CN219437247U

CN219437247U - Low-stress FPC flexible circuit board

Info

Publication number: CN219437247U
Application number: CN202223350543.5U
Authority: CN
Inventors: 胡坤; 肖书伟; 肖金花
Original assignee: Suzhou Huiju Electronic Technology Co ltd
Current assignee: Suzhou Huiju Electronic Technology Co ltd
Priority date: 2022-12-14
Filing date: 2022-12-14
Publication date: 2023-07-28
Anticipated expiration: 2032-12-14

Abstract

The utility model discloses a low-stress FPC flexible circuit board which comprises a device bottom plate, a first groove and a connecting layer, wherein the top end of the device bottom plate is provided with the connecting layer, the top end of the connecting layer is uniformly provided with a gap, the top end of the connecting layer is provided with a circuit layer, the top end of the circuit layer is provided with a device top plate, the top end of the device top plate is provided with a second groove, the bottom end of the device bottom plate is provided with a first groove, the top end of the first groove is uniformly provided with a first through hole penetrating into the second groove, the first groove at the bottom end of the first through hole is uniformly provided with a first device shell, the second groove is uniformly provided with a pressing block penetrating into the first through hole, and the top end of the pressing block is provided with a second through hole penetrating into the pressing block. According to the utility model, the device is not easy to break when being bent through the gaps on the connecting layers, and gaps exist among the connecting layers through the gaps among the connecting layers.

Description

Low-stress FPC flexible circuit board

Technical Field

The utility model relates to the technical field of electronic circuits, in particular to a low-stress FPC flexible circuit board.

Background

The FPC, also called a flexible circuit board, is a flexible printed circuit board which is made of a series of film materials such as polyimide or polyester film and has high reliability, is called a flexible board or FPC for short, has the characteristics of high wiring density, light weight and thin thickness, and is widely applied to various fields such as automobile electronics, consumer electronics, household appliances, industrial equipment and the like.

The utility model patent with the application number of 202120194145.5 and the name of low-stress Flexible Printed Circuit (FPC) and an electronic device records a low-stress Flexible Printed Circuit (FPC) and an electronic device, and the stress of a substrate lower than that of the FPC at present causes that the FPC cannot realize matched linkage or cannot achieve the linkage effect of an expected degree, and particularly the problem is obvious on the structure of the multilayer FPC which is currently applied at present. However, when the device is used, circuit elements on the device cannot be quickly disassembled and installed, and the device is not convenient to use; when the device is used, the device is easy to break in bending and cannot be used, so that a low-stress FPC flexible circuit board is urgently needed in the market at present.

Disclosure of Invention

The utility model aims to provide a low-stress FPC flexible circuit board, which solves the problems that the existing low-stress FPC flexible circuit board is not convenient to assemble and disassemble and is easy to break after bending in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a low stress FPC flexible circuit board, includes device bottom plate, first recess and articulamentum, the articulamentum is installed on the top of device bottom plate, and the top of articulamentum evenly has seted up the space, the circuit layer is installed on the top of articulamentum, and the device roof is installed on the top of circuit layer, the second recess has been seted up on the top of device roof, first recess has been seted up to the bottom of device bottom plate, and first recess top evenly has seted up the first through-hole that runs through to the inside of second recess, first device shell is evenly installed to the inside of first recess of first through-hole bottom, the inside piece of pressing that runs through to the inside of first through-hole that evenly is provided with of second recess, and the second through-hole that runs through the piece is all seted up on the piece top.

Preferably, a first cavity is formed in the first device shell, a first mounting plate is mounted in the first cavity, and a limiting plate is mounted at the top end of the first mounting plate.

Preferably, the bottom end of the first device shell is provided with a second device shell which penetrates through the top end of the first device shell and is connected with the second groove, and the top end of the outer side of the second device shell is uniformly provided with rolling grooves.

Preferably, a top bead is arranged in the rolling groove, a second cavity is formed in the second device shell, and a second mounting plate is mounted in the middle position of the second cavity.

Preferably, the bottom end of the second mounting plate is uniformly provided with springs connected with the bottom end inside the first device shell, and the top end of the second mounting plate is provided with a third through hole penetrating through the second mounting plate.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the top bead is extruded through the limiting plate, and pins of components in the second device shell are fixed through the top bead; the device is not easy to break when being bent through the gaps on the connecting layers, and gaps exist among the connecting layers; when the pressing block is pressed, the second device shell is extruded, the spring is extruded at the same time, and meanwhile, the limiting plate is moved away from the inside of the rolling groove, so that the electric components can be detached.

Drawings

FIG. 1 is a schematic view of a front cross-sectional structure of the present utility model;

FIG. 2 is a schematic diagram of a front view structure of the present utility model;

fig. 3 is an enlarged view of the portion a of fig. 1 according to the present utility model.

In the figure: 1. a device base plate; 2. a first groove; 3. a connection layer; 4. a void; 5. a circuit layer; 6. a device top plate; 7. a second groove; 8. pressing blocks; 9. a first through hole; 10. a second through hole; 11. a first device housing; 12. a spring; 13. a first mounting plate; 14. a limiting plate; 15. a first cavity; 16. top bead; 17. a second device housing; 18. rolling grooves; 19. a second cavity; 20. a third through hole; 21. and a second mounting plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the implementations described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, an embodiment of a low stress FPC flexible circuit board provided by the present utility model: the utility model provides a low stress FPC flexible circuit board, including device bottom plate 1, first recess 2 and tie layer 3, tie layer 3 is installed on the top of device bottom plate 1, and the top of tie layer 3 has evenly offered space 4, circuit layer 5 is installed on the top of tie layer 3, and device roof 6 is installed on the top of circuit layer 5, second recess 7 has been seted up on the top of device roof 6, first recess 2 has been seted up to the bottom of device bottom plate 1, and first recess 2 top has evenly been seted up and has been run through to the inside first through-hole 9 of second recess 7, first device shell 11 is evenly installed to the inside of first through-hole 9 bottom first recess 2, the inside piece 8 that presses of running through to the inside of first through-hole 9 evenly is provided with of second recess 7, and the second through-hole 10 that runs through pressing piece 8 has all been seted up on the top according to piece 8.

The inside of first device shell 11 has seted up first cavity 15, and the internally mounted of first cavity 15 has first mounting panel 13, limiting plate 14 is installed on the top of first mounting panel 13, first device shell 11 bottom is provided with the second device shell 17 that runs through first device shell 11 top and second recess 7 are connected, and the indent 18 has evenly been seted up on the top in the second device shell 17 outside, the inside of indent 18 is provided with top pearl 16, second cavity 19 has been seted up to the inside of second device shell 17, and the intermediate position department of second cavity 19 inside installs second mounting panel 21, spring 12 that is connected with the inside bottom of first device shell 11 is evenly installed to second mounting panel 21 bottom, the third through-hole 20 that runs through second mounting panel 21 has been seted up on second mounting panel 21 top.

Working principle: when the device is used, pins of components are inserted into the second through hole 10, the second mounting plate 21 is jacked by the spring 12 at the bottom end of the second mounting plate 21, the second device shell 17 is driven to fix the positions of the jacking beads 16 in the rolling groove 18, the pins entering the second cavity 19 are fixed by the jacking beads 16, the components are pressed by the pressing block 8 when being needed to be replaced, the second device shell 17 is pressed after the pressing block 8 is pressed, the spring 12 is pressed, and the limiting plate 14 is removed from the interior of the rolling groove 18, so that the electric components can be disassembled.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a low stress FPC flexible circuit board, includes device bottom plate (1), first recess (2) and tie layer (3), its characterized in that: the device comprises a device bottom plate (1), wherein a connecting layer (3) is arranged at the top end of the device bottom plate (1), gaps (4) are uniformly formed in the top end of the connecting layer (3), a circuit layer (5) is arranged at the top end of the connecting layer (3), a device top plate (6) is arranged at the top end of the circuit layer (5), a second groove (7) is formed in the top end of the device top plate (6), a first groove (2) is formed in the bottom end of the device bottom plate (1), first through holes (9) penetrating through the second groove (7) are uniformly formed in the first through holes (9), first device shells (11) are uniformly arranged in the first grooves (2), pressing blocks (8) penetrating through the first through holes (9) are uniformly arranged in the second grooves (7), and second through holes (10) penetrating the pressing blocks (8) are formed in the top ends of the pressing blocks (8).

2. The low stress FPC flexible circuit board according to claim 1, wherein: the inside of first device shell (11) has seted up first cavity (15), and the internally mounted of first cavity (15) has first mounting panel (13), limiting plate (14) are installed on the top of first mounting panel (13).

3. The low stress FPC flexible circuit board according to claim 1, wherein: the bottom end of the first device shell (11) is provided with a second device shell (17) which penetrates through the top end of the first device shell (11) and is connected with the second groove (7), and rolling grooves (18) are uniformly formed in the top end of the outer side of the second device shell (17).

4. A low stress FPC flexible circuit board according to claim 3, characterized in that: the inside of rolling groove (18) is provided with top pearl (16), second cavity (19) have been seted up to the inside of second device shell (17), and second mounting panel (21) are installed to the inside intermediate position department of second cavity (19).

5. The low stress FPC flexible circuit board according to claim 4, wherein: the spring (12) connected with the bottom inside the first device shell (11) is evenly installed at the bottom of the second mounting plate (21), and a third through hole (20) penetrating through the second mounting plate (21) is formed in the top of the second mounting plate (21).