CN219395129U - Single-layer printed circuit board - Google Patents

Abstract

The utility model discloses a single-layer printed circuit board, which comprises a substrate, wherein an electrifying component and a radiating structure are respectively arranged on the upper surface and the lower surface of the substrate, a plurality of groups of mounting holes are arranged on the edge of the surface of the substrate, the radiating efficiency of the substrate is improved through a radiating groove and a heat conducting strip which are arranged on the substrate, in the use process, the heat generated by the circuit board can be rapidly led out through the substrate, the radiating groove and the heat conducting strip, the heat conducting strip and the heat conducting strip increase the contact area between the substrate and air, the fixing component is fixedly connected with the substrate, the fixing component comprises a connecting component, the connecting component is spliced with the corresponding mounting holes, three mounting modes are provided for mounting the circuit board, the circuit board is prevented from being broken during mounting, the circuit board is not easy to damage, the substrate is prevented from being too high in temperature, the circuit board is prevented from aging, and the service life is prolonged.

Description

Single-layer printed circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a single-layer printed circuit board.

Background

The aluminum substrate is made of aluminum materials with good heat dissipation performance and is adopted by a plurality of high-heat power consumption circuits, but the aluminum substrate is used as a circuit board, an insulating layer and an anti-corrosion layer are inevitably required to be added, the heat conduction performance of the material of the insulating layer is very poor, the heat generated by the circuit and components of the aluminum substrate is difficult to be conducted to the aluminum part of the aluminum substrate at high efficiency in the actual application process of the aluminum substrate, the heat dissipation performance is not fully exerted, the service life of the internal circuit is also synchronously reduced due to aging blocks, in addition, the circuit board is fixed and connected by a plurality of screws, the screws are easily worn on the circuit board, the anti-corrosion layer of the circuit board is damaged, and when screw holes are formed in corners of the circuit board, the circuit board is easily broken.

Accordingly, in view of the above, research and improvement are made to the existing structure and the existing defects, and a single-layer printed circuit board is provided to achieve the purpose of having more practical value.

Disclosure of Invention

The present utility model is directed to a single-layer printed circuit board, which solves the above-mentioned problems of the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the single-layer printed circuit board comprises a substrate, wherein the substrate is made of aluminum, the advantages of light weight and good heat conduction performance of aluminum are utilized, an energizing assembly and a heat dissipation structure are respectively arranged on the upper surface and the lower surface of the substrate, and a plurality of groups of mounting holes are formed in the edge of the surface of the substrate, and the heat dissipation structure enables the substrate to maintain high-efficiency heat dissipation efficiency;

the fixing assembly is fixedly connected with the substrate and comprises a connecting assembly, and the connecting assembly is spliced with the corresponding mounting hole to realize detachable connection of the fixing assembly and the substrate.

Further, the power-on assembly comprises a copper foil layer, wherein a protective layer and an insulating layer are respectively arranged on the upper surface and the lower surface of the copper foil layer, the insulating layer is attached to the upper surface of the substrate, the thickness of the insulating layer is 100um, the copper foil layer is separated from the substrate, and the heat dissipation of the substrate is not seriously affected.

Further, the heat radiation structure comprises a plurality of groups of heat radiation grooves and a plurality of groups of heat conduction strips, the heat radiation grooves are formed in the surface of the substrate, the heat conduction strips and the substrate are integrally formed, the heat conduction strips are staggered with the groups of heat radiation grooves, and the heat radiation effect of the substrate is improved.

Further, fixed subassembly includes the bent plate and with bent plate integrated into one piece's orifice plate, and the bent plate is L shape setting, the screw has been inserted to inside the orifice plate, the bent plate is attached on the base plate surface, coupling assembling include anticreep head and with anticreep head integrated into one piece's barb, the anticreep pipe has been cup jointed on the barb surface, anticreep pipe and bent plate fixed connection, inside the card hole that is equipped with of anticreep pipe, the barb card advances card hole inside.

Further, the inside of mounting hole inserts by the rubber sleeve, and the rubber sleeve protects the base plate, avoids the base plate wearing and tearing, base plate surface edge is equipped with a plurality of groups of opening, and the opening is semi-circular setting.

Compared with the prior art, the utility model has the beneficial effects that: according to the utility model, the heat dissipation efficiency of the substrate is improved through the heat dissipation grooves and the heat conduction strips arranged on the substrate, and in the use process, heat generated by the circuit board can be rapidly led out through the substrate, the heat dissipation grooves and the heat conduction strips, the heat conduction strips and the heat dissipation grooves increase the contact area between the substrate and air, so that the substrate temperature is prevented from being too high, the circuit board is prevented from aging, and the service life is prolonged;

the utility model provides three mounting modes for mounting the circuit board, the nondestructive mounting of the circuit board can be realized by using the screws and the pore plates, the nondestructive mounting of the circuit board can also be realized by using the rubber sleeve after the curved plate is detached, the circuit board can be clamped through the semicircular notch, the circuit board is prevented from being broken during mounting, and the circuit board is not easy to damage.

Drawings

FIG. 1 is a top view of the present utility model;

FIG. 2 is a cross-sectional view of the present utility model;

fig. 3 is a schematic structural view of the connection between the anti-drop tube and the anti-drop head according to the present utility model.

In the figure: 1. a substrate; 2. a notch; 3. a mounting hole; 4. a rubber sleeve; 5. a bending plate; 6. an orifice plate; 7. an anti-falling pipe; 8. a screw; 9. an insulating layer; 10. a copper foil layer; 11. a protective layer; 12. a heat sink; 13. a heat conducting strip; 14. an anti-head release; 15. a barb; 16. and (5) clamping the hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the single-layer printed circuit board comprises a substrate 1, wherein an energizing component and a heat dissipation structure are respectively arranged on the upper surface and the lower surface of the substrate 1, the energizing component and the substrate 1 are combined into the circuit board, and a plurality of groups of mounting holes 3 are formed in the edge of the surface of the substrate 1 so as to be convenient for fixing the substrate 1;

the fixing component is fixedly connected with the substrate 1 and is used for propping against the substrate 1, and the fixing component comprises a connecting component which is spliced with the corresponding mounting hole 3 to realize the connection between the substrate 1 and the fixing component;

the power-on assembly comprises a copper foil layer 10, wherein the copper foil layer 10 is processed to form a linear conductive path, a protective layer 11 and an insulating layer 9 are respectively arranged on the upper surface and the lower surface of the copper foil layer 10, the insulating layer 9 is attached to the upper surface of the substrate 1, the protective layer 11 prevents the copper foil layer 10, the service life of the copper foil layer 10 is prolonged, and the insulating layer 9 prevents the copper foil layer 10 from being electrically connected with the substrate 1;

the heat dissipation structure comprises a plurality of groups of heat dissipation grooves 12 and a plurality of groups of heat conduction strips 13, wherein the heat dissipation grooves 12 are formed in the surface of the substrate 1, the heat conduction strips 13 and the substrate 1 are integrally formed, and the heat conduction strips 13 play a role in heat conduction on the surface of the substrate 1, so that the heat dissipation effect of the substrate 1 is improved;

the fixing assembly comprises a bending plate 5 and a hole plate 6 integrally formed with the bending plate 5, screws 8 are inserted into the hole plate 6, the bending plate 5 is attached to the surface of the base plate 1, and the base plate 1 is prevented from shaking when the base plate 1 is installed;

the connecting assembly comprises an anti-falling head 14 and a barb 15 integrally formed with the anti-falling head 14, wherein an anti-falling pipe 7 is sleeved on the surface of the barb 15, the anti-falling pipe 7 is fixedly connected with the bent plate 5, a clamping hole 16 is formed in the anti-falling pipe 7, and when the barb 15 is clamped into the clamping hole 16, the anti-falling head 14 and the anti-falling pipe 7 are matched to clamp the substrate 1;

the inside of mounting hole 3 inserts by rubber sleeve 4, and rubber sleeve 4 has the effect of insulating and protecting base plate 1, 1 surface edge of base plate is equipped with a plurality of groups of opening 2, conveniently blocks base plate 1.

Specifically, when the circuit board is electrified and heated during use, heat is transferred to the substrate 1, and the plurality of groups of heat dissipation grooves 12 and the plurality of groups of heat conduction strips 13 on the surface of the substrate 1 ensure that the substrate 1 is of a concave-convex structure, the contact surface with air is larger, the heat can be dissipated more quickly along the heat conduction strips 13, the circuit board is prevented from being in a high-temperature state, ageing is prevented, and the service life is prolonged;

when the circuit board is installed, the corresponding screws and the surface mounting holes 3 of the base plate 1 are utilized to fix the circuit board, the rubber sleeve 4 is inserted into the mounting holes 3, and the screws penetrate through the rubber sleeve 4 and cannot abrade the circuit board; the circuit board can be pressed by the corresponding screws and the openings 2 on the surface of the base plate 1, and the circuit board is not easy to wear; the anti-drop tube 7 is inserted into the rubber sleeve 4, the barb 15 is inserted into the anti-drop tube 7 and is clamped with the clamping hole 16, connection of the circuit board and the bent plate 5 is completed, the circuit board can be fixed through the screw 8 and the pore plate 6, and the circuit board cannot be damaged.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A single layer printed circuit board, characterized in that: the LED lamp comprises a substrate (1), wherein the upper surface and the lower surface of the substrate (1) are respectively provided with an electrifying component and a radiating structure, and the edge of the surface of the substrate (1) is provided with a plurality of groups of mounting holes (3);

the fixing assembly is fixedly connected with the substrate (1) and comprises a connecting assembly, and the connecting assembly is spliced with the corresponding mounting hole (3);

the fixing assembly comprises a bending plate (5) and a pore plate (6) integrally formed with the bending plate (5), screws (8) are inserted into the pore plate (6), and the bending plate (5) is attached to the surface of the base plate (1).

2. A single layer printed circuit board as claimed in claim 1 wherein: the power-on assembly comprises a copper foil layer (10), wherein a protective layer (11) and an insulating layer (9) are respectively arranged on the upper surface and the lower surface of the copper foil layer (10), and the insulating layer (9) is attached to the upper surface of the substrate (1).

3. A single layer printed circuit board as claimed in claim 1 wherein: the heat dissipation structure comprises a plurality of groups of heat dissipation grooves (12) and a plurality of groups of heat conduction strips (13), wherein the heat dissipation grooves (12) are formed in the surface of the base plate (1), and the heat conduction strips (13) and the base plate (1) are integrally formed.

4. A single layer printed circuit board as claimed in claim 1 wherein: the connecting assembly comprises an anti-falling head (14) and a barb (15) integrally formed with the anti-falling head (14), an anti-falling pipe (7) is sleeved on the surface of the barb (15), the anti-falling pipe (7) is fixedly connected with the bent plate (5), and a clamping hole (16) is formed in the anti-falling pipe (7).

5. A single layer printed circuit board as claimed in claim 1 wherein: the mounting hole (3) is internally inserted with a rubber sleeve (4), and a plurality of groups of openings (2) are formed in the edge of the surface of the substrate (1).