CN219352001U

CN219352001U - Mainboard and terminal equipment compatible with different WiFi modules

Info

Publication number: CN219352001U
Application number: CN202223226420.0U
Authority: CN
Inventors: 刘威
Original assignee: Shenzhen Weibu Information Co Ltd
Current assignee: Shenzhen Weibu Information Co Ltd
Priority date: 2022-12-02
Filing date: 2022-12-02
Publication date: 2023-07-14
Anticipated expiration: 2032-12-02

Abstract

The embodiment of the utility model discloses a mainboard and terminal equipment compatible with different WiFi modules, wherein a processor, a plurality of compatible welding positions, card socket welding positions and patch welding positions are arranged on a mainboard body of the mainboard; the compatible welding position is connected with the processor, the card inserting seat welding position and the patch welding position; when the socket is welded with the socket and the socket WiFi module is plugged in the socket, corresponding electronic elements are welded on corresponding bonding pads of each compatible welding position, so that the processor is connected with the socket WiFi module on the socket through the socket welding positions; when the patch type WiFi module is welded at the patch welding position, corresponding electronic elements are welded on corresponding bonding pads of all compatible welding positions, so that the processor is connected with the patch type WiFi module through the patch welding position. The purpose that two packaging WiFi modules share the main board is achieved, the PCB is not required to be developed one by one according to packaging types, and production cost and research and development cost are reduced.

Description

Mainboard and terminal equipment compatible with different WiFi modules

Technical Field

The utility model relates to the technical field of electronics, in particular to a mainboard and terminal equipment compatible with different WiFi modules.

Background

The WiFi module integrates the functions of a WiFi wireless network protocol IEEE802.11 protocol stack and a TCP/IP protocol stack into the module, and leads out various interfaces. The traditional hardware device is embedded into the WiFi module, and can directly connect to the Internet by utilizing WiFi, so that the wireless intelligent connection, wiFi remote control and other important components for the Internet of things are realized. Is generally applied to products such as notebook computers, flat panels, industrial Personal Computers (PCs) and the like.

Common WiFi module packaging types include a plug-in card 2230, a patch 1216, and the like, and according to market demands, the same manufacturer normally produces different packaging modules of the same IC. However, the existing encapsulated WiFi module can only be matched with one PCB, different PCB designs are needed for different module encapsulation, and the PCB with the corresponding model must be independently developed, so that the design cost of the product is greatly increased, and the cost performance of the product is reduced.

And in addition, the common pad design of a plurality of different packaging modules supporting different communication signals needs to occupy CPU port resources, so that CPU resource waste is caused, meanwhile, different BIOS (Basic Input Output System) and driving files need to be configured, the development period is prolonged, and the software management cost is increased.

Disclosure of Invention

Aiming at the technical problems, the embodiment of the utility model provides a mainboard and terminal equipment compatible with different WiFi modules, so as to solve the problem of cost increase caused by different PCB boards required to be designed for different packaging of the existing WiFi modules.

The embodiment of the utility model provides a mainboard compatible with different WiFi modules, which comprises a mainboard body, wherein a processor, a plurality of compatible welding positions, a card socket welding position and a patch welding position are arranged on the mainboard body; the compatible welding position is connected with the processor, the card inserting seat welding position and the patch welding position;

when the plug-in card holder is welded with the plug-in card holder and the plug-in card type WiFi module is plugged in the plug-in card holder, corresponding electronic elements are welded on corresponding bonding pads of all compatible welding positions, so that the processor is connected with the plug-in card type WiFi module through the plug-in card holder welding positions and the plug-in card type WiFi module;

when the patch type WiFi module is welded at the patch welding position, corresponding electronic elements are welded on corresponding bonding pads of all compatible welding positions, so that the processor is connected with the patch type WiFi module through the patch welding position.

Optionally, in the motherboard compatible with different WiFi modules, the compatible soldering bit is composed of a first pad, a second pad and a third pad;

each first bonding pad is connected with the card inserting seat welding position, each second bonding pad is connected with the processor, and each third bonding pad is connected with the patch welding position.

Optionally, in the motherboard compatible with different WiFi modules, the number of compatible welding positions is 6, including a first compatible welding position to a sixth compatible welding position;

the first bonding pad of the first compatible bonding bit, the first bonding pad of the second compatible bonding bit, the first bonding pad of the third compatible bonding bit, the first bonding pad of the fourth compatible bonding bit, the first bonding pad of the fifth compatible bonding bit and the first bonding pad of the sixth compatible bonding bit are in one-to-one connection with the PERP0 pin, the PERn0 pin, the PETp0 pin, the PETn0 pin, the REFCLKP0 pin and the REFCLKN0 pin of the socket bonding bit; the second bonding pad of the first compatible bonding bit, the second bonding pad of the second compatible bonding bit, the second bonding pad of the third compatible bonding bit, the second bonding pad of the fourth compatible bonding bit, the second bonding pad of the fifth compatible bonding bit and the second bonding pad of the sixth compatible bonding bit are in one-to-one connection with the PCIE3_TXP/USB31_3_TXP pin, PCIE3_TXN/USB31_3_TXN pin, PCIE3_RXP/USB31_3_RXP pin, PCIE3_TXP/USB31_3_RXN pin, CLKOUT_PCIE_P1 pin and CLKOUT_PCIE_N1 pin of the processor; and the third bonding pad of the first compatible bonding bit, the third bonding pad of the second compatible bonding bit, the third bonding pad of the third compatible bonding bit, the third bonding pad of the fourth compatible bonding bit, the third bonding pad of the fifth compatible bonding bit and the third bonding pad of the sixth compatible bonding bit are in one-to-one connection with the PETP0 pin, the PETN0 pin, the PERP0 pin, the PERN0 pin, the PEFCLKP0 pin and the PEFCLKN0 pin of the patch bonding bit.

Optionally, in the motherboard compatible with different WiFi modules, cnvi_wtd1P, cnvi_wtd1N, cnvi_wtd0P, cnvi_wtd0N, cnvi_wtjclkn, cnvi_wrd1P, cnvi_wrd1N, cnvi_wrd0P, cnvi_wrd0N, cnvi_wrjclkp, cnvi_wrjclkn, wtd1P, wtjd1N, wtjd0P, wtjd0N, wtjd0P, wtjclkp, wtjclkn, wgr_d1P, wgr_d0N, wgr_clkn, and wgr_n of the patch welding sites are connected in a one-to-one.

Optionally, in the motherboard compatible with different WiFi modules, when the card socket is welded with a card socket on the card socket welding position and the card socket WiFi module is inserted on the card socket, the motherboard body is provided with a first capacitor, a second capacitor, a first resistor, a second resistor, a third resistor and a fourth resistor;

the two ends of the first capacitor are correspondingly welded on the first bonding pad and the second bonding pad of the first compatible bonding site respectively, the two ends of the second capacitor are correspondingly welded on the first bonding pad and the second bonding pad of the second compatible bonding site respectively, the two ends of the first resistor are correspondingly welded on the first bonding pad and the second bonding pad of the third compatible bonding site respectively, the two ends of the second resistor are correspondingly welded on the first bonding pad and the second bonding pad of the fourth compatible bonding site respectively, the two ends of the third resistor are correspondingly welded on the first bonding pad and the second bonding pad of the fifth compatible bonding site respectively, and the two ends of the fourth resistor are correspondingly welded on the first bonding pad and the second bonding pad of the sixth compatible bonding site respectively.

Optionally, in the motherboard compatible with different WiFi modules, the capacitance value of the first capacitor and the second capacitor is 0.22uF, and withstand voltage is 6.3V.

Optionally, in the motherboard compatible with different WiFi modules, when the patch WiFi module is welded on the patch welding position, a third capacitor, a fourth capacitor, a fifth resistor, a sixth resistor, a seventh resistor and an eighth resistor are arranged on the motherboard body;

the two ends of the third capacitor are correspondingly welded on the second bonding pad and the third bonding pad of the second compatible bonding site respectively, the two ends of the fourth capacitor are correspondingly welded on the second bonding pad and the third bonding pad of the first compatible bonding site respectively, the two ends of the fifth resistor are correspondingly welded on the second bonding pad and the third bonding pad of the sixth compatible bonding site respectively, the two ends of the sixth resistor are correspondingly welded on the second bonding pad and the third bonding pad of the fifth compatible bonding site respectively, the two ends of the seventh resistor are correspondingly welded on the second bonding pad and the third bonding pad of the fourth compatible bonding site respectively, and the two ends of the eighth resistor are correspondingly welded on the second bonding pad and the third bonding pad of the third compatible bonding site respectively.

Optionally, in the motherboard compatible with different WiFi modules, the capacitance value of the third capacitor and the fourth capacitor is 0.1uF.

Optionally, in the motherboard compatible with different WiFi modules, when the compatible welding position is transversely set up on the motherboard, the first bonding pad, the second bonding pad and the third bonding pad are arranged in sequence from left to right.

The second aspect of the embodiment of the utility model provides a terminal device, which comprises the main board compatible with different WiFi modules.

In the technical scheme provided by the embodiment of the utility model, the main board compatible with different WiFi modules comprises a main board body, wherein a processor, a plurality of compatible welding positions, card socket welding positions and patch welding positions are arranged on the main board body; the compatible welding position is connected with the processor, the card inserting seat welding position and the patch welding position; when the plug-in card holder is welded with the plug-in card holder and the plug-in card type WiFi module is plugged in the plug-in card holder, corresponding electronic elements are welded on corresponding bonding pads of all compatible welding positions, so that the processor is connected with the plug-in card type WiFi module through the plug-in card holder welding positions and the plug-in card type WiFi module; when the patch type WiFi module is welded at the patch welding position, corresponding electronic elements are welded on corresponding bonding pads of all compatible welding positions, so that the processor is connected with the patch type WiFi module through the patch welding position. Selecting corresponding electronic element loading parts on compatible welding positions according to the type of the required WiFi module, namely forming a signal path from the processor to the card-inserted WiFi module or a signal path from the processor to the patch-type WiFi module; the purpose that two packaging WiFi modules share the main board and do not occupy port resources of the processor repeatedly is achieved, the PCB is not required to be developed one to one according to the packaging type of the WiFi modules, and production cost and research and development cost are reduced.

Drawings

Fig. 1 is a block diagram of a motherboard according to an embodiment of the present utility model.

Fig. 2 is a schematic circuit diagram of a processor according to an embodiment of the utility model.

FIG. 3 is a schematic circuit diagram of a compatible solder bit and socket in accordance with an embodiment of the present utility model.

Fig. 4 is a schematic circuit diagram of a compatible bonding pad and a bonding pad in an embodiment of the utility model.

Fig. 5 is a schematic circuit layout of a motherboard according to an embodiment of the utility model.

Fig. 6 is a schematic diagram of a component-loading circuit of each compatible soldering station in fig. 3 when selecting a card-type WiFi module according to an embodiment of the utility model.

Fig. 7 is a schematic diagram of a component-mounted circuit of each compatible soldering station in fig. 4 when selecting a patch WiFi module according to an embodiment of the utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. Embodiments of the present utility model are intended to be within the scope of the present utility model as defined by the appended claims.

Referring to fig. 1, a terminal device provided in an embodiment of the present utility model includes a motherboard compatible with different WiFi modules (mainly a card-type WiFi module and a patch-type WiFi module herein), where the motherboard includes a motherboard body, and a processor 10 (i.e., a CPU), a plurality of compatible welding positions, a card socket welding position 20, and a patch welding position 30 are disposed on the motherboard body; the compatible solder station connects the processor 10, the card socket solder station 20, and the patch solder station 30. According to the type of the required WiFi module, a socket is welded on the socket welding position 20 or a patch WiFi module is welded on the patch welding position 30 (the dotted line in figure 1 represents that the connection is selected according to the requirement), the socket WiFi module is inserted on the socket, and corresponding electronic elements are welded on corresponding bonding pads of each compatible welding position; the processor is connected with the plug-in type WiFi module through the plug-in type socket welding position 20 and the plug-in type socket, or the processor is connected with the patch type WiFi module through the patch type welding position 30.

Specifically, when the motherboard needs to use the card-type WiFi module, the card socket is welded on the card socket welding position 20, and the card-type WiFi module is inserted on the card socket, and at this time, the patch welding position 30 is empty. The processor 10 is connected with the socket welding position 20 through the electronic component on the compatible welding position, each pin on the socket welding position 20 is identical to the corresponding pin on the socket in a one-to-one correspondence manner, and the pins with the same name can be connected together to transmit the same signal, so that the processor 10 can transmit a first group of signals (including a plurality of PCIE (peripheral component interconnect express) signals) between the socket welding position 20 and the socket WiFi module on the socket.

When the mainboard needs to use the patch type WiFi module, the patch type WiFi module is directly welded on the reserved patch welding position 30, and the socket welding position 20 is empty. The processor 10 is connected to the patch WiFi module on the patch soldering site 30 through the electronic components on the compatible soldering site, and the processor 10 can transmit the first set of signals and the second set of signals (including a plurality of CNVi (Intel Integrated Connectivity I/O interface) signals) between the patch soldering site 30 and the patch WiFi module.

The processing of the signals by the WiFi module is prior art and will not be described in detail here. In the embodiment, the signal path from the processor 10 to the card-inserting type WiFi module or the signal path from the processor 10 to the card-inserting type WiFi module can be formed by reserving the card-inserting type welding position 20 and the patch type welding position 30 and selecting the corresponding electronic component on the compatible welding position according to the type of the required WiFi module; the purpose that two packaging WiFi modules share the main board and do not occupy port resources of the processor repeatedly is achieved, the PCB is not required to be developed one to one according to the packaging types of the WiFi modules, production cost and research cost are reduced, and the overall cost performance of the terminal equipment is improved. The mainboard is suitable for all electronic products or industrial equipment which have X86 architecture and need WiFi modules for data transmission, for example, the terminal equipment can be an integrated machine, a notebook computer, an industrial control computer and the like.

In this embodiment, the processor is preferably a Tiger rake CPU, and other types, such as ICL (Ice rake) -U, TGL (Tiger rake) -UP3, GML (Gemini Lake), may be used in the implementation. The card socket solder station 20 is preferably an m.2 interface socket, such as an NGFF slot E-Key. Because of the fact that there are more pins and signals transmitted, only the signals and pins associated with this embodiment are shown here; the specific function of the method is the prior art.

According to the signal requirement of WiFi module transmission, be equipped with 6 compatible welding position, as shown in FIG. 5, be equipped with first compatible welding position G1, second compatible welding position G2, third compatible welding position G3, fourth compatible welding position G4, fifth compatible welding position G5 and sixth compatible welding position G6 in proper order from the bottom up between plug-in card seat welding position 20 and paster welding position 30. Each compatible welding position consists of 3 welding discs which are arranged side by side, and in each compatible welding position, the welding disc positioned on the left (adjacent to the inserting card seat welding position 20) is a first welding disc A of each compatible welding position and is connected with a corresponding pin of the inserting card seat welding position 20; the bonding pad positioned in the middle is a second bonding pad B of each compatible bonding site and is connected with the processor 20; the pad on the right (adjacent to the patch pad 30) is the third pad C of each compatible pad, connecting the patch pad 30. When the main board is subjected to layout design, the bonding pads on all the compatible bonding sites are subjected to Colay design (namely stitch bonding pad design), namely the second bonding pads on all the compatible bonding sites are shared, and one end of each electronic element is connected with the second bonding pad in the middle when the electronic element is mounted.

Referring to fig. 2 to 5, the specific connection relationships are as follows:

the first bonding pad of the first compatible bonding bit G1, the first bonding pad of the second compatible bonding bit G2, the first bonding pad of the third compatible bonding bit G3, the first bonding pad of the fourth compatible bonding bit G4, the first bonding pad of the fifth compatible bonding bit G5, and the first bonding pad of the sixth compatible bonding bit G6 are connected with the PERp0 pin, the PERn0 pin, the PETp0 pin, the PETn0 pin, the refcl kp0 pin, and the refcl kn0 pin of the card socket bonding bit 20 one to one; the second bonding pad of the first compatible bonding bit G1, the second bonding pad of the second compatible bonding bit G2, the second bonding pad of the third compatible bonding bit G3, the second bonding pad of the fourth compatible bonding bit G4, the second bonding pad of the fifth compatible bonding bit G5 and the second bonding pad of the sixth compatible bonding bit G6 are in one-to-one connection with the PCIE3_TXP/USB31_3_TXP pin, PCIE3_TXN/USB31_3_TXN pin, PCIE3_RXP/USB31_3_RXP pin, PCIE3_TXP/USB31_3_RXN pin, CLKOUT_P1 pin and PCKOUT_PCIE_N1 pin of the processor; the third bonding pad of the first compatible bonding bit G1, the third bonding pad of the second compatible bonding bit G2, the third bonding pad of the third compatible bonding bit G3, the third bonding pad of the fourth compatible bonding bit G4, the third bonding pad of the fifth compatible bonding bit G5, and the third bonding pad of the sixth compatible bonding bit G6 are connected with the PETP0 pin, PETN0 pin, PERP0 pin, PERN0 pin, PEFCLKP0 pin, PEFCLKN0 pin of the patch bonding bit 30.

The 6 compatible solder bits are used to select whether to transmit a first set of signals (including a plurality of PCIE signals) to the card-mounted WiFi module or the patch WiFi module. The first set of signals includes a PCIE3_P3_M2_WLAN_TX_DP signal, a PCIE3_P3_M2_WLAN_TX_DN signal, a PCIE3_P3_M2_WLAN_RX_DP signal, a PCIE3_P3_M2_WLAN_RX_DN signal, a CLK_SRC1_M2_WLAN_DP signal, and a CLK_SRC1_M2_WLAN_DN signal. Since the second set of signals (including the plurality of CNVi signals) can only be transmitted to the patch WiFi module, the corresponding pins of the processor 10 are directly connected to the corresponding pins of the patch soldering bit 30. The pins of the patch welding position 30 are the same as those of the patch WiFi module and correspond to each other one by one, and the pins with the same names can be connected together to transmit the same signal.

The cnvi_wtd1P, cnvi_wtjd1N, cnvi_wtjd0P, cnvi_wtjd0N, cnvi_wtjclkp, cnvi_wtjclkn, cnvi_wrjd1P, cnvi_wrjd1N, cnvi_wrjd0P, cnvi_wrjd0N, cnvi_wrjclkp, cnvi_wrjclkn, are connected one-to-one with the wt_d1P, wt_d1N, wt_d0P, wt_d0N, wt_clkp, wt_clkn, wgr_d1P, wgr_d1N, wgr_d0P, wgr_d0N, wgr_p, wgr_clkn of the patch weld site 30. The second set of signals transmitted by these pins includes a cnv_wt_lane1_dp signal, a cnv_wt_lane1_dn signal, a cnv_wt_lane0_dp signal, a cnv_wt_lane0_dn signal, a cnv_wt_clk_dp signal, a cnv_wr_lane1_dp signal, a cnv_wr_lane1_dn signal, a cnv_wr_lane0_dp signal, a cnv_wr_lane0_dn signal, a cnv_wr_clk_dp signal, and a cnv_wr_clk_dn signal.

When the motherboard is manufactured, the corresponding pins among the compatible soldering positions, the card socket soldering position 20, the patch soldering position 30 and the processor are connected, and the corresponding bonding pads are grounded or connected with a power supply according to requirements. In actual use, the electronic components (such as welding resistors or capacitors) are welded on each compatible welding position according to the requirements of the user, the socket is welded on the socket welding position 20, the socket WiFi module is inserted on the socket, or the patch WiFi module is welded on the patch welding position 30, so that the functions of the main board compatible with different WiFi modules can be realized.

Referring to fig. 6, when the motherboard needs to use the card WiFi module, a card socket is welded on the card socket welding position 20 and the card WiFi module is inserted on the card socket, and the motherboard body is provided with (i.e. mounted with) a first capacitor C1, a second capacitor C2, a first resistor R1, a second resistor R2, a third resistor R3 and a fourth resistor R4. The two ends of the first capacitor C1 are correspondingly welded on a first bonding pad and a second bonding pad of a first compatible bonding bit G1 respectively, the two ends of the second capacitor C2 are correspondingly welded on a first bonding pad and a second bonding pad of a second compatible bonding bit G2 respectively, the two ends of the first resistor R1 are correspondingly welded on a first bonding pad and a second bonding pad of a third compatible bonding bit G3 respectively, the two ends of the second resistor R2 are correspondingly welded on a first bonding pad and a second bonding pad of a fourth compatible bonding bit G4 respectively, the two ends of the third resistor R3 are correspondingly welded on a first bonding pad and a second bonding pad of a fifth compatible bonding bit G5 respectively, and the two ends of the fourth resistor R4 are correspondingly welded on a first bonding pad and a second bonding pad of a sixth compatible bonding bit G6 respectively.

The capacitance of the first capacitor C1 and the second capacitor C2 is preferably 0.22uF (withstand voltage 6.3V), which is used for blocking the PCIE3_p3_m2_wlan_tx_dp signal and the PCIE3_p3_m2_wlan_tx_dn signal. The resistance values of the first resistor R1 to the fourth resistor R4 are preferably 0rΩ, which is equivalent to connecting the processor with the socket soldering station 20 by a wire, so that transmission of each PCIE signal can be performed between the socket WiFi module and the processor.

Referring to fig. 7, when the motherboard needs to use the patch WiFi module, the patch WiFi module is soldered on the patch soldering position 30, and the motherboard body is provided with (i.e. mounted with) a third capacitor C3, a fourth capacitor C4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7 and an eighth resistor R8. The two ends of the third capacitor C3 are correspondingly welded on the second bonding pad and the third bonding pad of the second compatible bonding bit G2 respectively, the two ends of the fourth capacitor C4 are correspondingly welded on the second bonding pad and the third bonding pad of the first compatible bonding bit G1 respectively, the two ends of the fifth resistor R5 are correspondingly welded on the second bonding pad and the third bonding pad of the sixth compatible bonding bit G6 respectively, the two ends of the sixth resistor R6 are correspondingly welded on the second bonding pad and the third bonding pad of the fifth compatible bonding bit G5 respectively, the two ends of the seventh resistor R7 are correspondingly welded on the second bonding pad and the third bonding pad of the fourth compatible bonding bit G4 respectively, and the two ends of the eighth resistor R8 are correspondingly welded on the second bonding pad and the third bonding pad of the third compatible bonding bit G3 respectively.

The capacitance of the third capacitor C3 and the fourth capacitor C4 is preferably 0.1uF, which is used for blocking the PCIE3_p3_m2_wlan_tx_dp signal and the PCIE3_p3_m2_wlan_tx_dn signal. The resistance values of the fifth resistor R5 to the eighth resistor R8 are preferably 0rΩ, which is equivalent to connecting the processor with the patch WiFi module by a wire, so that transmission of each PCIE signal can be performed between the patch WiFi module and the processor. Each CNVi signal is directly connected to the patch WiFi module.

With continued reference to fig. 5, based on the first bonding pad of each compatible bond site being adjacent to the card socket bond site 20 and the third bonding pad being adjacent to the patch bond site 30, the card socket bond site 20 is located to the left of each compatible bond site and the patch bond site 30 is located to the right of each compatible bond site. When in connection, PCIE signals corresponding to the card socket welding positions 20 are routed from the upper side of each second bonding pad B and the left side of the first bonding pad A, and CNVi signals corresponding to the patch welding positions 30 are routed from the lower side of each second bonding pad B and the right side of the third bonding pad C. The wiring of the two signals is separated, so that signal interference can be reduced, and the wiring is more orderly and reasonable. Because the signal output by the processor is connected with the shared second bonding pad, no bifurcation exists from the processor to the card socket bonding position 20 or the patch bonding position 30; the antenna can not be formed without bifurcation, and the interference can not be formed, so that the normal operation of the main board function can be ensured.

It should be understood that, since the card-plugging WiFi module and the patch WiFi module are only one type, in order to save the space of the motherboard, the card-plugging WiFi module is plugged on the card socket, and the main body of the card-plugging WiFi module can be overlapped with the patch welding position 30, and the main body of the card-plugging WiFi module is suspended and located above the patch welding position 30, as shown in fig. 5, the dashed frame represents the outline of the card-plugging WiFi module. In the specific implementation, the WiFi module can be replaced by other types, corresponding connecting seats are arranged according to the requirements of the WiFi module, and the number of electronic components and the number of compatible welding positions are arranged according to the number of signals to be switched. Fig. 5 only shows the positions of some important elements related to the present embodiment on the motherboard, which is only an example, and the important elements can be laid out according to requirements in specific implementation; other existing components on the motherboard are not described in detail herein.

In summary, the main board and the terminal device compatible with different WiFi modules provided by the utility model have the advantages that a single main board is compatible with different WiFi modules, a group of PCIE signals transmitted by the processor select different signal paths through the shared pad and are transmitted to different WiFi modules, so that the signal transmission requirements of the different WiFi modules in different packages can be met, the communication ports of the processor can be reasonably utilized, and the communication port resources of the processor are saved. Meanwhile, only one BIOS and one driving file are required to be configured, the signal transmission path on the main board can be changed by modifying the BOM (bill of materials) and selecting the electronic element corresponding to the upper part under the condition that the layout of the main board is not changed, the switching of different WiFi modules is realized, one main board is not required to be independently designed for one WiFi module, one set of software is not required to be independently developed for configuring the WiFi module, the development period is greatly shortened, and the cost is saved. The WiFi module can be freely selected, customized and personalized requirements of clients can be more effectively met, and meanwhile market material shortage conditions can be flexibly met.

The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. The main board compatible with different WiFi modules comprises a main board body, and is characterized in that a processor, a plurality of compatible welding positions, card inserting seat welding positions and patch welding positions are arranged on the main board body; the compatible welding position is connected with the processor, the card inserting seat welding position and the patch welding position;

2. The motherboard compatible with different WiFi modules according to claim 1, wherein the compatible solder joints are comprised of a first solder pad, a second solder pad, and a third solder pad;

3. The motherboard compatible with different WiFi modules according to claim 2, wherein the number of compatible solder sites is 6, including a first compatible solder site to a sixth compatible solder site;

4. A motherboard compatible with different WiFi modules according to claim 3, wherein the processor cnvi_wt_d1p, cnvi_wt_d1n, cnvi_wt_d0p, cnvi_wt_d0n, cnvi_wt_clkn, cnvi_wrd1p, cnvi_wrjd1n, cnvi_wrd0p, cnvi_wrjd0n, cnvi_wrjd1p, wtjd1p, wtjd0p, wtjd0n, wtjclkp, wgr_d1p, wgr_d0p, wgr_d0n, wgr_clkp, wgr_n for one-to-one connection with a patch weld.

5. The motherboard compatible with different WiFi modules according to claim 4, wherein when the card socket is welded with a card socket and the card socket WiFi module is inserted on the card socket, the motherboard body is provided with a first capacitor, a second capacitor, a first resistor, a second resistor, a third resistor and a fourth resistor;

6. The motherboard compatible with different WiFi modules according to claim 5, wherein the capacitance value of the first capacitor and the second capacitor is 0.22uF, and withstand voltage is 6.3V.

7. The motherboard compatible with different WiFi modules according to claim 4, wherein when the patch WiFi module is soldered on the patch soldering position, a third capacitor, a fourth capacitor, a fifth resistor, a sixth resistor, a seventh resistor, and an eighth resistor are disposed on the motherboard body;

8. The motherboard compatible with different WiFi modules according to claim 7, wherein the capacitance value of the third capacitor and the fourth capacitor is 0.1uF.

9. The motherboard compatible with different WiFi modules according to claim 2, wherein the first bonding pad, the second bonding pad, and the third bonding pad are arranged in sequence from left to right when the compatible solder is disposed laterally on the motherboard.

10. A terminal device comprising a motherboard compatible with different WiFi modules according to any of claims 1-9.