiconductor chip below under the structural action of the probe arm 22.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims

1. The semiconductor device testing device is characterized by comprising a placing table (1), wherein an installation upright post (2) is fixedly arranged on the surface of the side edge of the top of the placing table (1), an installation plate (3) is fixedly arranged on the surface of the side edge of the installation upright post (2), an objective table (4) is slidably arranged on the side edge of the installation plate (3), and abutting plates (13) are slidably arranged on the surfaces of two ends of the top of the objective table (4);

the device is characterized in that a mounting frame (5) is fixedly mounted on the surface of the middle end of the bottom of the objective table (4), a rotating screw rod (6) is rotatably mounted at two ends of the inner side of the mounting frame (5) through bearings, follow-up bevel teeth (10) are fixedly sleeved on the side surfaces of the rotating screw rods (6), a rotating rod (8) is rotatably mounted at the middle end of the bottom of the mounting frame (5) through damping bearings in a penetrating mode, and transmission bevel teeth (9) are fixedly mounted on the top surface of the rotating rod (8).

2. The semiconductor device testing apparatus according to claim 1, wherein the pressure sensor (14) is fixedly mounted on the top surface of the side edge of the abutting plate (13), the controller (15) is fixedly mounted on the top side edge surface of the objective table (4), the sliding groove (18) is formed in the middle end of the side edge of the mounting plate (3), the sliding blocks (17) are fixedly mounted on the surfaces of the two ends of the side edge of the objective table (4), the electromagnets (19) are fixedly mounted on the two ends of the inner side of the sliding groove (18), and the two ends of the outer side of the sliding blocks (17) are in sliding fit with the inner side surfaces of the electromagnets (19).

3. The semiconductor device testing apparatus according to claim 1, wherein the top surface of the mounting column (2) is slidably sleeved with an adjusting frame (20), both ends of the outer side of the adjusting frame (20) are screwed with adjusting bolts (21) through threads, a probe arm (22) is rotatably mounted on the top end of the side edge of each adjusting bolt (21), and an optical probe (23) is mounted at the bottom of each probe arm (22).

4. The semiconductor device testing apparatus according to claim 1, wherein each of the outer side surfaces of the rotary screw rods (6) is movably sleeved with a movable sleeve (7), a transmission block (12) is fixedly mounted on each of the outer side top surfaces of the movable sleeves (7), and the top of the transmission block (12) is fixedly connected with the bottom of the abutting plate (13).

5. The semiconductor device testing apparatus according to claim 1, wherein the stage (4) has a limiting groove (25) at a middle end thereof, and the transmission block (12) is slidably mounted in the limiting groove (25).

6. A semiconductor device testing apparatus according to claim 1, wherein each of said abutting plates (13) has a protective cushion (24) fixedly bonded to an inner side surface thereof, and said rotating rod (8) has an anti-sweat glove (11) bonded to an outer side surface thereof.

7. A semiconductor device testing apparatus according to claim 2, wherein the signal output of the pressure sensor (14) is electrically connected to the signal input of the controller (15), and the signal output of the controller (15) is electrically connected to the signal input of the electromagnet (19).