CN219435835U - Die bonding substrate conveying line and die bonding machine - Google Patents

Abstract

The application provides a solid brilliant base plate conveying line and solid brilliant machine, solid brilliant base plate conveying line includes: a machine table; the upper plate device is arranged on the machine table; the device comprises a plurality of die bonding platforms, a plurality of driving units and a plurality of driving units, wherein each die bonding platform comprises a first transmission mechanism, a clamping mechanism, a first mounting seat for supporting the first transmission mechanism and the clamping mechanism, and a moving mechanism, wherein the moving mechanism is mounted on the machine table, and a power output end of the moving mechanism is connected with the first mounting seat; the board collecting device is arranged on the machine; the upper plate device, the die bonding platforms and the plate collecting device are sequentially arranged along the X-axis direction. The solid brilliant base plate transmission line and solid brilliant machine that this application provided can simplify the transmission path of base plate, is favorable to reducing the transmission path length of base plate, has simplified solid brilliant machine structure, can make solid brilliant machine overall arrangement compacter, and is favorable to reducing equipment cost.

Description

Die bonding substrate conveying line and die bonding machine

Technical Field

The application belongs to the technical field of die bonding equipment, and more particularly relates to a die bonding substrate conveying line and a die bonding machine.

Background

In the production process of an LED (Light Emitting Diode ) product, an LED chip is generally required to be mounted on a substrate by adopting a die bonder, for a multicolor LED product, as the sizes of three chips of R/G/B are different, different die bonders are required to be adopted for die bonding, after die bonding of the LED chip of one color is finished, the LED chip of the other color is subjected to die bonding, and three die bonders are required to be adopted for three times of operation.

The existing wire-bonding die-bonding equipment comprises a conveying line, a plurality of clamp platforms and a plurality of die-bonding units, wherein the clamp platforms are arranged on the side edges of the conveying line, the die-bonding units are located on one side, away from the conveying line, of the clamp platforms, a connection mechanism is arranged at the position, corresponding to each clamp platform, of the conveying line, substrates are conveyed to the clamp platforms on the side edges of the die-bonding units through the connection mechanism, and then the die-bonding units are used for mounting various chips on the substrates on the corresponding clamp platforms. The wire bonding equipment has the advantages that in the substrate transmission process, the transmission path is long, the substrate is required to move along the X axis and the Y axis, the substrate is required to rotate around the Z axis, the movement is more, the occupied space is larger, the cost is higher, and the maintenance is not facilitated.

Disclosure of Invention

An object of the embodiment of the application is to provide a die bonding substrate conveying line, so as to solve the technical problems of long conveying path, more actions and larger occupied space of the wire bonding device in the substrate conveying process in the prior art.

In order to achieve the above purpose, the technical scheme adopted in the application is as follows: provided is a die bonder, comprising:

a machine table;

the upper plate device is arranged on the machine table and is used for supplying a substrate;

the device comprises a plurality of die bonding platforms, a plurality of first fixing devices and a plurality of second fixing devices, wherein each die bonding platform comprises a first transmission mechanism for transmitting the substrate along the X-axis direction, a clamping mechanism for clamping and positioning the substrate on the first transmission mechanism, a first mounting seat for supporting the first transmission mechanism and the clamping mechanism, and a moving mechanism for driving the first mounting seat to translate, the moving mechanism is mounted on the machine, and a power output end of the moving mechanism is connected with the first mounting seat;

the board collecting device is arranged on the machine table and is used for collecting the substrate;

the upper plate device, the die bonding platforms and the plate collecting device are sequentially arranged along the X-axis direction.

Through adopting upper plate device, a plurality of solid brilliant platform and the receipts board device of arranging in proper order along the X axis direction, can be at the transmission in-process of base plate along the X axis direction, with the base plate centre gripping fixed, so carry out solid brilliant operation on the base plate, do not need to transmit the base plate along the Y axis direction like this, and do not need to rotate the base plate, can simplify the transmission path of base plate, do not need to reserve the rotatory space of base plate around the Z axis, be favorable to reducing the transmission path length of base plate, also do not need to set up anchor clamps platform and control the base plate position in solid brilliant device, solid brilliant machine structure has been simplified, can make solid brilliant machine overall arrangement compacter, and be favorable to reducing equipment cost.

In one embodiment, the first mounting seat comprises a first base frame, a first support plate arranged on one side of the first base frame and a second support plate used for limiting the width of the substrate in a matched mode with the first support plate, the second support plate is slidably arranged on the other side of the first base frame, and the first base frame is connected with a power output end of the moving mechanism;

the first transmission mechanism comprises a first belt transmission assembly arranged on the first support plate, a second belt transmission assembly arranged on the second support plate and a first driving assembly used for driving the first belt transmission assembly and the second belt transmission assembly, wherein the first driving assembly is arranged on the second support plate, and a power output end of the first driving assembly is in transmission connection with the first belt transmission assembly and the second belt transmission assembly.

By adopting the technical means, the substrates with different widths can be compatible.

In one embodiment, the clamping mechanism comprises a pressing plate frame located above the first conveying mechanism, a stop component for stopping and positioning the substrate on the first conveying mechanism, and a jacking component for clamping the substrate in a matched mode with the pressing plate frame, wherein the pressing plate frame, the stop component and the jacking component are installed on the first installation seat, the stop component is located on one side, away from the upper plate device, of the pressing plate frame, and the jacking component is located below the pressing plate frame.

By adopting the technical means, the position of the substrate can be fixed, so that the die bonding operation can be conveniently performed.

In one embodiment, the moving mechanism comprises a first flat linear motor for driving the first mounting seat to move along the Y-axis direction and a second flat linear motor for driving the first flat linear motor to move along the X-axis direction, the second flat linear motor is mounted on the machine table, the power output end of the second flat linear motor is connected with the first flat linear motor, and the power output end of the first flat linear motor is connected with the first mounting seat.

By adopting the technical means, the horizontal position of the substrate can be adjusted, and the butt joint with the upstream and the downstream can be controlled.

In one embodiment, the upper plate device comprises a substrate feeding mechanism, a material box feeding mechanism, a second mounting seat for supporting the substrate feeding mechanism and the material box feeding mechanism, a first lifting mechanism for driving the second mounting seat to lift and a first mounting frame for supporting the first lifting mechanism, wherein the first mounting frame is mounted on the machine table, the second mounting seat is in sliding connection with the first mounting frame, and a power output end of the first lifting mechanism is connected with the second mounting seat.

By adopting the technical means, the substrate can be directly fed and the material box can be directly fed.

In one embodiment, the substrate feeding mechanism comprises a third supporting plate installed on one side of the second installation seat, a third belt transmission assembly installed on the third supporting plate, a fourth supporting plate used for being matched with the third supporting plate to limit the width of the substrate and a fourth belt transmission assembly used for being matched with the third belt transmission assembly to transmit the substrate, the fourth supporting plate is in sliding connection with the second installation seat, and the fourth belt transmission assembly is installed on the fourth supporting plate.

By adopting the technical means, the direct feeding device can be suitable for direct feeding of substrates with different widths.

In one embodiment, the feeding mechanism of the material box comprises a first clamping plate arranged on one side of the second mounting seat, a second clamping plate used for clamping the material box in cooperation with the first clamping plate, a pushing plate assembly used for pushing the substrate in the material box to output and a second base frame used for supporting the pushing plate assembly, the second clamping plate is slidably arranged on the second mounting seat, and the second base frame is arranged on the machine table.

By adopting the technical means, the feeding device can adapt to feeding of the material boxes with different widths.

In one embodiment, a second conveying mechanism for conveying the substrate along the X-axis direction is installed between two adjacent die bonding platforms.

By adopting the technical means, adjacent die bonding platforms can be connected to realize continuous transmission of the substrate.

In one embodiment, the number of die attach platforms is three.

By adopting the technical means, three die bonding positions can be provided, so that three chips can be assembled conveniently.

The embodiment of the application further provides a die bonder, which comprises a plurality of die bonders and the die bonder substrate conveying line in any one of the embodiments, wherein the die bonders are mounted on the machine table, one die bonder is arranged on the side edge of each moving mechanism, and each die bonder is used for assembling a chip on the substrate clamped by the corresponding clamping mechanism.

Through adopting above-mentioned technical means, can realize the assembly of multiple chip, be favorable to reducing the transmission path length of base plate, also need not set up anchor clamps platform in solid brilliant device and control the base plate position, simplified solid brilliant machine structure, can make solid brilliant machine overall arrangement compacter, and be favorable to reducing equipment cost.

In one embodiment, the die bonding device comprises a ring changing mechanism for supplying a crystal ring, a rotating mechanism for adjusting the rotating angle of the crystal ring, a thimble mechanism for jacking up a chip on the crystal ring and a die bonding mechanism for loading the chip jacked up by the thimble mechanism onto the substrate, wherein the ring changing mechanism, the rotating mechanism, the thimble mechanism and the die bonding mechanism are mounted on the machine.

By adopting the technical means, the chips on the wafer ring can be continuously and automatically assembled on the substrate, and the automation degree of the production line is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a die bonder according to an embodiment of the present disclosure;

fig. 2 is a schematic perspective view of a die attach substrate transfer line according to an embodiment of the present disclosure;

FIG. 3 is a schematic perspective view of the upper plate assembly of FIG. 2;

FIG. 4 is a schematic perspective view of the die attach table of FIG. 2;

FIG. 5 is an exploded view of the first transport mechanism, clamping mechanism and first mount of FIG. 4;

FIG. 6 is a schematic perspective view of the second transmission mechanism in FIG. 2;

fig. 7 is a schematic perspective view of the die bonding apparatus in fig. 1.

Wherein, each reference sign in the figure:

10-upper plate device; 11-a substrate feeding mechanism; 111-a third support plate; 112-a third belt conveyor assembly; 113-a fourth support plate; 114-a fourth belt transfer assembly; 12-a feeding mechanism of the material box; 121-a first clamping plate; 122-a second splint; 123-push plate assembly; 124-a second pedestal; 13-a second mount; 14-a first lifting mechanism; 15-a first mounting frame;

20-a die bonding platform; 21-a first transport mechanism; 211-a first belt conveyor assembly; 2111-a first idler; 2112-a second idler; 2113-a first belt; 212-a second belt conveyor assembly; 2121-third guide wheel; 2122-fourth guide wheel; 2123-a second belt; 213-a first drive assembly; 2131—a synchronization shaft; 2132—a first motor; 22-clamping mechanism; 221-a platen frame; 222-a stop assembly; 223-jacking assembly; 23-a first mount; 231-a first pedestal; 232-a first support plate; 233-a second support plate; 24-a movement mechanism; 241-a first flat linear motor; 242-a second flat linear motor;

30-a second transport mechanism; 31-a fifth belt transfer assembly; 32-a sixth belt conveyor assembly; 33-a second drive assembly; 34-a second mount;

40-plate collecting device;

50-a die bonding device; 51-a ring changing mechanism; 52-a rotation mechanism; 53-thimble mechanism; 54-a die bonding mechanism; 551-a first CCD camera; 552-a second CCD camera; 553-a third CCD camera;

60-machine.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," second, "" third, "" fourth, "" fifth, "and sixth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "first", "second", "third", "fourth", "fifth" and "sixth" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1, fig. 2, and fig. 4, a description will be given of a die attach substrate transfer line according to an embodiment of the present application. The die bond substrate conveying line comprises a plate loading device 10, a plurality of die bond platforms 20, a plate receiving device 40 and a machine 60; the upper plate device 10 is mounted on the machine 60, and the upper plate device 10 is used for supplying a substrate; each die bonding platform 20 comprises a first transmission mechanism 21, a clamping mechanism 22, a first mounting seat 23 and a moving mechanism 24, wherein the first transmission mechanism 21 is used for transmitting a substrate along the X-axis direction, the clamping mechanism 22 is used for clamping and positioning the substrate on the first transmission mechanism 21, and the first mounting seat 23 supports the first transmission mechanism 21 and the clamping mechanism 22; the moving mechanism 24 is mounted on the machine 60, a power output end of the moving mechanism 24 is connected with the first mounting seat 23, and the moving mechanism 24 is used for driving the first mounting seat 23 to translate; the board collecting device 40 is mounted on the machine 60, and the board collecting device 40 is used for collecting the substrate; the upper plate device 10, the plurality of die bonding stages 20 and the board collecting device 40 are sequentially arranged along the X-axis direction. The moving mechanism 24 drives the first mounting seat 23 to move, so that the first transmission mechanism 21 is in butt joint with the upper plate device 10; after the upper plate device 10 outputs the substrate, the substrate enters the first transmission mechanism 21, the clamping mechanism 22 can clamp and fix the substrate, so that the position of the substrate is kept stable, the moving mechanism 24 drives the first mounting seat 23 to move, and the position of the substrate is adjusted, so that the position of the substrate is matched with the position of the chip conveyed by the die bonding device 50, and the die bonding mechanism 54 is convenient for assembling the chip on the substrate; when the chip is assembled, the clamping mechanism 22 releases the substrate, the moving mechanism 24 controls the first conveying mechanism 21 to be in butt joint with the downstream, and the first conveying mechanism 21 conveys the substrate to the downstream; when the substrate is transferred to the board collecting device 40, the board collecting device 40 collects the substrate.

Through adopting upper plate device 10, a plurality of solid brilliant platform 20 and the receipts board device 40 of arranging in proper order along the X axis direction, can be at the transmission in-process of base plate along the X axis direction, with the base plate centre gripping fixed, so carry out solid brilliant operation on the base plate, only need finely tune the base plate position like this, need not to transmit the base plate along the Y axis direction, and need not rotate the base plate, can simplify the transmission path of base plate, need not reserve the rotatory space of base plate around the Z axis, be favorable to reducing the length of the transmission path of base plate, also need not set up anchor clamps platform and receive and control the base plate position in solid brilliant device 50, the solid brilliant machine structure has been simplified, can make solid brilliant machine overall arrangement compacter, and be favorable to reducing equipment cost.

By adopting a plurality of die bonding platforms 20, the continuous die bonding operation of a plurality of chips can be realized by matching with a plurality of die bonding devices 50, and the production steps of the multicolor LED product are simplified so as to meet the production requirements of the multicolor LED product.

In one embodiment of the present application, referring to fig. 2, 4 and 5, the first mounting seat 23 includes a first base frame 231, a first support plate 232 and a second support plate 233, the first support plate 232 is mounted on one side of the first base frame 231, the second support plate 233 is used to cooperate with the first support plate 232 to define a width of the substrate, the second support plate 233 is slidably mounted on the other side of the first base frame 231, and the first base frame 231 is connected to a power output end of the moving mechanism 24. Thus, the distance between the second support plate 233 and the first support plate 232 can be matched with the width of the substrate by adjusting the position of the second support plate 233, so as to meet the transmission requirements of substrates with different widths.

The first transmission mechanism 21 comprises a first belt transmission assembly 211, a second belt transmission assembly 212 and a first driving assembly 213, wherein the first belt transmission assembly 211 is installed on a first support plate 232, the second belt transmission assembly 212 is installed on a second support plate 233, the first driving assembly 213 is used for driving the first belt transmission assembly 211 and the second belt transmission assembly 212, the first driving assembly 213 is installed on the second support plate 233, and a power output end of the first driving assembly 213 is in transmission connection with the first belt transmission assembly 211 and the second belt transmission assembly 212. Thus, the two sides of the substrate can be respectively supported by the first belt transmission assembly 211 and the second belt transmission assembly 212, and the two sides of the substrate are driven to move along the X-axis direction at the same time, so that the substrate is ensured to be stably transmitted along the X-axis direction.

Optionally, a sliding groove is formed in the first base frame 231, the sliding groove is arranged along the Y-axis direction, a sliding block is slidably installed in the sliding groove, a connecting piece connected with the sliding block is installed on the second support plate 233, and the connecting piece is used for connecting the second support plate 233 with the sliding block and locking the position of the sliding block in the sliding groove. The connection member and the slider may be screw-coupled such that the slider may be slid when the connection member is released, so as to adjust the position of the second support plate 233 in the Y-axis direction.

In one embodiment of the present application, referring to fig. 2, 4 and 5, the clamping mechanism 22 includes a platen frame 221, a stop component 222 and a lifting component 223, the stop component 222 is used for stopping and positioning the substrate on the first conveying mechanism 21 to prevent the substrate from being conveyed downstream, the lifting component 223 is used for clamping the substrate in cooperation with the platen frame 221, the stop component 222 and the lifting component 223 are mounted on the first mounting seat 23, the platen frame 221 is located above the first conveying mechanism 21, the stop component 222 is located on a side of the platen frame 221 away from the upper plate device 10, and the lifting component 223 is located below the platen frame 221. When the first conveying mechanism 21 conveys the substrate, the substrate can be lifted up by the stop assembly 222, the substrate is stopped from being conveyed downstream, and the position of the substrate along the X-axis direction is positioned so that the substrate stops right below the pressing plate frame 221; the jacking component 223 is lifted, supports the substrate to be propped against the pressing plate frame 221, positions the substrate along the Z-axis direction, and clamps the substrate; the second support plate 233 and the first support plate 232 define the position of the substrate along the Y-axis direction, so that the position of the substrate on the first mounting seat 23 can be kept fixed, so as to facilitate the die bonding operation. Specifically, two sides of the pressing plate frame 221 are detachably connected with the first support plate 232 and the second support plate 233, respectively, so that different pressing plate frames 221 can be selected according to the widths of different substrates, so as to ensure that the substrates are clamped stably.

In one embodiment of the present application, referring to fig. 2, 4 and 5, the first belt transmission assembly 211 includes a first guide pulley 2111, a second guide pulley 2112 and a first belt 2113, wherein the first guide pulley 2111 is rotatably mounted on one end of the first support plate 232, the second guide pulley 2112 is rotatably mounted on the other end of the first support plate 232, and the first belt 2113 is supported on the first guide pulley 2111 and the second guide pulley 2112; the second belt transmission assembly 212 comprises a third guide wheel 2121, a fourth guide wheel 2122 and a second belt 2123, wherein the third guide wheel 2121 is rotatably installed at one end of the second support plate 233, the fourth guide wheel 2122 is rotatably installed at the other end of the second support plate 233, and the second belt 2123 is supported on the third guide wheel 2121 and the fourth guide wheel 2122; the first driving assembly 213 includes a synchronization shaft 2131 and a first motor 2132, the synchronization shaft 2131 is coaxially connected to the first guide pulley 2111 and the third guide pulley 2121, the first motor 2132 drives the synchronization shaft 2131 to rotate, the first motor 2132 is mounted on the second support plate 233, and a rotating shaft of the first motor 2132 is in driving connection with the synchronization shaft 2131. This can control the first belt 2113 and the second belt 2123 to run synchronously, so that the transfer speeds of both sides of the substrate are kept uniform, preventing the substrate from deviating from the X-axis direction.

Optionally, the synchronizing shaft 2131 is slidably sleeved with a first bearing and a second bearing, the first bearing is connected to the first support plate 232, and the second bearing is connected to the second support plate 233, so that when the position of the second support plate 233 is adjusted, the first bearing and the second bearing can slide along the synchronizing shaft 2131, so that the first belt conveyor assembly 211 and the second belt conveyor assembly 212 can approach or depart from each other, and the synchronizing shaft 2131 can be prevented from interfering with the movement of the second support plate 233.

In one embodiment, referring to fig. 2, 4 and 5, the stop assembly 222 includes a stop member, a first lift driver and a first support, the first lift driver is mounted on the first support, the first support is connected to the first base frame 231, an output shaft of the first lift driver is connected to the stop member, and the stop member is slidably connected to the first support. When the first lift driver drives the stopper to rise to the upper sides of the first and second belts 2113 and 2123, the substrate is prevented from being transferred downstream. Alternatively, the first lift actuator may be a linear motor or a cylinder or the like, so that the stopper can be controlled to lift.

In one embodiment, referring to fig. 2, 4 and 5, the jacking component 223 includes an abutting plate, a sliding rod, a sliding sleeve, a second lifting driver and a second support, the second lifting driver is installed on the second support, the second support is connected with the first base frame 231, an output shaft of the second lifting driver is connected with the abutting plate, the sliding rod is installed on the abutting plate, the sliding rod is arranged along the Z-axis direction, the sliding sleeve is installed on the second support, and the sliding sleeve is sleeved on the sliding rod in a sliding manner. When the second lifting driver drives the abutting plate to lift, the substrate can be pushed to lift along the Z axis until abutting on the pressing plate frame 221. Alternatively, the second lift actuator may be a linear motor or an air cylinder or the like, so that the lift of the abutment plate can be controlled.

In one embodiment of the present application, referring to fig. 2 and 3, the moving mechanism 24 includes a first flat linear motor 241 and a second flat linear motor 242, the first flat linear motor 241 is used for driving the first mounting seat 23 to move along the Y-axis direction, the second flat linear motor 242 is used for driving the first flat linear motor 241 to move along the X-axis direction, the second flat linear motor 242 is mounted on the machine 60, the power output end of the second flat linear motor 242 is connected with the first flat linear motor 241, and the power output end of the first flat linear motor 241 is connected with the first mounting seat 23. In this way, the position of the substrate in the X-axis direction and the Y-axis direction can be adjusted, and the first transfer mechanism 21 can be controlled to interface with the upstream and downstream devices.

In one embodiment of the present application, referring to fig. 1 to 3, a plate loading device 10 includes a substrate loading mechanism 11, a magazine loading mechanism 12, a second mounting base 13, a first lifting mechanism 14 and a first mounting frame 15, wherein the substrate loading mechanism 11 is used for loading substrates plate by plate, and the magazine loading mechanism 12 is used for supplying the substrates through the magazine; the second mounting seat 13 supports the substrate feeding mechanism 11 and the material box feeding mechanism 12, the first lifting mechanism 14 is used for driving the second mounting seat 13 to lift, the first mounting frame 15 supports the first lifting mechanism 14, the first mounting frame 15 is mounted on the machine table 60, the second mounting seat 13 is in sliding connection with the first mounting frame 15, and the power output end of the first lifting mechanism 14 is connected with the second mounting seat 13. Like this can realize magazine material loading and the direct material loading dual mode material loading of base plate, to the less base plate of width, can adopt the magazine material loading, to the great base plate of width, can adopt base plate feed mechanism 11 to carry out the material loading, so, can realize the material loading of different width base plates. Alternatively, the first lifting mechanism 14 may be a motor-driven screw-nut mechanism, or a flat linear motor, etc., so that the height of the second mounting seat 13 along the Z-axis direction may be controlled, so that the height of the output substrate of the upper plate device 10 is matched with the height of the first conveying mechanism 21, so as to meet the height requirements of two feeding modes.

In one embodiment of the present application, referring to fig. 1 to 3, the substrate feeding mechanism 11 includes a third supporting plate 111, a third belt transmission assembly 112, a fourth supporting plate 113 and a fourth belt transmission assembly 114, the third supporting plate 111 is installed on one side of the second mounting seat 13, the third belt transmission assembly 112 is installed on the third supporting plate 111, the fourth supporting plate 113 is used for defining the width of the substrate in cooperation with the third supporting plate 111, the fourth supporting plate 113 is slidably connected with the second mounting seat 13, the fourth belt transmission assembly 114 is used for transmitting the substrate in cooperation with the third belt transmission assembly 112, and the fourth belt transmission assembly 114 is installed on the fourth supporting plate 113. Thus, the distance between the fourth support plate 113 and the third support plate 111 can be adjusted by sliding the fourth support plate 113 along the Y-axis direction, and the distance between the fourth belt transmission assembly 114 and the third belt transmission assembly 112 can be adjusted to adapt to substrates with different widths. Alternatively, the connection structure of the fourth support plate 113 and the second mounting seat 13 may be a connection structure similar to the first base frame 231 using the second support plate 233 so as to adjust the position of the fourth support plate 113. Of course, in other embodiments of the present application, the connection structure between the third support plate 111 and the second mounting seat 13 may also be the same or similar connection structure between the fourth support plate 113 and the second mounting seat 13.

In one embodiment, the third belt transmission assembly 112 includes a first roller, a second roller, a third belt and a second motor, the first roller and the second roller are rotatably mounted at two ends of the third support plate 111 respectively, the third belt is supported on the first roller and the second roller, the second motor is mounted on the third support plate 111, the second motor is used for driving the first roller to rotate, and a rotating shaft of the second motor is in transmission connection with the first roller. Thus, one side of the substrate can be supported and driven to move along the X-axis direction. The fourth belt transmission assembly 114 may have the same structure as the third belt transmission assembly 112, so that the transmission speeds at two sides of the substrate can be matched, and the universality of the components can be improved, which is beneficial to reducing the cost. Of course, in other embodiments of the present application, the substrate feeding mechanism 11 may also adopt the same or similar structure as the first conveying mechanism 21.

In one embodiment of the present application, referring to fig. 1 to 3, the cartridge loading mechanism 12 includes a first clamping plate 121, a second clamping plate 122, a push plate assembly 123 and a second base frame 124, the first clamping plate 121 is mounted on one side of the second mounting seat 13, the second clamping plate 122 is slidably mounted on the other side of the second mounting seat 13, the second clamping plate 122 is used for clamping the cartridge with the first clamping plate 121, the push plate assembly 123 is used for pushing the substrate output in the cartridge, the second base frame 124 supports the push plate assembly 123, and the second base frame 124 is mounted on the machine 60. This enables the position of the second clamping plate 122 to be adjusted and the distance of the second clamping plate 122 from the first clamping plate 121 to clamp cartridges of different widths to be controlled. Alternatively, the connection structure between the first clamping plate 121 and the second mounting seat 13, and the connection structure between the second clamping plate 122 and the second mounting seat 13 may be the same or similar connection structure between the second support plate 233 and the first base frame 231, so as to match substrates or cartridges with different widths.

Optionally, a spring is disposed on a side of the first clamping plate 121 near the second clamping plate 122, and the spring is used for elastically pushing the cartridge to be tightly attached to the second clamping plate 122, so that the cartridge is conveniently loaded into the cartridge loading mechanism 12.

Alternatively, the push plate assembly 123 includes a push rod and a linear actuator mounted on the second pedestal 124, an output shaft of the linear actuator being coupled to the push rod. The linear actuator may be a push rod, electro-hydraulic push rod, or the like, so that the substrate in the cartridge may be pushed out.

Optionally, the third belt transmission assembly 112 is located at a side of the third support plate 111 adjacent to the fourth support plate 113, the fourth belt transmission assembly 114 is located at a side of the fourth support plate 113 adjacent to the third support plate 111, the first clamping plate 121 and the second clamping plate 122 are located between the third belt transmission assembly 112 and the fourth belt transmission assembly 114, and the first clamping plate 121 and the second clamping plate 122 are located at lower sides of the third belt transmission assembly 112 and the fourth belt transmission assembly 114. Thus, the first clamping plate 121 and the second clamping plate 122 can be prevented from interfering the substrate to be directly fed.

In one embodiment of the present application, referring to fig. 1, 2 and 6, a second transporting mechanism 30 is mounted on the machine 60, the second transporting mechanism 30 is located between two adjacent die bonding stages 20, and the second transporting mechanism 30 is used for transporting the substrate along the X-axis direction. In this way, the transfer of the substrate between the adjacent die bonding stages 20 in the X-axis direction can be realized.

Optionally, the second transmission mechanism 30 includes a fifth belt transmission assembly 31, a sixth belt transmission assembly 32, a second driving assembly 33 and a second mounting frame 34, the second mounting frame 34 is mounted on the machine 60, the fifth belt transmission assembly 31, the sixth belt transmission assembly 32 and the second driving assembly 33 are mounted on the second mounting frame 34, and the second driving assembly 33 is in transmission connection with the fifth belt transmission assembly 31 and the sixth belt transmission assembly 32. In this way, the substrate can be transported in the X-axis direction.

Alternatively, the fifth belt conveyor assembly 31, the sixth belt conveyor assembly 32, and the second driving assembly 33 may have the same or similar structure as the first conveyor mechanism 21, and the second mounting bracket 34 may have a similar structure as the first mounting bracket 23 so as to accommodate substrates of different widths.

In one embodiment of the present application, referring to fig. 1, 2 and 6, the number of die attach stations 20 is three. Therefore, three die bonding positions can be provided so as to realize die bonding of three chips and meet the production requirements of multicolor LED products. Specifically, the number of the second transmission mechanisms 30 is two, and the two second transmission mechanisms 30 are disposed between the three die bonding stages 20 at intervals, so that the die bonding stages 20 can be abutted.

In one embodiment of the present application, referring to fig. 1 and 2, the board collecting device 40 includes a board collecting mechanism, a material box collecting mechanism, a third mounting seat, a second lifting mechanism and a third mounting frame, where the board collecting mechanism is used for collecting boards board by board, and the material box collecting mechanism is used for collecting boards through the material box; the third mounting seat supports the substrate receiving mechanism and the material box receiving mechanism, the second lifting mechanism is used for driving the third mounting seat to lift, the third mounting frame supports the second lifting mechanism, the third mounting frame is mounted on the machine table 60, the third mounting seat is in sliding connection with the third mounting frame, and the power output end of the second lifting mechanism is connected with the third mounting seat. Therefore, the material box and the substrate can be directly received, the material box can be used for receiving the substrate with smaller width, and the substrate with larger width can be received by the substrate receiving mechanism, so that the material receiving of the substrates with different widths can be realized. Wherein, the substrate receiving mechanism, the third mounting seat, the second lifting mechanism and the third mounting frame may respectively adopt the same structures as the substrate feeding mechanism 11, the second mounting seat 13, the first lifting mechanism 14 and the first mounting frame 15.

Alternatively, the magazine receiving mechanism may be a hook plate assembly for pulling the substrate into the magazine to achieve automatic board receiving, instead of the push plate assembly 123 in the magazine feeding mechanism 12. The hook plate assembly belongs to the existing structure and is not described in detail herein.

Referring to fig. 1, fig. 2 and fig. 7, the embodiment of the present application further provides a die bonder, which includes a plurality of die bonders 50, and further includes the die bonder substrate conveying line in any of the embodiments, wherein the die bonders 50 are mounted on the machine table 60, a die bonder 50 is disposed on a side of each moving mechanism 24, and each die bonder 50 is used for assembling a chip on a substrate clamped by a corresponding clamping mechanism 22. Thus, the plurality of die bonding apparatuses 50 can be used to assemble a plurality of chips on the substrate. Through adopting the solid brilliant base plate conveying line in the above-mentioned embodiment, be favorable to reducing the transmission path length of base plate, also need not set up anchor clamps platform in solid brilliant device 50 and control the base plate position, simplified solid brilliant machine structure, can make solid brilliant machine overall arrangement compacter, and be favorable to reducing equipment cost.

In one embodiment of the present application, referring to fig. 1, 2 and 7, the die bonding apparatus 50 includes a ring changing mechanism 51, a rotating mechanism 52, a thimble mechanism 53 and a die bonding mechanism 54, the ring changing mechanism 51 is used for supplying and changing a die ring, the rotating mechanism 52 is used for adjusting a rotation angle of the die ring, the thimble mechanism 53 is used for jacking a chip on the die ring, the die bonding mechanism 54 is used for assembling the chip jacked by the thimble mechanism 53 on a substrate, and the ring changing mechanism 51, the rotating mechanism 52, the thimble mechanism 53 and the die bonding mechanism 54 are mounted on a machine 60. Therefore, by adopting the ring changing mechanism 51, the wafer ring bearing the chip can be arranged in the rotating mechanism 52, and the empty wafer ring on the rotating mechanism 52 can be stored in the ring changing mechanism 51 so as to realize automatic replacement of the wafer ring, so that the chip on the wafer ring can be continuously and automatically assembled on the substrate, and the automation degree of the production line is improved. The ring replacing mechanism 51, the rotating mechanism 52, the thimble mechanism 53 and the die bonding mechanism 54 may be designed in the prior art, and will not be described herein.

In one embodiment of the present application, referring to fig. 1, 2 and 7, the number of die bonding stages 20 is three, and the number of die bonding devices 50 is three. Thus, the three LED chips of R/G/B can be respectively subjected to die bonding by the three die bonding devices 50 so as to meet the die bonding requirement of multicolor LED products.

Optionally, the die bonding mechanism 54 is a 180 ° double swing arm die bonding mechanism, which is beneficial to improving die bonding efficiency.

Alternatively, the bonding head of the die bonding mechanism 54 may be of a split type structure, so that the die bonding mechanism can be conveniently detached for maintenance.

In one embodiment of the present application, referring to fig. 1, 2 and 7, the die bonding apparatus 50 further includes a first CCD (Charge Coupled Device ) camera 551, a second CCD camera 552 and a third CCD camera 553, wherein the first CCD camera 551 is used for detecting a chip position on the rotating mechanism 52, the second CCD camera 552 is used for detecting a bottom and a suction nozzle of the chip sucked by the die bonding mechanism 54, the third CCD camera 553 is used for detecting a substrate position on the clamping mechanism 22, and the first CCD camera 551, the second CCD camera 552 and the third CCD camera 553 are mounted on the machine 60. In this way, the second CCD camera 552 can detect the chip and the suction nozzle, and the first CCD camera 551 and the third CCD camera 553 can detect the assembly position of the chip and the corresponding chip of the substrate, so as to control the chip to be accurately assembled on the corresponding assembly position of the substrate.

The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims (10)

1. A die attach substrate transfer line comprising:

a machine (60);

a top plate device (10) mounted on the machine (60), the top plate device (10) being used for supplying a substrate;

the device comprises a plurality of die bonding platforms (20), wherein each die bonding platform (20) comprises a first transmission mechanism (21) for transmitting the substrate along the X-axis direction, a clamping mechanism (22) for clamping and positioning the substrate on the first transmission mechanism (21), a first mounting seat (23) for supporting the first transmission mechanism (21) and the clamping mechanism (22) and a moving mechanism (24) for driving the first mounting seat (23) to translate, the moving mechanism (24) is mounted on the machine table (60), and a power output end of the moving mechanism (24) is connected with the first mounting seat (23);

the board collecting device (40) is arranged on the machine table (60), and the board collecting device (40) is used for collecting the base board;

the upper plate device (10), the die bonding platforms (20) and the plate collecting device (40) are sequentially arranged along the X-axis direction.

2. The die attach substrate transfer line of claim 1, wherein: the first mounting seat (23) comprises a first base frame (231), a first support plate (232) mounted on one side of the first base frame (231) and a second support plate (233) used for being matched with the first support plate (232) to limit the width of the substrate, the second support plate (233) is slidably mounted on the other side of the first base frame (231), and the first base frame (231) is connected with the power output end of the moving mechanism (24);

the first transmission mechanism (21) comprises a first belt transmission assembly (211) arranged on a first support plate (232), a second belt transmission assembly (212) arranged on a second support plate (233) and a first driving assembly (213) used for driving the first belt transmission assembly (211) and the second belt transmission assembly (212), wherein the first driving assembly (213) is arranged on the second support plate (233), and the power output end of the first driving assembly (213) is in transmission connection with the first belt transmission assembly (211) and the second belt transmission assembly (212).

3. The die attach substrate transfer line of claim 1, wherein: the clamping mechanism (22) comprises a pressing plate frame (221) located above the first conveying mechanism (21), a stop component (222) used for stopping and positioning the substrate on the first conveying mechanism (21) and a jacking component (223) used for clamping the substrate in a matched mode with the pressing plate frame (221), the stop component (222) and the jacking component (223) are installed on the first installation seat (23), the stop component (222) is located on one side, away from the upper plate device (10), of the pressing plate frame (221), and the jacking component (223) is located below the pressing plate frame (221).

4. The die attach substrate transfer line of claim 1, wherein: the moving mechanism (24) comprises a first flat linear motor (241) used for driving the first mounting seat (23) to move along the Y-axis direction and a second flat linear motor (242) used for driving the first flat linear motor (241) to move along the X-axis direction, the second flat linear motor (242) is mounted on the machine table (60), the power output end of the second flat linear motor (242) is connected with the first flat linear motor (241), and the power output end of the first flat linear motor (241) is connected with the first mounting seat (23).

5. The die attach substrate transfer line of claim 1, wherein: the upper plate device (10) comprises a substrate feeding mechanism (11), a material box feeding mechanism (12), a second mounting seat (13) for supporting the substrate feeding mechanism (11) and the material box feeding mechanism (12), a first lifting mechanism (14) for driving the second mounting seat (13) to lift and a first mounting frame (15) for supporting the first lifting mechanism (14), wherein the first mounting frame (15) is mounted on the machine table (60), the second mounting seat (13) is in sliding connection with the first mounting frame (15), and a power output end of the first lifting mechanism (14) is connected with the second mounting seat (13).

6. The die attach substrate transfer line of claim 5, wherein: the substrate feeding mechanism (11) comprises a third support plate (111) arranged on one side of the second mounting seat (13), a third belt transmission assembly (112) arranged on the third support plate (111), a fourth support plate (113) used for being matched with the third support plate (111) to limit the width of the substrate, and a fourth belt transmission assembly (114) used for being matched with the third belt transmission assembly (112) to transmit the substrate, the fourth support plate (113) is in sliding connection with the second mounting seat (13), and the fourth belt transmission assembly (114) is arranged on the fourth support plate (113); and/or the number of the groups of groups,

the material box feeding mechanism (12) comprises a first clamping plate (121) arranged on one side of the second mounting seat (13), a second clamping plate (122) used for clamping the material box in a matched mode with the first clamping plate (121), a pushing plate assembly (123) used for pushing the substrate in the material box to output and a second base frame (124) used for supporting the pushing plate assembly (123), the second clamping plate (122) is slidably arranged on the second mounting seat (13), and the second base frame (124) is arranged on the machine table (60).

7. The die attach substrate transfer line of any of claims 1 to 6, wherein: the machine (60) is provided with a second transmission mechanism (30) used for transmitting the substrate along the X-axis direction between two adjacent die bonding platforms (20).

8. The die attach substrate transfer line of any of claims 1 to 6, wherein: the number of the die bonding platforms (20) is three.

9. A die bonder comprising a plurality of die bonders (50), characterized in that: the die bonding substrate transfer line according to any one of claims 1 to 8, wherein the die bonding device (50) is mounted on the machine (60), the die bonding device (50) is disposed at a side of each moving mechanism (24), and each die bonding device (50) is used for assembling a chip on the substrate clamped by the corresponding clamping mechanism (22).

10. The die bonder as claimed in claim 9, wherein: the die bonding device (50) comprises a ring changing mechanism (51) for supplying a crystal ring, a rotating mechanism (52) for adjusting the rotating angle of the crystal ring, a thimble mechanism (53) for jacking up a chip on the crystal ring and a die bonding mechanism (54) for loading the chip jacked up by the thimble mechanism (53) on the substrate, wherein the ring changing mechanism (51), the rotating mechanism (52), the thimble mechanism (53) and the die bonding mechanism (54) are arranged on the machine table (60).