CN219496442U

CN219496442U - Novel SOT363 encapsulation test device

Info

Publication number: CN219496442U
Application number: CN202223196525.6U
Authority: CN
Inventors: 茆健; 穆军杰; 李军
Original assignee: Changzhou Galaxy Century Microelectronics Co ltd
Current assignee: Changzhou Galaxy Century Microelectronics Co ltd
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-08-08
Anticipated expiration: 2032-11-30

Abstract

The utility model discloses a novel SOT363 packaging test device, which comprises two groups of symmetrically arranged test piece assemblies, wherein a rubber pad is sleeved on each group of test piece assemblies; the test sheet assembly comprises a plurality of test sheets, each test sheet comprises an upper sheet and a lower sheet, the upper sheet and the lower sheet are respectively inserted into the rubber pad, the upper sheet is positioned above the lower sheet, the test end of the lower sheet is bent towards the test end of the upper sheet, the test end of the lower sheet and the test end of the upper sheet are positioned on the same plane, and a gap is reserved between the test end of the lower sheet and the test end of the upper sheet; the test end of the lower piece is used for being in contact with the front end of the pin of the SOT363 packaged product to be tested, and the test end of the upper piece is used for being in contact with the rear end of the pin of the SOT363 packaged product to be tested. The utility model provides a novel SOT363 packaging test device, which solves the problem of poor contact when SOT363 packaging products are tested by improving the contact mode of the product pins and test pieces.

Description

Novel SOT363 encapsulation test device

Technical Field

The utility model relates to a novel SOT363 packaging test device, and belongs to the technical field of discrete device testing.

Background

At present, in the field of discrete device production, 100% electrical performance test is required before shipment, and it is confirmed that the electrical function of the discrete device meets the requirement of repackaging shipment. In order to ensure the test accuracy, the smaller and better the contact resistance requirements are when the product is tested, the product with the contact resistance exceeding the range is judged to be poor in contact. The test process is that the products are taken out one by one and carried to the test seat by the test sorting machine, and the tested product pins are contacted with the test pieces which are connected to the test head of the test host. The test host is connected with the signal, and executes preset electric performance parameters to evaluate the quality of the product. SOT363 is 6 pin encapsulation, because the preceding muscle shaping process of cutting of present test is high-speed forming machine, and the flat district roughness of pin is uncontrolled in the product pin cutting process, often is certain radian, and the pin front end is minimum, and cuts the muscle in-process to the tin of product pin front end has obvious extrusion, causes the tinning layer to be thinner.

In the existing test process, as shown in fig. 1, a manner of left-right contact between one pin and two test pieces of a package is adopted, and as the flatness of a pin flat area is not controlled in the cutting process of the pin of a product, a certain radian is often formed, and when the pin flat area is contacted with the test pieces, the problem of increased contact failure is caused, and as the contact failure causes more unqualified electrical parameter test, the yield of the product is lost by more than 3%, and the test yield is not up to standard.

Disclosure of Invention

The utility model aims to solve the technical problem of overcoming the defects of the prior art and providing a novel SOT363 packaging test device which solves the problem of poor contact when SOT363 packaging products are tested by improving the contact mode of the product pins and the test piece.

In order to solve the technical problems, the technical scheme of the utility model is as follows:

a novel SOT363 packaging test device comprises two groups of symmetrically arranged test piece assemblies, wherein a rubber pad is sleeved on each group of test piece assemblies;

the test sheet assembly comprises a plurality of test sheets, each test sheet comprises an upper sheet and a lower sheet, the upper sheet and the lower sheet are respectively inserted into the rubber pad, the upper sheet is positioned above the lower sheet, the test end of the lower sheet is bent towards the test end of the upper sheet, the test end of the lower sheet and the test end of the upper sheet are positioned on the same plane, and a gap is reserved between the test end of the lower sheet and the test end of the upper sheet;

the test end of the lower piece is used for being in contact with the front end of the pin of the SOT363 packaged product to be tested, and the test end of the upper piece is used for being in contact with the rear end of the pin of the SOT363 packaged product to be tested.

Further, the PCB is further included, through holes which are the same as the bolts are formed in the rubber pads, and the rubber pads are fixed on the PCB through the bolts.

Further, two groups of wiring terminals are arranged on the PCB, and the wiring terminals are located on one side, far away from the testing end, of the testing piece.

Further, the upper piece of the test piece is electrically connected with the wiring terminal.

Further, the lower piece of the test piece is electrically connected with the wiring terminal.

Further, the test pieces are provided with 3.

Further, the clearance between the test end of the lower sheet and the test end of the upper sheet is 0.05mm.

By adopting the technical scheme, the left-right contact mode of the product pins and the existing test piece is improved to be a front-back contact mode by improving the structure of the test piece, so that the contact points of the product pins and the test piece avoid the tin wiping positions of the pins, the problem of uneven flat areas of the product pins is effectively avoided, the uncontrolled flat areas of the SOT363 pins are avoided, the extrusion positions of the ribs are avoided, the contact area of the product pins and the test piece is increased, the product pins are well contacted with the test piece, the test yield is improved by a newly designed test device, the actual problem in the production of SOT363 packaged products is improved, the one-time passing rate of the test is improved, and the production efficiency is improved.

Drawings

FIG. 1 is a prior art test connection diagram of the present utility model;

FIG. 2 is a schematic diagram of a novel SOT363 package testing device according to the present utility model;

FIG. 3 is a schematic view of the mounting of the test strip assembly of the present utility model;

FIG. 4 is a side view of FIG. 3;

FIG. 5 is a schematic diagram showing the contact between the test piece and the product pins according to the present utility model.

Detailed Description

In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments that are illustrated in the appended drawings.

As shown in fig. 2, this embodiment provides a novel SOT363 packaging test device, which includes a PCB board 1 and two sets of symmetrically arranged test piece assemblies, and a rubber pad 2 is sleeved on each set of test piece assemblies. The rubber pad 2 is provided with a through hole 21 which is the same as the bolt penetrating through, and the rubber pad 2 is fixed on the PCB 1 through the bolt. The PCB board 1 is provided with two groups of wiring terminals 3 corresponding to the test piece components, the wiring terminals 3 are located on one side, far away from the test end, of the test piece 4, one group of the test piece components is connected with one wiring terminal 3, and the wiring terminals 3 are connected to a test head of a test host through wires.

As shown in fig. 2, the test piece assembly of the present embodiment includes 3 test pieces 4, and each test piece 4 contacts one pin of the SOT363 packaged product 5 during testing. As shown in fig. 3 and 4, the test piece 4 includes an upper piece 41 and a lower piece 42, two rows of mounting grooves for mounting the upper piece 41 and the lower piece 42 are provided in the rubber pad 2, and the upper piece 41 and the lower piece 42 are respectively inserted into the rubber pad 2.

The upper sheet 41 is located above the lower sheet 42, the test end of the lower sheet 42 is bent towards the test end of the upper sheet 41, the test end of the lower sheet 42 and the test end of the upper sheet 41 are located on the same plane, a gap 43 is reserved between the test end of the lower sheet 42 and the test end of the upper sheet 41, the gap 43 between the test end of the lower sheet 42 and the test end of the upper sheet 41 is 0.05mm, the upper sheet 41 of the test sheet 4 is electrically connected with the wiring terminal 3, and the lower sheet 42 of the test sheet 4 is electrically connected with the wiring terminal 3.

During testing, the SOT363 packaged product 5 is pressed down and placed on the test piece assembly, and one pin of the SOT363 packaged product 5 corresponds to one test piece 4. As shown in fig. 5, after the pressing, the test end of the lower sheet 42 contacts with the front end of the pin of the product 5 packaged by the SOT363 to be tested, the test end of the upper sheet 41 contacts with the rear end of the pin of the product 5 packaged by the SOT363 to be tested, and the contact mode of the product pin and the test sheet 4 is changed into front-back contact, so that the contact point of the product pin and the test sheet 4 avoids the tin wiping position of the pin, and the problem of uneven flat area of the product pin is effectively avoided.

The technical problems, technical solutions and advantageous effects solved by the present utility model have been further described in detail in the above-described embodiments, and it should be understood that the above-described embodiments are only illustrative of the present utility model and are not intended to limit the present utility model, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present utility model should be included in the scope of protection of the present utility model.

Claims

1. The novel SOT363 packaging testing device is characterized by comprising two groups of symmetrically arranged testing piece assemblies, wherein a rubber pad (2) is sleeved on each group of testing piece assemblies;

the test piece assembly comprises a plurality of test pieces (4), the test pieces (4) comprise an upper piece (41) and a lower piece (42), the upper piece (41) and the lower piece (42) are respectively inserted into the rubber pad (2), the upper piece (41) is positioned above the lower piece (42), the test end of the lower piece (42) is bent towards the test end of the upper piece (41), the test end of the lower piece (42) and the test end of the upper piece (41) are positioned on the same plane, and a gap (43) is reserved between the test end of the lower piece (42) and the test end of the upper piece (41);

the test end of the lower piece (42) is used for being in contact with the front end of the packaging product pin of the SOT363 to be tested, and the test end of the upper piece (41) is used for being in contact with the rear end of the packaging product pin of the SOT363 to be tested.

2. The novel SOT363 packaging testing device of claim 1, wherein: the novel rubber pad is characterized by further comprising a PCB (1), wherein through holes (21) which are the same as the bolts are formed in the rubber pad (2), and the rubber pad (2) is fixed on the PCB (1) through the bolts.

3. The novel SOT363 packaging testing device of claim 2, wherein: two groups of wiring terminals (3) are arranged on the PCB (1), and the wiring terminals (3) are located on one side, far away from the testing end, of the testing piece (4).

4. The novel SOT363 packaging testing device of claim 3, wherein: the upper piece (41) of the test piece (4) is electrically connected with the wiring terminal (3).

5. The novel SOT363 packaging testing device of claim 3, wherein: the lower piece (42) of the test piece (4) is electrically connected with the wiring terminal (3).

6. The novel SOT363 packaging testing device of claim 1, wherein: the number of the test pieces (4) is 3.

7. The novel SOT363 packaging testing device of claim 1, wherein: the gap (43) between the test end of the lower sheet (42) and the test end of the upper sheet (41) is 0.05mm.