CN219497777U - Chip heat abstractor and circuit board - Google Patents
Chip heat abstractor and circuit board Download PDFInfo
- Publication number
- CN219497777U CN219497777U CN202223195080.XU CN202223195080U CN219497777U CN 219497777 U CN219497777 U CN 219497777U CN 202223195080 U CN202223195080 U CN 202223195080U CN 219497777 U CN219497777 U CN 219497777U
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- Prior art keywords
- chip
- impedance
- circuit board
- heat sink
- plate body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides a chip heat dissipation device and a circuit board, wherein the chip heat dissipation device is applied to the circuit board, and the circuit board comprises a board body and a chip arranged on the board body; the chip heat dissipation device includes: the device comprises a radiating fin, an insulating connecting piece, conductive foam and an impedance reducing module; the radiating fin is erected above the plate body through the insulating connecting piece and is attached to the chip; the radiating fins are connected with the ground end of the plate body sequentially through the conductive foam and the impedance reducing module. According to the heat dissipation plate, the impedance of the interference signals on the heat dissipation plate can be reduced, so that the interference signals on the heat dissipation plate can be easily discharged to the ground end of the plate body.
Description
Technical Field
The application relates to the technical field of chip heat dissipation structures, in particular to a chip heat dissipation device and a circuit board.
Background
The chip belongs to one kind of integrated circuit, and the chip can produce a large amount of heat when the work load is heavier, and because the surface area of chip is less, consequently the heat exchange efficiency is low, therefore, the heat dissipation efficiency of chip is improved through the fin to the fin that the correlation technique can increase on the chip. The heat sink is generally made of metal with good heat conductivity and is fixed on the circuit board through a plastic buckle. However, since the chip is disposed on the circuit board, and the heat sink is disposed on the circuit board and above the chip, the heat sink and the chip form parasitic capacitance due to the arrangement of the heat sink, when the chip works, transient charge is coupled to the heat sink, and as the transient charge is accumulated, a large amount of interference signals are accumulated on the heat sink, and electromagnetic interference is generated by the interference signals, so that the work of the chip is affected.
Disclosure of Invention
The present application aims to overcome the drawbacks and disadvantages of the prior art, and provide a chip heat dissipating device and a circuit board, which can make the interference signal on the heat sink easier to bleed to the circuit board.
A first aspect of an embodiment of the present application provides a chip heat dissipating device, which is applied to a circuit board, where the circuit board includes a board body and a chip disposed on the board body; the chip heat dissipation device includes: the device comprises a radiating fin, an insulating connecting piece, conductive foam and an impedance reducing module;
the radiating fin is erected above the plate body through the insulating connecting piece and is attached to the chip; the radiating fins are connected with the ground end of the plate body sequentially through the conductive foam and the impedance reducing module.
A second aspect of embodiments of the present application provides a circuit board, including: the device comprises a plate body, a chip, a radiating fin, an insulating connecting piece, conductive foam and an impedance reducing module;
the chip is arranged on the plate body; the radiating fin is erected above the plate body through the insulating connecting piece and is attached to the chip; the radiating fins are connected with the ground end of the plate body sequentially through the conductive foam and the impedance reducing module.
Compared with the related art, the radiating fin of the circuit board is used for discharging interference signals on the radiating fin to the circuit board through the conductive foam, and the parasitic inductance generated by the connection structure of the conductive foam and the circuit board is connected with the ground end of the board body through the impedance reduction module to form a signal discharging line with the impedance reduction module.
In order that the present application may be more clearly understood, specific embodiments thereof will be described below with reference to the accompanying drawings.
Drawings
Fig. 1 is a circuit configuration diagram of a chip heat sink according to an embodiment of the present application.
Fig. 2 is a schematic diagram of circuit connection relationship of a circuit board according to an embodiment of the present application.
100. A circuit board; 101. a plate body; 103. a chip; 200. a chip heat sink; 201. a heat sink; 203. an insulating connector; 205. conductive foam; 207. and the impedance reducing module.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
Referring to fig. 1, which is a circuit diagram of a heat dissipating device of a chip 103 according to an embodiment of the present application, the heat dissipating device of the chip 103 is applied to a circuit board 100, and the circuit board 100 includes a board body 101 and the chip 103 disposed on the board body 101; the heat dissipation device of the chip 103 includes: a heat sink 201, an insulating connector 203, conductive foam 205, and a impedance reduction module 207. The heat sink 201 is mounted above the board 101 through the insulating connector 203, and the heat sink 201 is attached to the chip 103; the heat sink 201 is connected to the ground of the board 101 via the conductive foam 205 and the impedance reduction module 207.
The heat sink 201 includes a heat conducting surface and a heat dissipating surface, the heat conducting surface of the heat sink 201 is smooth, and the heat conducting surface of the heat sink 201 contacts the chip 103, so that the heat conducting surface of the heat sink 201 is attached to the chip 103, and heat of the chip 103 is transferred to the heat conducting surface of the heat sink 201; the heat dissipation surface of the heat dissipation plate 201 is provided with a plurality of heat dissipation fins, and the heat dissipation plate 201 increases the contact area with air through the heat dissipation fins so as to improve the efficiency of heat exchange with the air, thereby volatilizing the heat of the chip 103 obtained by the heat conduction surface.
Wherein the insulating connector 203 is used for reducing the pressure of the heat sink 201 to the components on the board 101. The insulating connector 203 may be a clip made of insulating material, such as a plastic clip.
The conductive foam 205 is disposed between the heat sink 201 and the board 101, and is used for connecting the heat sink 201 and the ground end of the board 101, so that the interference signal on the heat sink 201 can be discharged to the ground end of the board 101 through the conductive foam 205. However, since the interference signals are distributed at various positions of the heat sink 201, parasitic inductance may exist between the positions of the interference signals and the conductive foam 205, and if the heat sink 201 and the conductive foam 205 are connected by wires, parasitic inductance may also exist in the wire arrangement. Since the interference signal on the heat sink 201 includes the interference signal, and the parasitic inductance has a large impedance to the interference signal, it is difficult for the interference signal on the heat sink 201 to bleed to the circuit board 100.
The impedance reducing module 207 is a module or a component for reducing impedance of the interference signal in the line, where the impedance reducing module 207 includes a component that can reduce impedance of the parasitic inductance to the interference signal with the specified frequency when connected in series with the parasitic inductance.
Compared with the related art, the heat sink 201 of the present application discharges the interference signals on the heat sink 201 to the circuit board 100 through the conductive foam 205, and connects the impedance reducing module 207 with the ground end of the board body 101, and forms a signal discharge line with the parasitic inductance generated by the connection structure of the conductive foam 205 with the circuit board 100 and the impedance reducing module 207, since the impedance reducing module 207 is connected in series with the heat sink 201 and the conductive foam 205, the impedance of the discharge line to the interference signals with different frequencies is reduced through the impedance reducing module 207, so that the interference signals with different frequencies on the heat sink 201 can be discharged to the ground end of the board body 101 more easily. Preferably, the number of the impedance reducing modules 207 is not limited, and the number of components and circuit structures of each impedance reducing module 207 of the same chip 103 heat dissipation device may be different, and each bleeder circuit is formed by connecting each impedance reducing module 207 in series with a corresponding parasitic inductance, so that the impedance of each bleeder circuit to an interference signal with a specified frequency may be reduced, and the interference signals with different frequencies may be bleeder to the ground of the circuit board 100 via different bleeder circuits.
In one possible embodiment, the impedance-reducing module 207 includes one or more capacitors; the first end of each capacitor is connected with the conductive foam 205, and the second end of each capacitor is connected with the ground end of the board body 101.
In this embodiment, since the impedance reducing module 207 includes a capacitor, and the impedance reducing module 207 is connected in series with a parasitic inductance, the capacitor of the impedance reducing module 207 is also connected in series with the parasitic inductance to form a series LC resonant circuit, the interference signal of the heat sink 201 is approximately close to the resonant frequency of the LC resonant circuit, and the impedance of the LC resonant circuit is lower, so that the impedance of the signal discharging line to the interference signal can be reduced, the interference signal on the heat sink 201 can be discharged to the ground of the board 101 more easily, and a plurality of capacitors are connected in series with the parasitic inductance respectively, so that the impedance to the interference signals of different frequencies can be reduced, and more interference signals of different frequencies can be discharged to the ground of the board 101 more easily.
In one possible embodiment, the upper surface of the chip 103 is provided with a thermally conductive silicone, and the thermally conductive silicone contacts the heat sink 201, so that the heat sink 201 is attached to the chip 103. Through direct contact of the heat conducting silica gel and the chip 103, heat transfer of the chip 103 can be quickened, and heat of the chip 103 is transferred to the radiating fin 201 more efficiently.
In one possible embodiment, conductive foam 205 is filled between heat sink 201 and plate 101 to inhibit electromagnetic leakage. The conductive foam 205 is filled between the radiating fin 201 and the board body 101, so that the radiating fin 201 is prevented from being in direct contact with components arranged on the board body 101 such as the chip 103 or the impedance reducing module 207, electromagnetic leakage is restrained, shielding effect is achieved, and electromagnetic interference on the components on the board body 101 in the working process is reduced.
In one possible embodiment, the impedance-reducing module 207 further includes magnetic beads connected in parallel across each capacitor.
In this embodiment, the magnetic beads are connected in parallel to the capacitor, and the high-frequency signal with the corresponding frequency is prevented from passing through the signal release line connected with the magnetic beads in parallel by the high-frequency inductance characteristic of the magnetic beads, so that the user can conveniently plan the release condition of the interference signals with different frequencies on the cooling fin 201.
In one possible embodiment, the impedance-reducing module 207 further comprises an inductor connected in parallel across each capacitor.
In this embodiment, the inductor is connected in parallel with the capacitor, so that a parallel LC resonant circuit can be formed, and the parallel LC resonant circuit prevents the high-frequency signal with the corresponding frequency from passing through the signal release line with the inductor in parallel, so that the user can conveniently plan the release condition of the interference signals with different frequencies on the cooling fin 201.
Referring to fig. 2, a first aspect of the embodiments of the present application provides a circuit board 100, including: plate 101, chip 103 and heat sink for chip 103; the chip 103 is arranged on the plate 101; the heat sink of the chip 103 includes a heat sink 201, an insulating connector 203, conductive foam 205, and a impedance reduction module 207. The heat sink 201 is mounted above the board 101 through the insulating connector 203, and the heat sink 201 is attached to the chip 103; the heat sink 201 is connected to the ground of the board 101 via the conductive foam 205 and the impedance reduction module 207. The components of the heat dissipating device for the chip 103 in this embodiment are identical to those of the previous embodiment, and are not described herein.
In the description of the present application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate an orientation or a positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application.
Claims (10)
1. The chip heat dissipation device is characterized by being applied to a circuit board, wherein the circuit board comprises a board body and a chip arranged on the board body; the chip heat dissipation device includes: the device comprises a radiating fin, an insulating connecting piece, conductive foam and an impedance reducing module;
the radiating fin is erected above the plate body through the insulating connecting piece and is attached to the chip; the radiating fins are connected with the ground end of the plate body sequentially through the conductive foam and the impedance reducing module.
2. The chip heat sink according to claim 1, wherein: the impedance-reducing module comprises one or more capacitors; the first end of each capacitor is connected with the conductive foam, and the second end of each capacitor is connected with the ground end of the plate body.
3. The chip heat sink according to claim 2, wherein: the impedance-reducing module further comprises magnetic beads which are connected in parallel with the two ends of each capacitor.
4. The chip heat sink according to claim 2, wherein: the impedance-reducing module further comprises an inductor, and the inductor is connected in parallel with two ends of each capacitor.
5. The chip heat sink according to claim 1, wherein: the upper surface of chip is equipped with heat conduction silica gel, heat conduction silica gel contact the fin makes the fin laminating in the chip.
6. The chip heat sink according to claim 5, wherein: the conductive foam is filled between the radiating fin and the plate body to inhibit electromagnetic leakage.
7. A circuit board, comprising: plate body, chip and chip heat dissipating double-fuselage; the chip is arranged on the plate body; the chip heat dissipation device comprises a heat dissipation sheet, an insulating connecting piece, conductive foam and an impedance reduction module;
the radiating fin is erected above the plate body through the insulating connecting piece and is attached to the chip; the radiating fins are connected with the ground end of the plate body sequentially through the conductive foam and the impedance reducing module.
8. The circuit board of claim 7, wherein the impedance-reducing module comprises one or more capacitors; the first end of each capacitor is connected with the conductive foam, and the second end of each capacitor is connected with the ground end of the plate body.
9. The circuit board of claim 8, wherein: the impedance-reducing module further comprises magnetic beads which are connected in parallel with the two ends of each capacitor.
10. The circuit board of claim 8, wherein: the impedance-reducing module further comprises an inductor, and the inductor is connected in parallel with two ends of each capacitor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223195080.XU CN219497777U (en) | 2022-11-28 | 2022-11-28 | Chip heat abstractor and circuit board |
| PCT/CN2023/134655 WO2024114621A1 (en) | 2022-11-28 | 2023-11-28 | Chip heat dissipation apparatus and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223195080.XU CN219497777U (en) | 2022-11-28 | 2022-11-28 | Chip heat abstractor and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219497777U true CN219497777U (en) | 2023-08-08 |
Family
ID=87512769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223195080.XU Active CN219497777U (en) | 2022-11-28 | 2022-11-28 | Chip heat abstractor and circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN219497777U (en) |
| WO (1) | WO2024114621A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024114621A1 (en) * | 2022-11-28 | 2024-06-06 | 广州视源电子科技股份有限公司 | Chip heat dissipation apparatus and circuit board |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204859871U (en) * | 2015-08-13 | 2015-12-09 | 青岛海信电器股份有限公司 | Heat radiating system |
| CN105898979A (en) * | 2015-12-09 | 2016-08-24 | 乐视致新电子科技（天津）有限公司 | PCB device welded with conductive radiating fin, and conductive radiating fin and welding method thereof |
| CN208047146U (en) * | 2018-04-24 | 2018-11-02 | 深圳市共进电子股份有限公司 | A kind of cooling system based on mainboard |
| CN111010853B (en) * | 2019-12-26 | 2021-11-16 | 惠州Tcl移动通信有限公司 | Anti-interference heat dissipation structure and mobile terminal |
| CN213462428U (en) * | 2020-07-31 | 2021-06-15 | 惠州视维新技术有限公司 | Circuit board heat radiation structure |
| CN112752393B (en) * | 2020-11-03 | 2022-05-24 | 普联技术有限公司 | Circuit board with heat sink and grounding method for heat sink |
| CN219497777U (en) * | 2022-11-28 | 2023-08-08 | 广州视源电子科技股份有限公司 | Chip heat abstractor and circuit board |
-
2022
- 2022-11-28 CN CN202223195080.XU patent/CN219497777U/en active Active
-
2023
- 2023-11-28 WO PCT/CN2023/134655 patent/WO2024114621A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024114621A1 (en) * | 2022-11-28 | 2024-06-06 | 广州视源电子科技股份有限公司 | Chip heat dissipation apparatus and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024114621A1 (en) | 2024-06-06 |
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