CN219392975U - Conductive material and conductive device - Google Patents
Conductive material and conductive device Download PDFInfo
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- CN219392975U CN219392975U CN202320194697.5U CN202320194697U CN219392975U CN 219392975 U CN219392975 U CN 219392975U CN 202320194697 U CN202320194697 U CN 202320194697U CN 219392975 U CN219392975 U CN 219392975U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The application discloses electrically conductive material and electrically conductive device, wherein, this electrically conductive material includes: the conductive adhesive comprises conductive adhesive and first insulating adhesive, wherein the first insulating adhesive surrounds the outer contour of the conductive adhesive, and the thickness of the first insulating adhesive is smaller than that of the conductive adhesive. The conductive device includes: the device comprises conductive adhesive, first insulating adhesive, a first metal plate and a second metal plate, wherein the first insulating adhesive is arranged around the outer contour of the conductive adhesive, and the thickness of the first insulating adhesive is smaller than that of the conductive adhesive; the upper surface and the lower surface of the conductive adhesive are respectively connected with the first metal plate and the second metal plate. The method and the device solve the technical problem that metal deformation is easy to cause in the process of reducing the metal nonlinearity generation probability by increasing the metal interface pressure.
Description
Technical Field
The present application relates to the field of conductive materials, and in particular, to a conductive material and a conductive device.
Background
The existing conductive adhesive is feasible in terms of supporting the conductivity of a metal interface, but is easy to cause metal nonlinearity problem, especially in mass production, the product consistency problem is easy to cause, and the product consistency problem is easy to cause the improvement of the repair rate of the product.
At present, a mode of increasing the pressure between metal interfaces is generally adopted to reduce the probability of metal nonlinearity. However, there is a certain upper limit value for the pressure between the lifting metals, and after exceeding the upper limit value, the metal is easy to deform, and the integral product structural design is influenced, so that the miniaturization of the product is not facilitated.
In view of the above problems, no effective solution has been proposed at present.
Disclosure of Invention
The embodiment of the application provides a conductive material and a conductive device, which at least solve the technical problem that metal deformation is easy to cause in the process of reducing the metal nonlinear generation probability by increasing the metal interface pressure.
According to one aspect of embodiments of the present application, there is provided a conductive material comprising: the conductive adhesive and the first insulating adhesive are arranged around the outer contour of the conductive adhesive, and the thickness of the first insulating adhesive is smaller than that of the conductive adhesive.
Optionally, the first insulating glue is disposed around an outer contour of the conductive glue, including one of the following arrangements: the first insulating glue is arranged continuously around the outer contour of the conductive glue; the first insulating glue gap is disposed around the outer contour of the conductive glue.
Optionally, in the case that the first insulating glue is continuously disposed around the outer contour of the conductive glue, the area of the first insulating glue is the first area; in the case that the first insulating glue is arranged around the outer contour of the conductive glue at intervals, the area of the first insulating glue is a second area, wherein the second area is larger than or equal to the first area.
Optionally, the conductive adhesive and the first insulating adhesive are both double-sided adhesive tapes.
Optionally, the conductive paste includes: the device comprises a second insulating glue and a plurality of conductive particles, wherein the conductive particles are distributed in the second insulating glue.
According to another aspect of the embodiments of the present application, there is further provided a conductive device, a conductive adhesive, a first insulating adhesive, a first metal plate, and a second metal plate, wherein the first insulating adhesive is disposed around an outer contour of the conductive adhesive, and a thickness of the first insulating adhesive is smaller than a thickness of the conductive adhesive; the upper and lower surfaces of the conductive adhesive are respectively connected with the first metal plate and the second metal plate.
Optionally, the first insulating glue is disposed around an outer contour of the conductive glue, including one of the following arrangements: the first insulating glue is arranged continuously around the outer contour of the conductive glue; the first insulating glue gap is disposed around the outer contour of the conductive glue.
Optionally, in the case that the first insulating glue is continuously disposed around the outer contour of the conductive glue, the area of the first insulating glue is the first area; in the case that the first insulating glue is arranged around the outer contour of the conductive glue at intervals, the area of the first insulating glue is a second area, wherein the second area is larger than or equal to the first area.
Optionally, the conductive adhesive and the first insulating adhesive are both double-sided adhesive tapes.
Optionally, the conductive paste includes: the device comprises a second insulating glue and a plurality of conductive particles, wherein the conductive particles are distributed in the second insulating glue.
In an embodiment of the present application, there is provided a conductive material including: the conductive adhesive and the first insulating adhesive are arranged around the outer contour of the conductive adhesive, the thickness of the first insulating adhesive is smaller than that of the conductive adhesive, the insulating adhesive is arranged on the outer contour of the conductive adhesive, and the thickness of the insulating adhesive is smaller than that of the conductive adhesive, so that the purpose of protecting metal and the conductive adhesive is achieved, the technical effect that metal deformation cannot be caused in the process of increasing the metal interface pressure to realize low-probability metal nonlinearity is achieved, and the technical problem that metal deformation is easy to cause in the process of reducing the metal nonlinearity generation probability in the mode of increasing the metal interface pressure is solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
fig. 1 is a schematic structural view of a conductive device according to the related art;
fig. 2 is a schematic structural view of another conductive device according to the related art;
FIG. 3 is a schematic diagram of a conductive material according to an embodiment of the present application;
FIG. 4 is a schematic structural view of another conductive material according to an embodiment of the present application;
fig. 5 is a schematic structural view of a conductive device according to an embodiment of the present application;
fig. 6 is a schematic structural view of a conductive paste according to an embodiment of the present application.
Detailed Description
In order to make the present application solution better understood by those skilled in the art, the following description will be made in detail and with reference to the accompanying drawings in the embodiments of the present application, it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, shall fall within the scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
For better understanding of the embodiments of the present application, technical terms related in the embodiments of the present application are explained below:
metal nonlinearity: the electrical property, metal nonlinearity and material property of the material and the connection condition of contact surfaces between the materials are closely related, and when the material is irradiated by a power signal, various subharmonics can be generated, so that the radiation of a product exceeds the standard, and the compliance of the product is invalid.
The product consistency refers to the fact that the verified products produced in batches by the verification enterprises are basically consistent with the samples qualified by the pattern test, and are mainly consistent in structure, key parts and nameplates.
In the related art, the probability of metal nonlinearity is generally reduced by increasing the pressure between metal interfaces, that is, as shown in fig. 1, fig. 1 is a schematic structural diagram of a conductive device according to the related art, and in fig. 1, the current-through capability of the conductive adhesive 1 is improved by increasing the pressure between the metal plate a and the metal plate B, so as to further realize low-probability metal nonlinearity.
However, there is a certain upper limit value for increasing the pressure between the metal plate a and the metal plate B, beyond which the metal plate a and/or the metal plate B is easily deformed, and fig. 2 is a schematic structural diagram of another conductive device according to the related art, as shown in fig. 2, the metal plate a is deformed to a certain extent, so that other functions of the conductive device are affected, for example, the conductive adhesive 1 is exposed after the metal plate a is deformed, and the electrical characteristics of the conductive adhesive 1 are changed.
In addition, in the process of increasing the pressure between the metal a plate and the metal B plate, a large torque and a large screw are required, which is not beneficial to the miniaturization design of the whole product.
In summary, in the related art, the probability of metal nonlinearity problem is reduced by increasing the pressure between the metal plate a and the metal plate B, which is liable to cause metal deformation, failing to meet the design requirement; and influence holistic product structural design, be unfavorable for the product miniaturization. In order to solve this problem, related solutions are provided in the embodiments of the present application, and are described in detail below.
Fig. 3 is a schematic structural view of a conductive material according to an embodiment of the present application, as shown in fig. 3, the conductive material includes: the conductive adhesive 1 and the first insulating adhesive 2, wherein the first insulating adhesive 2 is arranged around the outer contour of the conductive adhesive 1, and the thickness of the first insulating adhesive 2 is smaller than that of the conductive adhesive 1.
In an embodiment, the first insulating glue 2 is continuously arranged around the outer contour of the conductive glue 1. Of course as will be appreciated by those skilled in the art,
according to an alternative embodiment of the present application, the first insulating glue 2 is continuously wrapped around a certain width at the outer contour of the conductive glue 1, wherein the thickness of the first insulating glue 2 is smaller than the thickness of the conductive glue 1. For example, the first insulating paste 2 having a width of 2mm is continuously surrounded on the outer contour of the conductive paste 1, and the thickness of the first insulating paste 2 is 0.02mm less than that of the conductive paste 1.
The technical scheme provided by the application can optimize the metal nonlinearity problem of the metal interface on the basis of realizing the current capacity of the metal plate A and the metal plate B, and is a design for realizing the compliance of electromagnetic compatibility (Electromagnetic compatibility, EMC) of equipment. Compared with the prior art, the method can realize the problem of low-probability metal nonlinearity, improves the one-time passing rate of products, reduces the cost of the products, and is particularly characterized in the following aspects:
when the application scenario of fig. 2 appears, the pressure applied between the metal plate a and the metal plate B causes the conductive adhesive to be deformed under pressure, and the insulating adhesive contacts the metal plate a and the metal plate B, at this time, the insulating adhesive and the conductive adhesive are connected with the metal plate a and the metal plate B, and the pressure applied on the conductive adhesive by the metal plate can be improved due to the thinner insulating adhesive and the adhesive force generated between the metal plates.
When the pressure between the metal plate A and the metal plate B fluctuates or is reduced, the adhesive force of the insulating adhesive can ensure that the pressure born by the conductive adhesive is within an acceptable range, and the non-linearity of metal is avoided.
When the pressure between the metal plate A and the metal plate B fluctuates or rises, the insulating adhesive and the conductive adhesive bear the pressure between the metal plate A and the metal plate B together, and the conductive performance of the conductive adhesive is not affected.
When metal sheet A and metal sheet B are softer metal film, when checking and maintenance, perk easily, but adopt this application to put forward technical scheme, the edge of perk is the edge of insulating glue, and the conducting resin can be got up by the protection well.
In summary, through setting up the first insulating glue 2 that surrounds electrically conductive glue 1 in succession at the outer profile of electrically conductive glue 1, can reduce the probability that the metal nonlinearity produced on the basis of realizing basic conductive properties, promoted the interface pressure of electrically conductive glue 1 simultaneously, i.e. this application provides the "locking" function that comes from first insulating glue 2, this very big promotion product's uniformity has realized extremely low repair rate simultaneously.
According to an alternative embodiment of the present application, the conductive adhesive 1 and the first insulating adhesive 2 are both double-sided adhesive.
For example, the first surface of the conductive paste 1 is connected to the release paper, the second surface of the conductive paste 1 is connected to the release paper, and likewise, the first surface of the first insulating paste 2 is connected to the release paper, and the second surface of the first insulating paste 2 is connected to the release paper. In the use process, the release paper connected with the first surface or the second surface of the conductive adhesive 1 is uncovered by bare hands or by using a tool, and the release paper connected with the first surface or the second surface of the first insulating adhesive 2 is uncovered. It should be noted that the spacer paper serves to isolate the gel portion of the conductive paste 1 from the outside and isolate the gel portion of the first insulating paste 2 from the outside, and the spacer medium includes, but is not limited to, paper.
Specifically, firstly, the release paper on the first surface of the conductive adhesive 1 is uncovered, then the release paper on the first surface of the first insulating adhesive 2 is uncovered, and the first surface of the conductive adhesive 1 is adhered to the first metal plate; and secondly, uncovering the isolating paper on the second surface of the conductive adhesive 1, uncovering the isolating paper on the second surface of the first insulating adhesive 2, and adhering the second surface of the conductive adhesive 1 to the second metal plate.
According to another alternative embodiment of the present application, the conductive paste 1 includes: the device comprises a second insulating glue 5 and a plurality of conductive particles 6, wherein the plurality of conductive particles 6 are distributed in the second insulating glue 5.
As shown in fig. 6, a plurality of conductive particles 6 are distributed in the second insulating paste 5 to constitute the conductive paste 1, wherein the conductive particles 6 include, but are not limited to: nickel particles. Note that the number of conductive particles 6 in fig. 6 is merely illustrative.
Fig. 4 is a schematic structural view of another conductive material according to an embodiment of the present application, as shown in fig. 4, including: the conductive adhesive 1 and the first insulating adhesive 2, wherein the first insulating adhesive 2 is arranged around the outer contour of the conductive adhesive 1, and the thickness of the first insulating adhesive 2 is smaller than that of the conductive adhesive 1.
In the present embodiment, the first insulating paste 2 is disposed around the outer contour of the conductive paste 1 at intervals.
According to an alternative embodiment of the present application, the first insulating glue 2 is spaced around a certain width at the outer contour of the conductive glue 1, wherein the thickness of the first insulating glue 2 is smaller than the thickness of the conductive glue 1. For example, the first insulating paste 2 having a width of 2.5mm is continuously surrounded on the outer contour of the conductive paste 1, and the thickness of the first insulating paste 2 is 0.02mm less than that of the conductive paste 1.
Note that, the manner in which the outer contour of the conductive paste 1 is spaced around the first insulating paste 2 having a certain width is not limited to the manner shown in fig. 4, and it is only necessary to keep the first insulating paste 2 spaced around the outer contour of the conductive paste 1. However, when the first insulating paste 2 is disposed around the outer contour of the conductive paste 1 at intervals, it is necessary to ensure that the area of the first insulating paste 2 at this time is not smaller than that of the first insulating paste 2 when the first insulating paste 2 is disposed continuously around the outer contour of the conductive paste 1.
In summary, by arranging the first insulating glue 2 around the conductive glue 1 at intervals on the outer contour of the conductive glue 1, the probability of non-linear generation of metal can be reduced on the basis of realizing basic conductive performance, and meanwhile, the interface pressure of the conductive glue 1 is improved.
According to an alternative embodiment of the present application, in the case where the first insulating paste 2 is continuously disposed around the outer contour of the conductive paste 1, the area of the first insulating paste 2 is a first area; in the case where the first insulating paste 2 is disposed around the outer contour of the conductive paste 1 at intervals, the area of the first insulating paste 2 is a second area, wherein the second area is greater than or equal to the first area.
When the first insulating glue 2 is arranged around the outer contour of the conductive glue 1 at intervals, the area of the first insulating glue 2 is larger than or equal to the area of the first insulating glue 2 when the first insulating glue 2 is arranged around the outer contour of the conductive glue 1 continuously, so that the adhesive force of the first insulating glue 2 is ensured, and further the technical effects of improving the consistency of products and reducing the repair rate of the products are achieved.
According to another alternative embodiment of the present application, the conductive adhesive 1 and the first insulating adhesive 2 are both double-sided adhesive.
For example, the first surface of the conductive paste 1 is connected to the release paper, the second surface of the conductive paste 1 is connected to the release paper, and likewise, the first surface of the first insulating paste 2 is connected to the release paper, and the second surface of the first insulating paste 2 is connected to the release paper. In a specific use process, the release paper connected with the first surface or the second surface of the conductive adhesive 1 is uncovered by bare hands or by using a tool, and the release paper connected with the first surface or the second surface of the first insulating adhesive 2 is uncovered. It should be noted that the spacer paper serves to isolate the gel portion of the conductive paste 1 from the outside and isolate the gel portion of the first insulating paste 2 from the outside, and the spacer medium includes, but is not limited to, paper.
Specifically, firstly, the release paper on the first surface of the conductive adhesive 1 is uncovered, and then the release paper on the first surface of the first insulating adhesive 2 is uncovered, so that the first surface of the conductive adhesive 1 is adhered to a first object; and secondly, uncovering the release paper on the second surface of the conductive adhesive 1, uncovering the release paper on the second surface of the first insulating adhesive 2, and adhering the second surface of the conductive adhesive 1 to a second object.
In some alternative embodiments of the present application, the conductive paste comprises: the device comprises a second insulating glue 5 and a plurality of conductive particles 6, wherein the plurality of conductive particles 6 are distributed in the second insulating glue 5.
As shown in fig. 6, a plurality of conductive particles 6 are distributed in the second insulating paste 5 to constitute the conductive paste 1, wherein the conductive particles 6 include, but are not limited to: nickel particles. Note that the number of conductive particles 6 in fig. 6 is merely illustrative.
Fig. 5 is a schematic structural view of a conductive device according to an embodiment of the present application, as shown in fig. 5, the conductive device includes: the conductive adhesive 1, the first insulating adhesive 2, the first metal plate 3 and the second metal plate 4, wherein the first insulating adhesive 2 is arranged around the outer contour of the conductive adhesive 1, and the thickness of the first insulating adhesive 2 is smaller than that of the conductive adhesive 1; the upper and lower surfaces of the conductive adhesive 1 are respectively connected with the first metal plate 3 and the second metal plate 3.
In the structural schematic diagram of the conductive device shown in fig. 5, an increase in pressure between the metal plate 3 and the metal plate 4 causes the conductive paste 1 to be deformed by pressure, and when the pressure between the metal plate 3 and the metal plate 4 increases to some extent, the first insulating paste 2 comes into contact with the metal plate 3 and the metal plate 4. At this time, the first insulating adhesive 2 and the conductive adhesive 1 are both connected with the metal plate 3 and the metal plate 4, and the adhesive force generated between the first insulating adhesive 2 and the metal plate 3 and between the first insulating adhesive 2 and the metal plate 4 can raise the pressure applied on the conductive adhesive 1 by the metal plate 3 and the metal plate 4 due to the thinner thickness of the first insulating adhesive 2.
By combining the analysis of fig. 1 and fig. 2, the conductive device provided by the application can reduce metal nonlinearity between metal plates of wireless products, realize effective protection of the metal plates by using the first insulating adhesive 2, and increase extremely limited cost on the basis of simple and feasible technical realization. The main aspects are as follows:
when the pressure between the metal plate 3 and the metal plate 4 is reduced, the adhesion force of the first insulating paste 2 can ensure that the pressure to which the conductive paste 1 is subjected is within an acceptable range. It should be noted that when the pressure to which the conductive paste 1 is subjected is within the limit range, the generation of the metal plate nonlinearity can be avoided.
When the pressure between the metal plate 3 and the metal plate 4 is increased, the first insulating paste 2 and the conductive paste 1 are commonly subjected to the pressure between the metal plate 3 and the metal plate 4, and at this time, the conductive performance of the conductive paste 1 is not affected.
When the metal plate 3 and the metal plate 4 are softer metal films, the metal films are easy to tilt when being inspected and maintained, but by adopting the technical scheme provided by the application, the tilted edges are edges of insulating glue, and the conductive glue can be well protected.
As an alternative embodiment of the present application, the first insulating paste 2 is disposed around the outer contour of the conductive paste 1, including one of the following arrangements: the first insulating paste 2 is continuously disposed around the outer contour of the conductive paste 1; the first insulating paste 2 is spaced around the outer contour of the conductive paste 1.
According to an alternative embodiment of the present application, the first insulating glue 2 is continuously wrapped around a certain width at the outer contour of the conductive glue 1, wherein the thickness of the first insulating glue 2 is smaller than the thickness of the conductive glue 1. For example, the first insulating paste 2 having a width of 2mm is continuously surrounded on the outer contour of the conductive paste 1, and the thickness of the first insulating paste 2 is 0.02mm less than that of the conductive paste 1.
In the embodiment shown in fig. 3, the first insulating glue 2 is continuously arranged around the outer contour of the conductive glue 1. In the embodiment shown in fig. 4, the first insulating glue 2 is arranged at intervals around the outer contour of the conductive glue 1.
It should be noted that, in any of the above modes, the first insulating adhesive 2 is disposed around the outer contour of the conductive adhesive 1, and the thickness of the first insulating adhesive 2 is smaller than the thickness of the conductive adhesive 1.
In some alternative embodiments of the present application, in the case where the first insulating paste 2 is continuously disposed around the outer contour of the conductive paste 1, the area of the first insulating paste 2 is a first area; in the case where the first insulating paste 2 is disposed around the outer contour of the conductive paste at intervals, the area of the first insulating paste 2 is a second area, wherein the second area is greater than or equal to the first area.
When the first insulating glue 2 is arranged around the outer contour of the conductive glue 1 at intervals, the area of the first insulating glue 2 is not smaller than the area of the first insulating glue 2 when the first insulating glue 2 is arranged around the outer contour of the conductive glue 1 continuously, so that the adhesive force of the first insulating glue 2 is ensured, and further the technical effects of improving the product consistency and reducing the product repair rate are achieved.
As another alternative embodiment of the present application, the conductive adhesive 1 and the first insulating adhesive 2 are both double-sided adhesive.
For example, the first surface of the conductive paste 1 is connected to the release paper, the second surface of the conductive paste 1 is connected to the release paper, and likewise, the first surface of the first insulating paste 2 is connected to the release paper, and the second surface of the first insulating paste 2 is connected to the release paper. In the use process, the release paper connected with the first surface or the second surface of the conductive adhesive 1 is uncovered by bare hands or by using a tool, and the release paper connected with the first surface or the second surface of the first insulating adhesive 2 is uncovered. It should be noted that the spacer paper serves to isolate the gel portion of the conductive paste 1 from the outside and isolate the gel portion of the first insulating paste 2 from the outside, and the spacer medium includes, but is not limited to, paper.
Specifically, firstly, after the release paper on the first surface of the conductive adhesive 1 is uncovered, the release paper on the first surface of the first insulating adhesive 2 is uncovered, and the first surface of the conductive adhesive 1 is adhered to the metal A; secondly, the release paper on the second surface of the conductive adhesive 1 is uncovered, the release paper on the second surface of the first insulating adhesive 2 is uncovered, and the second surface of the conductive adhesive 1 is adhered to the metal B.
In an alternative embodiment, the conductive paste 1 includes: the device comprises a second insulating glue 5 and a plurality of conductive particles 6, wherein the plurality of conductive particles 6 are distributed in the second insulating glue 5.
As shown in fig. 6, a plurality of conductive particles 6 are distributed in the second insulating paste 5 to constitute the conductive paste 1, wherein the conductive particles 6 include, but are not limited to: nickel particles. Note that the number of conductive particles 6 in fig. 6 is merely illustrative.
The method and the device can optimize the metal nonlinearity problem of the metal interface on the basis of ensuring the current flowing capability between the metal plates, and are innovative designs for realizing the electromagnetic compatibility of equipment. Compared with the prior art, the technical scheme provided by the application can reduce the probability of metal nonlinearity, and is adopted in more and more high-power wireless products. In addition, because the insulating glue is adopted around the conductive glue to wrap the metal plate, the metal plate is easy to warp, and the deformed place appears in the insulating area, so that the electrical property of the conductive glue cannot be changed, the technical scheme is adopted, the once-through rate of the product can be improved, and the cost of the product is effectively reduced.
The foregoing embodiment numbers of the present application are merely for describing, and do not represent advantages or disadvantages of the embodiments.
In the foregoing embodiments of the present application, the descriptions of the embodiments are emphasized, and for a portion of this disclosure that is not described in detail in this embodiment, reference is made to the related descriptions of other embodiments.
In the several embodiments provided in the present application, it should be understood that the disclosed technology content may be implemented in other manners. The above-described embodiments of the apparatus are merely exemplary, and the division of the units, for example, may be a logic function division, and may be implemented in another manner, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some interfaces, units or modules, or may be in electrical or other forms.
The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application and are intended to be comprehended within the scope of the present application.
Claims (8)
1. An electrically conductive material, comprising: conductive adhesive and first insulating adhesive, wherein,
the first insulating glue is arranged around the outer contour of the conductive glue, and the thickness of the first insulating glue is smaller than that of the conductive glue.
2. The conductive material of claim 1, wherein the first insulating gel is disposed around an outer contour of the conductive gel, comprising one of:
the first insulating glue is continuously arranged around the outer contour of the conductive glue;
the first insulating glue gap is disposed around an outer contour of the conductive glue.
3. The conductive material of claim 2, wherein,
the area of the first insulating glue is a first area under the condition that the first insulating glue is continuously arranged around the outer contour of the conductive glue;
and under the condition that the first insulating glue is arranged at intervals around the outer contour of the conductive glue, the area of the first insulating glue is a second area, wherein the second area is larger than or equal to the first area.
4. The conductive material of claim 1, wherein the conductive material is a conductive material,
the conductive adhesive and the first insulating adhesive are double-sided adhesive tapes.
5. A conductive device, comprising: the device comprises conductive adhesive, first insulating adhesive, a first metal plate and a second metal plate, wherein,
the first insulating glue is arranged around the outer contour of the conductive glue, and the thickness of the first insulating glue is smaller than that of the conductive glue;
the upper surface and the lower surface of the conductive adhesive are respectively connected with the first metal plate and the second metal plate.
6. The conductive device of claim 5, wherein the first insulating gel is disposed around an outer contour of the conductive gel, comprising one of:
the first insulating glue is continuously arranged around the outer contour of the conductive glue;
the first insulating glue gap is disposed around an outer contour of the conductive glue.
7. The apparatus of claim 6, wherein the conductive element comprises a conductive element,
the area of the first insulating glue is a first area under the condition that the first insulating glue is continuously arranged around the outer contour of the conductive glue;
and under the condition that the first insulating glue is arranged at intervals around the outer contour of the conductive glue, the area of the first insulating glue is a second area, wherein the second area is larger than or equal to the first area.
8. The conductive device of claim 5, wherein the conductive element comprises a conductive element,
the conductive adhesive and the first insulating adhesive are double-sided adhesive tapes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320194697.5U CN219392975U (en) | 2023-01-18 | 2023-01-18 | Conductive material and conductive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320194697.5U CN219392975U (en) | 2023-01-18 | 2023-01-18 | Conductive material and conductive device |
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| Publication Number | Publication Date |
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| CN219392975U true CN219392975U (en) | 2023-07-21 |
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| CN202320194697.5U Active CN219392975U (en) | 2023-01-18 | 2023-01-18 | Conductive material and conductive device |
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| CN (1) | CN219392975U (en) |
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