CN219491578U

CN219491578U - Heat conduction floor

Info

Publication number: CN219491578U
Application number: CN202320372445.7U
Authority: CN
Inventors: 胡红涛
Original assignee: Shanghai Boyou Industrial Co ltd
Current assignee: Shanghai Boyu Industrial Co ltd
Priority date: 2023-03-03
Filing date: 2023-03-03
Publication date: 2023-08-08
Anticipated expiration: 2033-03-03

Abstract

The utility model discloses a heat conduction floor which comprises a bottom plate, wherein a heat insulation plate is arranged at the top of the bottom plate, a heat insulation plate is arranged at the top of the heat insulation plate, a high-density plate is arranged at the top of the heat insulation plate, one side of the high-density plate is fixedly connected with a connecting block, the other side of the high-density plate is provided with a connecting groove, the top of the high-density plate is provided with an upper heat conduction groove, four corners of the top of the high-density plate are provided with openings, and an adhesive is arranged in each opening. According to the utility model, the upper stabilizing plate is firmly connected with the high-density plate through the anti-skid patterns, the adhesive and the openings, the heat insulation effect is achieved on the bottom of the high-density plate through the heat insulation plate, and the heat insulation plate is matched with the heat insulation plate to further reduce downward heat transfer, so that the bottom plate is prevented from being heated and bent, and the service life of the floor is prolonged.

Description

Heat conduction floor

Technical Field

The utility model relates to the technical field of floors, in particular to a heat conduction floor.

Background

The floor, namely the surface layer of the house floor or the floor, is made of timber or other materials, the floor is classified into a lot of solid wood floors, reinforced composite wood floors, three-layer solid wood composite floors, bamboo wood floors, anti-corrosion floors, cork floors, most popular multi-layer solid wood composite floors and the like, and geothermal heat is used as a novel heating mode in recent years.

Because the floor is heated and is easy to bend and deform, the floor is easy to damage, the using effect of the floor is affected, the service life of the floor is reduced, and the current requirements of people on floor heating cannot be met.

Therefore, it is necessary to invent a heat conductive floor to solve the above problems.

Disclosure of Invention

The utility model aims to provide a heat conduction floor, which is characterized in that an upper stabilizing plate is firmly connected with a high-density plate through the matching of anti-skid patterns, an adhesive and openings, the heat insulation effect is achieved on the bottom of the high-density plate through the arranged heat insulation plate, and the heat conduction floor is matched with a heat insulation plate to further reduce downward heat transfer, so that the bottom plate is prevented from being heated and bent, the service life of the floor is prolonged, and the defects in the technology are overcome.

In order to achieve the above object, the present utility model provides the following technical solutions: the heat conduction floor comprises a bottom plate, wherein a heat insulation plate is arranged at the top of the bottom plate, a heat insulation plate is arranged at the top of the heat insulation plate, a high-density plate is arranged at the top of the heat insulation plate, a connecting block is fixedly connected to one side of the high-density plate, a connecting groove is formed in the other side of the high-density plate, an upper heat conduction groove is formed in the top of the high-density plate, openings are formed in four corners of the top of the high-density plate, and an adhesive is arranged in the openings;

the top of high density board is provided with the stabilizer bar, lower heat conduction groove has been seted up to the bottom of going up the stabilizer bar, four corners of going up the stabilizer bar bottom all are provided with the anti-skidding line, the top of going up the stabilizer bar is provided with the heat-conducting plate, the top of heat-conducting plate is provided with the reinforcing plate, the top of reinforcing plate is provided with waterproof panel.

Preferably, two adjacent high density boards are connected through the joint of the connecting block and the connecting groove, and the outer side of the connecting block is attached to the inner side of the connecting groove.

Preferably, the cross section shape of the upper heat conducting grooves is in a crisscross grid shape, and the upper heat conducting grooves and the lower heat conducting grooves are in butt joint to form a heat conducting channel.

Preferably, the number of the openings is four, and the four openings are symmetrically distributed with respect to the vertical center line of the high-density board.

Preferably, the longitudinal section of the anti-skid pattern is arranged in a zigzag shape, and the anti-skid pattern and the upper stabilizing plate are of an integrated structure.

Preferably, the heat insulation board is a polyphenyl board, and the polyphenyl board has low heat conductivity coefficient.

In the technical scheme, the utility model has the technical effects and advantages that:

1. the upper stabilizing plate and the high-density plate are firmly connected through the anti-skid patterns, the adhesive and the openings, the bottom of the high-density plate is insulated through the insulation plate, and the heat is further reduced to be downwards transferred through the insulation plate, so that the bottom plate is prevented from being heated and bent, and the service life of the floor is prolonged;

2. the heat on the upper stabilizing plate is upwards transferred through the heat-conducting plate, the waterproof panel at the top of the reinforcing plate is reinforced through the reinforcing plate which is not easy to deform, the waterproof panel is prevented from being deformed due to heating, the surface layer of the floor is kept flat while the heat-conducting performance of the floor is improved, and the requirement of people on floor heating is met.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of the expanded structure of the high density fiberboard and upper stabilizer board of the present utility model;

FIG. 3 is a bottom perspective view of the upper stabilizing plate of the present utility model;

fig. 4 is a front cross-sectional view of the connection block and the connection groove of the present utility model.

Reference numerals illustrate:

1. a bottom plate; 2. a heat insulating plate; 3. a thermal insulation board; 4. a high density board; 5. a connecting block; 6. a connecting groove; 7. an upper heat conducting groove; 8. an opening; 9. an adhesive; 10. an upper stabilizing plate; 11. a lower heat conduction groove; 12. anti-skid lines; 13. a heat conductive plate; 14. a reinforcing plate; 15. a waterproof panel.

Detailed Description

In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.

The utility model provides a heat conduction floor as shown in figures 1-4, which comprises a bottom plate 1, wherein a heat insulation plate 2 is arranged at the top of the bottom plate 1, a heat insulation plate 3 is arranged at the top of the heat insulation plate 2, a high-density plate 4 is arranged at the top of the heat insulation plate 3, a connecting block 5 is fixedly connected to one side of the high-density plate 4, a connecting groove 6 is formed at the other side of the high-density plate 4, an upper heat conduction groove 7 is formed at the top of the high-density plate 4, openings 8 are formed at four corners of the top of the high-density plate 4, and an adhesive 9 is arranged in the openings 8;

the top of high density board 4 is provided with upper stabilizer plate 10, and lower heat conduction groove 11 has been seted up to the bottom of upper stabilizer plate 10, and four corners of upper stabilizer plate 10 bottom all are provided with anti-skidding line 12, and the top of upper stabilizer plate 10 is provided with heat-conducting plate 13, and the top of heat-conducting plate 13 is provided with reinforcing plate 14, and the top of reinforcing plate 14 is provided with waterproof panel 15.

Further, in the above technical scheme, two adjacent high density boards 4 are connected through connecting block 5 and spread groove 6 block, and the outside of connecting block 5 is laminated with the inboard of spread groove 6, conveniently makes two adjacent bottom plates butt joint through connecting block 5 and spread groove 6 that set up.

Further, in the above technical scheme, the cross section shape of the upper heat conducting groove 7 is set to be crisscross grid, the upper heat conducting groove 7 and the lower heat conducting groove 11 are in butt joint to form a heat conducting channel, the heat conducting channel is formed by the upper heat conducting groove 7 and the lower heat conducting groove 11, and the heat conducting pipe for floor heating is conveniently installed inside the bottom plate.

Further, in the above technical solution, the number of the openings 8 is four, the four openings 8 are symmetrically distributed about the vertical center line of the high-density board 4, and the four openings 8 are matched with the anti-skid patterns 12, and the high-density board 4 and the upper stabilizing board 10 are firmly connected under the bonding action of the adhesive 9.

Further, in the above technical solution, the longitudinal section of the anti-skid pattern 12 is set to be zigzag, the anti-skid pattern 12 and the upper stabilizing plate 10 are in an integral structure, and the contact area between the anti-skid pattern 12 and the adhesive 9 is increased through the zigzag anti-skid pattern 12, so that the connection between the anti-skid pattern 12 and the adhesive 9 is more stable.

Furthermore, in the above technical scheme, the heat insulation board 3 is a polyphenyl board material, the polyphenyl board material has low heat conductivity coefficient, and the polyphenyl board material is used as the heat insulation board 3, so that the heat insulation board is waterproof, can achieve the heat insulation effect, has high strength and low heat conductivity coefficient, and reduces downward heat transfer on the high-density board 4.

The working principle of the utility model is as follows:

referring to fig. 1 to 4 of the drawings, firstly, the lower part of the floor comprises a high-density board 4, a heat insulation board 3, a heat insulation board 2 and a bottom plate 1, the lower part of the bottom plate is installed at a proper position, a proper number of floors can be installed according to actual demands, a floor heating heat conduction pipe is installed in an upper heat conduction groove 7, and the transverse installation or the longitudinal installation is selected according to the actual demands;

referring to fig. 1-4 of the specification, secondly, the upper half part of the floor comprises a waterproof panel 15, a reinforcing plate 14, a heat conducting plate 13 and an upper stabilizing plate 10, the upper half part of the bottom plate is matched and installed on the lower half part of the bottom plate through anti-slip patterns 12, adhesives 9 and openings 8, the lower half part of the floor is combined with the upper half part, when the floor is used, the heat insulating effect is achieved on the bottom of the high-density board 4 through the heat insulating plate 3, and the heat insulating plate 2 is matched to further reduce the downward heat transfer, so that the bottom plate 1 is prevented from being heated and bent, the service life of the floor is prolonged, the heat on the upper stabilizing plate 10 is upwards transferred through the heat conducting plate 13, the waterproof panel 15 at the top of the floor is reinforced through the reinforcing plate 14 which is not easy to deform, the heat conducting performance of the floor is increased, and the surface layer of the floor is kept flat, and the requirements of people on the floor heating nowadays are met.

While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.

Claims

1. A heat conducting floor comprising a bottom plate (1), characterized in that: the heat insulation plate is characterized in that the top of the bottom plate (1) is provided with a heat insulation plate (2), the top of the heat insulation plate (2) is provided with a heat insulation plate (3), the top of the heat insulation plate (3) is provided with a high-density plate (4), one side of the high-density plate (4) is fixedly connected with a connecting block (5), the other side of the high-density plate (4) is provided with a connecting groove (6), the top of the high-density plate (4) is provided with an upper heat conduction groove (7), four corners at the top of the high-density plate (4) are provided with openings (8), and the inside of each opening (8) is provided with an adhesive (9);

the top of high density board (4) is provided with stabilizing board (10), lower heat conduction groove (11) have been seted up to the bottom of going up stabilizing board (10), four corners of going up stabilizing board (10) bottom all are provided with anti-skidding line (12), the top of going up stabilizing board (10) is provided with heat-conducting plate (13), the top of heat-conducting plate (13) is provided with reinforcing plate (14), the top of reinforcing plate (14) is provided with waterproof panel (15).

2. The heat conduction floor according to claim 1, wherein two adjacent high-density boards (4) are connected by clamping a connecting block (5) and a connecting groove (6), and the outer side of the connecting block (5) is attached to the inner side of the connecting groove (6).

3. A heat conducting floor according to claim 1, characterized in that the cross-sectional shape of the upper heat conducting grooves (7) is arranged in a criss-cross grid shape, and the upper heat conducting grooves (7) are butted with the lower heat conducting grooves (11) to form heat conducting channels.

4. A heat conductive floor according to claim 1, wherein the number of openings (8) is four, and the four openings (8) are symmetrically distributed in pairs about the vertical center line of the high density board (4).

5. A heat conducting floor according to claim 1, characterized in that the longitudinal section of the anti-skid pattern (12) is arranged in a zigzag shape, and the anti-skid pattern (12) and the upper stabilizing plate (10) are of an integrated structure.

6. A heat conducting floor according to claim 1, characterized in that the heat insulating board (3) is a polystyrene board.