CN219372718U

CN219372718U - Stable type reflow soldering steel mesh structure

Info

Publication number: CN219372718U
Application number: CN202320552406.5U
Authority: CN
Inventors: 于承勇
Original assignee: Qiansiyue Intelligent Technology Suzhou Co ltd
Current assignee: Qiansiyue Intelligent Technology Suzhou Co ltd
Priority date: 2023-03-21
Filing date: 2023-03-21
Publication date: 2023-07-18
Anticipated expiration: 2033-03-21

Abstract

The utility model relates to a stable reflow soldering steel mesh structure, which comprises a steel mesh body, wherein the steel mesh body consists of a main mesh, a first thickened mesh and a second thickened mesh, the first thickened mesh is fixedly connected to the upper surface of the main mesh, the second thickened mesh is fixedly connected to the lower surface of the main mesh, a bonding pad is arranged on the inner side of the steel mesh body, a soldering hole is formed on the inner side of the bonding pad, and the soldering hole penetrates through the inner side of the steel mesh body. This stable reflow soldering steel mesh structure, its total thickness keeps at 0.5 mm's scheme, and the steel mesh body after the thickening has increased the steel mesh and has gone up tin volume under, and the product makes the downthehole no air residue after the backward flow, makes its tin volume increase 150% after the printing, has improved the production yield, has solved the product and has had certain air in hole after first face welding is accomplished, and the product is because of the cavity exists air after producing the second face printing tin cream, and the air release leads to the problem of cavity bad production when the reflow soldering.

Description

Stable type reflow soldering steel mesh structure

Technical Field

The utility model relates to the technical field of electronic device manufacturing, in particular to a stable reflow soldering steel mesh structure.

Background

The printed circuit board is also called a printed circuit board, is an important electronic component, is a support body of the electronic component, is a carrier for electric connection of the electronic component, is called a printed circuit board because the printed circuit board is manufactured by adopting an electronic printing technology, and is called a printed circuit board because the PCB of the electronic product is continuously miniaturized, sheet-shaped elements appear, the traditional welding method can not meet the needs, at first, only a reflow soldering process is adopted in the assembly of the hybrid integrated circuit board, the assembled and welded elements are mainly sheet-shaped capacitors, sheet-shaped inductors, surface-mounted transistors, diodes and the like, and along with the gradual perfection of the whole SMT technology, the reflow soldering process technology and equipment which are a part of the surface-mounted technology are correspondingly developed, and the application of the printed circuit board is gradually wide, and the printed circuit board is almost applied to all electronic product fields.

The steel mesh structure for reflow soldering that adopts at present adopts 0.2mm thick steel mesh to print more, reflow soldering after through-hole part SMT installs, pass stove welding after the through-hole part needs PCB first face to print the installation because of the design reason, wherein PCB thick is 2.4mm, steel mesh thickness is 0.2mm, the product has certain air in hole after first face welding is accomplished, the product is because of the cavity exists in the air after producing the second face printing tin cream, air release leads to cavity bad production when passing reflow soldering, so propose a stable reflow soldering steel mesh structure and solve the problem that above-mentioned was proposed.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a stable reflow soldering steel mesh structure, which has the advantages of increasing the tin amount under the steel mesh and the like, and solves the problem that holes exist in a product after the first surface is soldered, and the product is poor in holes caused by air release during reflow soldering due to the existence of air in the holes after the second surface is printed with solder paste.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a stable type reflow soldering steel mesh structure, includes the steel mesh body, the steel mesh body comprises main network, first thickening net and second thickening net, first thickening net fixed connection is to the upper surface of main network, second thickening net fixed connection is to the lower surface of main network, the inboard of steel mesh body is provided with the pad, the welding hole has been seted up to the inboard of pad, the welding hole runs through to the inboard of steel mesh body, first fan-shaped groove and second fan-shaped groove have been seted up respectively to the inboard of pad.

Further, the thickness of the steel mesh body is 0.5mm, and the thickness of the main mesh is equal to that of the second thickened mesh.

Further, the thickness of the main net and the second thickened net is 0.15mm, and the thickness of the first thickened net is 0.2mm.

Further, the shape of the bonding pad is square, and the bonding hole is a square hole.

Further, the bonding pad is fixedly connected to the upper surface of the main network, and the inner side of the first thickening network is provided with a mounting groove matched with the bonding pad.

Further, a first diversion trench is arranged between the first fan-shaped trench and the bonding pad, and the trench wall of the first diversion trench is a slope surface.

Further, a second diversion trench is arranged between the second fan-shaped trench and the bonding pad, and the trench wall of the second diversion trench is a slope surface.

Further, the number of the bonding pads is set to be multiple, the bonding pads are distributed in a rectangular array, and the number of the first fan-shaped grooves and the second fan-shaped grooves in each bonding pad is four.

Further, the method comprises the steps of,

compared with the prior art, the utility model provides a stable reflow soldering steel mesh structure, which has the following beneficial effects:

1. this stable reflow soldering steel mesh structure, through the steel mesh body that main network, first thickening net and second thickening net constitute, its total thickness keeps at 0.5 mm's scheme, the steel mesh body after the thickening has increased the steel mesh and has gone up tin volume under, the product makes the downthehole no air remain after the backward flow, make its tin volume increase 150% after the printing, the production yield has been improved, the product has solved and has had certain air in the hole after the first face welding is accomplished, the product is because of air exists in the cavity after producing the second face printing tin cream, the problem that the air release leads to the bad production of cavity when the reflow soldering.

2. This stable type reflow soldering steel mesh structure through the first fan-shaped groove and the second fan-shaped groove of seting up in the pad, utilizes first guiding gutter and second guiding gutter be convenient for evenly scraping into first fan-shaped groove and second fan-shaped inslot with the soldering paste simultaneously, has ensured welded effective area.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic cross-sectional view of a steel mesh body of the present utility model;

fig. 3 is a schematic structural view of a bonding pad according to the present utility model.

In the figure: 1 steel mesh body, 101 main network, 102 first thickening net, 103 second thickening net, 2 bonding pads, 3 welding holes, 4 first fan-shaped grooves, 5 second fan-shaped grooves, 6 first guiding grooves, 7 second guiding grooves and 8 mounting grooves.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Embodiment one:

referring to fig. 1-2, a stable reflow soldering steel mesh structure in the present embodiment includes a steel mesh body 1, wherein the steel mesh body 1 is composed of a main mesh 101, a first thickened mesh 102 and a second thickened mesh 103, the first thickened mesh 102 is fixedly connected to an upper surface of the main mesh 101, and the second thickened mesh 103 is fixedly connected to a lower surface of the main mesh 101.

The thickness of the steel mesh body 1 is 0.5mm, the thickness of the main mesh 101 is equal to the thickness of the second thickened mesh 103, wherein the thicknesses of the main mesh 101 and the second thickened mesh 103 are both 0.15mm, the thickness of the first thickened mesh 102 is 0.2mm, the thickened steel mesh increases the tin amount under the steel mesh, no air residue exists in holes after the product is reflowed, and the tin amount is increased by 150% after printing.

In this embodiment, the inboard of steel mesh body 1 is provided with pad 2, and welding hole 3 has been seted up to the inboard of pad 2, and welding hole 3 runs through to the inboard of steel mesh body 1, and wherein, pad 2 fixed connection is to the upper surface of main network 101, and the mounting groove 8 with pad 2 looks adaptation has been seted up to the inboard of first thickening net 102, has made things convenient for the installation of pad 2.

The outer shape of the bonding pad 2 is square, and the bonding hole 3 is a square hole.

Embodiment two:

referring to fig. 3, on the basis of the first embodiment, a first fan-shaped groove 4 and a second fan-shaped groove 5 are respectively formed on the inner side of the bonding pad 2.

Wherein, first guiding gutter 6 has been seted up between first fan-shaped groove 4 and the bonding pad 2, and simultaneously, the cell wall of first guiding gutter 6 is the slope face, and at the solder paste during operation, the solder paste that utilizes first guiding gutter 6 is convenient for flow into in the first fan-shaped groove 4, has ensured welded effective area.

Wherein, second guiding gutter 7 has been seted up between second fan-shaped groove 5 and the bonding pad 2, and simultaneously, the cell wall of second guiding gutter 7 is the slope face, and at the solder paste during operation, in the second fan-shaped groove 5 is flowed into to the solder paste of utilizing second guiding gutter 7, has ensured welded effective area.

The number of the bonding pads 2 is plural, the plurality of bonding pads 2 are distributed in a rectangular array, and the number of the first fan-shaped grooves 4 and the second fan-shaped grooves 5 in each bonding pad 2 is four.

The working principle of the embodiment is as follows:

when the solder paste scraping device is used, the first thickening net 102 with the thickness of 0.2mm is added above the main net 1 with the thickness of 0.15mm, the second thickening net 103 with the thickness of 0.15mm is added below the main net 1, the total thickness is kept at the scheme of 0.5mm, and meanwhile, solder paste is uniformly scraped into the first fan-shaped groove 4 and the second fan-shaped groove 5 when the solder paste scraping device works.

The beneficial effects of the embodiment are as follows:

this stable reflow soldering steel mesh structure, through the steel mesh body 1 that main network 101, first thickening net 102 and second thickening net 103 constitute, its total thickness keeps at 0.5 mm's scheme, the steel mesh body 1 after thickening has increased the steel mesh and has gone up tin volume under, and the product makes the downthehole no air remain after the backward flow, makes its tin volume increase 150% after printing, has solved tin hole bad problem, has improved the production yield.

This stable type reflow soldering steel mesh structure through the first fan-shaped groove 4 and the second fan-shaped groove 5 of seting up in the pad 2, utilizes first guiding gutter 6 and second guiding gutter 7 to be convenient for evenly scraping into first fan-shaped groove 4 and second fan-shaped groove 5 with the soldering paste simultaneously in, has ensured welded effective area.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a stable form reflow soldering steel mesh structure, includes steel mesh body (1), its characterized in that: the steel mesh body (1) comprises main network (101), first thickening net (102) and second thickening net (103), first thickening net (102) fixed connection is to the upper surface of main network (101), second thickening net (103) fixed connection is to the lower surface of main network (101), the inboard of steel mesh body (1) is provided with pad (2), welding hole (3) have been seted up to the inboard of pad (2), welding hole (3) run through to the inboard of steel mesh body (1), first fan-shaped groove (4) and second fan-shaped groove (5) have been seted up respectively to the inboard of pad (2).

2. A stable reflow soldering steel mesh structure in accordance with claim 1, wherein: the thickness of the steel mesh body (1) is 0.5mm, and the thickness of the main mesh (101) is equal to that of the second thickened mesh (103).

3. A stable reflow soldering steel mesh structure in accordance with claim 1, wherein: the thickness of the main network (101) and the second thickening network (103) is 0.15mm, and the thickness of the first thickening network (102) is 0.2mm.

4. A stable reflow soldering steel mesh structure in accordance with claim 1, wherein: the shape of the bonding pad (2) is square, and the bonding hole (3) is a square hole.

5. A stable reflow soldering steel mesh structure in accordance with claim 1, wherein: the bonding pad (2) is fixedly connected to the upper surface of the main network (101), and an installation groove (8) matched with the bonding pad (2) is formed in the inner side of the first thickening network (102).

6. A stable reflow soldering steel mesh structure in accordance with claim 1, wherein: a first diversion trench (6) is arranged between the first fan-shaped trench (4) and the bonding pad (2), and the trench wall of the first diversion trench (6) is a slope surface.

7. A stable reflow soldering steel mesh structure in accordance with claim 1, wherein: a second diversion trench (7) is arranged between the second fan-shaped trench (5) and the bonding pad (2), and the trench wall of the second diversion trench (7) is a slope surface.

8. A stable reflow soldering steel mesh structure in accordance with claim 1, wherein: the number of the bonding pads (2) is multiple, the bonding pads (2) are distributed in a rectangular array, and the number of the first fan-shaped grooves (4) and the second fan-shaped grooves (5) in each bonding pad (2) is four.