CN203951359U - A kind of PCB structure of DC-DC reduction voltage circuit - Google Patents
A kind of PCB structure of DC-DC reduction voltage circuit Download PDFInfo
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- CN203951359U CN203951359U CN201420294159.4U CN201420294159U CN203951359U CN 203951359 U CN203951359 U CN 203951359U CN 201420294159 U CN201420294159 U CN 201420294159U CN 203951359 U CN203951359 U CN 203951359U
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 33
- 239000010949 copper Substances 0.000 claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000003985 ceramic capacitor Substances 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
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- 229910052751 metal Inorganic materials 0.000 claims description 3
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- 230000000694 effects Effects 0.000 abstract description 4
- 230000005670 electromagnetic radiation Effects 0.000 abstract 1
- 238000013461 design Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 238000004146 energy storage Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
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- 239000000463 material Substances 0.000 description 3
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- 238000010992 reflux Methods 0.000 description 2
- 208000034423 Delivery Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
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- 229920005989 resin Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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Abstract
The utility model discloses a kind of PCB structure of DC-DC reduction voltage circuit, all electronic devices and components are in the layout of the same aspect of PCB; And all input capacitances, output capacitance and inductance component are in the layout of power conversion chip rear; Input capacitance C1 and output capacitance C3 are placed side by side on the same axis of PCB; One end of one end of input capacitance C1 and input capacitance C2 is connected to by covering copper on the power input of power conversion chip U1, and the other end is earth terminal; The ground connection heat dissipation bonding pad of the earth terminal of input capacitance C1 and input capacitance C2 and power conversion chip remains on same axis, and leaves and cover copper space and adopt large area to cover copper and be connected; Input capacitance C2 is placed in parallel in the front of input capacitance C1 and near power conversion chip; All ground connection is covered the internal layer ground level that copper is placed dense vias and is connected to PCB.The utlity model has that electromagnetic radiation is little, good heat dissipation effect and the high advantage of Power Integrity.
Description
Technical field
The utility model relates to board design field, relates in particular to a kind of PCB structure of DC-DC reduction voltage circuit.
Background technology
DC-DC change-over circuit is the voltage conversion circuit that input direct voltage is converted to stable output dc voltage.DC (Direct Current) represents " DC power supply ".DC-DC change-over circuit is divided three classes: step-up DC-DC change-over circuit, buck DC-DC change-over circuit and buck-boost type DC-DC change-over circuit, can adopt different control according to demand.
In the time that power circuit designs, there is an index that is called Power Integrity, be called for short PI (Power Integrity).When in the past to signal integrity analysis, generally all suppose that power supply is in absolute stable state, but along with system improves constantly the requirement of simulation accuracy, this hypothesis more and more can not be accepted, therefore PI arises at the historic moment.For the analysis of signal integrity (Signal Integrity), except considering reflection, crosstalk and electromagnetic interference (EMI) outside, the analysis of Power Integrity is more and more paid close attention to by people, and reliable and stable power supply supply becomes the important directions that designers study.In the time that high speed circuit is carried out to emulation, often because the imperfection of signal reference layer causes signal circuit path change multiterminal, thereby cause that the EMI performance of signal quality variation and product becomes, and directly affect signal integrity.
Cause the unsettled root of power supply to be mainly two aspects: the one, under device speed-sensitive switch state, the alternating current of transient state is excessive; The 2nd, there is inductance in current circuit path.Particularly, ground bounce noise is too large, and decoupling capacitor design is unreasonable, return flow path impact is serious, and cutting apart of ground level is improper, and stratum design is unreasonable, electric current maldistribution, the skin effect of high frequency causes system impedance variation etc., all can become the principal element of destroying Power Integrity.Power Integrity is affected or destroys and all likely has influence on the object that in whole system, signal is realized; interfere with communications system; reduce the transmission quality of signal; destroy the normal delivery of signal; and likely produce the serious problems such as EMI, finally cause equipment operation undesired or or can not regular event.In embedded system, Power Integrity is damaged and more can directly has influence on signal integrity.
Summary of the invention
Technical problem to be solved in the utility model is; a kind of PCB structure of DC-DC reduction voltage circuit is provided; carrying out in power supply PCB placement-and-routing process; by the rational deployment to electronic devices and components; avoid power supply ground level to cut apart that improper, current reflux path is obstructed or current reflux loop area is excessive and cause the problems such as electromagnetic interference, protection power source integrality is not damaged.
For solving above technical problem, the utility model embodiment provides a kind of PCB structure of DC-DC reduction voltage circuit, and described DC-DC reduction voltage circuit comprises power conversion chip U1, input capacitance C1, input capacitance C2, inductance L 1, output capacitance C3, output capacitance C4, output capacitance C5;
All electronic devices and components of described DC-DC reduction voltage circuit are in the layout of the same aspect of PCB; And all input capacitances, output capacitance and inductance component are in the layout of power conversion chip U1 rear;
Input capacitance C1 and output capacitance C3 are placed side by side on the same axis of PCB;
One end of input capacitance C1 is connected to by covering copper on the power input of power conversion chip U1, and the other end is earth terminal; One end of input capacitance C2 is connected to by covering copper on the power input of power conversion chip U1, and the other end is earth terminal; The ground connection heat dissipation bonding pad of the earth terminal of input capacitance C1 and input capacitance C2 and power conversion chip U1 remains on same axis, and leaves and cover copper space and adopt large area to cover copper and be connected; Input capacitance C2 is placed in parallel in the front of input capacitance C1 and near power conversion chip U1;
All ground connection is covered copper and is placed a large amount of dense vias, and is connected to the internal layer ground level of PCB.
Further, output capacitance C4 is placed in parallel in the rear of next-door neighbour input capacitance C1 and output capacitance C3; Described output capacitance C4 is polar capacitor, and its positive pole connects inductance L 1 rear end, minus earth by covering copper.
Further, described inductance L 1 is vertically positioned over the right side of output capacitance C3 and output capacitance C4; Inductance L 1 front end is connected with the output signal end of power conversion chip U1 by covering copper; Inductance L 1 rear end is connected by covering copper with output capacitance C3, output capacitance C4 and output capacitance C5.
Again further, output capacitance C5 is perpendicular to output capacitance C4 and be parallel to inductance L 1 and place.
Preferably, inductance L 1 adopts specification to be: the metal dust integrated inductance of length × wide=(7.3 ± 0.5mm) × (6.8 ± 0.5mm).Input capacitance C1 and output capacitance C3 adopt the chip ceramic capacitor that encapsulation model is 1210.Input capacitance C2 and output capacitance C5 employing encapsulation model are 0402 or 0603 chip ceramic capacitor.Output capacitance C4 adopts the perhaps tantalum electric capacity of electrostrictive polymer that encapsulation model is 7343.
The PCB structure of the DC-DC reduction voltage circuit that the utility model embodiment provides, according to the electric circuit characteristic of DC-DC reduction voltage circuit itself, by the rational deployment to electronic devices and components, and adopt package dimension little, highly low device, reduce the area occupied of two current circuits that form in DC-DC reduction voltage circuit, reduce pcb board level area occupied and the device space, thereby two external Radiative EMIs of loop aerial that the electronic devices and components in reduction circuit form, ensure the Power Integrity of DC-DC reduction voltage circuit, power source performance is reliable and stable, Power supply belt load capacity is strong, output ripple is little, and the ground level of pcb board is also complete continuously, and earth terminal is adopted to the intensive design of via hole, the better heat-radiation effect of circuit board.
Brief description of the drawings
Fig. 1 is the circuit theory diagrams of the DC-DC reduction voltage circuit that provides of the utility model;
Fig. 2 is the schematic diagram that moves towards of the current circuit that forms of DC-DC reduction voltage circuit that Fig. 1 provides;
Fig. 3 is the device layout figure of an embodiment of the PCB structure of the DC-DC reduction voltage circuit that provides of the utility model;
Fig. 4 is that two current circuits forming in the utility model Fig. 3 embodiment move towards schematic diagram on pcb board.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.
Referring to Fig. 1, be the circuit theory diagrams of the DC-DC reduction voltage circuit that provides of the utility model.
Particularly, described DC-DC reduction voltage circuit comprises power conversion chip U1, input capacitance C1, input capacitance C2, inductance L 1, output capacitance C3, output capacitance C4, output capacitance C5.Wherein, one end ground connection after input capacitance C1 and input capacitance C2 composition parallel circuits, the other end is on changing voltage input and two voltage input end VIN that are connected to power conversion chip U1; Three voltage output end SW of power conversion chip U1 are connected on one end of inductance L 1 jointly, and the other end of inductance L 1 is the voltage output end of DC-DC reduction voltage circuit, and are jointly connected with one end of output capacitance C3, output capacitance C4, output capacitance C5; The other end of output capacitance C3, output capacitance C4, output capacitance C5 is ground connection respectively; The chip ground end PGND of power conversion chip U1 is connected with ground.
As shown in Figure 2, in the design of this power supply DC-DC reduction voltage circuit, there are following two current circuits:
Current circuit 1: power input VCC_input → input capacitance C1 → input capacitance C2 → power conversion chip U1 → inductance L 1 → output capacitance C5 → output capacitance C4 → output capacitance C3 → input capacitance C1 earth terminal;
Current circuit 2: power conversion chip U1 → inductance L 1 → output capacitance C5 → output capacitance C4 → output capacitance C3 → power conversion chip U1 earth terminal.
Wherein, input capacitance C1, the input capacitance C2 of above two current circuits play filter action, respectively low frequency and the high-frequency interferencing signal in filtering input supply voltage; 1 of inductance L, as energy storage device, coordinates power conversion chip U1 to realize DC-DC step-down object; Output capacitance C3, output capacitance C4, output capacitance C5 play filter action equally, low frequency in filtering output supply voltage and high-frequency interferencing signal, reduce out-put supply ripple, and the output capacitance C4 polymer electric capacity (or tantalum electric capacity) that is large capacitance, can be used as energy storage device.
Along with the development of embedded system, embedded system is more and more higher to the requirement of power-supply system, not only requires the conversion efficiency of power-supply system high, and it is little to require it to take pcb board level area.Therefore, switching frequency is generally at extremely several MHz of hundreds of KHz, even higher.And two loops of Switching Power Supply DC-DC reduction voltage circuit all very easily form the loop aerial of two different frequencies, thereby externally send electromagnetic interference signal, therefore,, in order to reduce loop aerial to extraradial electromagnetic interference, must reduce the loop area of these two current circuits.
As shown in Figure 3, be the device layout figure of an embodiment of the PCB structure of the DC-DC reduction voltage circuit that provides of the utility model.
When concrete enforcement, all electronic devices and components of described DC-DC reduction voltage circuit are in the layout of the same aspect of PCB; And all input capacitances, output capacitance and inductance component are in the layout of power conversion chip U1 rear.Input capacitance C1 and output capacitance C3 are placed side by side on the same axis of PCB; One end of input capacitance C1 is connected to by covering copper on the power input of power conversion chip U1, and the other end is earth terminal; One end of input capacitance C2 is connected to by covering copper on the power input of power conversion chip U1, and the other end is earth terminal; The ground connection heat dissipation bonding pad of the earth terminal of input capacitance C1 and input capacitance C2 and power conversion chip U1 remains on same axis, and leaves and cover copper space and adopt large area to cover copper and be connected; Input capacitance C2 is placed in parallel in the front of input capacitance C1 and near power conversion chip U1; All ground connection is covered copper and is placed a large amount of dense vias, and is connected to the internal layer ground level of PCB.
Further, output capacitance C4 is placed in parallel in the rear of next-door neighbour input capacitance C1 and output capacitance C3; Described output capacitance C4 is polar capacitor, and its positive pole connects inductance L 1 rear end, minus earth by covering copper.
Described inductance L 1 is vertically positioned over the right side of output capacitance C3 and output capacitance C4; Inductance L 1 front end is connected with the output signal end of power conversion chip U1 by covering copper; Inductance L 1 rear end is connected by covering copper with output capacitance C3, output capacitance C4 and output capacitance C5.
Output capacitance C5 is perpendicular to output capacitance C4 and be parallel to inductance L 1 and place.
Preferably, inductance L 1 adopts specification to be: the metal dust integrated inductance of length × wide=(7.3 ± 0.5mm) × (6.8 ± 0.5mm).And input capacitance C1 and output capacitance C3 adopt the patch capacitor that encapsulation model is 1210, preferably adopt chip ceramic capacitor, further, input capacitance C1 and output capacitance C3 preferably adopt X5R material ceramic condenser, the ceramic condenser ESR of this encapsulation is low, high frequency characteristics is good, highly suitable, is particularly useful for the occasion compact to PCB area requirements; And input capacitance C2 and output capacitance C5 employing encapsulation model are 0402 or 0603 patch capacitor, preferably adopt chip ceramic capacitor, and preferably adopt X5R material ceramic condenser, the solder pad space length of the electric capacity of this encapsulation on pcb board is little, ESR is low, parasitic parameter is little and withstand voltage is high, is conducive to the overall performance of the pcb board that improves power supply DC-DC reduction voltage circuit.
Further, output capacitance C4 adopts the perhaps tantalum electric capacity (being highly less than or equal to 2 millimeters) of electrostrictive polymer that encapsulation model is 7343.The polymer electric capacity of this encapsulation does not need step-down to use, and capacitance is larger.Under equal capacitance, the volume of polymer electric capacity, dielectric loss coefficient, leakage coefficient are all little than alminium electrolytic condenser, and performance is better than alminium electrolytic condenser.In power circuit, output capacitance C4 not only can be used as filtering device, also can be used as energy storage device.Tantalum electric capacity need use in buck DC-DC change-over circuit.
In the present embodiment, the ratio of the aperture of described via hole and PCB pad is: aperture/pad=12mil (Mill)/24mil, described via hole is 0.73A (peace) at the thick lower conveyance capacity of 1OZ (ounce) copper.When concrete enforcement, the earth terminal of other electric capacity all covers copper by large area and is connected.On the heat dissipation bonding pad being connected with earth terminal at power conversion chip U1 and near all capacity earth ends, at least 4 to 6 via holes are set to internal layer ground level, to improve the radiating effect of PCB.And process out-of-date employing resin material at PCB via hole is filled and led up, to prevent that in SMT (Surface Mount Technology, surface mounting technology) process, tin phenomenon is leaked in appearance.Cover copper size and must meet size of current demand, and need leave enough width surpluses.As: copper thickness is 35um, and electric current is 2A, needs to cover at least wide copper of 0.8mm.
As shown in Figure 4, be that two current circuits forming in the utility model Fig. 3 embodiment move towards schematic diagram on pcb board.
By Rational choice and the layout designs of device on pcb board of the electronic devices and components to DC-DC change-over circuit, make in power circuit selected components and parts more rationally, device layout is compacter, reduce to a considerable extent pcb board level space and current circuit area, be conducive to the installation of radome.
When concrete enforcement, rationally use the switching frequency of power conversion chip U1, be conducive to too reduce the external Radiative EMI of power circuit.
The PCB structure of the DC-DC reduction voltage circuit that employing the utility model embodiment provides designs switch power supply circuit board, has following beneficial effect:
1, adopt electronic devices and components package dimension little, highly low, take pcb board level area and the device space little;
2, electronic devices and components are reasonable in pcb board Ji Zhong placement-and-routing, and current circuit area is little, and outwards Radiative EMI is little, ensures other circuit proper communication;
3, pcb board ground level is also complete continuously, and ground connection via hole is intensive, good heat dissipation effect;
4, power source performance is reliable and stable, and Power supply belt load capacity is strong, and output ripple is little.
The above is preferred implementation of the present utility model; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection range of the present utility model.
Claims (10)
1. a PCB structure for DC-DC reduction voltage circuit, is characterized in that, described DC-DC reduction voltage circuit comprises power conversion chip U1, input capacitance C1, input capacitance C2, inductance L 1, output capacitance C3, output capacitance C4, output capacitance C5;
All electronic devices and components of described DC-DC reduction voltage circuit are in the layout of the same aspect of PCB; And all input capacitances, output capacitance and inductance component are in the layout of power conversion chip U1 rear;
Input capacitance C1 and output capacitance C3 are placed side by side on the same axis of PCB;
One end of input capacitance C1 is connected to by covering copper on the power input of power conversion chip U1, and the other end is earth terminal; One end of input capacitance C2 is connected to by covering copper on the power input of power conversion chip U1, and the other end is earth terminal; The ground connection heat dissipation bonding pad of the earth terminal of input capacitance C1 and input capacitance C2 and power conversion chip U1 remains on same axis, and leaves and cover copper space and adopt large area to cover copper and be connected; Input capacitance C2 is placed in parallel in the front of input capacitance C1 and near power conversion chip U1;
All ground connection is covered copper and is placed a large amount of dense vias, and is connected to the internal layer ground level of PCB.
2. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 1, is characterized in that, output capacitance C4 is placed in parallel in the rear of next-door neighbour input capacitance C1 and output capacitance C3; Described output capacitance C4 is polar capacitor, and its positive pole connects inductance L 1 rear end, minus earth by covering copper.
3. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 2, is characterized in that, described inductance L 1 is vertically positioned over the right side of output capacitance C3 and output capacitance C4; Inductance L 1 front end is connected with the output signal end of power conversion chip U1 by covering copper; Inductance L 1 rear end is connected by covering copper with output capacitance C3, output capacitance C4 and output capacitance C5.
4. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 3, is characterized in that, output capacitance C5 is perpendicular to output capacitance C4 and be parallel to inductance L 1 and place.
5. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 1, is characterized in that, it is the metal dust integrated inductance of 7.3 ± 0.5mm, the wide 6.8 ± 0.5mm of being that inductance L 1 adopts length.
6. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 1, is characterized in that, input capacitance C1 and output capacitance C3 adopt the chip ceramic capacitor that encapsulation model is 1210.
7. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 1, is characterized in that, input capacitance C2 and output capacitance C5 employing encapsulation model are 0402 or 0603 chip ceramic capacitor.
8. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 1, is characterized in that, output capacitance C4 adopts the perhaps tantalum electric capacity of electrostrictive polymer that encapsulation model is 7343.
9. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 8, is characterized in that, the height of output capacitance C4 is less than or equal to 2 millimeters.
10. the PCB structure of DC-DC reduction voltage circuit as claimed in claim 1, is characterized in that, the ratio of the aperture of described via hole and PCB pad is: Mill, Mill/24, aperture/pad=12.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420294159.4U CN203951359U (en) | 2014-06-04 | 2014-06-04 | A kind of PCB structure of DC-DC reduction voltage circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420294159.4U CN203951359U (en) | 2014-06-04 | 2014-06-04 | A kind of PCB structure of DC-DC reduction voltage circuit |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211466A (en) * | 2016-08-17 | 2016-12-07 | 上海小糸车灯有限公司 | The PCB layout system of vehicle LED signal lamp constant-current control module |
| CN109496057A (en) * | 2018-11-12 | 2019-03-19 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board layout |
| CN109640515A (en) * | 2019-01-28 | 2019-04-16 | 晶晨半导体（深圳）有限公司 | A kind of printed circuit board structure |
| CN111934539A (en) * | 2020-10-09 | 2020-11-13 | 成都正扬博创电子技术有限公司 | Anti-electromagnetic interference non-isolation DC-DC circuit board |
-
2014
- 2014-06-04 CN CN201420294159.4U patent/CN203951359U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211466A (en) * | 2016-08-17 | 2016-12-07 | 上海小糸车灯有限公司 | The PCB layout system of vehicle LED signal lamp constant-current control module |
| CN106211466B (en) * | 2016-08-17 | 2017-11-07 | 上海小糸车灯有限公司 | The PCB layout structure of vehicle LED signal lamp constant-current control module |
| CN109496057A (en) * | 2018-11-12 | 2019-03-19 | 晶晨半导体(上海)股份有限公司 | A kind of printed circuit board layout |
| CN109640515A (en) * | 2019-01-28 | 2019-04-16 | 晶晨半导体（深圳）有限公司 | A kind of printed circuit board structure |
| CN111934539A (en) * | 2020-10-09 | 2020-11-13 | 成都正扬博创电子技术有限公司 | Anti-electromagnetic interference non-isolation DC-DC circuit board |
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Granted publication date: 20141119 |