CN210982257U - Multi-view visual inspection jig for surface defects of semiconductor silicon wafer - Google Patents

Multi-view visual inspection jig for surface defects of semiconductor silicon wafer Download PDF

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Publication number
CN210982257U
CN210982257U CN201921628798.9U CN201921628798U CN210982257U CN 210982257 U CN210982257 U CN 210982257U CN 201921628798 U CN201921628798 U CN 201921628798U CN 210982257 U CN210982257 U CN 210982257U
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CN
China
Prior art keywords
transverse
longitudinal
shaft
frame
ball
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Expired - Fee Related
Application number
CN201921628798.9U
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Chinese (zh)
Inventor
林火旺
刘立清
廖文民
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Dongguan Qingying Intelligent Automation Technology Co ltd
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Dongguan Qingying Intelligent Automation Technology Co ltd
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Priority to CN201921628798.9U priority Critical patent/CN210982257U/en
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Publication of CN210982257U publication Critical patent/CN210982257U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a multi-visual angle visual inspection jig for surface flaws of semiconductor silicon wafers, which comprises a frame, a movable frame, a swinging frame, a bearing device, a first driving mechanism and a second driving mechanism; the supporting device comprises a ball shaft and a tray; the lower end of the swing frame is hinged with the upper end of the movable frame and is matched with the first driving mechanism to drive the movable frame to horizontally, transversely and longitudinally move, so that the swing frame is controlled to swing in a universal manner through the horizontal transverse or longitudinal movement of the movable frame, the ball shaft is arranged on the rack in a universal swinging manner through the ball head, and the lower end of the ball shaft is rotatably arranged on the swing frame, so that the ball shaft can swing correspondingly along with the swing of the swing frame; the swing frame is provided with a second driving mechanism, so that the second driving mechanism is used for driving the ball shaft to rotate; the first driving mechanism and the second driving mechanism are used for enabling the silicon wafer to swing towards different directions, so that the silicon wafer can be comprehensively inspected from multiple angles.

Description

Multi-view visual inspection jig for surface defects of semiconductor silicon wafer
Technical Field
The utility model relates to a silicon wafer inspection field technique especially indicates a many visual angles visual inspection tool of semiconductor silicon wafer surface blemish.
Background
Inspection of the surface of a silicon wafer is important in semiconductor processing and manufacturing, which affects the processing efficiency of the silicon wafer. In practice, an operator needs to hold a silicon wafer with hands when inspecting the silicon wafer, and in order to perform a complete inspection of the silicon wafer to ensure the accuracy of the inspection, the operator needs to swing the silicon wafer at various angles to inspect the silicon wafer from a plurality of angles. However, this inspection method of holding a silicon wafer by hand is inconvenient for an operator and is prone to error. Therefore, a new solution needs to be researched to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to the defects existing in the prior art, and a main object of the present invention is to provide a multi-view visual inspection jig for surface defects of semiconductor silicon wafers, which can solve the problem of inconvenience and easy error when an operator inspects the silicon wafers.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a multi-view visual inspection jig for surface defects of semiconductor silicon wafers comprises a rack, a movable frame, a swinging frame, a bearing device, a first driving mechanism and a second driving mechanism; the movable frame can be horizontally, transversely and longitudinally movably arranged back and forth; the lower end of the swing frame is hinged with the upper end of the movable frame; the supporting device comprises a ball shaft and a tray for supporting the semiconductor silicon wafer, wherein the ball shaft is provided with a ball head, the ball shaft is arranged on the rack in a universal swinging manner through the ball head, the tray is fixed at the top end of the ball shaft, and the lower end of the ball shaft is rotatably arranged on the swinging frame; the first driving mechanism is arranged on the frame and drives the movable frame to horizontally and longitudinally move back and forth; the second driving mechanism is arranged on the swing frame and drives the ball shaft to rotate.
As a preferred scheme, the movable frame comprises a movable seat and a connecting rod, the connecting rod is vertically and rotatably mounted on the movable seat, and the upper end of the connecting rod is hinged with the lower end of the swing frame.
As a preferred scheme, the first driving mechanism comprises a transverse driving shaft, a transverse driven shaft, a longitudinal driving shaft, a longitudinal driven shaft, a transverse sliding rod, a longitudinal sliding rod, a transverse motor, a longitudinal motor, two transverse belts and two longitudinal belts; the transverse driving shaft, the transverse driven shaft, the longitudinal driving shaft and the longitudinal driven shaft are all rotatably arranged on the rack, the transverse driving shaft and the transverse driven shaft extend longitudinally and are arranged in parallel at transverse intervals, and the longitudinal driving shaft and the longitudinal driven shaft extend transversely and are arranged in parallel at longitudinal intervals; the transverse sliding rod extends longitudinally, and two ends of the transverse sliding rod are respectively sleeved on the longitudinal driving shaft and the longitudinal driven shaft in a sliding manner; the longitudinal slide bar extends transversely, and two ends of the longitudinal slide bar are respectively sleeved on the transverse driving shaft and the transverse driven shaft in a sliding manner; the transverse motor is fixed on the frame and drives the transverse driving shaft to rotate; the longitudinal motor is fixed on the frame and drives the longitudinal driving shaft to rotate; the two transverse belts extend transversely and are longitudinally arranged in parallel at intervals, the two transverse belts are connected between a transverse driving shaft and a transverse driven shaft, two ends of the transverse sliding rod are respectively and fixedly connected with the two transverse belts, and the movable seat is slidably sleeved on the transverse sliding rod; the two longitudinal belts extend longitudinally and are arranged in parallel at transverse intervals, the two longitudinal belts are connected between a longitudinal driving shaft and a longitudinal driven shaft, two ends of the longitudinal sliding rod are fixedly connected with the two longitudinal belts respectively, and the movable seat is sleeved on the longitudinal sliding rod in a sliding manner.
As a preferable scheme, the second driving mechanism comprises a motor, a driving pulley and a driven pulley; the motor is fixed on the swing frame, the driving belt wheel is installed on an output shaft of the motor, the driven belt wheel is fixed at the lower end of the ball shaft, and a transmission belt is connected between the driven belt wheel and the driving belt wheel.
As a preferred scheme, an air cavity is arranged in the tray, the tray is provided with a concave position matched with the semiconductor silicon wafer, a plurality of air holes are formed in the bottom surface of the concave position and are distributed at intervals and communicated with the air cavity, an air passage penetrates through the upper end surface and the lower end surface of the ball shaft, and the upper end of the air passage is communicated with the air cavity.
As a preferred scheme, a side plate is packaged on the side face of the rack, a top plate is packaged on the top face of the rack, the movable frame, the swing frame, the first driving mechanism and the second driving mechanism are all located in the rack, the ball head is exposed out of the surface of the top plate, and the tray is located above the top plate.
As a preferred scheme, the upper end of the ball shaft is sleeved with a dustproof soft cover, and the dustproof soft cover is abutted against the surface of the top plate and covers the ball head.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
the lower end of the swing frame is hinged with the upper end of the movable frame, and the first driving mechanism is matched to drive the movable frame to horizontally, transversely and longitudinally move back and forth, so that the swing frame is controlled to swing universally through the horizontal, transverse or longitudinal movement of the movable frame, moreover, the ball shaft is arranged on the rack in a universal swinging manner through the ball head, and the lower end of the ball shaft is rotatably arranged on the swing frame, so that the ball shaft can correspondingly swing along with the swinging of the swing frame, and thus, the function of controlling the universal swinging of the ball shaft by the first driving mechanism is realized; the swing frame is provided with a second driving mechanism, so that the second driving mechanism is used for driving the ball shaft to rotate; therefore, the universal swing of ball axle can be controlled to this product, and the rotation of ball axle can also be controlled to this product, thus, the tray that sets up on ball axle top will be along with the motion of ball axle and corresponding motion, in practical application, the operator settles silicon wafer on the tray after, let silicon wafer swing towards different directions through first actuating mechanism, and let silicon wafer corresponding position rotation to the inspection scope on the silicon wafer through second actuating mechanism, just so can carry out comprehensive inspection to silicon wafer from a plurality of angles, compare original technique, this product has avoided the trouble that the operator need take silicon wafer to inspect by hand, it can let the operator inspect silicon wafer more conveniently, and be difficult to the error.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is an assembled perspective view of a preferred embodiment of the present invention;
FIG. 2 is an internal structural view of the preferred embodiment of the present invention;
FIG. 3 is a schematic diagram of the internal connection structure of the preferred embodiment of the present invention;
FIG. 4 is a partial block diagram of a preferred embodiment of the present invention;
FIG. 5 is another partial block diagram of the preferred embodiment of the present invention;
FIG. 6 is a partial block diagram of a preferred embodiment of the present invention;
FIG. 7 is a diagram of a supporting device according to a preferred embodiment of the present invention;
fig. 8 is a cross-sectional view of a preferred embodiment of the invention.
The attached drawings indicate the following:
10. frame 20, adjustable shelf
21. Movable seat 22, connecting rod
30. Swing frame 40 and supporting device
41. Ball axle 411, ball head
412. Air duct 42 and tray
421. Air cavity 422, concave position
423. Air hole 50 and first driving mechanism
51. Transverse driving shaft 52 and transverse driven shaft
53. Longitudinal driving shaft 54 and longitudinal driven shaft
55. Transverse sliding rod 56 and longitudinal sliding rod
57. Transverse motor 58 and longitudinal motor
59. Transverse belt 501 and longitudinal belt
60. Second drive mechanism 61, motor
62. Driving pulley 63 and driven pulley
71. Side plate 72, top plate
80. Silicon wafer 90, dust cover.
Detailed Description
Referring to fig. 1 to 8, a specific structure of a preferred embodiment of the present invention is shown, which includes a frame 10, a movable frame 20, a swing frame 30, a supporting device 40, a first driving mechanism 50 and a second driving mechanism 60.
In this embodiment, the frame 10 is a square frame, the side plates 71 are enclosed on the side surfaces of the frame 10, the top plate 72 is enclosed on the top surface of the frame 10, and the movable frame 20, the swing frame 30, the first driving mechanism 50 and the second driving mechanism 60 are all located in the frame 10, so that the frame 10 and the internal structure thereof can be isolated from the outside by the side plates 71 and the top plate 72, and the danger of an operator touching the internal structure during use can be prevented.
The movable frame 20 can be horizontally, transversely and longitudinally movably arranged back and forth; in this embodiment, the movable frame 20 includes a movable seat 21 and a connecting rod 22, and the connecting rod 22 is vertically and rotatably mounted on the movable seat 21.
The lower end of the swing frame 30 is hinged with the upper end of the movable frame 20, and the swing frame 30 is controlled to swing universally through the horizontal transverse or longitudinal movement of the movable frame 20; in this embodiment, the upper end of the aforementioned connecting rod 22 is hinged to the lower end of the swing frame 30.
The supporting device 40 comprises a ball shaft 41 and a tray 42 for supporting the semiconductor silicon wafer 80, the ball shaft 41 has a ball head 411, the ball shaft 41 is mounted on the frame 10 through the ball head 411 in a universal swinging manner, the tray 42 is fixed at the top end of the ball shaft 41, the lower end of the ball shaft 41 is rotatably mounted on the swing frame 30, so that the ball shaft 41 can swing correspondingly in different directions along with the swing of the swing frame 30; in this embodiment, the tray 42 has an air cavity 421 therein, the tray 42 has a concave 422 adapted to the semiconductor silicon wafer 80, the bottom surface of the concave 422 is opened with a plurality of air holes 423, the plurality of air holes 423 are arranged at intervals and are all communicated with the air cavity 421, and the upper and lower end surfaces of the ball shaft 41 are penetrated with an air passage 412, the upper end of the air passage 412 is communicated with the air cavity 421, so that before use, an air pipe of an external device is communicated with the lower end of the air passage 412, then, after the operator places the silicon wafer 80 in the concave 422, the external device is started to suck air, and the air holes 423 form a suction force to firmly fix the silicon wafer 80 on the concave 422; the ball 411 is exposed on the surface of the top plate 72, the tray 42 is located above the top plate 72, and the upper end of the ball shaft 41 is sleeved with a dust-proof soft cover 90, the dust-proof soft cover 90 abuts against the surface of the top plate 72 and covers the ball 411.
The first driving mechanism 50 is disposed on the frame 10 and drives the movable frame 20 to move back and forth horizontally and longitudinally.
Specifically, the first driving mechanism 50 comprises a transverse driving shaft 51, a transverse driven shaft 52, a longitudinal driving shaft 53, a longitudinal driven shaft 54, a transverse sliding rod 55, a longitudinal sliding rod 56, a transverse motor 57, a longitudinal motor 58, two transverse belts 59 and two longitudinal belts 501; the transverse driving shaft 51, the transverse driven shaft 52, the longitudinal driving shaft 53 and the longitudinal driven shaft 54 are all rotatably mounted on the frame 10, the transverse driving shaft 51 and the transverse driven shaft 52 both extend longitudinally and are arranged in parallel at transverse intervals, and the longitudinal driving shaft 53 and the longitudinal driven shaft 54 both extend transversely and are arranged in parallel at longitudinal intervals; the transverse sliding rod 55 extends longitudinally, and two ends of the transverse sliding rod 55 are respectively sleeved on the longitudinal driving shaft 53 and the longitudinal driven shaft 54 in a sliding manner; the longitudinal sliding rod 56 extends transversely, and two ends of the longitudinal sliding rod 56 are respectively sleeved on the transverse driving shaft 51 and the transverse driven shaft 52 in a sliding manner; the transverse motor 57 is fixed on the frame 10 and drives the transverse driving shaft 51 to rotate; the longitudinal motor 58 is fixed on the frame 10 and drives the longitudinal driving shaft 53 to rotate; the two transverse belts 59 extend transversely and are arranged in parallel at a longitudinal interval, the two transverse belts 59 are connected between the transverse driving shaft 51 and the transverse driven shaft 52, two ends of the transverse sliding rod 55 are respectively and fixedly connected with the two transverse belts 59, and the movable seat 21 is slidably sleeved on the transverse sliding rod 55, so that when the transverse motor 57 is started, the transverse motor 57 drives the transverse driving shaft 51 to rotate, the transverse belts 59 can transmit transversely, and the transverse sliding rod 55 can move transversely and push the movable seat 21 to move transversely under the driving of the transverse belts 59; the two longitudinal belts 501 extend longitudinally and are arranged in parallel at transverse intervals, the two longitudinal belts 501 are connected between the longitudinal driving shaft 53 and the longitudinal driven shaft 54, two ends of the longitudinal sliding rod 56 are respectively and fixedly connected with the two longitudinal belts 501, and the movable seat 21 is slidably sleeved on the longitudinal sliding rod 56, so that when the longitudinal motor 58 is started, the longitudinal motor 58 drives the longitudinal driving shaft 53 to rotate, the longitudinal belts 501 longitudinally transmit, and the longitudinal sliding rod 56 longitudinally moves under the driving of the longitudinal belts 501 and pushes the movable seat 21 to longitudinally move.
The second driving mechanism 60 is disposed on the swing frame 30 and drives the ball shaft 41 to rotate; in the present embodiment, the second driving mechanism 60 includes a motor 61, a driving pulley 62, and a driven pulley 63; the motor 61 is fixed on the swing frame 30, the driving pulley 62 is mounted on the output shaft of the motor 61, the driven pulley 63 is fixed at the lower end of the ball shaft 41, and a driving belt (not shown) is connected between the driven pulley 63 and the driving pulley 62, so that the motor 61 can drive the ball shaft 41 to rotate.
Detailed description the method of use of this example is as follows:
an air pipe of an external device is first communicated with the lower end of the air passage 412. Then, after the silicon wafer 80 to be inspected is placed in the recess 422, an external device is activated to perform suction, and at this time, the tray 42 firmly sucks the silicon wafer 80 on the recess 422. Then, according to the actual inspection requirement, the first driving mechanism 50 drives the movable frame 20 to move transversely or longitudinally for a certain distance, so as to drive the swing frame 30 to swing to a certain angle, at this time, the ball shaft 41 swings along with the swing frame 30 to form a corresponding angle, correspondingly, the silicon wafer 80 on the tray 42 also swings to a corresponding angle, and furthermore, the second driving mechanism 60 can control the ball shaft 41 to rotate, correspondingly, the silicon wafer 80 on the tray 42 also rotates, and after the silicon wafer 80 is adjusted to a proper inspection position, an operator can conveniently perform visual inspection on the silicon wafer 80 or perform photographing detection by using a camera. When the inspection is finished, the external equipment is stopped to remove the suction force, and the operator can remove the silicon wafer 80 that has been inspected.
The utility model discloses a design focus lies in:
the lower end of the swing frame is hinged with the upper end of the movable frame, and the first driving mechanism is matched to drive the movable frame to horizontally, transversely and longitudinally move back and forth, so that the swing frame is controlled to swing universally through the horizontal, transverse or longitudinal movement of the movable frame, moreover, the ball shaft is arranged on the rack in a universal swinging manner through the ball head, and the lower end of the ball shaft is rotatably arranged on the swing frame, so that the ball shaft can correspondingly swing along with the swinging of the swing frame, and thus, the function of controlling the universal swinging of the ball shaft by the first driving mechanism is realized; the swing frame is provided with a second driving mechanism, so that the second driving mechanism is used for driving the ball shaft to rotate; therefore, the universal swing of ball axle can be controlled to this product, and the rotation of ball axle can also be controlled to this product, thus, the tray that sets up on ball axle top will be along with the motion of ball axle and corresponding motion, in practical application, the operator settles silicon wafer on the tray after, let silicon wafer swing towards different directions through first actuating mechanism, and let silicon wafer corresponding position rotation to the inspection scope on the silicon wafer through second actuating mechanism, just so can carry out comprehensive inspection to silicon wafer from a plurality of angles, compare original technique, this product has avoided the trouble that the operator need take silicon wafer to inspect by hand, it can let the operator inspect silicon wafer more conveniently, and be difficult to the error.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.

Claims (7)

1. The utility model provides a many visual angles of semiconductor silicon wafer surface flaw visual inspection tool which characterized in that: comprises a frame, a movable frame, a swinging frame, a supporting device, a first driving mechanism and a second driving mechanism; the movable frame can be horizontally, transversely and longitudinally movably arranged back and forth; the lower end of the swing frame is hinged with the upper end of the movable frame; the supporting device comprises a ball shaft and a tray for supporting the semiconductor silicon wafer, wherein the ball shaft is provided with a ball head, the ball shaft is arranged on the rack in a universal swinging manner through the ball head, the tray is fixed at the top end of the ball shaft, and the lower end of the ball shaft is rotatably arranged on the swinging frame; the first driving mechanism is arranged on the frame and drives the movable frame to horizontally and longitudinally move back and forth; the second driving mechanism is arranged on the swing frame and drives the ball shaft to rotate.
2. The multi-view visual inspection jig for surface defects of semiconductor silicon wafers according to claim 1, characterized in that: the adjustable shelf comprises an adjustable seat and a connecting rod, the connecting rod is vertically arranged on the adjustable seat in a rotatable manner, and the upper end of the connecting rod is hinged with the lower end of the adjustable shelf.
3. The multi-view visual inspection jig for surface defects of semiconductor silicon wafers according to claim 2, characterized in that: the first driving mechanism comprises a transverse driving shaft, a transverse driven shaft, a longitudinal driving shaft, a longitudinal driven shaft, a transverse sliding rod, a longitudinal sliding rod, a transverse motor, a longitudinal motor, two transverse belts and two longitudinal belts; the transverse driving shaft, the transverse driven shaft, the longitudinal driving shaft and the longitudinal driven shaft are all rotatably arranged on the rack, the transverse driving shaft and the transverse driven shaft extend longitudinally and are arranged in parallel at transverse intervals, and the longitudinal driving shaft and the longitudinal driven shaft extend transversely and are arranged in parallel at longitudinal intervals; the transverse sliding rod extends longitudinally, and two ends of the transverse sliding rod are respectively sleeved on the longitudinal driving shaft and the longitudinal driven shaft in a sliding manner; the longitudinal slide bar extends transversely, and two ends of the longitudinal slide bar are respectively sleeved on the transverse driving shaft and the transverse driven shaft in a sliding manner; the transverse motor is fixed on the frame and drives the transverse driving shaft to rotate; the longitudinal motor is fixed on the frame and drives the longitudinal driving shaft to rotate; the two transverse belts extend transversely and are longitudinally arranged in parallel at intervals, the two transverse belts are connected between a transverse driving shaft and a transverse driven shaft, two ends of the transverse sliding rod are respectively and fixedly connected with the two transverse belts, and the movable seat is slidably sleeved on the transverse sliding rod; the two longitudinal belts extend longitudinally and are arranged in parallel at transverse intervals, the two longitudinal belts are connected between a longitudinal driving shaft and a longitudinal driven shaft, two ends of the longitudinal sliding rod are fixedly connected with the two longitudinal belts respectively, and the movable seat is sleeved on the longitudinal sliding rod in a sliding manner.
4. The multi-view visual inspection jig for surface defects of semiconductor silicon wafers according to claim 1, characterized in that: the second driving mechanism comprises a motor, a driving belt wheel and a driven belt wheel; the motor is fixed on the swing frame, the driving belt wheel is installed on an output shaft of the motor, the driven belt wheel is fixed at the lower end of the ball shaft, and a transmission belt is connected between the driven belt wheel and the driving belt wheel.
5. The multi-view visual inspection jig for surface defects of semiconductor silicon wafers according to claim 1, characterized in that: the tray is internally provided with an air cavity, the tray is provided with a concave position matched with the semiconductor silicon wafer, the bottom surface of the concave position is provided with a plurality of air holes which are arranged at intervals and are communicated with the air cavity, the upper end surface and the lower end surface of the ball shaft are penetrated with an air passage, and the upper end of the air passage is communicated with the air cavity.
6. The multi-view visual inspection jig for surface defects of semiconductor silicon wafers according to claim 1, characterized in that: the side face of the rack is packaged with a side plate, the top face of the rack is packaged with a top plate, the movable frame, the swing frame, the first driving mechanism and the second driving mechanism are all located in the rack, the ball head is exposed out of the surface of the top plate, and the tray is located above the top plate.
7. The multi-view visual inspection jig for surface defects of semiconductor silicon wafers according to claim 6, wherein: the upper end of the ball shaft is sleeved with a dustproof soft cover which is abutted against the surface of the top plate and covers the ball head.
CN201921628798.9U 2019-09-27 2019-09-27 Multi-view visual inspection jig for surface defects of semiconductor silicon wafer Expired - Fee Related CN210982257U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921628798.9U CN210982257U (en) 2019-09-27 2019-09-27 Multi-view visual inspection jig for surface defects of semiconductor silicon wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921628798.9U CN210982257U (en) 2019-09-27 2019-09-27 Multi-view visual inspection jig for surface defects of semiconductor silicon wafer

Publications (1)

Publication Number Publication Date
CN210982257U true CN210982257U (en) 2020-07-10

Family

ID=71438396

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921628798.9U Expired - Fee Related CN210982257U (en) 2019-09-27 2019-09-27 Multi-view visual inspection jig for surface defects of semiconductor silicon wafer

Country Status (1)

Country Link
CN (1) CN210982257U (en)

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200710

Termination date: 20210927