CN219372526U - Height-reducing miniaturized camera module - Google Patents

Abstract

The application provides a height-reducing's miniaturized module of making a video recording, include: lens, bracket, optical filter, chip, circuit board, electronic device and mobile phone adapter plate; the mobile phone adapter plate is provided with an accommodating hole; the lens is arranged on the upper end face of the bracket, the optical filter is arranged in the bracket, and the optical filter is correspondingly positioned below the lens; the chip and the electronic device are both arranged at the lower end face of the circuit board, the circuit board is arranged between the lower end face of the bracket and the upper end face of the mobile phone adapter plate, and the chip and the electronic device are arranged in the accommodating hole; the structure of the camera module can be optimized, the overall height is reduced, and the camera module is miniaturized.

Description

Height-reducing miniaturized camera module

Technical Field

The utility model relates to the technical field of mobile phone cameras, in particular to a miniaturized camera module capable of reducing height.

Background

As shown in fig. 1-2 of the specification, the current mobile phone camera module generally comprises a lens 1, a bracket 2, an optical filter 3, a chip 4, a circuit board 5 and an electronic device 6; the lens 1 and the optical filter 3 are both arranged in an inner hole of the bracket 2, and the optical filter 3 is correspondingly positioned below the lens 1; the chip 4 and the electronic device 6 are arranged on the upper end face of the circuit board 5, the bracket 2 is arranged on the upper end face of the circuit board 5, the chip 4 is arranged below the lens 1 and the optical filter 3, the chip 4 and the optical filter 3 are arranged oppositely, the circuit board 5 is also provided with a connector 7, and the camera module is connected with other parts of the mobile phone through the connector 7.

However, the problem that the mobile phone camera module structure can exist is that the overall structure of the camera module is large, and the overall height is high, so that the mobile phone camera module structure does not accord with the trend of ultrathin development of the existing mobile phone.

Therefore, it is necessary to provide a technical solution that can optimize the structure of the camera.

Disclosure of Invention

The utility model provides a miniaturized camera module with reduced height, which aims to solve the problems of large overall structure and higher height of the existing camera.

The technical scheme adopted by the utility model is as follows: a reduced height miniaturized camera module comprising: lens, bracket, optical filter, chip, circuit board, electronic device and mobile phone adapter plate; the mobile phone adapter plate is provided with an accommodating hole; the lens is arranged at the upper end face of the bracket, the optical filter is arranged in the bracket, and the optical filter is correspondingly positioned below the lens; the chip and the electronic device are both arranged at the lower end face of the circuit board, the circuit board is arranged between the lower end face of the bracket and the upper end face of the mobile phone adapter plate, and the chip and the electronic device are arranged in the accommodating hole.

In an embodiment, the circuit board is provided with a through connection hole, the connection hole is located below the optical filter, the chip is located at a lower port of the connection hole, and the chip and the optical filter are arranged opposite to each other.

In one embodiment, gold wires are arranged on the upper end face of the chip and connected with the circuit board.

In one embodiment, a clamping groove is formed in the upper end face of the bracket, and the optical filter is installed in the clamping groove; the bottom surface department of draw-in groove is provided with the card hole that runs through the terminal surface under the support, draw-in groove and card hole intercommunication so that the light filter shows in the top of chip.

In one embodiment, a shielding member for shielding signals is provided at the lower end surface of the circuit board, and the shielding member is located in the accommodating hole and covers the electronic device and the outside of the chip.

In one embodiment, the shielding piece comprises a bottom plate and coamings, four coamings are arranged at the edge of the bottom plate in an upward protruding mode, and an inner cavity is formed by surrounding the four coamings at the upper end face of the bottom plate; the coaming is fixed at the lower end face of the circuit board, and the chip and the electronic device are placed in the inner cavity.

In one embodiment, each two adjacent coamings have a gap at the corners through which heat is dissipated from the interior of the shield.

In one embodiment, the shield is a block of metallic electromagnetic shielding material for shielding electromagnetic signals and has a protective effect on the chip and electronics.

In one embodiment, a heat sink is disposed in the inner cavity of the shielding member, and the heat sink is disposed around the chip and the electronic device, and is used for dissipating heat from the chip and the electronic device.

In one embodiment, the optical filter and the bracket are fixed by glue; the bracket and the circuit board are fixed through glue or solder paste.

The beneficial effects of the utility model are as follows:

1. in the application, the lens is arranged at the upper end face of the bracket, the optical filter is arranged in the bracket, the lens corresponds to the optical filter, the arrangement mode of the lens, the optical filter and the bracket in the prior art is changed, so that the structure of the bracket can be correspondingly optimized, namely, the overall structure of the bracket is adjusted, the overall size and the height of the camera module are further reduced, meanwhile, the circuit board is arranged at the lower end face of the bracket, the chip and the electronic device are arranged at the lower end face of the circuit board, the accommodating hole is formed in the mobile phone adapter plate, and when the circuit board is placed at the upper end face of the mobile phone adapter plate, the chip and the electronic device can be placed in the accommodating hole of the mobile phone adapter plate, so that the chip and the electronic device are accommodated, and the height of the camera module is further reduced; therefore, the structure of the camera module can be optimized, the overall height is reduced, and the camera module is miniaturized.

2. In this application, the lower terminal surface department of circuit board is provided with the shield, and chip and electronic device all are located the shield inside to this protects chip and electronic device through the shield, and shields electromagnetic signal.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model, and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the description serve to explain the utility model. In the drawings:

FIG. 1 is an exploded view of a prior art camera module;

FIG. 2 is a cross-sectional view of a prior art camera module;

FIG. 3 is a cross-sectional view of an embodiment of the present utility model;

FIG. 4 is an exploded view of an embodiment of the present utility model;

FIG. 5 is a schematic diagram of a rack and a circuit board according to an embodiment of the utility model;

fig. 6 is a schematic structural view of a shielding member according to an embodiment of the present utility model.

The drawings are marked with the following description: 1. a lens; 2. a bracket; 201. a clamping groove; 202. a bottom surface; 203. a clamping hole; 3. a light filter; 4. a chip; 5. a circuit board; 501. a connection hole; 6. an electronic device; 7. a connector; 8. a shield; 801. a bottom plate; 802. coaming plate; 803. a gap; 9. a mobile phone adapter plate; 901. an accommodation hole; 10. gold wires; 11. a heat sink.

Detailed Description

The following describes specific embodiments of the present utility model in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the utility model, are not intended to limit the utility model.

For the convenience of understanding of those skilled in the art, the following examples are provided to illustrate specific implementation procedures of the technical solutions provided in the present application.

The embodiment provides a miniaturized camera module with reduced height.

Referring to fig. 3-6, fig. 3 shows a cross-sectional view of the camera module of the present embodiment, where the mobile phone adapter plate only shows a part of the structure; fig. 4 shows an exploded view of the camera module of the present embodiment, in which only a part of the structure of the mobile phone adapter is shown; fig. 5 shows a schematic structural view of the camera bracket and the circuit board of the present embodiment; fig. 6 shows a schematic structural view of the shield of the present embodiment.

The camera module of this embodiment includes: the lens 1, the bracket 2, the optical filter 3, the chip 4, the circuit board 5, the electronic device 6 and the mobile phone adapter plate 9; the mobile phone adapter plate 9 is provided with an accommodating hole 901; the lens 1 is arranged at the upper end face of the bracket 2, the optical filter 3 is arranged inside the bracket 2, and the optical filter 3 is exposed at the upper end face of the bracket 2 and is correspondingly positioned below the lens 1; the chip 4 and the electronic device 6 are both arranged at the lower end face of the circuit board 5, the circuit board 5 is arranged between the lower end face of the bracket 2 and the upper end face of the mobile phone adapter plate 9, the chip 4 and the electronic device 6 are arranged in the accommodating hole 901 of the mobile phone adapter plate 9, and the chip 4 and the optical filter 3 are arranged oppositely; the mobile phone adapter plate 9 and the bracket 2 are used for providing positions to correspondingly install all components, when the camera module works, the lens 1 gathers and transmits light of an observed object into the optical filter 3, the optical filter 3 performs light filtration, then the light is projected to the chip 4 after passing through the clamping hole 203 of the bracket and the connecting hole 501 of the circuit board 5, and the light source is calculated and imaged at the chip 4, so that the camera work is completed.

In this embodiment, the lens 1 is disposed at the upper end face of the bracket 2, and the optical filter 3 is disposed inside the bracket 2, so as to change the arrangement modes of the lens 1, the optical filter 3 and the bracket 2 in the prior art, so that the structure of the bracket 2 can be correspondingly optimized, that is, the overall structure size of the bracket 2 is adjusted, the height is reduced, and the overall structure size and the height of the camera module are further reduced, meanwhile, the circuit board 5 is disposed at the lower end face of the bracket 2, the chip 4 and the electronic device 6 are disposed at the lower end face of the circuit board 5, and the accommodating hole 901 is disposed on the mobile phone adapter 9, when the circuit board 5 is disposed at the upper end face of the mobile phone adapter 9, the chip 4 and the electronic device 6 can be placed in the accommodating hole 901, so as to accommodate the chip 4 and the electronic device 6, and thus the overall height of the camera module is further reduced; therefore, the structure of the camera module can be optimized, the overall height of the camera module is reduced, and the camera module is miniaturized.

The middle of the circuit board 5 is hollowed out, the chip 4 is installed at the hollowed-out part, and the chip 4 is located at the lower end face of the circuit board 5.

Further, the optical filter 3 is fixed with the bracket 2 through glue; the bracket 2 and the circuit board 5 are fixed by glue or solder paste.

Further, the circuit board 5 is provided with a through connection hole 501, the connection hole 501 is located below the optical filter 3, and the chip 4 is located at the lower port of the connection hole 501, so that the chip 4 corresponds to the optical filter 3, and an external light source can pass through the lens 1, then pass through the optical filter 3 to perform optical path filtration, and then be projected to the chip 4, and the light source is computed and imaged.

Further, gold wires 10 are arranged on the upper end face of the chip 4 and connected with the circuit board 5. Specifically, the chip 4 and the circuit board 5 are connected by surface packaging and bonding, and the gold wire 10 is connected to the side of the connection hole 501 of the circuit board 5.

In another embodiment, the chip 4 is disposed inside the connection hole 501 of the circuit board 5, and the side wall of the chip 4 and the inner wall of the connection hole 501 may be fixed by glue connection, and then connected to the circuit board 5 at the edge of the chip 4 by the gold wire 10.

Further, a clamping groove 201 is formed in the upper end face of the bracket 2, and the optical filter 3 is installed in the clamping groove 201; a clamping hole 203 penetrating through the lower end face of the bracket 2 is arranged at the bottom face 202 of the clamping groove 201, and the clamping groove 201 is communicated with the clamping hole 203 so that the optical filter 3 is exposed above the chip 4. Specifically, the bracket 2 is concavely arranged in the middle of the upper end surface to form a clamping groove 201, the structure of the clamping groove 201 corresponds to that of the optical filter 3, in this embodiment, the clamping groove 201 is rectangular, and the optical filter 3 is installed in the clamping groove 201, so that the optical filter 3 can be accommodated in the bracket 2, and the height of the camera module is reduced; meanwhile, a clamping hole 203 is formed in the bottom surface 202 of the clamping groove 201, and the clamping hole 203 penetrates through the lower end surface of the support 2, so that the optical filter 3 is exposed above the chip 4, and a light source filtered by the optical filter 3 can be smoothly projected into the chip 4, and the operation of the camera module is ensured.

Further, a shield 8 for shielding signals is provided at the lower end face of the circuit board 5, and the shield 8 is located in the accommodation hole 901 and covers the outside of the electronic device 6 and the chip 4. Specifically, the shielding member 8 is a metal electromagnetic shielding material block, such as iron, silver, nickel, copper, aluminum or metal alloy, and is mainly used for shielding electromagnetic signals to ensure that the chip 4 and the electronic device 6 work normally, meanwhile, the shielding member 8 is placed in the accommodating hole 901, so that the overall height of the camera module cannot be affected, and in addition, the shielding member 8 can also protect internal elements, such as the chip 4 and the electronic device 6.

Further, the shielding member 8 comprises a bottom plate 801 and a coaming 802, four coaming 802 are arranged at the edge of the bottom plate 801 in an upward protruding mode, and an inner cavity is formed by surrounding the four coaming 802 at the upper end face of the bottom plate 801; the coaming 802 is fixed at the lower end face of the circuit board 5, and the chip 4 and the electronic device 6 are placed in the inner cavity, so that the chip 4 and the electronic device 6 are shielded by signals through the shielding member 8, and the chip 4 and the electronic device 6 are protected.

Further, the heat dissipation fins 11 are disposed in the inner cavity of the shielding member 8, in this embodiment, the heat dissipation fins 11 are disposed in four blocks and are disposed around the chip 4 and the electronic device 6, and the heat dissipation is performed on the chip 4 and the electronic device 6 through the heat dissipation fins 11, so as to ensure that the chip 4 and the electronic device work normally. In addition, the corners of every two adjacent coamings 802 of the shielding member 8 are provided with gaps 803, and air in the inner cavity can be discharged through the gaps, so that heat dissipation is further carried out on the inside of the shielding member 8 through the gaps 803.

Compared with the prior art: the connection mode and the arrangement structure of the lens 1, the optical filter 3 and the bracket 2 are changed, so that the structure of the bracket 2 can be correspondingly optimized, the miniaturization design is realized, the height is reduced, the overall size and the height of the camera module are further reduced, meanwhile, the chip 4 and the electronic device 6 are arranged in the accommodating hole 901 of the mobile phone adapter plate 9 after being installed, and the chip 4 and the electronic device 6 are accommodated in the accommodating hole 901, so that the overall height of the camera module is further reduced; therefore, through above-mentioned setting, this application can optimize the structure of module of making a video recording, reduces the overall height of the module of making a video recording, makes the module of making a video recording realize miniaturized setting.

Any combination of the various embodiments of the utility model should be considered as being within the scope of the present disclosure, as long as the inventive concept is not violated; within the scope of the technical idea of the utility model, any combination of various simple modifications and different embodiments of the technical proposal without departing from the inventive idea of the utility model should be within the scope of the utility model.

Claims (10)

1. A miniaturized camera module of reduced height, comprising: lens, bracket, optical filter, chip, circuit board, electronic device and mobile phone adapter plate; the mobile phone adapter plate is provided with an accommodating hole; the lens is arranged at the upper end face of the bracket, the optical filter is arranged in the bracket, and the optical filter is correspondingly positioned below the lens; the chip and the electronic device are both arranged at the lower end face of the circuit board, the circuit board is arranged between the lower end face of the bracket and the upper end face of the mobile phone adapter plate, and the chip and the electronic device are arranged in the accommodating hole.

2. The reduced height compact camera module of claim 1, wherein: the circuit board is provided with a through connecting hole, the connecting hole is positioned below the optical filter, the chip is positioned at the lower port of the connecting hole, and the chip and the optical filter are oppositely arranged.

3. The reduced height compact camera module of claim 1 or 2, wherein: and a gold wire is arranged on the upper end face of the chip and is connected with the circuit board.

4. The reduced height compact camera module of claim 1, wherein: a clamping groove is formed in the upper end face of the bracket, and the optical filter is arranged in the clamping groove; the bottom surface department of draw-in groove is provided with the card hole that runs through the terminal surface under the support, draw-in groove and card hole intercommunication so that the light filter shows in the top of chip.

5. The reduced height compact camera module of claim 1, wherein: a shielding piece for shielding signals is arranged at the lower end face of the circuit board, is positioned in the accommodating hole and covers the electronic device and the outside of the chip.

6. The reduced height compact camera module of claim 5, wherein: the shielding piece comprises a bottom plate and coamings, four coamings are arranged at the edge of the bottom plate in an upward protruding mode, and an inner cavity is formed by surrounding the four coamings at the upper end face of the bottom plate; the coaming is fixed at the lower end face of the circuit board, and the chip and the electronic device are placed in the inner cavity.

7. The reduced height compact camera module of claim 6, wherein: every two adjacent coamings have gaps at corners, and the inside of the shielding piece is radiated through the gaps.

8. The reduced height compact camera module of claim 5, wherein: the shielding piece is a metal electromagnetic shielding material block and is used for shielding electromagnetic signals, and the shielding piece has a protective effect on chips and electronic devices.

9. The reduced height compact camera module of claim 6, wherein: and a radiating fin is arranged in the inner cavity of the shielding piece and is arranged around the chip and the electronic device and used for radiating the heat of the chip and the electronic device.

10. The reduced height compact camera module of claim 1, wherein: the optical filter and the bracket are fixed by glue; the bracket and the circuit board are fixed through glue or solder paste.