CN219476073U

CN219476073U - Computer CPU heat abstractor

Info

Publication number: CN219476073U
Application number: CN202320749118.9U
Authority: CN
Inventors: 杨泉河; 娜日斯; 乌丽雅苏
Original assignee: Individual
Current assignee: Individual
Priority date: 2023-04-07
Filing date: 2023-04-07
Publication date: 2023-08-04
Anticipated expiration: 2033-04-07

Abstract

The utility model relates to the technical field of CPU heat dissipation, and discloses a computer CPU heat dissipation device, which comprises a base, a rotating seat and a frame; the rotary seat and the rotary block are inserted into the rotary hole, and the rotary seat and the rotary block are movably arranged in the rotary hole; the inside both sides of roating seat are parallel to run through and are offered the perforation, the perforation internal fixation runs through and installs the heat pipe, the screw has been offered in the vertical run through of base top both sides, screw and commentaries on classics hole are run through each other, fastening bolt is installed to the screw rotation. According to the technical scheme, the radiating fins and the radiating fan can be flexibly rotated, the orientation of the radiating fins and the radiating fan can be reasonably adjusted according to the air duct in the chassis, the radiating efficiency is improved, and the radiating fins can be prevented from shielding the memory bank slot through rotation, so that inconvenience in plugging and unplugging of the memory bank caused by shielding the memory bank slot is avoided.

Description

Computer CPU heat abstractor

Technical Field

The utility model relates to the technical field of CPU heat dissipation, in particular to a computer CPU heat dissipation device.

Background

When the CPU works, a large amount of heat is generated, if the heat is not timely emitted, the CPU is crashed, the CPU is possibly burned down if the heat is light, the CPU radiator is used for radiating the heat of the CPU, the radiator plays a decisive role in the stable operation of the CPU, and when the computer is assembled, the purchase of a good radiator is very important.

However, with the increasing size of the radiator, the size of the main board is mainly divided into an ATX main board, an M-ATX middle board and an ITX mini board, and when the radiator with a larger size is arranged on the M-ATX middle board and the ITX mini board, a certain shielding is usually caused to the slot of the memory bank, so that the memory bank is very inconvenient to be plugged and unplugged, and secondly, because the air channels of the chassis are different, the radiator cannot be installed and perfectly matched with the air channels, thereby affecting the heat dissipation efficiency, and urgent improvement is needed.

Disclosure of Invention

The utility model aims to provide a heat dissipation device for a CPU of a computer, which solves the problems in the background technology.

The embodiment of the application provides a computer CPU heat dissipation device, which comprises a base, a rotating seat and a frame;

the rotary seat and the rotary block are inserted into the rotary hole, and the rotary seat and the rotary block are movably arranged in the rotary hole;

the inside both sides of roating seat are parallel to run through and are offered the perforation, the perforation internal fixation runs through and installs the heat pipe, the screw has been offered in the vertical run through of base top both sides, screw and commentaries on classics hole are run through each other, fastening bolt is installed to the screw rotation.

Through adopting above-mentioned technical scheme, rotation heat radiation fins and radiator fan that can be nimble makes its orientation carry out reasonable regulation according to the wind channel of quick-witted incasement portion, improves radiating efficiency, and secondly still can prevent through rotating that heat radiation fins from causing the shielding to the memory bank slot, lead to the comparatively inconvenient of pulling out of memory bank when avoiding shielding the memory bank slot.

Optionally, a frame is fixedly installed above the heat pipe.

By adopting the technical scheme, the fixed installation of the cooling fan can be facilitated.

Optionally, a plurality of groups of heat dissipation fins are sleeved on the heat pipe, and each group of heat dissipation fins is uniformly distributed on the inner side of the frame.

By adopting the technical scheme, heat can be rapidly led out to complete heat dissipation.

Optionally, the front end of the frame is detachably provided with a cooling fan.

By adopting the technical scheme, the air flow rate can be increased, so that the cooling speed is increased.

Optionally, the bottom of the rotating block and the bottom of the rotating hole are in contact with each other, and the side wall of the rotating block and the side wall of the rotating hole are in contact with each other.

By adopting the technical scheme, the heat conduction work can be effectively ensured.

Compared with the prior art, the beneficial effects of the technical scheme are as follows:

according to the technical scheme, the rotating block is positioned in the rotating hole, so that the direction of the radiating fins and the radiating fan can be adjusted, the radiating direction of the radiating fan can be reasonably adjusted according to the air channel in the case, the installation flexibility of the radiating fan is greatly improved, the radiating fan can be flexibly adjusted in the later stage, and the memory slot can be prevented from being blocked by rotation, so that inconvenience caused by blocking during the memory slot pulling and inserting is avoided.

Drawings

Other features, objects and advantages of the present utility model will become more apparent upon reading of the detailed description of non-limiting embodiments, given with reference to the accompanying drawings in which:

FIG. 1 is a schematic diagram of a front view of a heat sink for a CPU of a computer according to the present utility model;

FIG. 2 is a schematic cross-sectional view of a rotating base and a base of the heat sink of the CPU of the computer according to the present utility model;

FIG. 3 is a schematic diagram of a base structure of a heat sink of a CPU of a computer according to the present utility model;

fig. 4 is a schematic diagram of a rotating seat structure of the heat dissipating device of the CPU of the computer according to the present utility model.

In the figure: 1. a base; 11. a fastening bolt; 12. a turning hole; 13. a screw hole; 2. a rotating seat; 21. a rotating block; 22. perforating; 23. a heat pipe; 3. a frame; 31. a heat radiation fin; 4. a heat radiation fan.

Detailed Description

Referring to fig. 1-4, the present utility model provides a technical solution: the CPU heat dissipating double-fuselage of the computer, including base 1, swivel mount 2 and frame 3;

the upper part of the inside of the base 1 is provided with a rotating hole 12, the bottom of the rotating seat 2 is integrally provided with a rotating block 21, the rotating seat 2 and the rotating block 21 are inserted into the rotating hole 12, the rotating seat 2 and the rotating block 21 are movably arranged in the rotating hole 12, and the rotating seat 2 and the rotating block 21 can be flexibly rotated in the rotating hole 12;

in this technical scheme, the rotation of the rotating seat 2 can be realized by the rotation of the rotating block 21 in the rotating hole 12, and the heat pipe 23, the frame 3, the heat dissipation fins 31 and the heat dissipation fan 4 can be driven to rotate at the moment;

the two sides of the inside of the rotating seat 2 are parallelly and penetratingly provided with through holes 22, a heat pipe 23 is fixedly and penetratingly arranged in the through holes 22, the two sides of the top of the base 1 are longitudinally and penetratingly provided with screw holes 13, the screw holes 13 are mutually communicated with the rotating holes 12, and the screw holes 13 are rotatably provided with fastening bolts 11;

in this technical solution, the connection between the heat pipe 23 and the rotating base 2 can be achieved through the through hole 22, so that the rotating base 2 can conduct heat to the heat pipe 23, and the heat pipe can move downwards through the rotation of the fastening bolt 11, and can mutually abut against the rotating block 21 at this time, thereby completing the fixing work of the rotating block 21.

In some technical solutions, as shown in fig. 1, a frame 3 is fixedly installed above the heat pipe 23; when in use, the frame 3 can play a supporting role, and can also provide a mounting position for the cooling fan 4.

In some technical solutions, as shown in fig. 1, a plurality of groups of heat dissipation fins 31 are sleeved on the heat pipe 23, and each group of heat dissipation fins 31 is uniformly distributed on the inner side of the frame 3; in use, heat conduction is achieved through the heat sink fins 31.

In some technical solutions, as shown in fig. 1, a cooling fan 4 is detachably mounted at the front end of a frame 3; when in use, the cooling fins 31 can be rapidly cooled by the air draft of the cooling fan 4.

In some technical solutions, as shown in fig. 2, the bottom of the rotating block 21 and the bottom of the rotating hole 12 are in contact with each other, and the side wall of the rotating block 21 and the side wall of the rotating hole 12 are in contact with each other; in use, the base 1 is ensured to be able to transfer heat to the rotating base 2 by the contact of the bottom and side walls of the rotating block 21 with the bottom and side walls of the rotating hole 12.

When the heat pipe type heat pipe fixing device is used, the base 1 can be pressed on the CPU after silicone grease is smeared on the surface of the CPU, the heat of the CPU can be conducted to the base 1 when the heat pipe type heat pipe fixing device works after the fixing is finished, then can be conducted to the rotating block 21 and the rotating seat 2, and then can be conducted to the heat pipe 23 and then emitted through the heat radiating fins 31, finally, the cooling speed is increased through the blowing of the heat pipe 4, and when the heat pipe type heat pipe fixing device is installed, the rotating block 21 can rotate in the rotating hole 12 to adjust the directions of the heat radiating fins 31 and the heat radiating fan 4, so that the heat pipe type heat pipe fixing device can be used for adjusting the heat radiating direction of the heat radiating fan 4 according to an air channel in a chassis reasonably, the installation flexibility is greatly improved, the later stage can be flexibly adjusted, the heat pipe type heat pipe fixing device can also prevent the heat pipe type heat pipe from being blocked when a memory bar is pulled out through rotation, inconvenience caused by the blocking when the memory bar is prevented from being pulled out when the fixing bolt 11 is adjusted, the rotation of the heat pipe type heat pipe fixing device can be rotated downwards to move through the fastening bolt 11 in a screw hole 13 after the fixing bolt 11 is in contact with the rotating block 12.

Claims

1. Computer CPU heat abstractor, its characterized in that: comprises a base (1), a rotating seat (2) and a frame (3);

a rotating hole (12) is formed in the upper part of the interior of the base (1), a rotating block (21) is integrally formed at the bottom of the rotating seat (2), the rotating seat (2) and the rotating block (21) are inserted into the rotating hole (12), and the rotating seat (2) and the rotating block (21) are movably arranged in the rotating hole (12);

the heat pipe (23) is fixedly installed in the through holes (22), screw holes (13) are longitudinally formed in the two sides of the top of the base (1) in a penetrating mode, the screw holes (13) are communicated with the rotating holes (12), and the fastening bolts (11) are rotationally installed in the screw holes (13).

2. The heat sink of computer CPU according to claim 1, wherein a frame (3) is fixedly mounted above the heat pipe (23).

3. The heat sink device for CPU of computer according to claim 2, wherein the heat pipe (23) is sleeved with a plurality of sets of heat dissipation fins (31), and each set of heat dissipation fins (31) is uniformly distributed inside the frame (3).

4. The heat sink of the CPU of the computer according to claim 1, wherein the front end of the frame (3) is detachably mounted with a heat radiation fan (4).

5. The heat sink of the computer CPU according to claim 1, wherein the bottom of the rotating block (21) and the bottom of the rotating hole (12) are in contact with each other, and the side wall of the rotating block (21) and the side wall of the rotating hole (12) are in contact with each other.