CN219363533U

CN219363533U - Polymer conductive adhesive film

Info

Publication number: CN219363533U
Application number: CN202222525624.8U
Authority: CN
Inventors: 林壁鹏; 赵成海; 秦柏威
Original assignee: Shenzhen Xiliu Photoelectroicite Technic Co ltd
Current assignee: Shenzhen Xiliu Photoelectroicite Technic Co ltd
Priority date: 2022-09-23
Filing date: 2022-09-23
Publication date: 2023-07-18
Anticipated expiration: 2032-09-23

Abstract

The utility model discloses a high-molecular conductive adhesive film, which comprises a first protective film layer, a high-molecular conductive adhesive layer and a second protective film layer, wherein the first protective film layer, the high-molecular conductive adhesive layer and the second protective film layer are sequentially and fixedly connected, and the high-molecular conductive adhesive layer is one of epoxy resin, polyacrylic resin, polyimide resin, modified rubber, phenolic resin, polyester resin and polyurethane resin; the high-molecular conductive adhesive layer adopts a high-molecular conductive material, is environment-friendly, reduces the filling amount of conductive powder, greatly reduces the manufacturing cost, saves resources, has good conductivity, can smoothly conduct charges from a printed circuit board to the position of a metal reinforcing steel sheet, has extremely strong adhesive force to metal, and meets the use requirement of reinforcement.

Description

Polymer conductive adhesive film

Technical Field

The utility model belongs to the technical field of conductive adhesive films, and particularly relates to a high-molecular conductive adhesive film.

Background

The conductive adhesive film is a lead-free connecting material which provides mechanical and electrical connection between the element and the circuit board, and is thus increasingly widely used in various electronic fields such as microelectronic packaging, printed circuit boards, conductive circuit bonding, etc., and as the demand for consumer electronics continues to increase, the demand for printed circuit boards is also increasing.

The printed circuit board needs to increase strength and conductivity at the terminal part and the special part, and is generally realized by using a reinforcing material at the reinforcing part, and then, the electric connection between a steel sheet (reinforcing material) and the printed circuit board is realized through a conductive adhesive film.

Disclosure of Invention

The utility model aims at: in order to solve the above-mentioned problems, a polymer conductive adhesive film is provided.

The technical scheme adopted by the utility model is as follows: the utility model provides a polymer conductive adhesive film, includes first protection film layer, polymer conductive adhesion layer and second protection film layer, first protection film layer, polymer conductive adhesion layer and second protection film layer are fixed in order and are linked to each other.

In a preferred embodiment, the polymer conductive adhesive layer is one of epoxy resin, polyacrylic resin, polyimide resin, modified rubber, phenolic resin, polyester resin, and polyurethane resin.

In a preferred embodiment, the first protective film layer and the second protective film layer are selected from one of a PET release film, a PP release film, a PBT release film, and a release paper.

In a preferred embodiment, the first protective film layer and the second protective film layer have a thickness of 25 to 100 μm.

In a preferred embodiment, the polymer material in the polymer conductive adhesive layer is selected from one of polypyrrole, polyphenylene sulfide, a polymalocyanine compound, polyaniline and polythiophene.

In a preferred embodiment, the polymeric conductive adhesive layer has a thickness of 40-60 μm.

In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:

1. in the utility model, the conductive polymer structural material is adopted as a whole, so that the method is environment-friendly, the filling amount of conductive adhesive layer powder is reduced, the manufacturing cost is greatly reduced, the resources are saved, and the designability of the prepared electromagnetic shielding film can be greatly improved by the design of the whole structure.

2. In the utility model, the whole adhesive film has good conduction performance, can smoothly conduct charges from the printed circuit board to the position of the metal reinforcing steel sheet, has extremely strong adhesive force to metal, and meets the use requirement of reinforcement.

Drawings

Fig. 1 is a schematic structural diagram of a polymer conductive adhesive film according to the present utility model.

The marks in the figure: 1-a first protective film layer, 2-a high polymer conductive adhesive layer and 3-a second protective film layer.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Referring to fig. 1, a polymer conductive adhesive film comprises a first protective film layer 1, a polymer conductive adhesive layer 2 and a second protective film layer 3, wherein the first protective film layer 1, the polymer conductive adhesive layer 2 and the second protective film layer 3 are sequentially and fixedly connected, the polymer conductive adhesive layer 2 is one of epoxy resin, polyacrylic resin, polyimide resin, modified rubber, phenolic resin, polyester resin and polyurethane resin, conductive powder and a polymer material are further included in the polymer conductive adhesive layer 2, a conductive polymer structural material is adopted, the environment is protected, the filling amount of the powder of the conductive adhesive layer is reduced, the manufacturing cost is greatly reduced, resources are saved, and the designability of the prepared electromagnetic shielding film is greatly improved through the whole structural design.

In this embodiment, the first protective film layer 1 and the second protective film layer 3 are selected from one of a PET release film, a PP release film, a PBT release film and release paper, and the thickness of the first protective film layer 1 and the second protective film layer 3 is 25-100 μm, so that the first protective film layer 1 and the second protective film layer 3 can play a role in protecting the polymer conductive adhesive layer 2.

In this embodiment, the polymer material in the polymer conductive adhesive layer 2 is selected from one of polypyrrole, polyphenylene sulfide, a polymalocyanine compound, polyaniline and polythiophene, and the conductive powder in the polymer conductive adhesive layer 2 comprises one or a combination of several of silver powder, copper powder, nickel powder, silver-coated copper powder, silver-coated nickel powder, graphite and conductive carbon black, and the thickness of the polymer conductive adhesive layer 2 is 40-60 μm.

In order to better apply the utility model, the following describes the preparation method of the conductive adhesive film, which comprises the following steps:

a1, removing greasy dirt and foreign matters on the inner surface of the first protective layer film roll;

a2, coating a layer of high-molecular conductive adhesive on the first protective film, wherein the thickness is 40-60 mu m, and drying in an oven at 60-120 ℃ at a linear speed of 5-20m/min; a3, rolling;

a4, attaching a second protective film.

The preparation method of the polymer conductive adhesive film provided by the utility model adopts a conventional mature technology in the process, so that the manufacturing process of the polymer conductive adhesive film is simple and easy to realize, is convenient to popularize and apply in industry, and has the advantages of simplicity in operation, easiness in production and the like.

The preparation method of the polymer conductive adhesive film provided by the embodiment comprises the following steps:

a1, removing greasy dirt and foreign matters on the inner surface of a film roll of a first protective film layer 1 (PET release film) with the thickness of 100 mu m;

a2, coating a layer of high polymer conductive adhesive layer 2 (the proportion of the silver-coated copper powder is 80 percent and the silver-coated copper powder is distributed in the modified epoxy resin) coated with 60 mu m of conductive powder on the first protective film layer 1, drying the mixture in an oven at the temperature of 60-120 ℃ and the linear speed of 5-20m/min;

a3, rolling;

and A4, attaching a second protective film layer 3 on the surface of the macromolecule conductive bonding layer 2.

Example 2

A1, removing greasy dirt and foreign matters on the inner surface of a film roll of a first protective film layer (PET release film) 1 with the thickness of 100 mu m;

a2, coating a layer of high polymer conductive adhesive layer 2 (the proportion of the silver-coated copper powder is 50 percent and the content of the polythiophene is 2 percent) with the thickness of 60 mu m and containing conductive powder and coated with 60 mu m on the first protective film layer 1, and drying in an oven at the temperature of 60-120 ℃ and the linear speed of 5-20m/min;

a3, rolling;

and A4, attaching a second protective film on the surface of the macromolecule conductive bonding layer 2.

Experimental example product Performance detection

The polymer conductive adhesive film prepared in the example was subjected to quality detection using the quality detection criteria shown in table 1.

TABLE 1 quality test results

The detection results show that all the test results of the polymer conductive adhesive film provided by the application can reach the corresponding indexes. The utility model adopts the high polymer conductive material, is green and environment-friendly, reduces the filling amount of conductive powder, greatly reduces the manufacturing cost, saves resources, has good conduction performance, can smoothly conduct charges from a printed circuit board to the position of a metal reinforcing steel sheet, has extremely strong adhesive force to metal, and meets the use requirement of reinforcement.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. The utility model provides a polymer conductive adhesive film, includes first protection film layer, polymer conductive adhesive layer and second protection film layer, its characterized in that: the first protective film layer, the high polymer conductive adhesive layer and the second protective film layer are fixedly connected in sequence.

2. The polymer conductive adhesive film according to claim 1, wherein: the high polymer conductive adhesive layer is one of epoxy resin, polyacrylic resin, polyimide resin, modified rubber, phenolic resin, polyester resin and polyurethane resin.

3. The polymer conductive adhesive film according to claim 1, wherein: the first protective film layer and the second protective film layer are selected from one of PET release film, PP release film, PBT release film and release paper.

4. The polymer conductive adhesive film according to claim 1, wherein: the thickness of the first protective film layer and the second protective film layer is 25-100 mu m.

5. The polymer conductive adhesive film according to claim 2, wherein: the high polymer material in the high polymer conductive adhesive layer is selected from one of polypyrrole, polyphenylene sulfide, a polymalocyanine compound, polyaniline and polythiophene.

6. The polymer conductive adhesive film according to claim 1, wherein: the thickness of the macromolecule conductive bonding layer is 40-60 mu m.