CN219385320U - Copper device is prevented knot by chemistry copper tank - Google Patents
Copper device is prevented knot by chemistry copper tank Download PDFInfo
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- CN219385320U CN219385320U CN202223565114.XU CN202223565114U CN219385320U CN 219385320 U CN219385320 U CN 219385320U CN 202223565114 U CN202223565114 U CN 202223565114U CN 219385320 U CN219385320 U CN 219385320U
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- plate
- liquid
- copper
- pipe
- wheel set
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The utility model discloses a copper bonding prevention device for a chemical copper tank, which relates to the field of manufacturing of panels and comprises the following components: a trough plate; the conveying roller plate group is arranged above the groove plate; the circulating liquid pipe is arranged above the groove plate and below the conveying roller plate group; the liquid supplementing pipe is arranged below the groove plate, connected with the circulating liquid pipe and arranged in parallel with the conveying roller plate group; the lower conveying wheel set is arranged above the groove plate; and an upper conveying wheel set arranged above the lower conveying wheel set, wherein the conveying roller sheet set comprises: the lower conveying wheel set is arranged above the groove plate; the upper conveying wheel set is arranged above the lower conveying wheel set; so as to increase the reaction rate and reduce the occurrence of copper junction.
Description
Technical Field
The utility model relates to the field of manufacturing of panels, in particular to a copper-binding preventing device for a chemical copper tank.
Background
In the processing process of the plate, the solution is required to be used for carrying out the copper plating process of the plate, namely, the plate is conveyed to a chemical copper tank to carry out oxidation-reduction reaction under the action of the relevant solution, so that the relevant copper plating process is completed; however, in the usual processing, copper bonding occurs at the feed and at the rollers, and the fluidity of the relevant redox agent in the copper bath is poor, and the reaction time is gradually increased.
Therefore, it is necessary to provide a copper-bonding prevention device for a chemical copper tank to solve the above problems.
Disclosure of Invention
In order to achieve the above purpose, the present utility model provides the following technical solutions: a copper-binding prevention device for a chemical copper tank, comprising:
a trough plate;
the conveying roller plate group is arranged above the groove plate;
the circulating liquid pipe is arranged above the groove plate and below the conveying roller plate group;
the liquid supplementing pipe is arranged below the groove plate, connected with the circulating liquid pipe and arranged in parallel with the conveying roller plate group.
Further, preferably, the conveying roller sheet set includes:
the lower conveying wheel set is arranged above the groove plate;
and the upper conveying wheel set is arranged above the lower conveying wheel set.
Further, preferably, the fluid replacement pipe includes:
the liquid supplementing valves are arranged on one side of the liquid supplementing pipe in a plurality of groups;
and one end of the conveying pipe is connected with the liquid supplementing valve, and the other end of the conveying pipe is connected with the circulating liquid pipe.
Further, preferably, the circulating liquid pipe includes:
the liquid outlets are arranged on the circulating liquid pipe in a plurality of groups and are positioned right against the side surface of the groove plate;
further, preferably, the slot plate includes:
the liquid plate is arranged below the side of the lower conveying wheel set;
the vertical plate is arranged at one side of the liquid plate and is positioned below one group of lower conveying wheel sets;
the mounting table is arranged on the liquid plate and is positioned below the other group of lower conveying wheel sets, and one end of the mounting table is connected with a lifting rod;
the connecting plate is arranged between the vertical plate and the liquid plate and is positioned between the mounting table and the vertical plate;
the support plate is arranged on the connecting plate and is positioned on one surface of the connecting plate, which is close to the vertical plate;
the liquid cover is arranged in the middle of the liquid plate and below the mounting table, the liquid cover is arranged on one surface of the liquid plate, and the liquid pipe is arranged on the other surface of the liquid plate.
Further, preferably, the standing plate includes:
the row ports are arranged on the vertical plates in a plurality of groups;
and the calandria is connected with the calandria.
Compared with the prior art, the utility model provides a copper-binding preventing device for a chemical copper tank, which comprises the following components
The beneficial effects are that:
in the embodiment of the utility model, the mobility of the related liquid medicine in the copper tank is enhanced through the use of the circulating liquid pipe, and the related copper phenomenon is reduced through the fact that the conveying roller plate set is far away from the liquid medicine and the reaction position.
Drawings
FIG. 1 is a schematic view of a chemical copper tank anti-copper-junction device with a main view angle;
FIG. 2 is a schematic view of a part of the structure of a chemical copper tank anti-copper-bonding device;
FIG. 3 is a schematic top view of a chemical copper tank anti-copper-bonding device;
FIG. 4 is a schematic diagram of a liquid replenishing pipe of a copper-binding preventing device of a chemical copper tank;
FIG. 5 is a schematic diagram of a trough plate of a chemical copper trough copper-binding prevention device;
in the figure: 1. a transport roller sheet set; 11. an upper conveying wheel set; 12. a lower conveying wheel set; 2. a fluid supplementing pipe; 21. a fluid supplementing valve; 22. a delivery tube; 3. a circulating liquid pipe; 31. a liquid outlet; 4. a trough plate; 41. a vertical plate; 411. a discharge port; 412. a calandria; 42. a liquid plate; 43. a mounting table; 431. a lifting rod; 44. a connecting plate; 45. a support plate; 46. a liquid cover; 461. and a liquid pipe.
Detailed Description
Referring to fig. 1 to 5, in an embodiment of the present utility model, a copper-bonding prevention device for a chemical copper tank includes:
a trough plate 4;
the conveying roller plate group 1 is arranged above the groove plate 4;
a circulating liquid pipe 3 which is arranged above the groove plate 4 and below the conveying roller plate group 1;
the liquid supplementing pipe 2 is arranged below the groove plate 4, connected with the circulating liquid pipe 3 and arranged in parallel with the conveying roller plate group 1.
In this embodiment, as shown in fig. 1, the conveying roller sheet set 1 includes:
a lower conveying wheel set 12 mounted above the trough plate 4;
an upper conveying wheel set 11 is arranged above the lower conveying wheel set 12.
In this embodiment, as shown in fig. 4, the fluid infusion tube 2 includes:
a plurality of sets of fluid supplementing valves 21 are arranged on one side of the fluid supplementing pipe 2;
and one end of a conveying pipe 22 is connected with the liquid supplementing valve 21, and the other end of the conveying pipe is connected with the circulating liquid pipe 3.
In this embodiment, as shown in fig. 4, the circulating fluid pipe 3 includes:
the liquid outlets 31 are arranged on the circulating liquid pipe 3 in a plurality of groups and are positioned on the side surface opposite to the groove plate 4;
in this embodiment, as shown in fig. 2 or 3, the slot plate 4 includes:
a liquid plate 42 arranged below the lower conveying wheel set 12;
a vertical plate 41 installed at one side of the liquid plate 42 and positioned below a group of the lower conveying wheel sets 12;
the mounting table 43 is arranged on the liquid plate 42 and is positioned below the other group of lower conveying wheel sets 12, and one end of the mounting table 43 is connected with a lifting rod 431;
a connecting plate 44 disposed between the vertical plate 41 and the liquid plate 42 and between the mounting table 43 and the vertical plate 41;
a support plate 45 mounted on the connection plate 44 at a surface of the connection plate 44 close to the vertical plate 41;
the liquid cover 46 is arranged in the middle of the liquid plate 42 and below the mounting table 43, and the liquid cover 46 is arranged on one surface of the liquid plate 42 and the liquid pipe 461 is arranged on the other surface of the liquid plate 42.
In this embodiment, as shown in fig. 5 or 3, the vertical plate 41 includes:
the discharge ports 411 are arranged on the vertical plate 41 in a plurality of groups;
a drain pipe 412 connected to the drain port 411.
As a preferred embodiment, the position of the conveying roller sheet set 1 is adjusted by the lifting rod 431 and the supporting plate 45, then a panel is placed between the lower conveying wheel set 12 and the upper conveying wheel set 11, then the panel is sent below the liquid outlet 31, above the liquid plate 42, the liquid supplementing valve 21 controls the conveying pipe 22 to convey the liquid medicine to the panel, so as to complete the relevant copper plating reaction, and the liquid pipe 412 and the liquid pipe 461 enable the solution reacted on the liquid plate 42 to be discharged, so that the circulation of the relevant liquid medicine is formed.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. The utility model provides a copper device is prevented to chemistry copper tank which characterized in that: comprising the following steps:
a trough plate (4);
the conveying roller plate group (1) is arranged above the groove plate (4);
the circulating liquid pipe (3) is arranged above the groove plate (4) and is positioned below the conveying roller plate group (1);
the liquid supplementing pipe (2) is arranged below the groove plate (4), connected with the circulating liquid pipe (3) and arranged in parallel with the conveying roller plate group (1).
2. The copper-binding preventing device for a chemical copper tank according to claim 1, wherein: the conveying roller sheet group (1) comprises:
a lower conveying wheel set (12) arranged above the trough plate (4);
and the upper conveying wheel set (11) is arranged above the lower conveying wheel set (12).
3. The copper-binding preventing device for a chemical copper tank according to claim 1, wherein: the fluid replacement pipe (2) comprises:
a plurality of groups of liquid supplementing valves (21) are arranged on one side of the liquid supplementing pipe (2);
and one end of the conveying pipe (22) is connected with the liquid supplementing valve (21), and the other end of the conveying pipe is connected with the circulating liquid pipe (3).
4. The copper-binding preventing device for a chemical copper tank according to claim 1, wherein: the circulating liquid pipe (3) comprises:
the liquid outlets (31) are arranged on the circulating liquid pipe (3) in a plurality of groups and are positioned right opposite to the side face of the groove plate (4).
5. The copper-binding preventing device for a chemical copper tank according to claim 2, wherein: the trough plate (4) comprises:
the liquid plate (42) is arranged below the side of the lower conveying wheel set (12);
a vertical plate (41) which is arranged at one side of the liquid plate (42) and is positioned below a group of lower conveying wheel sets (12);
the mounting table (43) is arranged on the liquid plate (42) and is positioned below the other group of lower conveying wheel sets (12), and one end of the mounting table (43) is connected with a lifting rod (431);
a connecting plate (44) arranged between the vertical plate (41) and the liquid plate (42) and between the mounting table (43) and the vertical plate (41);
a support plate (45) mounted on the connecting plate (44) and positioned on one surface of the connecting plate (44) close to the vertical plate (41);
the liquid cover (46) is arranged in the middle of the liquid plate (42) and below the mounting table (43), the liquid cover (46) is arranged on one surface of the liquid plate (42), and the liquid pipe (461) is arranged on the other surface of the liquid plate.
6. The copper bonding prevention device for a chemical copper tank according to claim 5, wherein: the standing plate (41) comprises:
a plurality of groups of discharge ports (411) are arranged on the vertical plate (41);
a drain pipe (412) connected to the drain port (411).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202223565114.XU CN219385320U (en) | 2022-12-30 | 2022-12-30 | Copper device is prevented knot by chemistry copper tank |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202223565114.XU CN219385320U (en) | 2022-12-30 | 2022-12-30 | Copper device is prevented knot by chemistry copper tank |
Publications (1)
Publication Number | Publication Date |
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CN219385320U true CN219385320U (en) | 2023-07-21 |
Family
ID=87192143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202223565114.XU Active CN219385320U (en) | 2022-12-30 | 2022-12-30 | Copper device is prevented knot by chemistry copper tank |
Country Status (1)
Country | Link |
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CN (1) | CN219385320U (en) |
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2022
- 2022-12-30 CN CN202223565114.XU patent/CN219385320U/en active Active
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