CN220235202U - Electronic equipment - Google Patents

Abstract

The application discloses electronic equipment belongs to the technical field of electronic equipment. Comprising the following steps: screen module, framework and coupling assembling, coupling assembling presss from both sides along first direction and locates between screen module and the framework, coupling assembling includes: the insulating adhesive layer and the conductive adhesive layer are clamped in the conductive adhesive layer along the extending direction of the screen module, and both the insulating adhesive layer and the conductive adhesive layer are in butt joint with the frame body and the screen module along the first direction; wherein the first direction is a direction perpendicular to the screen.

Description

Electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.

Background

Static electricity is an electrical charge in a static state, typically generated by mutual friction or induction between objects. When an object with Static electricity contacts with an object with zero potential or an object with potential difference, charge transfer occurs, and a strong current is instantaneously generated, namely, electrostatic discharge (ESD) occurs.

Currently, electronic devices of electronic devices are generally composed of a cover, a screen, a frame, and other components, and the cover and the frame are generally connected by glue.

However, in the conventional method of bonding the frame and the screen by glue, there is a certain use defect such as poor sealing property and abnormal display caused by ESD.

Disclosure of Invention

An object of the embodiment of the application is to provide an electronic device, which can solve the problems of poor sealing performance of the electronic device and abnormal display caused by easy occurrence of ESD in the prior art.

In order to solve the technical problems, the application is realized as follows: there is provided an electronic device comprising: screen module, framework and coupling assembling, coupling assembling presss from both sides along first direction and locates between screen module and the framework, coupling assembling includes: the insulating adhesive layer and the conductive adhesive layer are clamped in the conductive adhesive layer along the extending direction of the screen module, and the insulating adhesive layer and the conductive adhesive layer are electrically insulated and are both abutted with the frame body and the screen module along the first direction; wherein the first direction is a direction perpendicular to the screen.

In this application embodiment, electronic equipment can include screen module, framework and coupling assembling, and coupling assembling's setting is used for realizing the connection between the screen module can the framework. The connection assembly is arranged between the screen module and the frame along a first direction, namely, a direction perpendicular to the screen module, and it is understood that the connection assembly realizes connection between the screen module and the frame along the first direction. The connecting assembly comprises an insulating adhesive layer and a conductive adhesive layer, wherein the insulating adhesive layer has certain sealing waterproof property and certain viscosity. The insulating glue layer is all abutted with the frame body and the screen module along the first direction, and it can be understood that the insulating glue layer is connected between the screen module and the frame body and simultaneously has the function of preventing moisture in the outside from entering between the screen module and the frame body. The conductive adhesive layer has stronger ESD protection capability. Along the extending direction of screen module, with the conducting resin layer clamp locate in the insulating resin layer, and the insulating resin layer with conducting resin layer all with screen module and framework butt, realized that the insulating resin layer is waterproof protectiveness and the oxidation of conducting resin layer, have the beneficial effect that improves conducting resin layer life to and realized that the insulating resin layer is to being connected between screen module and the framework. The arrangement of the conductive adhesive layer also realizes that the conductive adhesive layer is connected with the metal frame body to form a loop, when high-voltage ESD occurs, the ESD electric arc breaks down the outside insulating adhesive to reach the conductive adhesive layer, and the conductive adhesive layer is used for guiding the frame body, so that the conductive adhesive layer has the beneficial effects of preventing ESD from directly striking the screen module and generating poor screen display.

Drawings

Fig. 1 is a schematic top view of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic view of a partial enlarged structure at A in FIG. 1 in an embodiment of the present application;

FIG. 3 is a schematic cross-sectional structure of an electronic device in an embodiment of the present application;

FIG. 4 is an exploded view of a portion of an electronic device in an embodiment of the present application;

FIG. 5 is a schematic structural view of a connection assembly according to an embodiment of the present application;

FIG. 6 is a schematic diagram of a cross-sectional structure of a left side of an electronic device in an embodiment of the present application;

fig. 7 is a schematic top view of the left side of the electronic device according to the embodiment of the present application;

fig. 8 is a schematic cross-sectional structure of the left side of the electronic device in the case where the frame body is divided into a metal part and a nonmetal part in the embodiment of the present application;

fig. 9 is a schematic cross-sectional structure of the left side of another electronic device in the case where the housing is divided into a metal part and a nonmetal part in the embodiment of the present application;

FIG. 10 is a schematic view of the structure of the connection assembly and the frame connection in the embodiment of the present application;

FIG. 11 is a schematic view of another form of frame structure according to an embodiment of the present application;

fig. 12 is a schematic view of another form of connection between a frame and a connection assembly according to an embodiment of the present application.

Reference numerals illustrate:

10. a screen module; 11. a cover plate; 12. a screen; 20. a frame; 21. a metal part; 22. a non-metal portion; 23. a first subslot; 24. a second groove; 241. a first cavity; 242. a second cavity; 25. a second subslot; 30. a connection assembly; 31. an insulating adhesive layer; 311. a first sub-adhesive layer; 312. a second sub-adhesive layer; 32. and a conductive adhesive layer.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The electronic device and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings by specific embodiments and application scenarios thereof.

Referring to fig. 1 to 12, embodiments of the present application provide an electronic device including: the screen module 10, the framework 20 and the coupling assembling 30, coupling assembling 30 presss from both sides along the first direction and locates between screen module 10 and the framework 20, coupling assembling 30 includes: the insulating adhesive layer 31 and the conductive adhesive layer 32 are clamped in the conductive adhesive layer 32 along the extending direction of the screen module 10, and the insulating adhesive layer 31 and the conductive adhesive layer 32 are abutted with the frame body 20 and the screen module 10 along the first direction; wherein the first direction is a direction perpendicular to the screen.

In this embodiment, the electronic device may include a screen module 10, a frame 20, and a connection assembly 30, where the connection assembly 30 is configured to implement connection between the screen module 10 and the frame 20. The connection assembly 30 is disposed between the screen module 10 and the frame 20 in a first direction, i.e., a direction perpendicular to the screen module 10, and it is understood that the connection assembly 30 enables connection between the screen module 10 and the frame 20 in the first direction. The connection assembly 30 includes an insulating adhesive layer 31 and a conductive adhesive layer 32, where the insulating adhesive layer 31 has a certain sealing waterproof property and a certain viscosity. The insulating glue layer 31 is abutted against both the frame body 20 and the screen module 10 along the first direction, and it can be understood that the insulating glue layer 31 also has the effect of preventing moisture in the outside from entering between the screen assembly and the frame body 20 while realizing connection between the screen module 10 and the frame body 20. The conductive adhesive layer 32 has a strong ESD protection capability. Along the extending direction of screen module 10, locate insulating glue layer 31 with the clamp of conductive glue layer 32 in, and insulating glue layer 31 with conductive glue layer 32 all with screen module 10 and framework 20 butt, realized insulating glue layer 31 to conductive glue layer 32's waterproof protectiveness and anti-oxidation, have the beneficial effect that improves conductive glue layer 32 life to and realized the connection between insulating glue layer 31 to screen module 10 and the framework 20. The conductive adhesive layer 32 is further arranged to be connected with the metal frame body 20 to form a loop, when high-voltage ESD occurs, the ESD arc breaks down the outside insulating adhesive to reach the conductive adhesive layer 32, and the conductive adhesive layer 32 is used for guiding the frame body 20, so that the conductive adhesive layer 32 has the beneficial effects of preventing ESD from directly striking the screen module 10 and generating poor screen display.

Note that the insulating glue layer 31 is formed of insulating glue, and the conductive glue layer 32 is formed of conductive glue.

Optionally, in the embodiment of the present application, the frame 20 includes a metal portion 21 and a non-metal portion 22 connected to each other, and the metal portion 21 is at least partially abutted against the conductive adhesive layer 32.

In this embodiment of the application, the setting of framework 20 provides installation space and support for screen module 10 on the one hand, and on the other hand, when framework 20 is the metal material, can also realize the ESD release through with electric glue layer 32 butt, avoid the damage of ESD to the subassembly in the screen module 10. Specifically, the frame body 20 includes a metal portion 21 and a non-metal portion 22, the metal portion 21 is disposed and abutted against the conductive adhesive layer 32, when an ESD event occurs, the ESD directly leaks to the metal portion 21 through the conductive adhesive layer 32 when the ESD is low voltage and high voltage, thereby having the beneficial effects of avoiding the ESD from directly striking the screen module 10 and causing the screen module 10 to display bad.

The frame 20 may be configured to be at least partially a metal portion 21, and the metal portion 21 and the conductive adhesive layer 32 may abut against each other to directly discharge static electricity. The portion of the frame 20 not abutting against the conductive adhesive layer 32 may be configured as the non-metal portion 22, which has the beneficial effects of reducing the weight of the frame 20, and further reducing the overall weight and cost of the electronic device.

Optionally, in this embodiment, the screen module 10 includes a cover plate 11 and a screen 12 sequentially disposed along a first direction, the insulating adhesive layer 31 and the conductive adhesive layer 32 are both sandwiched between the cover plate 11 and the frame body 20 along the first direction, and the insulating adhesive layer 31 and the conductive adhesive layer 32 are disposed on an outer side edge of the screen 12 along an extending direction of the screen 12.

In this embodiment, the screen module 10 includes a cover plate 11 and a screen 12, where the cover plate 11, the screen 12 and the frame 20 are sequentially arranged along a first direction, the area of the screen 12 is smaller than that of the cover plate 11, and the outer side frame of the frame 20 is also larger than that of the screen 12, so that the insulating adhesive layer 31 and the conductive adhesive layer 32 are both sandwiched between the cover plate 11 and the frame 20 along the first direction to realize connection between the cover plate 11 and the frame 20. And, the insulating adhesive layer 31 and the conductive adhesive layer 32 are disposed on the outer side of the screen 12 along the extending direction of the screen. In practical application, the arrangement of the insulating adhesive layer 31 not only realizes the adhesion between the cover plate 11 and the frame body 20, but also enables a relatively sealed cavity to be formed between the cover plate 11 and the frame body 20, thereby preventing the entry of external air and moisture, and having the beneficial effect of preventing the screen 12 arranged in the cavity from being polluted and damaged by the external air and moisture. The conductive adhesive layer 32 is disposed by abutting with the non-metal portion 22, so as to prevent ESD from directly striking the screen module 10 and prevent poor display of the screen 12.

Optionally, in the embodiment of the present application, the insulating adhesive layer 31 includes a first sub-adhesive layer 311 close to the screen 12 and a second sub-adhesive layer 312 far from the screen 12, where the second sub-adhesive layer 312, the conductive adhesive layer 32 and the first sub-adhesive layer 311 are sequentially disposed along the extending direction of the screen 12; along the extending direction of the screen 12, the conductive adhesive layer 32 is completely abutted against the metal portion 21, and the first sub-adhesive layer 311 are at least partially abutted against the non-metal portion 22.

In this embodiment, the insulating adhesive layer 31 includes a first sub-adhesive layer 311 close to the screen 12 and a second sub-adhesive layer 312 far away from the screen 12, and it can be understood that the connection assembly 30 is disposed in a manner that the second sub-adhesive layer 312, the conductive adhesive layer 32 and the first sub-adhesive layer 311 are sequentially disposed along the extending direction of the screen 12. Along the extending direction of the screen 12, the conductive adhesive layer 32 is completely abutted against the metal portion 21, the first sub adhesive layer 311 and the first sub adhesive layer 311 are at least partially abutted against the non-metal portion 22, and in practical application, the conductive adhesive layer 32 is protected from air by the first sub adhesive layer 311 and the second sub adhesive layer 312, which has the beneficial effect of preventing the conductive adhesive layer 32 from oxidation corrosion, and the conductive adhesive layer 32 completely abutted against the metal portion 21 forms an ESD protection path.

Optionally, in the embodiment of the present application, the frame 20 is provided with a first sub-slot 23, a second slot 24 and a second sub-slot 25, where the first sub-slot 23, the second slot 24 and the second sub-slot 25 are respectively disposed corresponding to the first sub-adhesive layer 311, the conductive adhesive layer 32 and the second sub-adhesive layer 312; the second sub-groove 25, the second groove 24, and the first sub-groove 23 are sequentially provided along the extending direction of the screen 12, and the second sub-groove 25, the second groove 24, and the first sub-groove 23 are each recessed in the first direction in a direction away from the screen 12.

In the embodiment of the present application, in practical application, both the insulating glue layer 31 and the conductive glue layer 32 are formed by glue, and the glue has a certain fluidity, and the arrangement of the first sub-groove 23, the second groove 24 and the second sub-groove 25 is used for restricting the flow of the glue forming the insulating glue layer 31 and the conductive glue layer 32. The first sub-groove 23, the second groove 24, and the second sub-groove 25 are disposed corresponding to the first sub-adhesive layer 311, the conductive adhesive layer 32, and the second sub-adhesive layer 312, respectively, and are used for restricting the flow of the glue of the corresponding first sub-adhesive layer 311, conductive adhesive layer 32, and second sub-adhesive layer 312, respectively. In practical application, in order to correspond to the arrangement of the first sub-adhesive layer 311, the conductive adhesive layer 32 and the second sub-adhesive layer 312, and also in order to realize the one-to-one correspondence of different grooves and different adhesive layers, the second sub-groove 25, the second groove 24 and the first sub-groove 23 are sequentially arranged along the extending direction of the screen 12, and the second sub-groove 25, the second groove 24 and the first sub-groove 23 are all recessed along the first direction towards the direction away from the screen 12, that is, a certain accommodating space is provided for the different adhesive layers along the first direction towards the direction away from the screen 12, so as to limit the flow of the glue of the first sub-adhesive layer 311, the conductive adhesive layer 32 or the second sub-adhesive layer 312 to mutually mix and influence the bonding or the conductive effect.

Optionally, in the embodiment of the present application, the second groove 24 is formed in the metal portion 21, and the first sub-groove 23 and the second sub-groove 25 are each at least partially formed in the non-metal portion 22.

Since the conductive adhesive layer 32 is at least partially in contact with the metal portion 21, the second groove 24 corresponding to the conductive adhesive layer 32 is opened in the metal portion 21. In order to prevent the connection position between the conductive adhesive layer 32 and the metal portion 21 from being exposed to the external environment, the first sub-adhesive layer 311 and the second sub-adhesive layer 312 are at least partially abutted against the non-metal portion 22, and therefore, the first sub-groove 23 and the second sub-groove 25 respectively disposed on the first sub-adhesive layer 311 and the second sub-adhesive layer 312 are at least partially opened in the non-metal portion 22.

Alternatively, in the embodiment of the present application, the second sub-groove 25, the second groove 24, and the first sub-groove 23 are each spaced apart in the extending direction of the screen 12.

In this embodiment of the present application, in practical application, the first sub-adhesive layer 311, the conductive adhesive layer 32 and the second sub-adhesive layer 312 are formed by glue, the glue has certain fluidity, when bonding the cover plate 11 and the frame 20, the glue is injected into the groove first, then the cover plate 11 is placed on the frame 20, after the cover plate 11 is placed, the glue inevitably flows out to the periphery, the setting of interval is to provide a certain outflow space for the flowing glue, and the beneficial effects of avoiding the mutual mixing of the glue flows of the first sub-adhesive layer 311, the conductive adhesive layer 32 or the second sub-adhesive layer 312 to affect the use effect are provided.

Alternatively, in the embodiment of the present application, a side of the first sub-groove 23 away from the second groove 24 is disposed on the non-metal portion 22, and a side of the second sub-groove 25 away from the second groove 24 is disposed on the non-metal portion 22.

In the embodiment of the present application, the first sub-groove 23 corresponds to the first sub-adhesive layer 311, and the second sub-groove 25 corresponds to the second sub-adhesive layer 312, wherein one side of the first sub-groove 23 is close to the second groove 24, and the other side is far from the second groove 24; one side of the second sub-groove 25 is close to the second groove 24 and the other side is distant from the second groove 24. The second groove 24 is provided with the conductive adhesive layer 32, and the conductive adhesive layer 32 abuts against the metal portion 21 to form an ESD protection path. Wherein, one side of the first sub-groove 23 far from the second groove 24 is disposed on the nonmetal portion 22, and one side of the second sub-groove 25 far from the second groove 24 is disposed on the nonmetal portion 22, it is understood that, that is, the junction of the nonmetal portion 22 and the metal portion 21 does not exceed one side of the first sub-groove 23 far from the second groove 24, and also exceeds one side of the second sub-groove 25 far from the second groove 24. The arrangement effectively realizes that the conductive adhesive layer 32 is protected by the first sub adhesive layer 311 and the second sub adhesive layer 312 from moisture and air in the outside, and prevents the conductive adhesive layer 32 from being oxidized and corroded to cause failure.

Alternatively, in the embodiment of the present application, the second slot 24 includes a first cavity 241 and a second cavity 242 that are mutually communicated along a first direction, the first cavity 241 extends along the first direction in a direction away from the screen 12, and two sides of the second cavity 242 extend along the extending direction of the screen 12 toward the first sub-slot 23 and the second sub-slot 25, respectively; the orthographic view of the first cavity 241 in the direction perpendicular to the screen 12 is located within the orthographic view of the second cavity 242 in the direction perpendicular to the screen 12; the conductive adhesive layer 32 is abutted against both the first cavity 241 and the second cavity 242.

In this embodiment, the second groove 24 includes a first cavity 241 and a second cavity 242 that are mutually communicated along a first direction, the first cavity 241 extends along the first direction in a direction away from the screen 12, two sides of the second cavity 242 extend along the extending direction of the screen 12 toward the first sub-groove 23 and the second sub-groove 25 respectively, and the conductive adhesive layer 32 is abutted to both the first cavity 241 and the second cavity 242. The orthographic projection pattern of the first cavity 241 in the direction perpendicular to the screen 12 is located in the second cavity 242 in the direction perpendicular to the screen 12, that is, in practical application, the arrangement of the second cavity 242 and the first cavity 241 increases the contact area between the conductive adhesive layer 32 and the metal portion 21 under the condition that the metal area exposed on the plane parallel to the screen 12 is not increased, and has the beneficial effects of reducing the contact resistance between the conductive adhesive layer 32 and the metal portion 21 and enhancing the adhesive force between the conductive adhesive layer 32 and the frame 20.

Alternatively, in the embodiment of the present application, the height of the insulating adhesive layer 31 along the first direction is H, and the height of the conductive adhesive layer 32 along the first direction is H; wherein H is more than or equal to H.

In this embodiment, the setting of insulating glue layer 31 still is used for providing the protection for electrically conductive glue layer 32, and highly being higher than electrically conductive glue layer 32 along the high back of first direction of insulating glue layer 31, first sub-glue layer 311, second sub-glue layer 312, apron 11 and framework 20 are with electrically conductive glue layer 32 parcel wherein, and protection electrically conductive glue layer 32 keeps apart with the external world, has the beneficial effect that prevents electrically conductive glue layer 32 and take place the oxidation corrosion.

It should be noted that the electronic device in the embodiments of the present application may include a mobile electronic device and a non-mobile electronic device. By way of example, the mobile electronic device may be a mobile terminal device, such as a cell phone, tablet, notebook, palm, vehicle-mounted electronic device, wearable device, ultra-mobile personal computer (ultra-mobile personal computer, UMPC), netbook or personal digital assistant (personal digital assistant, PDA), etc., and the non-mobile electronic device may be a non-mobile terminal device, such as a server, network attached storage (network attached storage, NAS), personal computer (personal computer, PC), etc., the embodiments of the present application are not limited in particular.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.

Claims (10)

1. An electronic device, comprising: screen module (10), framework (20) and coupling assembling (30), coupling assembling (30) are located along first direction clamp between screen module (10) and framework (20), coupling assembling (30) include:

the insulating adhesive layer (31) and the conductive adhesive layer (32), wherein the conductive adhesive layer (32) is clamped in the insulating adhesive layer (31) along the extending direction of the screen module (10), and the insulating adhesive layer (31) and the conductive adhesive layer (32) are abutted to the frame body (20) and the screen module (10) along the first direction;

wherein the first direction is a direction perpendicular to the screen module (10).

2. The electronic device according to claim 1, characterized in that the frame (20) comprises a metallic portion (21) and a non-metallic portion (22) connected to each other, the metallic portion (21) being at least partially in abutment with the conductive glue layer (32).

3. The electronic device according to claim 2, wherein the screen module (10) includes a cover plate (11) and a screen (12) sequentially arranged along the first direction, the insulating adhesive layer (31) and the conductive adhesive layer (32) are both sandwiched between the cover plate (11) and the frame body (20) along the first direction, and the insulating adhesive layer (31) and the conductive adhesive layer (32) are disposed on an outer side edge of the screen (12) along an extension direction of the screen (12).

4. An electronic device according to claim 3, characterized in that the insulating glue layer (31) comprises a first sub-glue layer (311) close to the screen (12) and a second sub-glue layer (312) remote from the screen (12), the second sub-glue layer (312), the conductive glue layer (32) and the first sub-glue layer (311) being arranged in sequence along the extension direction of the screen (12);

along the extending direction of the screen (12), the conductive adhesive layer (32) is completely abutted against the metal part (21), and the first sub-adhesive layer (311) and the second sub-adhesive layer (312) are at least partially abutted against the nonmetal part (22).

5. The electronic device according to claim 4, wherein the frame (20) is provided with a first sub-groove (23), a second groove (24) and a second sub-groove (25), and the first sub-groove (23), the second groove (24) and the second sub-groove (25) are respectively arranged corresponding to the first sub-adhesive layer (311), the conductive adhesive layer (32) and the second sub-adhesive layer (312);

the second subslot (25), the second subslot (24) and the first subslot (23) are arranged in sequence along the extending direction of the screen (12), and the second subslot (25), the second subslot (24) and the first subslot (23) are all recessed along the first direction towards the direction far away from the screen (12).

6. The electronic device according to claim 5, wherein the second slot (24) is open to the metal portion (21), and wherein the first sub-slot (23) and the second sub-slot (25) are each at least partially open to the non-metal portion (22).

7. The electronic device according to claim 6, characterized in that the second sub-slot (25), the second slot (24) and the first sub-slot (23) are each spaced apart in the extending direction of the screen (12).

8. The electronic device according to claim 6, wherein a side of the first sub-groove (23) away from the second groove (24) is provided to the nonmetallic portion (22), and a side of the second sub-groove (25) away from the second groove (24) is provided to the nonmetallic portion (22).

9. The electronic device according to claim 8, wherein the second slot (24) comprises a first cavity (241) and a second cavity (242) mutually penetrating along the first direction, the first cavity (241) extending along the first direction in a direction away from the screen (12), both sides of the second cavity (242) extending along the extending direction of the screen (12) towards the first sub-slot (23) and the second sub-slot (25), respectively;

the orthographic projection pattern of the first cavity in the direction perpendicular to the screen (12) is positioned inside the orthographic projection pattern of the second cavity in the direction perpendicular to the screen (12);

the conductive adhesive layer (32) is abutted with the first cavity (241) and the second cavity (242).

10. The electronic device according to any one of claims 1 to 9, wherein the height of the insulating glue layer (31) along the first direction is H, and the height of the conductive glue layer (32) along the first direction is H;

wherein H is more than or equal to H.