CN111098251B - Pre-pressing clamp for installing circuit board assembly in inertial integrated navigation equipment - Google Patents
Pre-pressing clamp for installing circuit board assembly in inertial integrated navigation equipment Download PDFInfo
- Publication number
- CN111098251B CN111098251B CN201911366986.3A CN201911366986A CN111098251B CN 111098251 B CN111098251 B CN 111098251B CN 201911366986 A CN201911366986 A CN 201911366986A CN 111098251 B CN111098251 B CN 111098251B
- Authority
- CN
- China
- Prior art keywords
- plate
- bottom plate
- board
- pressing
- rubber pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/02—Assembly jigs
Abstract
The utility model provides a pre-compaction anchor clamps that is arranged in inertia combination navigation equipment circuit board assembly installation links firmly bracket component and the bottom plate that is located its top as an organic whole through the screw, and bottom plate up end left side is equipped with compresses tightly the subassembly that compresses tightly that fixes placing the printing board on the locating area, locating component installs on bottom plate up end right side and corresponds with integrated circuit mounted position on the printing board and the convex surface position on the heating panel, bottom plate and locating component carry out the leveling through balanced board subassembly, locating component is last to be equipped with the heat conduction rubber pad and to be located the printing board right side and to be fixed in the heating panel convex surface on the locating area and compress tightly the heat conduction rubber pad, treats that the heat conduction rubber pad warp to stabilize after with heat conduction rubber pad, heating panel and printing board bonding link firmly. The invention overcomes the defects existing in manual installation, improves the assembly consistency and the one-time assembly qualification rate, has controllable assembly height of the heat-conducting rubber pad, has strong reliability of the installed circuit board assembly and has larger application value.
Description
Technical Field
The invention belongs to the technical field of mechanical assembly fixtures, and particularly relates to a pre-pressing fixture for mounting a circuit board assembly in inertial integrated navigation equipment.
Background
The inertial integrated navigation equipment is one of important instruments on the airplane and is used for collecting, resolving and displaying flight data related to the course, the attitude and the like of the airplane. The equipment mainly carries out navigation calculation by a strapdown integrated navigation component, and the working reliability of the equipment is determined by the compactness of the installation of a circuit board component in the strapdown integrated navigation component. Some circuit board subassemblies need carry out the heating panel installation in the strapdown integrated navigation subassembly, and in the actual operation at present, the manual mode of manual use is directly installed, and the defect of manual installation method is: firstly, the printed board is deformed and damaged during manual installation, and communication hidden danger is caused; secondly, when the printed circuit board and the heat dissipation plate are installed manually, a fit gap exists between the printed circuit board and the heat dissipation plate, the heat dissipation effect of the integrated circuit at the position is affected, and the integrated circuit fails due to overtemperature when working at high temperature; thirdly, when the printed board is installed manually, the printed board directly bears extrusion stress, so that the pins of the integrated circuit deform, and the reliability of the device is directly influenced; manual installation varies from person to person, and operators are difficult to control the assembly height of the heat-conducting rubber pad, so that the deformation quantity is difficult to control during assembly of the circuit board assembly; the above defects in manual installation may cause damage to the printed board on the circuit board assembly, which may cause hidden communication troubles, and thus affect the integrity of the navigation solution function, and therefore, there is a need for improvement.
Disclosure of Invention
The technical problems solved by the invention are as follows: the pre-pressing clamp for installing the circuit board assembly in the inertial combined navigation equipment solves the defects existing in manual installation, improves the assembly consistency and the one-time assembly qualification rate, is controllable in the assembly height of the heat-conducting rubber pad, is strong in reliability of the installed circuit board assembly, and has a large application value.
The technical scheme adopted by the invention is as follows: a prepressing fixture for installing a circuit board assembly in inertial combined navigation equipment comprises a support assembly, a pressing assembly, a height-adjustable positioning assembly and a balance board assembly, wherein the support assembly and a bottom board positioned above the support assembly are fixedly connected into a whole through screws, the upper end surface of the bottom board is provided with a positioning area for positioning a printed board and a heat dissipation board matched with the printed board respectively, the left side of the upper end surface of the bottom board is provided with the pressing assembly for pressing and fixing the printed board placed on the positioning area, the positioning assembly is arranged on the right side of the upper end surface of the bottom board and corresponds to an integrated circuit mounting position on the printed board and a convex surface position on the heat dissipation board, the bottom board and the positioning assembly are leveled through the balance board assembly, the positioning assembly is provided with a heat conduction rubber pad, and the heat conduction rubber pad is pressed by the convex surface of the heat dissipation board positioned on the right side of the printed board and fixed on the positioning area, and after the heat-conducting rubber pad is deformed and stabilized, the heat-conducting rubber pad, the heat dissipation plate and the printed board are bonded and fixedly connected.
The positioning area comprises a printed board positioning area and a heating panel positioning area, two groups of mutually parallel convex edge blocks are arranged on the upper end face of the bottom plate, positioning notches are formed in the inner side of the upper end face of each group of convex edge blocks, the openings of the positioning notches are oppositely arranged, two positioning notches in one group of convex edge blocks on the left side of the upper end face of the bottom plate form the printed board positioning area, two positioning notches in the other group of convex edge blocks on the right side of the upper end face of the bottom plate form the heating panel positioning area, the printed board and the heating panel are respectively placed in the printed board positioning area and the heating panel positioning area, the printed board is pressed and fixed on the printed board positioning area by the pressing assembly, and the four corners of the heating panel are fixed on the heating panel positioning area through screws.
Furthermore, the support assembly comprises a support plate and two side plates which are arranged in parallel, wherein the support plate is positioned below the bottom plate, and the end parts of the support plate are fixedly connected with the side plates into a whole through screws.
Further, bottom plate up end left side is equipped with four groups and compresses tightly the subassembly, compress tightly the subassembly and include clamp plate, rank shape screw and spring, all make two screws on the left protruding arris piece of a set of bottom plate up end, the system has the rank shape hole on the clamp plate, the spring is located in the rank shape hole with the packing ring that is located the spring upper end, rank shape screw passes packing ring and spring and screw adaptation spiral closure to make the platform that compresses tightly of clamp plate one side lower extreme compress tightly the printing board through rotatory clamp plate.
Further, bottom plate up end right side is equipped with three locating component of group, locating component includes rotator and hob, the system has the screw hole that corresponds with three convex surface position on the heating panel on the bottom plate up end right side face, the hob lower extreme closes soon with the screw hole adaptation and hob upper end and rotator fixed connection to the regulation of rotator height is realized in the rotation through the hob.
Further, the balance plate assembly comprises a balance plate, an apron and balls, wherein the middle of the surface of the balance plate is provided with a strip-shaped groove and the balls are placed in the strip-shaped groove, the apron is made of a transparent material and is fixed on the balance plate through screws to seal the notch of the strip-shaped groove.
Further, the bottom plate is made of CrWMn alloy steel.
Compared with the prior art, the invention has the advantages that:
1. according to the technical scheme, the three groups of positioning assemblies are arranged on the right side of the upper end face of the bottom plate, so that the consistency of the heights of the corresponding three contact surfaces is ensured when the heat dissipation plate, the printed board and the heat-conducting rubber pad are assembled, the local deformation or protrusion of the printed board caused by the inconsistent heights of the three contact surfaces when the circuit board assembly is directly assembled is avoided, the reliable contact of the heat dissipation plate and a heat dissipation device is ensured, and the hidden danger of damage of the printed board is avoided;
2. according to the technical scheme, the horizontal positions of the three rotating bodies are adjusted, so that the horizontal positions of the three contact surfaces of the heat dissipation plate are adjusted, the pressure-bearing load of an integrated circuit on the contact surface of the circuit board assembly is reduced, and the failure rate of corresponding devices is effectively reduced;
3. the technical scheme improves the consistency of assembly operation, an operator adjusts the simulated convex surface of the printed board on the pre-pressing fixture, the heat dissipation plate is compacted and tightly attached to the heat conduction rubber pad and then is separated from the pre-pressing fixture, and the heat dissipation plate can be installed on the matched printed boards, and the consistency of the matching surfaces of the heat dissipation plate and the printed boards is ensured;
4. the technical scheme has the advantages that the structure is simple, the installation and the operation are convenient, the bottom plate and the positioning assembly are leveled by arranging the balance plate assembly, the consistency and the qualification rate of the assembly of the circuit board assembly are effectively improved, and the use value is high.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a sectional view taken along line a-a of fig. 1.
Detailed Description
In the following, an embodiment of the present invention will be described in conjunction with fig. 1-2, so as to clearly and completely describe the technical solutions, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, but not all of the embodiment.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
A pre-compaction anchor clamps that is arranged in inertia combination navigation equipment circuit board unit mount, including bracket component 1, compress tightly subassembly 2, height adjustable locating component 3 and balanced board subassembly 4, bracket component 1 links firmly as an organic wholely with the bottom plate 5 that is located its top through 2 GB70-85M4X20 screws, constitutes the base of this anchor clamps, 5 up end of bottom plate is equipped with respectively carries out the locate area 8 of fixing a position to printing board 6 and heating panel 7 that pairs with printing board 6, 5 up end left sides of bottom plate are equipped with compresses tightly subassembly 2 fixed to printing board 6 of placing on locate area 8, locating component 3 install in 5 up end right sides of bottom plate and correspond with integrated circuit mounted position on the printing board 6 and the convex surface position on the heating panel 7, bottom plate 5 and locating component 3 carry out the leveling through balanced board subassembly 4, locating component 3 is last to be equipped with the heat conduction rubber pad and is located the printing board 6 right side and is fixed in the heating panel position on the locate area 8 7, pressing the heat-conducting rubber pad by the convex surface, and bonding and fixedly connecting the heat-conducting rubber pad, the heat dissipation plate 7 and the printed board 6 after the heat-conducting rubber pad deforms stably;
specifically, the positioning area 8 comprises a printed board positioning area 8-1 and a heat dissipation plate positioning area 8-2, two groups of convex edge blocks 5-1 which are parallel to each other are arranged on the upper end face of the bottom plate 5, positioning notches 5-2 with openings arranged oppositely are formed in the inner side of the upper end face of each group of convex edge blocks 5-1, two positioning notches 5-2 on one group of convex edge blocks 5-1 on the left side of the upper end face of the bottom plate 5 form the printed board positioning area 8-1, two positioning notches 5-2 on the other group of convex edge blocks 5-1 on the right side of the upper end face of the bottom plate 5 form the heat dissipation plate positioning area 8-2, the printed board 6 and the heat dissipation plate 7 are respectively placed on the printed board positioning area 8-1 and the heat dissipation plate positioning area 8-2, the printed board 6 is pressed and fixed on the printed board positioning area 8-1 by a pressing assembly 2, and the four corners of the heat dissipation plate 7 are fixed on the heat dissipation plate positioning area 8-2 by screws The above step (1);
specifically, the support assembly 1 comprises a support plate 1-2 and two side plates 1-1 which are arranged in parallel, wherein the support plate 1-2 is positioned below a bottom plate 5, and the end parts of the support plate 1-2 are fixedly connected with the side plates 1-1 into a whole through screws; specifically, four groups of pressing components 2 are arranged on the left side of the upper end face of the bottom plate 5, each pressing component 2 comprises a pressing plate 2-1, a stepped screw 2-2 and a spring 2-3, two screw holes 5-3 are formed in a group of convex edge blocks 5-1 on the left side of the upper end face of the bottom plate 5, stepped holes 2-5 are formed in the pressing plate 2-1, the springs 2-3 and gaskets 2-4 positioned at the upper ends of the springs 2-3 are arranged in the stepped holes 2-5, the stepped screws 2-2 penetrate through the gaskets 2-4 and the springs 2-3 to be matched and screwed with the screw holes 5-3, and the pressing table 2-6 at the lower end of one side of the pressing plate 2-1 is used for pressing the printed board 6 by rotating the pressing plate 2-1; the material of the pressing plate 2-1 can be hard rubber plate I type material except fluorine plastic, and the hardness is properly increased so as to prevent the pressing plate 2-1 from deforming in the pressing process.
Specifically, three groups of positioning assemblies 3 are arranged on the right side of the upper end face of the bottom plate 5, each positioning assembly 3 comprises a rotating body 3-1 and a screw rod 3-2, threaded holes 5-4 corresponding to three convex surfaces on the heat dissipation plate 7 are formed in the right side plate face of the upper end face of the bottom plate 5, the lower end of each screw rod 3-2 is matched and screwed with the corresponding threaded hole 5-4, the upper end of each screw rod 3-2 is fixedly connected with the corresponding rotating body 3-1, and the height of the corresponding rotating body 3-1 is adjusted through rotation of the corresponding screw rod 3-2; the height of the rotating body 3-1 connected with the screw rod 3-2 is adjusted through the screw rod 3-2 of the positioning assembly 3, so that the upper plane of the rotating body 3-1 is flush with the height point of the corresponding integrated circuit surface on the printed board 6, and the effect of aligning the upper surfaces of three devices on the printed board 6 and simulating the convex surface (the upper plane of the rotating body 3-1) of the printed board 6 is achieved.
Specifically, the balance plate assembly 4 comprises a balance plate 4-1, a cover plate 4-2 and balls 4-3, wherein a strip-shaped groove is formed in the middle of the surface of the balance plate 4-1, the balls 4-3 are placed in the strip-shaped groove, the cover plate 4-2 is made of a transparent material, and the opening of the strip-shaped groove is sealed by the cover plate 4-2 fixed on the balance plate 4-1 through screws; the balance plate assembly 4 is used for checking the flatness of the upper plane of the rotating body 3-1 and the upper surface of a corresponding device of the printed board 6, when the prepressing fixture is used, the prepressing fixture is horizontally placed on a workbench surface according to a use environment, and prepressing can be carried out after adjusting and positioning the simulated convex surface of the prepressing printed board 6, and the balance plate assembly 4 is used during detection without being installed on the prepressing fixture; specifically, the bottom plate 5 is made of CrWMn alloy steel.
Pre-pressing: place this pre-compaction anchor clamps level on table surface, adnexed spot on the clean up bottom plate 5 prepares the printing board 6 that is used for the circuit board subassembly of pre-compaction, uses this pre-compaction anchor clamps to carry out the assembling process of circuit board subassembly specifically as follows:
1) rotating three screw rods 3-2 arranged on a bottom plate 5 to the lowest, wherein the upper surfaces of three rotating bodies 3-1 connected with the three screw rods are level with the large plane of the bottom plate 5, flatly placing a balance plate assembly 4 on the bottom plate 5, and observing that balls 4-3 in the balance plate assembly 4 can be kept stable in the middle of a strip-shaped groove to ensure that the large plane of the bottom plate 5 is level;
2) the printed board 6 is flatly placed on the printed board positioning area 8-1 on the right side of the upper end face of the bottom plate 5, and the pressing plate 2-1 is rotated to enable the pressing table 2-6 to rotate to the inner side to press the printed board 6;
3) adjusting three spiral rods 3-2 arranged on a bottom plate 5, wherein the upper surfaces of three rotating bodies 3-1 connected with the three spiral rods are required to be flush with the upper surfaces of three integrated circuits of a printed board 6, flatly placing a balance board assembly 4 on the three rotating bodies 3-1, and observing that balls in the balance board assembly can be kept stable in the middle of a strip-shaped hole, thereby verifying that the adjustment is in place;
4) and removing the protective film on one surface of the three heat-conducting rubber pads with qualified sizes after cutting, and aligning and pasting the surface with the film on the corresponding rotating body 3-1.
5) Aligning three convex surfaces of a heat dissipation plate 7 matched with the printed board 6 with three rotating bodies 3-1, and then flatly placing the heat dissipation plate on a heat dissipation plate positioning area 8-2, and fastening the heat dissipation plate 7 on the heat dissipation plate positioning area 8-2 by using 2 GJB2272/13M2x16 and 2 GJB2272/13M2.5x16 screws of the circuit board assembly;
6) after the heat-conducting rubber pads are deformed and stabilized for 1min, removing 2 GJB2272/13M2x16 and 2 GJB2272/13M2.5x16 screws, taking down the heat dissipation plate 7, adhering the three heat-conducting rubber pads with the pre-pressed sizes in place on the heat dissipation plate 7, and carefully removing the protective film on the other surface of the heat-conducting rubber pads;
7) and rotating the pressing plate 2-1 to enable the pressing and soaking table 2-6 to rotate to the outer side, taking down the printed board 6, aligning and then attaching three integrated circuits of the printed board 6 with three heat-conducting rubber pads on the heat dissipation plate 7, and then completing the subsequent assembly process according to the assembly process of the circuit board assembly.
After the steps are completed, the pre-pressing clamp can be cleaned and maintained.
According to the technical scheme, three groups of positioning assemblies 3 are arranged on the right side of the upper end face of a bottom plate 5, so that the consistency of the heights of corresponding three contact surfaces of a heat dissipation plate 6, a printed board 7 and a heat-conducting rubber pad is ensured when the heat dissipation plate, the printed board 7 and the heat-conducting rubber pad are assembled, the local deformation or protrusion of the printed board 6 caused by the inconsistent heights of the three contact surfaces when the circuit board assembly is directly assembled is avoided, the reliable contact of the heat dissipation plate 7 and a heat dissipation device is ensured, the hidden danger of damage of the printed board 6 is avoided, the horizontal positions of the three contact surfaces of the heat dissipation plate 7 are adjusted by adjusting the horizontal positions of three rotating bodies 3-1, the pressure bearing load of an integrated circuit on the contact surface of the circuit board assembly is reduced, the failure rate of the corresponding device is effectively reduced, the consistency of assembly operation is improved, an operator adjusts the simulated convex surface of the printed board 6 on a pre-pressing clamp, and releases the pre-pressing clamp after the heat dissipation plate 7 is compacted and tightly attached to the heat-conducting rubber pad, can install on the printing board 6 that pairs, the uniformity of both fitting surfaces obtains guaranteeing, simple structure, and installation convenient operation levels bottom plate 5 and locating component 3 through setting up balanced board subassembly 4, has effectively improved the uniformity and the qualification rate of circuit board subassembly assembly, has higher use value.
The above-mentioned embodiments are merely preferred embodiments of the present invention, which are not intended to limit the scope of the present invention, and therefore, all equivalent changes made by the contents of the claims of the present invention should be included in the claims of the present invention.
Claims (7)
1. A pre-compaction anchor clamps that is arranged in circuit board subassembly installation among inertia combination navigation equipment, its characterized in that: including bracket component (1), compress tightly subassembly (2), height adjustable locating component (3) and balanced board subassembly (4), bracket component (1) links firmly as an organic wholely through the screw with bottom plate (5) that is located its top, bottom plate (5) up end is equipped with locating area (8) of going on fixing a position to printing board (6) and heating panel (7) that pair with printing board (6) respectively, bottom plate (5) up end left side is equipped with compresses tightly fixed compressing tightly subassembly (2) to printing board (6) of placing on locating area (8), locating component (3) install in bottom plate (5) up end right side and correspond with integrated circuit mounted position on printing board (6) and convex surface position on heating panel (7), leveling is carried out through balanced board subassembly (4) in bottom plate (5) and locating component (3), be equipped with the heat conduction rubber pad on locating component (3) and be located printing board (6) right side and be fixed in the location and fix a position the locating component (4) and correspond, locating component (3) are equipped with the heat conduction rubber pad and just in The convex surface of the heat-conducting rubber pad is pressed by the convex surface of the heat-radiating plate (7) on the area (8), and the heat-conducting rubber pad, the heat-radiating plate (7) and the printed board (6) are bonded and fixedly connected after the heat-conducting rubber pad is deformed and stabilized.
2. The pre-pressing jig for circuit board assembly mounting in an inertial group navigation device of claim 1, wherein: the positioning area (8) comprises a printed board positioning area (8-1) and a heat dissipation plate positioning area (8-2), two groups of convex edge blocks (5-1) which are parallel to each other are arranged on the upper end face of the bottom plate (5), positioning notches (5-2) with openings arranged in opposite directions are arranged on the inner side of the upper end face of each group of convex edge blocks (5-1), two positioning notches (5-2) on one group of convex edge blocks (5-1) on the left side of the upper end face of the bottom plate (5) form the printed board positioning area (8-1), two positioning notches (5-2) on the other group of convex edge blocks (5-1) on the right side of the upper end face of the bottom plate (5) form the heat dissipation plate positioning area (8-2), the printed board (6) and the heat dissipation plate (7) are respectively placed on the printed board positioning area (8-1) and the heat dissipation plate positioning area (8-2), the printed board (6) is pressed and fixed on the printed board positioning area (8-1) by the pressing component (2), and four corners of the heat dissipation plate (7) are fixed on the heat dissipation plate positioning area (8-2) through screws.
3. The pre-pressing jig for circuit board assembly mounting in an inertial group navigation device of claim 1, wherein: the support assembly (1) comprises a support plate (1-2) and two side plates (1-1) which are arranged in parallel, wherein the support plate (1-2) is positioned below the bottom plate (5), and the end parts of the support plate (1-2) are fixedly connected with the side plates (1-1) into a whole through screws.
4. The pre-pressing jig for circuit board assembly mounting in an inertial group navigation device of claim 1, wherein: four groups of pressing components (2) are arranged on the left side of the upper end face of the bottom plate (5), each pressing component (2) comprises a pressing plate (2-1), a step-shaped screw (2-2) and a spring (2-3), two screw holes (5-3) are respectively arranged on a group of convex edge blocks (5-1) on the left side of the upper end surface of the bottom plate (5), the pressure plate (2-1) is provided with an order hole (2-5), the spring (2-3) and a gasket (2-4) positioned at the upper end of the spring (2-3) are arranged in the order hole (2-5), the step-shaped screw (2-2) passes through the gasket (2-4) and the spring (2-3) to be matched and screwed with the screw hole (5-3), and the pressing table (2-6) at the lower end of one side of the pressing plate (2-1) presses the printed board (6) by rotating the pressing plate (2-1).
5. The pre-pressing jig for circuit board assembly mounting in an inertial group navigation device of claim 1, wherein: bottom plate (5) up end right side is equipped with three locating component (3) of group, locating component (3) are including rotator (3-1) and hob (3-2), the system has screw hole (5-4) that correspond with three convex surface position on the heating panel (7) on bottom plate (5) up end right side face, hob (3-2) lower extreme closes soon with screw hole (5-4) adaptation and hob (3-2) upper end and rotator (3-1) fixed connection to the regulation of rotator (3-1) height is realized to the rotation through hob (3-2).
6. The pre-pressing jig for circuit board assembly mounting in an inertial group navigation device of claim 1, wherein: the balance plate assembly (4) comprises a balance plate (4-1), a cover plate (4-2) and balls (4-3), wherein a strip-shaped groove is formed in the middle of the surface of the balance plate (4-1), the balls (4-3) are placed in the strip-shaped groove, the cover plate (4-2) is made of a transparent material, and the cover plate (4-2) is fixed on the balance plate (4-1) through screws to seal the notch of the strip-shaped groove.
7. The pre-pressing jig for wiring board assembly mounting in an inertial group navigation device according to claim 1 or 2 or 3 or 4 or 5 or 6, characterized in that: the bottom plate (5) is made of CrWMn alloy steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911366986.3A CN111098251B (en) | 2019-12-26 | 2019-12-26 | Pre-pressing clamp for installing circuit board assembly in inertial integrated navigation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911366986.3A CN111098251B (en) | 2019-12-26 | 2019-12-26 | Pre-pressing clamp for installing circuit board assembly in inertial integrated navigation equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111098251A CN111098251A (en) | 2020-05-05 |
| CN111098251B true CN111098251B (en) | 2021-10-22 |
Family
ID=70424953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911366986.3A Active CN111098251B (en) | 2019-12-26 | 2019-12-26 | Pre-pressing clamp for installing circuit board assembly in inertial integrated navigation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111098251B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111922960B (en) * | 2020-08-13 | 2021-10-01 | 立讯智造(浙江)有限公司 | Clamping device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5820117A (en) * | 1995-06-28 | 1998-10-13 | Micron Electronics, Inc. | Air bladder fixture tooling for supporting circuit board assembly processing |
| US6042388A (en) * | 1999-01-19 | 2000-03-28 | Unisys Corporation | Electromechanical module having a thin springy plate for establishing pressed electrical connections |
| CN1891021A (en) * | 2003-12-31 | 2007-01-03 | 德州仪器公司 | System and method for self-leveling heat sink for multiple height devices |
| TWI336232B (en) * | 2006-02-17 | 2011-01-11 | Foxconn Tech Co Ltd | Heat dissipation device |
| KR200470720Y1 (en) * | 2012-03-27 | 2014-08-25 | 주식회사 신영 | Jig apparatus for TWB |
| CN104191397A (en) * | 2014-09-28 | 2014-12-10 | 成都市翻鑫家科技有限公司 | Stud leveling clamp |
| CN205201096U (en) * | 2015-12-14 | 2016-05-04 | 重庆金东电子有限公司 | Radiator mounting groove mills with clamping apparatus |
| CN109420717A (en) * | 2017-08-29 | 2019-03-05 | 竑腾科技股份有限公司 | Parallel equal-height pressing jig and parallel equal-height pressing device |
| CN109648494A (en) * | 2018-12-29 | 2019-04-19 | 陕西宝成航空仪表有限责任公司 | Remover-and-replacer |
-
2019
- 2019-12-26 CN CN201911366986.3A patent/CN111098251B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5820117A (en) * | 1995-06-28 | 1998-10-13 | Micron Electronics, Inc. | Air bladder fixture tooling for supporting circuit board assembly processing |
| US6042388A (en) * | 1999-01-19 | 2000-03-28 | Unisys Corporation | Electromechanical module having a thin springy plate for establishing pressed electrical connections |
| CN1891021A (en) * | 2003-12-31 | 2007-01-03 | 德州仪器公司 | System and method for self-leveling heat sink for multiple height devices |
| TWI336232B (en) * | 2006-02-17 | 2011-01-11 | Foxconn Tech Co Ltd | Heat dissipation device |
| KR200470720Y1 (en) * | 2012-03-27 | 2014-08-25 | 주식회사 신영 | Jig apparatus for TWB |
| CN104191397A (en) * | 2014-09-28 | 2014-12-10 | 成都市翻鑫家科技有限公司 | Stud leveling clamp |
| CN205201096U (en) * | 2015-12-14 | 2016-05-04 | 重庆金东电子有限公司 | Radiator mounting groove mills with clamping apparatus |
| CN109420717A (en) * | 2017-08-29 | 2019-03-05 | 竑腾科技股份有限公司 | Parallel equal-height pressing jig and parallel equal-height pressing device |
| CN109648494A (en) * | 2018-12-29 | 2019-04-19 | 陕西宝成航空仪表有限责任公司 | Remover-and-replacer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111098251A (en) | 2020-05-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111098251B (en) | Pre-pressing clamp for installing circuit board assembly in inertial integrated navigation equipment | |
| Stiteler et al. | System for real-time measurement of thermally induced PWB/PWA warpage | |
| CN110595739B (en) | Automatic crimping mechanism | |
| CN107731142B (en) | Component for lighting test | |
| CN214066333U (en) | Passive buzzer testing device | |
| CN213274696U (en) | Integral dynamic balance auxiliary device for fan stator | |
| CN212239506U (en) | Tool clamp for laser tin soldering process of optical device | |
| CN210155502U (en) | Camera installing support is used in engine production | |
| KR100553816B1 (en) | Cog bonder | |
| CN212675098U (en) | Manufacturing device for ICT test | |
| CN207570487U (en) | A kind of product thickness verifying attachment | |
| CN216700323U (en) | Microphone testing arrangement is used in aircraft part repair | |
| CN220106481U (en) | Auxiliary clamp for wire bonding | |
| CN210451675U (en) | Novel IGBT press fitting tool | |
| US20240027808A1 (en) | Electro-optical display module which has two interconnected elements | |
| CN220455353U (en) | Reliability test jig and test device | |
| CN216772143U (en) | Crimping tool and test equipment of cell product | |
| CN220773111U (en) | Single-sided radio frequency chip high-frequency performance test fixture | |
| CN212629099U (en) | Display screen IC laminating equipment | |
| CN116207006A (en) | Tool and method for aligning and mounting micro sensitive element | |
| CN211179346U (en) | Adhesive high temperature creep performance testing arrangement | |
| CN216349105U (en) | Detection apparatus for medical display ambient light sensor | |
| CN218765995U (en) | Motor belt tension test and structural strength test bench | |
| CN219305136U (en) | ACF attaching clamp with single-sided adjustment | |
| CN216526043U (en) | Device for testing grounding impedance of steel sheet of mobile phone camera |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |