CN219419851U - Pump cooling assembly and laser - Google Patents

Abstract

The embodiment of the application discloses a pumping cooling assembly and a laser. The pump cooling assembly comprises a cooling main body and a micro-channel module, wherein the cooling main body is provided with a cooling cavity, the cooling main body is provided with a mounting surface, an opening communicated with the cooling cavity is formed in the mounting surface, the micro-channel module is connected with the mounting surface of the cooling main body, the micro-channel module is provided with a first surface and a second surface which are opposite along the direction far away from the mounting surface, the second surface is used for mounting a pump chip, the micro-channel module comprises a plurality of layers of cooling channels which are communicated in sequence along the direction far away from the mounting surface, the cooling channels penetrate through the first surface and are communicated with the cooling cavity through the opening, and at least two layers of adjacent cooling channels are arranged in a staggered mode. According to the cooling device, the cooling channels are arranged in the micro-channel module in a staggered mode, so that the heat exchange area of the cooling medium and the pumping cooling assembly is increased, the turbulence degree of the cooling medium during flowing can be increased, and the heat exchange effect of the pumping cooling assembly is improved.

Description

Pump cooling assembly and laser

Technical Field

The application relates to the technical field of lasers, in particular to a pumping cooling assembly and a laser.

Background

Semiconductor lasers have become an important light source which is not replaced in optical fiber communication, optical fiber sensing and various laser pumping because of the advantages of high conversion efficiency, long service life, small volume and the like. When a semiconductor laser is used as a pump source, due to the limited output power of a single pump chip, a beam combining design is generally required for the light beam. For example, in single-tube space beam combination, a plurality of pump chips are sequentially arranged and sintered on a pump base in a step shape, and correspondingly formed emergent light paths with height differences are collimated by a fast-slow axis collimating lens and then are subjected to fast-axis beam combination by a reflecting mirror. Along with the increase of output power, the heat generated in the use process of the laser is also increased, and for this reason, in the existing laser, a water cooling plate is usually directly arranged on a pumping base, and the pumping chip is radiated by using the water cooling plate, but the radiating effect of the mode is poor, so that the use performance of the laser is affected.

Disclosure of Invention

The embodiment of the application provides a pump cooling assembly, which can solve the problem that the heat dissipation effect of the existing pump cooling assembly is poor.

An embodiment of the present application provides a pump cooling assembly, comprising:

the cooling device comprises a cooling main body, a cooling cavity and a cooling device, wherein the cooling main body is provided with a mounting surface, and an opening communicated with the cooling cavity is formed in the mounting surface;

the micro-channel module is connected with the mounting surface of the cooling main body and is provided with a first surface and a second surface which are opposite to each other along the direction away from the mounting surface, and the second surface is used for mounting a pump chip; the micro-channel module comprises a plurality of layers of cooling channels which are sequentially communicated along the direction away from the mounting surface, and the cooling channels penetrate through the first surface and are communicated with the cooling cavity through the opening; at least two layers of adjacent cooling channels are arranged in a staggered mode.

Optionally, in some embodiments of the present application, any two layers of adjacent cooling channels are staggered in a direction of the second face toward the first face.

Optionally, in some embodiments of the present application, orthographic projection portions of any two layers of the cooling channels in a direction of the second face toward the first face overlap.

Optionally, in some embodiments of the present application, the mounting surface includes a plurality of sub-mounting surfaces arranged in parallel, and the plurality of sub-mounting surfaces are distributed in a stepped manner, and each sub-mounting surface is correspondingly provided with the opening that is communicated with the cooling cavity; the pump cooling assembly comprises a plurality of micro-channel modules, and the micro-channel modules are in one-to-one correspondence connection with the sub-mounting surfaces.

Optionally, in some embodiments of the present application, the microchannel module comprises a first cooling plate and a second cooling plate connected to each other in a direction of the first face toward the second face; a plurality of first grooves which are arranged in parallel along a first direction are formed in one side of the first cooling plate, which faces the cooling main body, the first grooves extend along a second direction, the first grooves penetrate through the first cooling plate along the thickness direction of the first cooling plate, and the plurality of first grooves form cooling channels of the first cooling plate;

a plurality of second grooves are formed in one side of the second cooling plate, facing the cooling main body, and are arranged in parallel along the second direction, the second grooves extend along the first direction, and the plurality of second grooves form cooling channels of the second cooling plate; the first groove and the second groove are communicated with each other.

Optionally, in some embodiments of the present application, the first groove has two opposite first side walls in the first direction, at least one first side wall is provided with a plurality of third grooves arranged in parallel along the second direction, and the third grooves and the first grooves form a cooling channel of the first cooling plate; and/or the number of the groups of groups,

the second grooves are provided with two opposite second side walls in the second direction, at least one second side wall is provided with a plurality of fourth grooves which are arranged in parallel along the first direction, and the fourth grooves and the second grooves form cooling channels of the second cooling plate.

Optionally, in some embodiments of the present application, the microchannel module further comprises a third cooling plate connected between the first cooling plate and the second cooling plate; a plurality of fifth grooves distributed in an array are formed in one side, facing the cooling main body, of the third cooling plate, the fifth grooves penetrate through the third cooling plate along the thickness direction of the third cooling plate, and the plurality of fifth grooves form cooling channels of the third cooling plate; the fifth groove is communicated with the first groove and the second groove.

Optionally, in some embodiments of the present application, the first cooling plate, the second cooling plate, and the third cooling plate are integrally formed.

Optionally, in some embodiments of the present application, a depth of each layer of the cooling channel is greater than or equal to 0.2mm and less than or equal to 0.4mm in a direction of the first face toward the second face.

Accordingly, embodiments of the present application further provide a laser, including:

a pump base;

the pump cooling assembly of any of the above claims connected to the pump mount;

and the pump chip is arranged on the micro-channel module of the pump cooling assembly.

The pumping cooling assembly in this embodiment includes cooling body and microchannel module, cooling body is formed with the cooling cavity, cooling body has the installation face, set up the opening with cooling cavity intercommunication on the installation face, microchannel module is connected with cooling body's installation face, microchannel module has relative first face and second face along the direction of keeping away from the installation face, the second face is used for installing the pumping chip, microchannel module includes the multilayer along the direction of keeping away from the installation face and communicates in proper order the cooling channel, the cooling channel runs through first face to communicate with the cooling cavity through the opening, at least two-layer adjacent cooling channel staggers the setting. This application is through setting up multilayer cooling channel in the microchannel module, and the crisscross setting of at least two-layer adjacent cooling channel for when coolant circulates to multilayer cooling channel through the cooling cavity of cooling main part, coolant and the holistic heat exchange area increase of pumping cooling module, also can increase coolant's disorder degree simultaneously, and then improve pumping cooling module's heat transfer effect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a pump cooling assembly according to an embodiment of the present application;

FIG. 2 is an exploded view of a pump cooling assembly according to an embodiment of the present application;

FIG. 3 is a cross-sectional view of a microchannel module provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of a cooling channel in a micro-channel module according to an embodiment of the present application;

FIG. 5 is a plan view of cooling channels of layers in a microchannel module according to an embodiment of the present application;

fig. 6 is a schematic structural diagram of a laser according to an embodiment of the present application.

Reference numerals illustrate:

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.

The embodiment of the application provides a pump cooling assembly and a laser, which are respectively described in detail below. The following description of the embodiments is not intended to limit the preferred embodiments.

First, the embodiment of the present application provides a pump cooling assembly, as shown in fig. 1 and 2, the pump cooling assembly 100 includes a cooling body 110, the cooling body 110 is formed with a cooling cavity 111, and the cooling cavity 111 is used as a main flow channel of a cooling medium for inflow and outflow of the cooling medium. The cooling body 110 has a mounting surface 112, the mounting surface 112 is provided with an opening 113 communicated with the cooling cavity 111, and the opening 113 on the mounting surface 112 is used for introducing the cooling medium flowing to the cooling cavity 111 into other structures so as to ensure the overall heat exchange effect of the pump cooling assembly 100.

As shown in fig. 3 and 4, the pump cooling assembly 100 includes a micro-channel module 120, the micro-channel module 120 being connected to the mounting surface 112 of the cooling body 110, the micro-channel module 120 having opposite first and second surfaces 121 and 122 in a direction away from the mounting surface 112, the second surface 122 being for mounting the pump chip 300 to cool the pump chip 300. The micro-channel module 120 includes a plurality of cooling channels 123 sequentially communicated along a direction away from the mounting surface 112, the cooling channels 123 penetrate through the first surface 121 and are communicated with the cooling cavity 111 through the openings 113, so that the cooling medium can flow to the plurality of cooling channels 123 of the micro-channel module 120 through the openings 113, thereby increasing the heat exchange area of the cooling medium and the pump cooling assembly 100, and further improving the heat exchange efficiency.

The at least two adjacent cooling channels 123 are staggered, that is, in the direction from the first surface 121 toward the second surface 122, the orthographic projections of the at least two adjacent cooling channels 123 on the cooling body only partially overlap, so that certain dislocation exists while the two layers of cooling channels 123 are ensured to be mutually communicated, and when the cooling medium flows from one layer of cooling channels 123 to the other layer of cooling channels 123, the flowing direction of the cooling medium can be changed, so that the turbulence degree of the cooling medium in the micro-channel module 120 is increased, and the overall heat exchange efficiency of the pump cooling assembly 100 is improved.

In this embodiment, the pump cooling assembly 100 includes a cooling main body 110 and a micro-channel module 120, the cooling main body 110 is formed with a cooling cavity 111, the cooling main body 110 has a mounting surface 112, an opening 113 communicating with the cooling cavity 111 is formed in the mounting surface 112, the micro-channel module 120 is connected with the mounting surface 112 of the cooling main body 110, the micro-channel module 120 has a first surface 121 and a second surface 122 opposite to each other along a direction far away from the mounting surface 112, the second surface 122 is used for mounting a pump chip 300, the micro-channel module 120 includes a plurality of layers of cooling channels 123 sequentially communicating along a direction far away from the mounting surface 112, the cooling channels 123 penetrate through the first surface 121 and communicate with the cooling cavity 111 through the opening 113, and at least two adjacent cooling channels 123 are staggered. This application is through setting up multilayer cooling channel 123 in microchannel module 120, and the crisscross setting of at least two-layer adjacent cooling channel 123 for when coolant circulates to multilayer cooling channel 123 through cooling body 110's cooling cavity 111, coolant and the holistic heat exchange area increase of pumping cooling module 100 also can increase coolant's disorder degree simultaneously, and then improves the heat transfer effect of pumping cooling module 100.

Optionally, in the direction of the second surface 122 towards the first surface 121, any two adjacent cooling channels 123 are staggered, that is, orthographic projections of any two adjacent cooling channels 123 on the cooling body are only partially overlapped, and when the cooling medium flows from any one layer of cooling channel 123 to the adjacent layer of cooling channel 123, the flowing direction of the cooling medium is changed, so that the turbulence of the cooling medium in the micro-channel module 120 is further increased, and further the overall heat exchange efficiency of the pump cooling assembly 100 is improved.

In some embodiments, the cooling channels 123 of two adjacent layers are staggered, but the two cooling channels 123 of two spaced layers are overlapped, i.e. the micro-channel module 120 is formed by alternately arranging the cooling channels 123 of two structures, which can correspondingly simplify the structural design mode of the micro-channel module 120 while increasing the turbulence degree of the cooling medium in flowing, thereby being beneficial to improving the production efficiency of the pump cooling assembly 100 and reducing the production cost.

In other embodiments, the orthographic projections of any two layers of cooling channels 123 in the direction of the second face 122 towards the first face 121 are partially overlapped, that is, the orthographic projections of any two layers of cooling channels 123 on the cooling body are only partially overlapped, that is, the flowing manner of the cooling medium in each layer of cooling channels 123 is different, so that the turbulence of the cooling medium flowing can be increased to the greatest extent, and the overall heat exchange efficiency of the pump cooling assembly 100 is further improved.

It should be noted that, the staggered arrangement manner between the multiple cooling channels 123 can be adjusted according to the actual design and the use requirement, and only needs to ensure that the pump cooling assembly 100 has sufficient heat exchange efficiency, which is not limited in particular.

Optionally, as shown in fig. 2, the mounting surface 112 includes a plurality of sub-mounting surfaces 1121 arranged in parallel, the plurality of sub-mounting surfaces 1121 are distributed in a step, an opening 113 communicating with the cooling cavity 111 is correspondingly formed on each sub-mounting surface 1121, the pump cooling assembly 100 includes a plurality of micro-channel modules 120, the plurality of micro-channel modules 120 are connected with the plurality of sub-mounting surfaces 1121 in a one-to-one correspondence manner, and one pump chip 300 is correspondingly mounted on the second surface 122 of each micro-channel module 120, so as to realize simultaneous cooling of the plurality of pump chips 300. In addition, since the plurality of sub-mounting surfaces 1121 are arranged in a stepwise manner, the pump chips 300 mounted on the micro-channel module 120 can also be arranged in a stepwise manner, so that the pump cooling assembly 100 can simultaneously meet different light-emitting requirements of the laser 10.

The cooling channels 123 in the micro-channel modules 120 correspondingly mounted on each sub-mounting surface 1121 may be the same or different, and their specific design manner may be adjusted according to the actual use requirements, which is not particularly limited herein.

Alternatively, as shown in fig. 4 and 5, in the direction of the first surface 121 toward the second surface 122, the micro-channel module 120 includes a first cooling plate 124 and a second cooling plate 125 connected to each other, a plurality of first grooves 1241 disposed in parallel along the first direction X are formed on a side of the first cooling plate 124 facing the cooling body 110, the first grooves 1241 extend along the second direction Y, the first grooves 1241 penetrate the first cooling plate 124 along the thickness direction of the first cooling plate 124, and the plurality of first grooves 1241 form cooling channels 123 of the first cooling plate 124. The side of the second cooling plate 125 facing the cooling body 110 is provided with a plurality of second grooves 1251 arranged in parallel along the second direction Y, the second grooves 1251 extend along the first direction X, the plurality of second grooves 1251 form cooling channels 123 of the second cooling plate 125, the first direction X and the second direction Y form an included angle, and the first grooves 1241 are mutually communicated with the second grooves 1251.

That is, the cooling channels 123 on the first cooling plate 124 and the second cooling plate 125 are formed by the first grooves 1241 and the second grooves 1251 which are staggered with each other, so that two layers of the cooling channels 123 are formed in the micro-channel module 120, and when the cooling medium flows in the first grooves 1241 and the second grooves 1251, the staggered first grooves 1241 and the staggered second grooves 1251 can increase the turbulence of the cooling medium flow, thereby improving the heat exchange efficiency of the micro-channel module 120.

In addition, the staggered arrangement of the first grooves 1241 and the second grooves 1251 in the distribution direction and the extension direction can also ensure that the whole surface of the pump chip 300 mounted on the micro-channel module 120 can perform effective heat exchange, thereby ensuring the stability of the performance of the pump chip 300 and prolonging the service life of the pump chip 300.

In some embodiments, the first groove 1241 has two opposite first sidewalls 1242 in the first direction X, and at least one first sidewall 1242 is provided with a plurality of third grooves 1243 disposed in parallel along the second direction Y, and the third grooves 1243 and the first grooves 1241 form the cooling passages 123 of the first cooling plate 124. That is, in the extending direction of the first grooves 1241, the first grooves 1241 are also simultaneously communicated with the plurality of third grooves 1243 to increase the heat exchange area of the cooling passages 123 of the first cooling plate 124, thereby improving the heat exchange efficiency of the first cooling plate 124.

The two first sidewalls 1242 of the first groove 1241 may be provided with a plurality of third grooves 1243 at the same time, and the third grooves 1243 on the two first sidewalls 1242 may be disposed opposite to each other or disposed in a staggered manner. The first side walls 1242 of only part of the first grooves 1241 in the first grooves 1241 can be provided with third grooves 1243; or the first side wall 1242 of each first groove 1241 is provided with a third groove 1243. That is, the arrangement position and arrangement manner of the third grooves 1243 can be adjusted according to the structural design requirement of the cooling passages 123 on the first cooling plate 124, which is not particularly limited herein.

In other embodiments, the second groove 1251 has two opposite second sidewalls 1252 in the second direction Y, and at least one second sidewall 1252 is provided with a plurality of fourth grooves 1253 arranged in parallel along the first direction X, and the fourth grooves 1253 and the second grooves 1251 form the cooling channels 123 of the second cooling plate 125. That is, in the extending direction of the second grooves 1251, the second grooves 1251 are also simultaneously communicated with the plurality of fourth grooves 1253 to increase the heat exchange area of the cooling passages 123 in the second cooling plate 125, thereby improving the heat exchange efficiency of the second cooling plate 125.

The second side walls 1252 of the second groove 1251 can be provided with a plurality of fourth grooves 1253 at the same time, and the fourth grooves 1253 on the two second side walls 1252 can be arranged oppositely or in a staggered manner. A fourth groove 1253 is formed in the second side wall 1252 of only part of the second grooves 1251 in the plurality of second grooves 1251; or the second side wall 1252 of each second groove 1251 is provided with a fourth groove 1253. That is, the arrangement position and arrangement manner of the fourth groove 1253 can be adjusted according to the structural design requirement of the cooling channel 123 on the second cooling plate 125, which is not limited herein.

In still other embodiments, at least one first sidewall 1242 of the first groove 1241 is provided with a plurality of third grooves 1243 arranged in parallel along the second direction Y, and at least one second sidewall 1252 of the second groove 1251 is provided with a plurality of fourth grooves 1253 arranged in parallel along the first direction X. Namely, the first, second, third and fourth grooves 1241, 1251, 1243 and 1253 are simultaneously communicated to simultaneously increase the heat exchange area of the first and second cooling plates 124 and 125, thereby improving the overall heat exchange efficiency of the microchannel module 120.

The positions and the arrangement manners of the third grooves 1243 and the fourth grooves 1253 can be adjusted according to the structural design requirements of the cooling passages 123 on the first cooling plate 124 and the second cooling plate 125, which are not limited in particular.

Optionally, the micro-channel module 120 further comprises a third cooling plate 126, the third cooling plate 126 being connected between the first cooling plate 124 and the second cooling plate 125; a plurality of fifth grooves 1261 distributed in an array are formed on one side of the third cooling plate 126 facing the cooling body 110, the fifth grooves 1261 penetrate through the third cooling plate 126 along the thickness direction of the third cooling plate 126, the plurality of fifth grooves 1261 form cooling channels 123 of the third cooling plate 126, and the fifth grooves 1261 are communicated with the first grooves 1241 and the second grooves 1251.

Since the first grooves 1241 and the third grooves 1243 on the first cooling plate 124 and the second grooves 1251 and the fourth grooves 1253 on the second cooling plate 125 are completely staggered in the distribution and extension directions, the flow speed of the cooling medium can be reduced to a certain extent while the flow disturbance of the cooling medium is improved, and the heat exchange area of the cooling medium and the whole microchannel module 120 can be increased by arranging the third cooling plate 126 between the first cooling plate 124 and the second cooling plate 125, on the one hand, and on the other hand, the fifth grooves 1261 on the third cooling plate 126 can be used as channels for the cooling medium to circulate between the first cooling plate 124 and the second cooling plate 125 so as to increase the circulation speed of the cooling medium between the first cooling plate 124 and the second cooling plate 125 and further improve the heat exchange effect.

Wherein, the cross section of the fifth grooves 1261 can be diamond, each fifth groove 1261 can be communicated with one first groove 1241 and one second groove 1251, and one first groove 1241 and one second groove 1251 are communicated by a plurality of fifth grooves 1261, so that the cooling medium can have a certain orientation between the first cooling plate 124 and the second cooling plate 125 while being disturbed by the cooling channels 123 of the first cooling plate 124 and the second cooling plate 125, thereby improving the turbulence and the flow rate adaptability of the cooling medium in the micro-channel module 120, and further improving the overall heat exchange effect of the micro-channel module 120.

It should be noted that, the first cooling plate 124, the second cooling plate 125, and the third cooling plate 126 are integrally formed, that is, the first cooling plate 124, the second cooling plate 125, and the third cooling plate 126 are integrally formed, so as to ensure the sealing performance of the cooling medium flowing in the microchannel module 120, and reduce the leakage of the cooling medium during the use of the pump cooling assembly 100.

In some embodiments, the first cooling plate 124, the second cooling plate 125 and the third cooling plate 126 can also be manufactured separately and then assembled to reduce the difficulty in manufacturing the cooling channels 123 in the microchannel module 120, and the sealing performance between the first cooling plate 124, the second cooling plate 125 and the third cooling plate 126 is ensured during assembly to ensure the stable use of the pump cooling assembly 100.

It should be noted that, in the embodiment of the present application, the number of cooling plates and the number of corresponding cooling channels 123 included in the micro-channel module 120 specifically, and the specific structure of each layer of cooling channels 123 can be adjusted accordingly according to the actual use requirement, which is not limited in particular.

Alternatively, the depth of each layer of cooling channels 123 is greater than or equal to 0.2mm and less than or equal to 0.4mm in the direction of the first face 121 toward the second face 122. If the depth of each layer of cooling channels 123 is too small, the turbulence of the cooling medium flowing in the layers of cooling channels 123 is small, and the overall heat exchange area is also small, so that the overall heat exchange effect of the micro-channel module 120 is affected; if the depth of each layer of cooling channels 123 is too large, the thickness of the entire microchannel module 120 is too large, thereby increasing the difficulty of the sintering molding process of the multi-layer cooling channels 123.

In the actual manufacturing process, the depth of the single-layer cooling channel 123 can be set to be 0.2mm, 0.25mm, 0.3mm, 0.35mm or 0.4mm, etc., and the specific value of the depth can be correspondingly adjusted according to the actual use requirement, so that the micro-channel module 120 can be smoothly manufactured and has higher heat exchange efficiency, and the special limitation is not required.

Secondly, the embodiment of the present application further provides a laser, where the laser includes a pump cooling assembly, and the specific structure of the pump cooling assembly refers to the foregoing embodiments, and since the laser adopts all the technical solutions of all the foregoing embodiments, at least the laser has all the beneficial effects brought by the technical solutions of the foregoing embodiments, which are not described in detail herein.

As shown in fig. 6, the laser 10 includes a pump mount 200, a pump cooling assembly 100, and a pump chip 300, the pump cooling assembly 100 is connected to the pump mount 200, and the pump chip 300 is mounted on the micro-channel module 120 of the pump cooling assembly 100. In addition, the laser 10 further includes an optical module (not shown) mounted on the pump mount 200, and a tail pipe for radiating and fixing the optical fiber is provided on the pump mount 200, from which the laser beam generated by each pump chip 300 is emitted.

Specifically, the pump cooling assembly 100 includes a cooling body 110 and a micro-channel module 120, the cooling body 110 is formed with a cooling cavity 111, the cooling body 110 has a mounting surface 112, an opening 113 communicating with the cooling cavity 111 is formed in the mounting surface 112, the micro-channel module 120 is connected with the mounting surface 112 of the cooling body 110, the micro-channel module 120 has a first surface 121 and a second surface 122 opposite to each other along a direction away from the mounting surface 112, the second surface 122 is used for mounting the pump chip 300, the micro-channel module 120 includes multiple layers of cooling channels 123 sequentially communicating along a direction away from the mounting surface 112, the cooling channels 123 penetrate through the first surface 121 and communicate with the cooling cavity 111 through the opening 113, and at least two adjacent layers of cooling channels 123 are staggered. This application is through setting up multilayer cooling channel 123 in microchannel module 120, and the crisscross setting of at least two-layer adjacent cooling channel 123 for when coolant circulates to multilayer cooling channel 123 through cooling body 110's cooling cavity 111, coolant and the holistic heat exchange area increase of pumping cooling module 100 also can increase coolant's disorder degree simultaneously, and then improves pumping cooling module 100's heat transfer effect, promotes laser 10's performance and life.

The foregoing has described in detail a pump cooling assembly and a laser provided by embodiments of the present application, and specific examples have been applied herein to illustrate the principles and implementations of the present application, the above examples being provided only to assist in understanding the methods of the present application and their core ideas; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims (10)

1. A pump cooling assembly, comprising:

the cooling device comprises a cooling main body, a cooling cavity and a cooling device, wherein the cooling main body is provided with a mounting surface, and an opening communicated with the cooling cavity is formed in the mounting surface;

the micro-channel module is connected with the mounting surface of the cooling main body and is provided with a first surface and a second surface which are opposite to each other along the direction away from the mounting surface, and the second surface is used for mounting a pump chip; the micro-channel module comprises a plurality of layers of cooling channels which are sequentially communicated along the direction away from the mounting surface, and the cooling channels penetrate through the first surface and are communicated with the cooling cavity through the opening; at least two layers of adjacent cooling channels are arranged in a staggered mode.

2. The pump cooling assembly of claim 1 wherein any two adjacent layers of the cooling channels are staggered in a direction of the second face toward the first face.

3. The pump cooling assembly of claim 1 wherein orthographic projection portions of any two layers of the cooling channels in a direction of the second face toward the first face overlap.

4. The pump cooling assembly of claim 1, wherein the mounting surface comprises a plurality of sub-mounting surfaces arranged in parallel, the plurality of sub-mounting surfaces are in stepped distribution, and each sub-mounting surface is correspondingly provided with the opening communicated with the cooling cavity; the pump cooling assembly comprises a plurality of micro-channel modules, and the micro-channel modules are in one-to-one correspondence connection with the sub-mounting surfaces.

5. The pump cooling assembly of claim 1, wherein the microchannel module comprises a first cooling plate and a second cooling plate connected to each other in a direction of the first face toward the second face; a plurality of first grooves which are arranged in parallel along a first direction are formed in one side of the first cooling plate, which faces the cooling main body, the first grooves extend along a second direction, the first grooves penetrate through the first cooling plate along the thickness direction of the first cooling plate, and the plurality of first grooves form cooling channels of the first cooling plate;

a plurality of second grooves are formed in one side of the second cooling plate, facing the cooling main body, and are arranged in parallel along the second direction, the second grooves extend along the first direction, and the plurality of second grooves form cooling channels of the second cooling plate; the first groove and the second groove are communicated with each other.

6. The pump cooling assembly of claim 5, wherein the first groove has two opposite first side walls in the first direction, at least one of the first side walls being provided with a plurality of third grooves arranged in parallel along the second direction, the third grooves and the first grooves forming cooling channels of the first cooling plate; and/or the number of the groups of groups,

the second grooves are provided with two opposite second side walls in the second direction, at least one second side wall is provided with a plurality of fourth grooves which are arranged in parallel along the first direction, and the fourth grooves and the second grooves form cooling channels of the second cooling plate.

7. The pump cooling assembly of claim 5, wherein the microchannel module further comprises a third cooling plate connected between the first cooling plate and the second cooling plate; a plurality of fifth grooves distributed in an array are formed in one side, facing the cooling main body, of the third cooling plate, the fifth grooves penetrate through the third cooling plate along the thickness direction of the third cooling plate, and the plurality of fifth grooves form cooling channels of the third cooling plate; the fifth groove is communicated with the first groove and the second groove.

8. The pump cooling assembly of claim 7 wherein the first cooling plate, the second cooling plate, and the third cooling plate are integrally formed.

9. The pump cooling assembly of any one of claims 1 to 8 wherein the depth of each layer of the cooling channels is greater than or equal to 0.2mm and less than or equal to 0.4mm in the direction of the first face toward the second face.

10. A laser, the laser comprising:

a pump base;

the pump cooling assembly of any one of claims 1 to 9 connected to the pump mount;

and the pump chip is arranged on the micro-channel module of the pump cooling assembly.