CN219395372U - Uniform temperature heat dissipation machine case - Google Patents

Abstract

The utility model relates to a uniform-temperature heat dissipation machine case which comprises a machine case, wherein an accommodating space is formed in the machine case, and opening parts communicated with the accommodating space are formed in two sides of the machine case; the first temperature equalizing plate is provided with two groups and is respectively provided with an opening part at two sides of the chassis, and a plurality of groups of protrusions extend into the accommodating space.

Description

Uniform temperature heat dissipation machine case

Technical Field

The utility model relates to the technical field of cases, in particular to a uniform-temperature heat dissipation case.

Background

The existing chassis generally adopts air cooling and liquid cooling to dissipate heat, but the air cooling and the heat dissipation capability is weak, when the transient temperature rise of a heat source chip in the chassis is caused, the heat is accumulated in the chassis due to the fact that the heat instantaneously exceeds the heat dissipation capability of a heat dissipation channel, the temperature of the chassis is instantaneously risen, the upper limit of the working temperature of the chassis is possibly exceeded, the safety of electric elements in the chassis is endangered, and the liquid cooling and the heat dissipation have the defects of large occupied volume and liquid leakage risk.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model provides a uniform-temperature heat dissipation machine case, which comprises the following specific technical scheme:

a samming heat dissipation chassis comprising:

the device comprises a case, a first cover and a second cover, wherein an accommodating space is formed in the case, and openings communicated with the accommodating space are formed in two sides of the case;

the first temperature equalizing plate is provided with two groups, and is respectively provided with openings at two sides of the case, a plurality of groups of protrusions extend into the accommodating space from the side wall of the first temperature equalizing plate, and a limiting groove is formed between two adjacent groups of protrusions;

the integrated circuit board subassembly is provided with the multiunit, multiunit integrated circuit board subassembly and spacing groove one-to-one block, multiunit integrated circuit board subassembly will the accommodation space separates and forms a plurality of sub-accommodation spaces for place the PCB board, the integrated circuit board subassembly includes the second samming board, second samming board one side is hugged closely with the PCB, second samming board both sides extend have with protruding extension that laminates, the heat that the second samming board produced is collected the back conduction with the PCB gives first samming board, first samming board and external intercommunication heat dissipation form first heat dissipation passageway.

As an improvement of the technical scheme, one side of the side wall of the case, which is adjacent to the two groups of opening parts, is provided with a mounting opening, and the mounting opening is provided with an organic cover which is detachably connected through a bolt.

As the improvement of above-mentioned technical scheme, the integrated circuit board subassembly still includes the wedge latch bar that sets up in extension one side and sets up in two sets of guide posts of second samming board one end, the guide post is moved along the spacing groove through the mounting hole and is made the wedge latch bar get into, will the wedge latch bar is screwed up, controls its and the protruding laminating heat conduction of the protruding laminating of the tight and extension and spacing groove opposite side of protruding laminating in spacing groove one side.

As the improvement of above-mentioned technical scheme, the integrated circuit board subassembly still includes the plug ware, the edge that the guide post one side was kept away from to the second samming board has been seted up and has been dodged the groove, dodge the inslot and be provided with the plug ware through the torsional spring.

As an improvement of the technical scheme, a plurality of groups of heat dissipation grooves are formed in one side of the case, and the heat dissipation grooves are used for communicating the inside of the case with the outside to form a second heat dissipation channel.

The utility model has the beneficial effects that:

because the first temperature equalizing plate and the second temperature equalizing plate are internally provided with the phase change material, the temperature rise of the chassis can be effectively restrained, the concentrated collection and storage of short-time heat consumption or periodic heat consumption can be realized, the second temperature equalizing plate is clung to the PCB, and the heat generated by the PCB can be absorbed.

Drawings

FIG. 1 is a front view of the overall structure of the present utility model;

FIG. 2 is a schematic view of the structure of the utility model after the first temperature equalization plate is disassembled;

FIG. 3 is a rear elevational view of the overall structure of the present utility model;

FIG. 4 is a front view of an inventive board assembly;

fig. 5 is a rear view of the inventive board card assembly.

Reference numerals: 1. a chassis; 11. an opening portion; 12. a mounting port; 2. a first temperature equalizing plate; 21. a protrusion; 3. a heat sink; 4. a board card assembly; 41. a guide post; 42. an avoidance groove; 43. a plug-in device; 44. a second temperature equalizing plate; 441. an extension; 45. wedge-shaped locking strips.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

A uniform-temperature heat dissipation case comprises a case 1, a first uniform-temperature plate 2 and a plate card assembly 4;

the inside accommodation space that has of machine case 1, the machine case both sides all are provided with the opening part 11 with accommodation space intercommunication, first samming board 2 is provided with two sets of, and set up the opening part 11 with machine case 1 both sides respectively, first samming board 2 lateral wall and extend to accommodation space inside has multiunit protruding 21, form the spacing groove between two sets of adjacent protruding 21, board card subassembly 4 is provided with the multiunit, multiunit board card subassembly 4 and spacing groove one-to-one block, multiunit board card subassembly 4 separates the accommodation space and forms a plurality of sub-accommodation space for place the PCB board, board card subassembly 4 includes second samming board 44, second samming board 44 one side is hugged closely with the PCB, second samming board 44 both sides extend to have the extension 441 with protruding 21 laminating, second samming board 44 is with the heat conduction of PCB production for first samming board 2, first samming board 2 and external intercommunication heat dissipation, form first heat dissipation passageway.

Because the first temperature equalizing plate 2 and the second temperature equalizing plate 44 contain phase change materials, the temperature rise of the chassis 1 can be effectively restrained, the concentrated collection and storage of short-time heat consumption or periodic heat consumption can be realized, the heat dissipation and the temperature equalization can be effectively carried out, a plurality of sub-accommodating spaces are formed by separation to mount the PCB, the mutual influence of the PCB after heat generation is effectively avoided, the second temperature equalizing plate 44 is tightly attached to the PCB, the heat generated by the PCB can be absorbed, and further because the extension part 441 of the second temperature equalizing plate 44 is attached to the protrusion 21 of the first temperature equalizing plate 2, the second temperature equalizing plate 44 is used for collecting the heat generated by the PCB and then conducting the heat to the first temperature equalizing plate 2, and the first temperature equalizing plate 2 is communicated with the outside to form a heat dissipation channel, thereby heat dissipation can be effectively restrained, the transient temperature rise rate of a heat source chip can be effectively restrained, the normal operation of the PCB is ensured, and the service life is prolonged.

In order to facilitate maintenance or replacement of the board card assembly 4 and the PCB, referring to fig. 3, a mounting opening 12 is formed in a side wall of the chassis 1 and located at a side adjacent to the two sets of opening portions 11, an organic cover is detachably connected to the mounting opening 12 through bolts, and multiple sets of board card assemblies 4 inside the chassis 1 can be replaced or maintained by removing the cover.

In order to lock the board card assembly 4 inside the case 1, refer to fig. 3, fig. 4 and fig. 5, the board card assembly 4 further comprises a wedge-shaped locking strip 45 arranged on one side of the extension portion 441 and two groups of guide posts 41 arranged at one end of the second temperature equalizing plate 44, the guide posts 41 move along the limit groove through the mounting opening 12 so that the wedge-shaped locking strip 45 enters, the wedge-shaped locking strip 45 is screwed tightly, the protrusion 21 on one side of the limit groove is controlled to be tightly attached to the protrusion 21 on the other side of the limit groove, the extension portion 441 is attached to the protrusion 21 on the other side of the limit groove to conduct heat, the guide posts 41 are inserted into the limit groove, the guide posts 41 are guided, the wedge-shaped locking strip 45 is convenient to enter the limit groove, and the wedge-shaped locking strip 45 is screwed tightly through the guide posts 41, so that on one hand, the installation locking of the second temperature equalizing plate 44 can be realized, and on the other hand, the extension portion 441 and the protrusion 21 can be attached to realize the heat conduction effect.

For being convenient for take out board card assembly 4 from quick-witted case 1 inside, refer to fig. 3 and 5, board card assembly 4 still includes plug ware 43, the edge that guide post 41 one side was kept away from to second samming board 44 has been seted up and has been dodged groove 42, dodged the inslot and be provided with plug ware 43 through the torsional spring, rotate plug ware 43, give torsional spring torsion for plug ware 43 wherein the expansion end of longer part shifts out and dodges groove 42, the staff of being convenient for grasps, then drive board card assembly 4 and shift out, loosen plug ware 43, under torsional spring resilience elasticity effect, make plug ware 43 resume initial position.

In order to reduce the weight of the case 1, a plurality of groups of heat dissipation grooves 3 are formed in one side of the case 1, referring to fig. 1, 2 and 3, the heat dissipation grooves 3 are used for communicating the interior of the case 1 with the outside to form a second heat dissipation channel, and the heat dissipation area is increased and the heat dissipation capacity is increased through the heat dissipation grooves 3, so that the temperature of the case 1 is better kept.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims (5)

1. The utility model provides a samming heat dissipation machine case which characterized in that includes:

the device comprises a case (1), wherein an accommodating space is formed in the case (1), and openings (11) communicated with the accommodating space are formed in two sides of the case;

the first temperature equalizing plate (2) is provided with two groups, and is respectively provided with opening parts (11) at two sides of the case (1), a plurality of groups of protrusions (21) are extended from the side wall of the first temperature equalizing plate (2) to the inside of the accommodating space, and limit grooves are formed between two groups of adjacent protrusions (21);

the integrated circuit board subassembly (4), be provided with the multiunit, multiunit integrated circuit board subassembly (4) and spacing groove one-to-one block, multiunit integrated circuit board subassembly (4) will accommodation space separates and forms a plurality of sub-accommodation spaces for place the PCB board, integrated circuit board subassembly (4) include second samming board (44), second samming board (44) one side is hugged closely with the PCB, extension (441) with protruding (21) laminating are extended to second samming board (44) both sides, second samming board (44) are collected the heat that the PCB produced and are conducted for behind the heat collection for first samming board (2), first samming board (2) and external intercommunication heat dissipation form first heat dissipation channel.

2. The uniform temperature heat dissipation chassis according to claim 1, wherein: and a mounting opening (12) is formed in one side of the side wall of the case (1) adjacent to the two groups of opening parts (11), and the mounting opening (12) is detachably connected with the organic cover through bolts.

3. The uniform temperature heat dissipation chassis according to claim 2, wherein: the integrated circuit board subassembly (4) still including set up in wedge latch bar (45) of extension (441) one side and set up in two sets of guide posts (41) of second samming board (44) one end, guide post (41) are moved along the spacing groove through installing port (12) and are made wedge latch bar (45) get into, will wedge latch bar (45) are screwed up, control it is tight with protruding (21) laminating of spacing groove one side and extension (441) and protruding (21) laminating heat conduction of spacing groove opposite side.

4. A heat sink case according to claim 3, wherein: the integrated circuit board subassembly (4) still includes plug ware (43), dodge groove (42) has been seted up to the edge that second samming board (44) kept away from guide post (41) one side, dodge to be provided with plug ware (43) through the torsional spring in groove (42).

5. The uniform temperature heat dissipation chassis according to claim 1, wherein: a plurality of groups of heat dissipation grooves (3) are formed in one side of the case (1), and the heat dissipation grooves (3) are used for communicating the inside of the case (1) with the outside to form a second heat dissipation channel.