CN219459670U - Patch device of miniature sensitive element - Google Patents
Patch device of miniature sensitive element Download PDFInfo
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- CN219459670U CN219459670U CN202223267853.0U CN202223267853U CN219459670U CN 219459670 U CN219459670 U CN 219459670U CN 202223267853 U CN202223267853 U CN 202223267853U CN 219459670 U CN219459670 U CN 219459670U
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Abstract
The utility model provides a patch device for a miniature sensitive element, which comprises a base bearing structure, a patch limiting structure, a counterweight structure, a base limiting groove, a sensitive element limiting groove, a locating pin limiting hole and a locating pin, wherein the base limiting groove is used for placing and coarsely limiting a base to be patched, the base limiting groove is used for machining the base locating limiting hole and the sensitive element limiting groove by a precise laser machining technology according to the outline dimension of the sensitive element and the dimension of a base locating pin, the locating pin is used for precisely assembling and positioning the limiting structure and the counterweight structure, and the counterweight structure is used for applying pressure to the sensitive element placed on a tube shell so as to realize the tight fit between a fixed supporting area of the sensitive element and a tube shell mounting boss. The utility model can solve the problems of low efficiency and poor uniformity of the sensitive element paster in batches, and improves the precision and consistency of the paster process.
Description
Technical Field
The utility model relates to the technical field of basic electrical elements, in particular to a patch device of a miniature sensitive element.
Background
In the production process chain of the micro sensor, the chip mounting process of the sensitive element is a key link for realizing reliable packaging. The requirement of miniature sensing devices in the current market environment is huge, and a high-efficiency and standardized mass production chain is a key for solving the current dilemma, so that higher requirements are put on the consistency and the precision of the device production process.
The mounting errors introduced by the patch process can directly affect the performance of the microsensor device. When the semi-automatic chip mounter is used for mounting, because of the fluidity of the adhesive, each sensitive element needs to be pre-cured on a heating table during mounting, and single serial operation leads to accumulation of curing time, so that the processing efficiency is greatly reduced. Meanwhile, the parallelism and the center alignment precision of the patch are manually adjusted by operators, and the process consistency is poor.
Accordingly, there is a need for an apparatus and method that improves the consistency of the patch process.
Disclosure of Invention
The utility model aims to solve the problem of consistency of a pasting technology, and provides a pasting device of a miniature sensitive element, which can effectively improve the pasting production efficiency of the sensitive element and the alignment precision of a fixing and supporting area and a base mounting boss through batch limiting design, and ensure the consistency of the pasting technology.
The utility model provides a patch device of a miniature sensitive element, which comprises a base bearing structure, a patch limiting structure and a counterweight structure, wherein the base bearing structure, the patch limiting structure and the counterweight structure are detachably arranged from bottom to top;
the mounting boss of the to-be-pasted base corresponds to the position of the fixed supporting area of the sensitive element, the sensitive element limiting groove is formed by connecting the fixed supporting area with the mounting boss through paste glue according to a hollowed-out groove processed by the size of the sensitive element, and the front end of the spring thimble is arranged on the upper part of the fixed supporting area and is in contact with the fixed supporting area, so that the spring is in a compressed state.
The patch device of the miniature sensitive element, which is provided by the utility model, is used as a preferable mode, and further comprises a base pin limiting hole arranged at one side of the sensitive element limiting groove, wherein a base pin penetrating through the base to be patch is arranged on the base to be patch, and the upper part of the base pin is positioned in the base pin limiting hole.
According to the patch device of the miniature sensitive element, as an optimal mode, the base pin limiting holes are through holes and are positioned on two sides of the fixing and supporting area.
The patch device of the miniature sensitive element, which is provided by the utility model, is used as an optimal mode, and further comprises a base pin limiting groove arranged in the base limiting groove, wherein the lower part of the base pin penetrates through the base pin limiting groove.
According to the patch device of the miniature sensitive element, as an optimal mode, the base pin limiting groove is a strip-shaped groove.
In the patch device for the micro-sensor, the positioning pin is arranged between the patch limiting structure and the counterweight structure to position the counterweight structure in an optimal way.
According to the patch device for the miniature sensing element, the sensing element limiting groove and the frame structure of the sensing element are positioned in an optimal mode.
According to the patch device for the miniature sensing element, the sensing element limiting grooves and the two ends of the sensing element are positioned in an optimal mode.
In the patch device of the miniature sensitive element, as an optimal mode, the front end of the spring thimble is of a semicircular structure, the spring thimble is in point contact with the fixing and supporting area, and a limit hole sleeved with the positioning pin is formed in the stainless steel plate
According to the patch device for the miniature sensitive element, the number of the base limiting grooves, the number of the sensitive element limiting grooves and the number of the spring thimbles are at least two as an optimal mode.
The utility model provides a patch device of a miniature sensitive element. The tool comprises a base bearing structure, a patch limiting structure, a locating pin and a counterweight structure, wherein a locating slot is designed on the base bearing structure and used for placing and coarsely limiting a base to be patched. The limiting structure is used for machining a base positioning limiting hole and a sensitive element positioning limiting groove by a precise laser machining technology according to the external dimension of the sensitive element and the dimension of the base positioning pin. The locating pin is used for precision assembly location between limit structure and the counter weight structure, and the counter weight structure is used for exerting pressure to the sensitive element of placing on the tube shell to realize the inseparable laminating between sensitive element admittedly and prop up regional and the tube shell installation boss. The utility model can solve the problems of low efficiency and poor uniformity of the sensitive element paster in batches, and improves the precision and consistency of the paster process.
The utility model provides a matched fixture for a micro sensitive element patch, which comprises a main body, a main body and a main body, wherein the main body is provided with a plurality of grooves, the grooves are formed in the main body, and the main body is provided with a plurality of grooves: sensitive element paster frock includes: the base bearing structure is used for positioning a base for placing the patch to be attached; the patch limiting structure comprises a limiting design of a base positioning pin to be patched and a sensitive element to be patched, and the center alignment between a fixed supporting area of the sensitive element to be patched and a base mounting boss is realized through the limiting design and the processing process error control; the positioning pin is used for assembling and positioning between the limiting structure and the counterweight structure; and the counterweight structure is used for applying pressure after aligning and installing the sensitive element so as to realize the close fit between the fixed supporting area of the sensitive element and the base installation boss.
The base bearing structure is provided with a plurality of positioning grooves which are arranged at intervals, a plurality of bases to be pasted can be simultaneously borne, and the bases are in one-to-one correspondence with the positioning grooves.
The limiting structure utilizes precision laser processing, the hollow structure comprises a limiting hole of a base positioning pin and a limiting groove of a sensitive element, the limiting groove of the sensitive element is designed according to the actual appearance of the element, a frame part or two ends of the sensitive element are selected as design references, the sensitive element is limited to deviate and twist in a horizontal plane, and the center alignment between a fixed supporting area of the sensitive element and a base mounting boss is realized by taking the precision processing limiting structure as the reference.
The locating pin is connected with the locating hole on the limiting structure at first and serves as a reference for alignment between the spring probe and the sensitive element fixing and supporting area on the counterweight structure.
The counterweight structure is formed by assembling a spring thimble with threads and a stainless steel plate with a threaded hole. The center of the threaded hole on the stainless steel plate is overlapped with the center of the fixed supporting area of the assembled sensitive element, the thimble with the spring has a compression allowance, after the assembly, the tip of the thimble contacts with the fixed supporting area of the sensitive element to apply pressure due to the dead weight of the cover plate, and the spring is in a compressed state, so that the assembly height difference of the sensitive element generated by the processing technology can be compensated.
The patch method of the utility model comprises the following steps: and dispensing on the mounting boss of the base to be pasted, and mounting the locating pin on the base with glue on a base limiting hole of the base on the limiting structure in an aligning manner, so that the assembly of the limiting structure and the base is realized. And then assembling the base and the limiting structure with the base bearing structure, clamping the sensitive element to be pasted into the limiting groove of the pasting limiting structure, and realizing the alignment between the sensitive element fixing and supporting area and the base mounting boss. And a locating pin is inserted into a locating hole on the patch structure, the counterweight structure is assembled with the limiting tool through the locating pin, alignment between the probe tip of the counterweight structure and the sensitive element fixing and supporting area is realized, and the probe tip of the counterweight structure is pressed against the sensitive element fixing and supporting area, so that tight fitting is realized. According to the type of the selected adhesive, the temperature and the heating time of the incubator are set, the curing of the adhesive is realized, and the firm and reliable bonding between the sensitive element and the base is completed.
Before the base to be pasted and the limiting structure are assembled, ultrasonic cleaning is carried out on the base to be pasted, and after cleaning is finished, drying treatment is carried out on the base.
Before the to-be-pasted base and the limiting structure are assembled, a proper amount of pasting glue is dispensed on the surface of the installation boss of the to-be-pasted base and evenly spread.
The utility model has the following advantages:
(1) The utility model provides a positioning and mounting tool for a miniature sensitive element, which is characterized in that a limiting structure processed by a precision processing technology is used for performing center positioning control on a sensitive element mounting fixture and a mounting boss of a base to be mounted, so that positioning accuracy and consistency of mounting during mounting are ensured. The design of counter weight frock can apply certain bonding pressure to the bonding region when the paster is glued and realize the inseparable laminating of sensitive element and base to guarantee that complete equipment shifts the in-process of curing in the incubator, sensitive element and base's stability does not take place the deviation aversion, shortens single serial cumulative curing time to the time of parallel simultaneous curing in batches, has shortened paster glues solidification total time greatly, effectively promotes paster efficiency when improving paster precision and uniformity.
(2) Aiming at the problem that the adhesive attaching efficiency is reduced due to the accumulation of the pre-curing time of each element adhesive attaching during single serial operation, the utility model provides a method for simultaneously curing a plurality of elements at one time after the assembly is completed, and the adhesive attaching efficiency of sensitive elements is greatly improved. After the sensitive element and the base are installed and aligned, a counterweight structure is installed, the counterweight structure applies certain pressure to the joint area between the sensitive element and the base, and meanwhile, the counterweight structure and the limiting tool are fixed through a locating pin, and the whole matched structure is in a mechanical fixing state and is not easy to deviate. And (3) taking the whole tool into an incubator to heat so as to realize batch curing of the surface mount adhesive. The spring arranged in the spring thimble enables a certain travel allowance to exist, so that the assembly height difference can be made up, the position angle offset caused by viscosity change in the heating and curing process of the adhesive is automatically adjusted, and the adhesive mounting precision in the adhesive mounting and curing process is effectively ensured.
Drawings
FIG. 1 is a diagram of a patch device base carrying structure of a microsensitive element;
FIG. 2 is a diagram showing a positioning structure and a sensor assembly of a micro sensor using a middle frame to define an origin;
FIG. 3 is an assembly diagram of a limiting structure and a sensor of a chip mounter of a micro sensor, wherein the limiting structure uses hammerheads at two ends to limit an origin;
FIG. 4 is a block diagram of a patch device locating pin of a microsensor;
FIG. 5 is a cross-sectional view of a weight of a patch device of a microsensitive element;
FIG. 6 is a cross-sectional view of an assembly of a mounting structure, a spacing structure, a sensing element and a weight structure of a chip device base of a miniature sensing element;
FIG. 7 is an assembly view of a patch device sensor and a base of a miniature sensor;
FIG. 8 is a block diagram of a patch device base of a microsensitive element;
fig. 9 is a diagram showing a structure of a patch device sensor of a micro sensor.
Reference numerals:
01. a sensor; 011. a fixation and support region; 02. a base; 021. a mounting boss; 022. a base pin; 03. a paster adhesive; 1. a base carrying structure; 2. a patch limiting structure; 3. a counterweight structure; 31. a stainless steel plate; 32. a spring thimble; 4. a base limit groove; 5. a sensitive element limit groove; 6. a locating pin limiting hole; 7. a positioning pin; 8. base pin limit holes; 9. base pin limit groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1
As shown in fig. 1 to 6, a patch device for micro sensing elements comprises a base bearing structure 1, a patch limiting structure 2 and a counterweight structure 3 which are detachably arranged from bottom to top, a base limiting groove 4 arranged in the base bearing structure 1, a sensing element limiting groove 5, a locating pin limiting hole 6 and a locating pin 7 arranged in the patch limiting structure 2, a base pin limiting hole 8 arranged at one side of the sensing element limiting groove 5 and a base pin limiting groove 9 arranged in the base limiting groove 4;
as shown in fig. 5, the counterweight structure 3 includes a stainless steel plate 31 and a spring thimble 32 detachably connected to the stainless steel plate 31;
the mounting boss 021 of the to-be-pasted base 02 is corresponding to the fixedly supported area 011 of the sensing element 01 in position, the middle of the sensing element limiting groove 5 is provided with a hollow opening to enable the fixedly supported area 011 to be connected with the mounting boss 021 through the pasting glue 03, and the front end of the spring thimble 32 is arranged on the upper part of the fixedly supported area 011 and is contacted with the fixedly supported area 011 to enable the spring to be in a compressed state; a base pin 022 penetrating through the base 02 to be pasted is arranged on the base 02 to be pasted, and the upper part of the base pin 022 penetrates into a base pin limiting hole 8 to be located;
the structures of the to-be-pasted substrate 02 and the sensitive element 01 are shown in fig. 8-9;
the base pin limiting holes 8 are through holes and are positioned at two sides of the fixing and supporting area 011, the lower parts of the base pins 022 penetrate through the base pin limiting grooves 9, and the base pin limiting grooves 9 are strip-shaped grooves;
the locating pin 7 is arranged between the patch limiting structure 2 and the counterweight structure 3 to locate the counterweight structure 3;
as shown in fig. 2, the sensing element limiting groove 5 is positioned with hammerheads at two ends of the sensing element 01, or as shown in fig. 3, the sensing element limiting groove 5 is positioned with a frame structure of the sensing element 01;
the front end of the spring thimble 32 is of a semicircular structure, the spring thimble 32 is in point contact with the fixing and supporting area 011, and a limiting hole sleeved with the positioning pin 7 is formed in the stainless steel plate 31.
The number of the base limit groove 4, the sensitive element limit groove 5 and the spring thimble 32 is at least two.
Example 2
As shown in fig. 1 to 9, a patch device for a microsensor according to an embodiment of the present utility model provides an alignment installation tool for a microsensor, where the tool includes a base bearing structure 1, a patch limiting structure 2, a locating pin limiting hole 6, a locating pin 7, and a counterweight structure 3. The base carrying structure 1 is used for carrying a base 02 to be pasted; the base pin limiting hole 8 and the sensitive element limiting groove 5 are machined on the patch limiting structure by using a precise laser machining technology, the base pin limiting hole 8 on the limiting tool is used for high-precision assembly of the base and the limiting tool, is one of reference coordinates for alignment of the sensitive element and the base, the sensitive element limiting groove 5 and the base pin limiting hole 8 on the limiting structure belong to positioning references, and the base mounting boss 021 and the center alignment mounting of the sensitive element fixing and supporting area 011 are realized; the counterweight structure is formed by positioning and mounting a spring thimble with threads and a stainless steel plate, and has the function of applying patch pressure by means of dead weight; the locating pin is used for limiting the assembly of the limiting structure and the counterweight structure, the locating pin limiting hole on the limiting structure is used as a reference, the assembly between the counterweight structure spring thimble 32 and the limiting center of the limiting structure is realized, and then the purpose that the spring thimble 32 is in counterpoint contact with the sensitive element fixing and supporting area 011 during use is achieved, specific pressure is applied, and the close fitting of the sensitive element and the base is realized.
By adopting the configuration mode, the chip mounting device for the miniature sensitive element is provided, the tool is provided with a limiting structure which is processed by a precision processing technology, and central self-alignment mounting is carried out on the mounting boss 021 of the sensitive element mounting bracket 011 and the mounting boss 021 of the chip mounting base, so that the alignment precision and consistency of mounting during chip mounting are ensured. The design of counter weight structure can apply certain paster pressure to the bonding area when the paster is glued and realize the inseparable laminating of sensitive element and base to guarantee that complete equipment shifts the in-process of curing in the incubator, sensitive element and base's stability does not take place the deviation aversion, shortens single serial cumulative curing time to the time of parallel simultaneous curing in batches, has shortened the paster total time of gluing greatly, effectively promotes paster efficiency when improving paster precision and uniformity.
Meanwhile, in the utility model, in order to ensure the stability of the patch base and the consistency of the upper surface horizontal height, a plurality of limiting grooves 4 are processed on the base bearing structure to load and limit the patch base. As a specific embodiment of the utility model, the package tube of the micro angular rate sensing device is shown in fig. 8, the sensitive element structure is shown in fig. 9, the bases to be pasted are correspondingly placed on the to-be-pasted tool one by one, the bases are not shifted, and the horizontal heights of the installation bosses of the to-be-pasted are consistent.
Meanwhile, in order to improve the alignment precision of the limit structure to the sensitive element installation area, the limit structure is taken as a reference, the limit holes 8 of the base pins and the limit grooves 5 of the sensitive element are respectively processed in the hollow structure of the limit structure, and the limit grooves can adopt a design mode of using a middle frame as a limit origin or a limit mode of using hammer heads at two ends as frames.
Meanwhile, in the utility model, in order to improve the accuracy of center alignment of the spring thimble tip 32 and the sensing element fixing and supporting 011 on the counterweight structure, two positioning pins are designed, the positioning pins are inserted into two limiting holes on the limiting structure by taking the limiting structure as a reference, and sleeve holes on the counterweight structure are assembled with the positioning pins, so that the accurate assembly between the counterweight structure and the limiting structure is realized.
As a specific embodiment of the utility model, the threaded spring thimble 32 is assembled with a stainless steel plate with a threaded hole, and the stainless steel plate 31 is provided with a limiting hole which is sleeved with a positioning pin, so that the assembly with a limiting structure is realized, and the tip of the spring thimble is precisely aligned with the central area of a limiting groove on the limiting structure, namely the central area of a post-limiting sensitive element fixing support 011. The tip of the spring thimble is hemispherical, the electrode damage of the solid supporting area is avoided by adopting a point contact mode, the pitching angle is generated due to the inclination of the contact surface, and the patch precision is improved.
The patch method of examples 1 to 2 includes: and dispensing in the mounting area of the element to be pasted or dispensing a plurality of mounting bosses 021 of the base to be pasted, and mounting the positioning pins 022 on the base in alignment with the base pin limiting holes 8 on the limiting structure, so as to realize the assembly of the limiting structure and the base. And then assembling the base and the limiting structure with the base bearing structure, clamping the sensitive element to be pasted into the limiting groove of the pasting limiting structure, and realizing the alignment between the sensitive element fixing and supporting area and the base mounting boss. And a locating pin 7 is inserted into a locating hole on the limiting structure, the counterweight structure 3 is assembled with the patch limiting structure 2 through the locating pin, alignment between the probe tip 32 of the counterweight structure and the solid supporting area 011 of the sensitive element is realized, and the probe tip of the counterweight structure is pressed against the solid supporting area of the sensitive element, so that close fitting is realized. According to the type of the selected adhesive, the temperature and the heating time of the incubator are set, the curing of the adhesive is realized, and the firm and reliable bonding between the sensitive element and the base is completed.
By the aid of the configuration mode, the positioning and mounting tool for the miniature sensitive element is provided, and is of a limiting structure processed through a precision machining technology, center positioning control is carried out on the mounting support of the sensitive element and the mounting boss of the base to be mounted, so that positioning accuracy and consistency of mounting during mounting are guaranteed. The design of counter weight frock can apply certain bonding pressure to the bonding region when the paster is glued and realize the inseparable laminating of sensitive element and base to guarantee that complete equipment shifts the in-process of curing in the incubator, sensitive element and base's stability does not take place the deviation aversion, shortens single serial cumulative curing time to the time of parallel simultaneous curing in batches, has shortened paster glues solidification total time greatly, effectively promotes paster efficiency when improving paster precision and uniformity.
At the same time: before the to-be-pasted base and the limiting tool are assembled, the sensitive element pasting method further comprises the following steps: and cleaning the to-be-pasted substrate before dispensing. Ultrasonic cleaning with alcohol or acetone for 10min, and oven drying at 80deg.C for 2 hr.
For a further understanding of the present utility model, the following detailed description of the present utility model is directed to a tool and method for micro sensor mounting in conjunction with fig. 1-9.
As shown in fig. 1 to 9, according to an embodiment of the present utility model, there is provided a fixture for installing a micro sensor device in alignment, the fixture including a base carrying structure 1, a patch limiting structure 2, a locating pin limiting hole 6, a locating pin 7, and a weight structure 3. The base bearing structure is used for loading a base 02 to be pasted, a base pin limiting hole 8 on the limiting structure is used for one of reference standards of base and sensitive element alignment, a sensitive element limiting groove 5 on the limiting structure and the base limiting hole belong to the same positioning standard, and the base pin limiting hole and the base limiting hole realize center alignment installation of a base installation boss 021 and a sensitive element fixing and supporting area 011. The counterweight structure is formed by positioning and installing a spring thimble with threads and a stainless steel plate, and has the function of applying patch pressure by means of dead weight. The locating pin is used for limiting the assembly of the limiting structure and the counterweight structure, the pattern of the limiting structure is used as a reference, the assembly between the spring thimble of the counterweight structure and the limiting center of the limiting structure is realized, the alignment contact between the spring thimble and the fixing and supporting area of the sensitive element is further realized, the specific pressure is applied, and the close fit between the sensitive element and the base is realized.
Aiming at the problem of low alignment efficiency of the sensitive element and the base, the utility model provides a batch self-alignment limiting mode, and after the sensitive element is placed in the limiting groove, the self-alignment of the centers of the fixed supporting area of the sensitive element and the mounting boss of the base is realized. And a limiting pattern on a limiting structure processed by a precision processing technology is used as a positioning reference, and a base pin positioning hole 8 on the limiting structure realizes positioning assembly between a base and the limiting structure, so that the central area of a limiting groove 5 on the limiting structure coincides with the central point of a base boss 021. And the central position 011 of the region coincides with the central region of the limiting groove due to the restriction of the limiting position of the sensitive element placed in the limiting groove, and the central alignment between the sensitive element fixing support and the base boss is realized by taking the limiting groove on the limiting structure as a reference.
Aiming at the problem that the adhesive attaching efficiency is reduced due to the accumulation of the pre-curing time of each element adhesive attaching during single serial operation, the utility model provides a method for simultaneously curing a plurality of elements at one time after the assembly is completed, and the adhesive attaching efficiency of sensitive elements is greatly improved. After the sensitive element and the base are installed and aligned, a counterweight structure is installed, the counterweight structure applies certain pressure to the joint area between the sensitive element and the base, and meanwhile, the counterweight structure and the limiting tool are fixed through a locating pin, and the whole matched structure is in a mechanical fixing state and is not easy to deviate. And (3) taking the whole tool into an incubator to heat so as to realize batch curing of the surface mount adhesive. The spring arranged in the spring thimble enables a certain travel allowance to exist, so that the assembly height difference can be made up, the position angle offset caused by viscosity change in the heating and curing process of the adhesive is automatically adjusted, and the adhesive mounting precision in the adhesive mounting and curing process is effectively ensured.
The following is a detailed description of the method of bonding using the bonding tool of the present utility model:
firstly, carrying out batch inspection on the tube shell 02, including appearance and air tightness, and cleaning the tube shell after the inspection is qualified, such as alcohol and acetone, respectively carrying out ultrasonic treatment for 10min. After the cleaning is completed, the pipe shell is dried, for example, at 80 ℃ for 2 hours.
And secondly, a proper amount of adhesive 03 is dispensed on the base mounting boss 021 manually or automatically and is evenly spread.
And thirdly, according to the base positioning holes 8 on the limiting structure, high-precision assembly of the base 02 and the patch limiting structure 2 is completed, and meanwhile, assembly of the limiting structure, the base with glue and the base bearing structure is completed.
Fourthly, the sensitive elements 01 in the film clamping box are placed in the limiting grooves 5 of the limiting structure one by one.
And fifthly, installing two positioning pins 7, realizing the assembly between the counterweight structure 3 and the patch limiting structure 2 through the positioning pins, enabling the tip of the spring thimble 32 on the counterweight structure to be just aligned with the fixedly supported area where the sensitive element and the base are bonded, and applying pressure according to the dead weight of the tool to finish the fixation of the assembly structure.
And step six, the assembled whole tool is sent into a baking oven with a set temperature, and the curing of the adhesive is carried out, for example, 170 ℃ for 20min, so that the firm bonding of the sensitive element and the base is realized.
In summary, the utility model provides a tool and a method for mounting a patch on a micro sensor. The single serial accumulated curing time is improved to be the simultaneous batch parallel curing time, and the efficiency of the patch is improved. The application of the precise limiting structure realizes the self-alignment between the sensitive element structure and the base, ensures the precision and consistency of the surface mounting technology, and provides a reliable batch surface mounting technology.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (10)
1. A patch device for a microsensitive element, comprising: the device comprises a base bearing structure (1), a patch limiting structure (2) and a counterweight structure (3) which are detachably arranged from bottom to top, wherein a base limiting groove (4) arranged in the base bearing structure (1) and a sensitive element limiting groove (5), a locating pin limiting hole (6) and a locating pin (7) arranged in the patch limiting structure (2) are arranged, and the counterweight structure (3) comprises a stainless steel plate (31) and a spring thimble (32) detachably connected with the stainless steel plate (31);
treat paster base (02) setting is in base spacing groove (4), sensitive element (01) set up in sensitive element spacing groove (5), treat installation boss (021) of paster base (02) with the solid area (011) position correspondence of sensitive element (01), set up hollow trompil in the middle of sensitive element spacing groove (5) and make solid area (011) with installation boss (021) are connected through paster glue (03), the front end setting of spring thimble (32) is in the upper portion of solid area (011) and with solid area (011) contact and make the spring be in compression state.
2. A patch device for a microsensitive element according to claim 1, wherein: the sensor comprises a sensor limiting groove (5) and is characterized by further comprising a base pin limiting hole (8) arranged on one side of the sensor limiting groove, wherein a base pin (022) penetrating through the base (02) to be pasted is arranged on the base (02) to be pasted, and the upper part of the base pin (022) is positioned deep into the base pin limiting hole (8).
3. A patch device for a microsensitive element according to claim 2, wherein: the base pin limiting holes (8) are through holes and are positioned on two sides of the fixing and supporting area (011).
4. A patch device for a microsensitive element according to claim 2, wherein: the base pin limiting groove (9) is formed in the base limiting groove (4), and the lower portion of the base pin (022) penetrates through the base pin limiting groove (9).
5. The patch device for a microsensitive element of claim 4 wherein: the base pin limit groove (9) is a strip-shaped groove.
6. A patch device for a microsensitive element according to claim 1, wherein: the locating pin (7) is arranged between the patch limiting structure (2) and the counterweight structure (3) so as to locate the counterweight structure (3).
7. A patch device for a microsensitive element according to claim 1, wherein: the sensitive element limiting groove (5) is positioned with the frame structure of the sensitive element (01).
8. A patch device for a microsensitive element according to claim 1, wherein: and the sensitive element limiting grooves (5) are positioned at two ends of the sensitive element (01).
9. A patch device for a microsensitive element according to claim 1, wherein: the front end of the spring thimble (32) is of a semicircular structure, the spring thimble (32) is in point contact with the fixing and supporting area (011), and a limiting hole sleeved with the positioning pin (7) is formed in the stainless steel plate (31).
10. A patch device for a microsensitive element according to claim 1, wherein: the number of the base limiting grooves (4), the number of the sensitive element limiting grooves (5) and the number of the spring ejector pins (32) are at least two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223267853.0U CN219459670U (en) | 2022-12-07 | 2022-12-07 | Patch device of miniature sensitive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223267853.0U CN219459670U (en) | 2022-12-07 | 2022-12-07 | Patch device of miniature sensitive element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219459670U true CN219459670U (en) | 2023-08-01 |
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ID=87412738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223267853.0U Active CN219459670U (en) | 2022-12-07 | 2022-12-07 | Patch device of miniature sensitive element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219459670U (en) |
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2022
- 2022-12-07 CN CN202223267853.0U patent/CN219459670U/en active Active
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