CN101654601A - Adhesive tape for backlight module and making method thereof - Google Patents
Adhesive tape for backlight module and making method thereof Download PDFInfo
- Publication number
- CN101654601A CN101654601A CN200910172017A CN200910172017A CN101654601A CN 101654601 A CN101654601 A CN 101654601A CN 200910172017 A CN200910172017 A CN 200910172017A CN 200910172017 A CN200910172017 A CN 200910172017A CN 101654601 A CN101654601 A CN 101654601A
- Authority
- CN
- China
- Prior art keywords
- layer
- adhesive tape
- backlight module
- conductive
- insulation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention provides a lamellar adhesive tape for a backlight module, comprising a first insulating layer, a metal layer, a conducting layer, a second insulating layer and a nonconducting layer, wherein the conducting layer is positioned between the metal layer and the second insulating layer and is in direct contact with a frame in the backlight module. The invention also provides a method formaking the lamellar adhesive tape, comprising the steps: providing the nonconducting layer on a printing circuit board assembly of the backlight module; providing the first insulating layer on the nonconducting layer; providing the conducting layer on the first insulating layer; providing the metal layer on the conducting layer; providing the second insulating layer on the metal layer and enablingthe conducting layer and the frame of the backlight module to be in direct contact. The lamellar adhesive tape and the making method can effectively prevent a system element or the printing circuit board assembly from being damaged due to high-voltage electric shock or static electricity.
Description
Technical field
The present invention relates to the backlight liquid crystal display module, relate in particular to the adhesive tape that is used for ESD and EMI design in the backlight module.
Background technology
Current; under the back light barrier framework of notebook computer; for reach EMI (electromagnetic interference: Fang Hu requirement Electro Magnetic Interference), can use adhesive tape to fix electronic devices and components and the printed circuit-board assembly (PCBA:Printed Circuit Board Assembly) of protection on the backlight module usually with conductive metal interlayer.Yet, applying external high-voltage electric shock, during such as the ESD Hi-pot test, instantaneous high pressure can penetrate the insulation layer of tape surface, is transmitted to the minimum part of impedance on the backlight module via the intermediary metal sandwich then.In this conductive process, often some electric current flows into the system component of printed circuit-board assembly or notebook computer, causes PCBA or system component to damage, thereby the normal operation of total system is impacted.
Summary of the invention
At the existing above-mentioned defective in EMI and ESD design of LCD backlight panel in the prior art, the invention provides a kind of stratiform adhesive tape and manufacture method thereof that is used for backlight panel.
According to an aspect of the present invention, provide a kind of stratiform adhesive tape that is used for backlight module, comprised first insulation layer, metal level, conductive layer, second insulation layer and non-conductive layer.Wherein, first insulation layer is positioned on the metal level, and second insulation layer is positioned on the non-conductive layer, and conductive layer is between the metal level and second insulation layer, and wherein conductive layer directly contacts with framework in the backlight module.
Preferably, framework is coupled to the system earth end by the system hole of backlight module.
Preferably, first insulation layer of stratiform adhesive tape and/or described second insulation layer are pet layer (Polyethylene terephthalate: polyethylene terephthalate).
Preferably, metal level is the aluminium foil layer that electrically conducts electricity; Conductive layer is the conductive adhesive layer that electrically conducts electricity; Non-conductive layer is the non-conductive glue-line that is electrically insulated, and is coupled to the printed circuit-board assembly of backlight module.
According to a further aspect of the invention, provide a kind of manufacture method that is used for the stratiform adhesive tape of backlight module, having comprised: on the printed circuit-board assembly of backlight module, provide non-conductive layer; First insulation layer is provided on non-conductive layer; On first insulation layer, provide conductive layer; Metal level is provided on conductive layer; Second insulation layer is provided on metal level; And conductive layer directly contacted with the framework of backlight module.
Preferably, first insulation layer of stratiform adhesive tape and/or second insulation layer are pet layers.
Preferably, conductive layer is the conductive adhesive layer that electrically conducts electricity.And framework is coupled to the system earth end by the system hole of backlight module.
Adopted the present invention to be used for the stratiform adhesive tape and the manufacture method thereof of backlight module, can prevent effectively that system component or printed circuit-board assembly from damaging because of suffering high-voltage electric shock.In addition, the conductive adhesive layer in this stratiform adhesive tape directly contacts with framework and the IC of system has also been protected effectively as the static release way in the minimum path of impedance that produces.
Description of drawings
The reader will become apparent all respects of the present invention after the reference accompanying drawing has been read the specific embodiment of the present invention.Wherein,
Fig. 1 shows the printed circuit-board assembly of backlight module in the prior art and the arrangement synoptic diagram of stratiform adhesive tape;
Fig. 2 shows according to one aspect of the present invention, the arrangement synoptic diagram of the printed circuit-board assembly of backlight module and stratiform adhesive tape;
Fig. 3 shows the structural representation of stratiform adhesive tape as shown in Figure 1;
Fig. 4 shows the structural representation of stratiform adhesive tape as shown in Figure 2;
Fig. 5 shows schematic path flow graph when being arranged in release electrostatic shown in Figure 1; And
Fig. 6 shows schematic path flow graph when being arranged in release electrostatic shown in Figure 2.
Embodiment
With reference to the accompanying drawings, the specific embodiment of the present invention is described in further detail.In whole description, identical Reference numeral is represented identical parts.
Fig. 1 shows the printed circuit-board assembly of backlight module in the prior art and the arrangement synoptic diagram of stratiform adhesive tape.With reference to Fig. 1, the stratiform adhesive tape comprises black pet layer 100, aluminium foil layer 102, clear PET layer 104 and black glue surface layer 106.In general, PET is meant polyester film, and it is a kind of macromolecular material.Wherein, black pet layer 100 is positioned at the top of stratiform adhesive tape, and black glue surface layer 106 is positioned at the below of stratiform adhesive tape and contact with printed circuit-board assembly and framework 108.When the stratiform adhesive tape bears the high-voltage electric shock, its instantaneous high pressure can puncture black pet layer 100, and metal sandwich by electrically conducting electricity, aluminium foil layer 102, conduct current to the do not have ground connection system component of notebook computer in (the minimum path of non-impedance), in addition, this instantaneous high pressure also may continue across clear PET layer 104 and black glue surface layer 106 enters printed circuit-board assembly from aluminium foil layer 102.
In this conductive process, high-voltage impacts and tends to cause system component or printed circuit-board assembly to damage, thereby influences the normal operation of total system.In order to address this problem, need those skilled in the art to design the minimum path of an impedance, high-voltage is directed on the element or object that is coupled with the system earth end, and meanwhile, the minimum path of this impedance is not connected with system component and printed circuit-board assembly.
Fig. 2 shows according to one aspect of the present invention, the arrangement synoptic diagram of the printed circuit-board assembly of backlight module and stratiform adhesive tape.Those of ordinary skill in the art should be appreciated that Fig. 1 or Fig. 2 have just described the several major partss relevant with EMI and ESD, and the assembly of whole backlight module is not confined to this.With reference to Fig. 2, the stratiform adhesive tape comprises: black pet layer 200, aluminium foil layer 202, conductive adhesive layer 204, clear PET layer 206 and black glue surface layer 208.Be similar to Fig. 1, black pet layer 200 is positioned at the top of stratiform adhesive tape, and black glue surface layer 208 is positioned at the below of stratiform adhesive tape.It is evident that this black glue surface layer 208 contacts with printed circuit-board assembly and do not contact with framework 210; This conductive adhesive layer 204 directly contacts with framework 210.
Those of ordinary skill in the art is to be understood that, " black " mentioned above or " transparent " have just schematically been described the different colours of each layer of stratiform adhesive tape, without any influence, and they are also contained within the purpose of the present invention for the fundamental characteristics of PET or glue face for they.Those of ordinary skill in the art it should also be understood that, black pet layer 200 among Fig. 2, aluminium foil layer 202, clear PET layer 206 and black glue surface layer 208 can correspond respectively to black pet layer 100, aluminium foil layer 102, clear PET layer 104 and black glue surface layer 106 among Fig. 1.As shown in Figure 2, when this stratiform adhesive tape bore the high-voltage electric shock, instantaneous high pressure also can puncture black pet layer 200, and by aluminium foil layer 202.But, be that with difference among Fig. 1 the conductive adhesive layer 204 that is positioned at aluminium foil layer 202 belows has constituted the minimum path of impedance with framework 210, high-voltage can be directly conducted to the system earth end by this path.Because the system earth mode of display panel and notebook computer is, be connected with the system earth end thereby framework locked in the system hole.Because the minimum path of designing among Fig. 2 of impedance, high-voltage can not be directly transferred to system component or printed circuit-board assembly.
More specifically, Fig. 3 shows the structural representation of stratiform adhesive tape as shown in Figure 1, and Fig. 4 shows the structural representation of stratiform adhesive tape as shown in Figure 2.With reference to Fig. 3, the stratiform adhesive tape comprises black pet layer 300, aluminium foil layer 302, clear PET layer 304 and black glue surface layer 306, wherein black pet layer 300 is corresponding to black pet layer 100, aluminium foil layer 302 is corresponding to aluminium foil layer 102, clear PET layer 304 is corresponding to clear PET layer 104, and black glue surface layer 306 is corresponding to black glue surface layer 106.Equally, with reference to Fig. 4, the stratiform adhesive tape comprises black pet layer 400, aluminium foil layer 402, conductive adhesive layer 404, clear PET layer 406 and black glue surface layer 408, wherein black pet layer 400 is corresponding to black pet layer 200, aluminium foil layer 402 is corresponding to aluminium foil layer 202, conductive adhesive layer 404 is corresponding to aluminium foil layer 204, and clear PET layer 406 is corresponding to clear PET layer 206, and black glue surface layer 408 is corresponding to black glue surface layer 208.In conjunction with Fig. 3 and Fig. 4, be not difficult to find out that conductive adhesive layer 404 is very crucial layers, it has constituted the minimum path of impedance with framework, system earth end, when having high pressure to pass through on the conductive adhesive layer, promptly is released via this framework and system earth end.In addition, should be appreciated that this conductive adhesive layer does not contact with printed circuit-board assembly, but contact with framework.
Fig. 5 shows schematic path flow graph when being arranged in release electrostatic shown in Figure 1, and Fig. 6 shows schematic path flow graph when being arranged in release electrostatic shown in Figure 2.By the comparison of Fig. 5 and Fig. 6, can more easily find out the static release way of the stratiform adhesive tape of different structure.By analyzing this static release way, those of ordinary skill in the art can draw the design concept of the minimum path of impedance for EMI of system and/or ESD apparently.Particularly, at Fig. 5, when producing static on the stratiform adhesive tape, this static conducts to IC by first pet layer, Al layer, second pet layer and insulation glue-line.When electrostatic potential is higher, very likely damage IC.In contrast, in Fig. 6, when producing static on the stratiform adhesive tape, this static conducts to metal frame by first pet layer, Al layer, conductive adhesive layer.Because metal frame and system earth end are coupled, so conductive resin one-tenth, metal frame and system earth end have constituted the minimum path of impedance, thus release electrostatic promptly.At this moment, the existence because of second pet layer and insulation glue-line can not damaged between conductive adhesive layer and IC.In addition, when the stratiform adhesive tape framework among Fig. 5 runs into the ESD fault, also need stick on conductive resin usually and be solved, both having lost time has also increased cost.And in the face of same situation, only need among Fig. 6 to attach and once just can finish the ESD design.
Above, describe the specific embodiment of the present invention with reference to the accompanying drawings.But those skilled in the art can understand, and under situation without departing from the spirit and scope of the present invention, can also do various changes and replacement to the specific embodiment of the present invention.These changes and replace all drop in claims of the present invention institute restricted portion.
Claims (10)
1. stratiform adhesive tape that is used for backlight module, comprise first insulation layer, metal level, second insulation layer and non-conductive layer, described first insulation layer is positioned on the described metal level, described second insulation layer is positioned on the described non-conductive layer, it is characterized in that, layered adhesive tape also has the conductive layer between described metal level and described second insulation layer, and described conductive layer directly contacts with framework.
2. stratiform adhesive tape as claimed in claim 1 is characterized in that, described framework is coupled to the system earth end by the system hole of described backlight module.
3. stratiform adhesive tape as claimed in claim 1 is characterized in that, described first insulation layer and/or described second insulation layer are pet layers.
4. stratiform adhesive tape as claimed in claim 1 is characterized in that, described metal level is the aluminium foil layer that electrically conducts electricity.
5. stratiform adhesive tape as claimed in claim 1 is characterized in that, described conductive layer is the conductive adhesive layer that electrically conducts electricity.
6. stratiform adhesive tape as claimed in claim 1 is characterized in that, described non-conductive layer is the non-conductive glue-line that is electrically insulated, and is coupled to the printed circuit-board assembly of backlight module.
7. manufacture method that is used for the stratiform adhesive tape of backlight module is characterized in that this method comprises:
On the printed circuit-board assembly of described backlight module, provide non-conductive layer;
First insulation layer is provided on described non-conductive layer;
On described first insulation layer, provide conductive layer;
On described conductive layer, provide metal level;
Second insulation layer is provided on described metal level; And
Described conductive layer is directly contacted with the framework of described backlight module.
8. manufacture method as claimed in claim 7 is characterized in that, described first insulation layer and/or described second insulation layer are pet layers.
9. manufacture method as claimed in claim 7 is characterized in that, described conductive layer is the conductive adhesive layer that electrically conducts electricity.
10. manufacture method as claimed in claim 7 is characterized in that, described framework is coupled to the system earth end by the system hole of described backlight module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910172017A CN101654601A (en) | 2009-09-03 | 2009-09-03 | Adhesive tape for backlight module and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910172017A CN101654601A (en) | 2009-09-03 | 2009-09-03 | Adhesive tape for backlight module and making method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101654601A true CN101654601A (en) | 2010-02-24 |
Family
ID=41709062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910172017A Pending CN101654601A (en) | 2009-09-03 | 2009-09-03 | Adhesive tape for backlight module and making method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101654601A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300381A (en) * | 2010-06-25 | 2011-12-28 | 和硕联合科技股份有限公司 | Electronic device |
| CN102692761A (en) * | 2012-03-16 | 2012-09-26 | 友达光电股份有限公司 | Display device |
| CN106047206A (en) * | 2016-07-19 | 2016-10-26 | 常熟市长江胶带有限公司 | Highly conductive adhesive tape |
| CN106893515A (en) * | 2017-04-01 | 2017-06-27 | 合肥达悦电子科技有限公司 | Conductive tape |
| CN112365796A (en) * | 2020-11-26 | 2021-02-12 | 京东方科技集团股份有限公司 | Backlight module and display device |
-
2009
- 2009-09-03 CN CN200910172017A patent/CN101654601A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300381A (en) * | 2010-06-25 | 2011-12-28 | 和硕联合科技股份有限公司 | Electronic device |
| CN102300381B (en) * | 2010-06-25 | 2015-01-14 | 和硕联合科技股份有限公司 | Electronic device |
| CN102692761A (en) * | 2012-03-16 | 2012-09-26 | 友达光电股份有限公司 | Display device |
| CN102692761B (en) * | 2012-03-16 | 2014-08-20 | 友达光电股份有限公司 | Display device |
| CN106047206A (en) * | 2016-07-19 | 2016-10-26 | 常熟市长江胶带有限公司 | Highly conductive adhesive tape |
| CN106893515A (en) * | 2017-04-01 | 2017-06-27 | 合肥达悦电子科技有限公司 | Conductive tape |
| CN112365796A (en) * | 2020-11-26 | 2021-02-12 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN112365796B (en) * | 2020-11-26 | 2022-09-27 | 京东方科技集团股份有限公司 | Backlight module and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9576450B2 (en) | Security wrap with breakable conductors | |
| CN203896581U (en) | Safety guard with tearable substrate | |
| US9209139B2 (en) | Multilayer security wrap | |
| CN109375442B (en) | Display panel and display device | |
| WO2020098235A1 (en) | Array substrate, display panel, method of fabricating display panel, and mother substrate | |
| KR101148467B1 (en) | Electronic paper display device | |
| KR102245304B1 (en) | Display device with power supply in cover type | |
| KR101871773B1 (en) | Plastic panel and flat panel display device using the same | |
| US9898943B2 (en) | Liquid crystal display module | |
| US10455693B2 (en) | Display device comprising remaining portion of inspection line with cut edge | |
| CN102819126B (en) | Testing device and testing method | |
| US10168591B2 (en) | Liquid crystal display device | |
| CN101654601A (en) | Adhesive tape for backlight module and making method thereof | |
| KR101842537B1 (en) | A liquid crystal display apparatus and an array substrate thereof | |
| US10339846B2 (en) | Device and method for circuit testing and display device applying the same | |
| US7411294B2 (en) | Display device having misalignment detection pattern for detecting misalignment between conductive layer and insulating layer | |
| US20050180072A1 (en) | Electrostatic discharge guide and liquid crystal display utilizing same | |
| CN110827688A (en) | Display panel, display panel mother board and display device | |
| CN113130557A (en) | Display device | |
| CN113284419B (en) | Display panel, display device and vehicle-mounted display device | |
| CN113555374B (en) | Display substrate, preparation method thereof and display device | |
| CN101290406A (en) | Line and liquid crystal display panel applying same | |
| JP5258517B2 (en) | ELECTRO-OPTICAL DEVICE AND ELECTRONIC DEVICE HAVING THE SAME | |
| CN110346973B (en) | Liquid crystal display backlight module | |
| US20090073098A1 (en) | Display module with identification circuit on panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100224 |