CN219350214U

CN219350214U - Discrete device heat abstractor

Info

Publication number: CN219350214U
Application number: CN202320188780.1U
Authority: CN
Inventors: 林浩; 朱丽华; 曹祥俊
Original assignee: Jiangsu Zhengqixin Semiconductor Co ltd
Current assignee: Jiangsu Zhengqixin Semiconductor Co ltd
Priority date: 2023-02-10
Filing date: 2023-02-10
Publication date: 2023-07-14
Anticipated expiration: 2033-02-10

Abstract

The utility model discloses a discrete device heat dissipation device, which relates to the technical field of semiconductors and aims to solve the technical problems that a discrete device heat dissipation device in the prior art generally lacks a heat conduction structure, heat on a discrete device is difficult to transfer to a heat conduction material to realize large-area heat dissipation, and the heat dissipation effect of the discrete device is difficult to improve; the upper end and the upper end inner wall of encapsulation shell run through and have seted up first cell body, and the inner wall fixed mounting of first cell body has first heat conduction copper billet, and the both ends run through around the encapsulation shell and have seted up the second cell body, the mounting panel activity set up in the inner wall of second cell body, the lower extreme inner wall fixed mounting of encapsulation shell has discrete device body, can realize the heat dispersion of large tracts of land on the heat transfer to the heat conduction material with the heat transfer on the discrete device.

Description

Discrete device heat abstractor

Technical Field

The utility model belongs to the technical field of semiconductors, and particularly relates to a discrete device heat dissipation device.

Background

The discrete device is widely applied to the fields of consumer electronics, computers, peripheral equipment, network communication, automobile electronics, led display screens and the like, the existing semiconductor discrete device can generate larger heat when in use, a heat dissipation plate is usually arranged on the bottom surface of a plastic package body for timely dissipation of the heat, so that the heat can be dissipated, but the heat dissipation effect of the discrete device is limited because the heat dissipation area of the heat dissipation plate is smaller, the heat dissipation device of the existing discrete device usually lacks a heat conduction structure, the heat on the discrete device is difficult to be transferred to a heat conduction material to realize large-area heat dissipation, the heat dissipation effect of the discrete device is difficult to be improved, and the heat dissipation effect of the discrete device needs to be further improved.

At present, the utility model patent number CN201922110665.9 discloses a heat dissipating device of a semiconductor discrete device, which comprises a plastic package body, pins are fixedly arranged on the right side of the plastic package body, a heat dissipating cover is clamped at the top of the plastic package body, connecting sheets are uniformly formed on two sides of the top and the bottom of the heat dissipating cover, positioning holes are formed on the surfaces of the connecting sheets, the connecting sheets and the plastic package body are connected through the screw penetrating positioning holes.

Therefore, in view of the above-mentioned problem that the existing discrete device heat dissipation device generally lacks a heat conduction structure, it is difficult to transfer the heat of the discrete device to the heat conducting material to achieve large-area heat dissipation, and it is difficult to improve the heat dissipation effect of the discrete device, a solution is needed to achieve that the discrete device heat dissipation device has a heat conduction structure, so that the heat of the discrete device can be transferred to the heat conducting material to achieve large-area heat dissipation capability.

Disclosure of Invention

(1) Technical problem to be solved

Aiming at the defects of the prior art, the utility model aims to provide a discrete device heat dissipation device, which aims to solve the technical problems that the existing discrete device heat dissipation device generally lacks a heat conduction structure, heat on a discrete device is difficult to transfer to a heat conduction material to realize large-area heat dissipation, and the heat dissipation effect of the discrete device is difficult to improve.

(2) Technical proposal

In order to solve the technical problems, the utility model provides a discrete device heat dissipation device, which comprises a packaging shell and a mounting plate movably arranged in the packaging shell; the upper end and the upper end inner wall of encapsulation shell run through and have seted up first cell body, the inner wall fixed mounting of first cell body has first heat conduction copper billet, the front and back both ends of encapsulation shell run through and have seted up the second cell body, the mounting panel activity set up in the inner wall of second cell body, the lower extreme inner wall fixed mounting of encapsulation shell has discrete device body, the upper and lower both ends of mounting panel run through and have seted up the third cell body, the inner wall fixed mounting of third cell body has the third heat conduction copper billet, the lower extreme of third heat conduction copper billet is laminated mutually with the upper end of discrete device body, the upper end of third heat conduction copper billet is laminated mutually with the lower extreme of first heat conduction copper billet.

When the discrete device heat dissipation device of the technical scheme is used, the mounting plate is placed on the inner wall of the second groove body, at the moment, the lower end of the third heat conduction copper block is attached to the upper end of the discrete device body, the upper end of the third heat conduction copper block is attached to the lower end of the first heat conduction copper block, and heat generated by the discrete device body during operation is transferred to the first heat conduction copper block through the third heat conduction copper block, so that large-area heat dissipation can be realized, and the heat dissipation effect of the discrete device body is improved.

Further, the left end and the right end of the packaging shell are fixedly provided with second heat-conducting copper blocks, the second heat-conducting copper blocks are of L-shaped structures, the lower ends of the second heat-conducting copper blocks and the lower ends of the packaging shell are in the same plane, and heat on the discrete device body can be quickly led out through the arrangement of the second heat-conducting copper blocks, so that the separation effect of the second heat-conducting copper blocks can be improved.

Further, the edges of four corners at the upper end and the lower end of the mounting plate are penetrated and provided with first spiral grooves, the edges of four corners at the upper end of the packaging shell are fixedly provided with second spiral grooves, bolts are installed on the inner wall threads of the second spiral grooves, the bolts penetrate through the second spiral grooves to be installed on the inner wall of the first spiral grooves, and the mounting plate can be quickly fixed on the packaging shell.

Further, the front end and the rear end of the packaging shell are penetrated and provided with the fourth groove body, the inner wall of the fourth groove body is fixedly provided with the fourth heat conduction copper block, the front end and the rear end of the fourth heat conduction copper block are in the same plane with the front end and the rear end of the packaging shell, and the arrangement of the fourth heat conduction copper block can conduct heat on the discrete device body to the fourth heat conduction copper block, so that the heat dissipation effect of the discrete device body can be improved.

Further, the front end and the rear end of the discrete device body are fixedly provided with fifth heat conduction copper blocks which are uniformly distributed, the front end and the rear end of the fifth heat conduction copper blocks are attached to the inner walls of the front end and the rear end of the packaging shell, and the arrangement of the fifth heat conduction copper blocks facilitates heat on the discrete device body to be conducted to the fourth heat conduction copper blocks.

Further, the left end and the right end of the discrete device body are fixedly provided with heat conducting plates, the left end and the right end of the heat conducting plates are fixedly provided with heat conducting copper frames, the upper ends of the heat conducting plates and the upper ends of the heat conducting copper frames are on the same plane, and the heat conducting plates and the heat conducting copper frames can conduct heat on the discrete device body to the second heat conducting copper blocks.

Further, the upper end of the heat conducting plate and the upper end of the discrete device body are in the same plane, one end of the heat conducting copper frame away from the center of the discrete device body is connected with one end of the second heat conducting copper block close to the center of the discrete device body, and the arrangement that the upper end of the heat conducting plate and the upper end of the discrete device are in the same plane can facilitate stable installation of the discrete device.

(3) Advantageous effects

Compared with the prior art, the utility model has the beneficial effects that: according to the discrete device heat dissipation device, the discrete device body and the mounting plate are arranged, the mounting plate is placed on the inner wall of the second groove body, the lower end of the third heat conduction copper block is attached to the upper end of the discrete device body, the upper end of the third heat conduction copper block is attached to the lower end of the first heat conduction copper block, heat generated by the discrete device body in operation is transferred to the first heat conduction copper block through the third heat conduction copper block, large-area heat dissipation can be achieved, therefore, the heat dissipation effect of the discrete device body is improved, the heat on the discrete device body can be conducted to the fourth heat conduction copper block through the fourth heat conduction copper block, the heat on the discrete device body can be conducted to the second heat conduction copper block through the heat conduction plate and the heat conduction copper frame, and the heat dissipation effect of the discrete device body can be improved.

Drawings

FIG. 1 is a schematic perspective view of a heat sink for discrete devices according to an embodiment of the present utility model;

FIG. 2 is a schematic perspective view of a mounting plate of one embodiment of a discrete device heat sink of the present utility model;

FIG. 3 is a schematic perspective view of a package housing of one embodiment of a heat sink for discrete devices according to the present utility model;

fig. 4 is a schematic internal perspective view of a package housing of a discrete device heat sink according to an embodiment of the present utility model.

The marks in the drawings are: 1. a package housing; 2. a first tank body; 3. a first thermally conductive copper block; 4. a second tank body; 5. a mounting plate; 6. a second thermally conductive copper block; 7. a bolt; 8. a third tank; 9. a third thermally conductive copper block; 10. a first screw groove; 11. a fourth tank body; 12. a fourth thermally conductive copper block; 13. a second screw groove; 14. a heat conductive plate; 15. a thermally conductive copper frame; 16. a fifth thermally conductive copper block; 17. a discrete device body.

Detailed Description

The specific embodiment is a discrete device heat dissipation device, the schematic perspective structure of which is shown in fig. 1, and the schematic perspective structure of a mounting plate 5 of which is shown in fig. 2, the discrete device heat dissipation device comprises a package shell 1 and the mounting plate 5 movably arranged in the package shell 1; the upper end and the upper end inner wall of encapsulation shell 1 run through and have seted up first cell body 2, the inner wall fixed mounting of first cell body 2 has first heat conduction copper billet 3, the front and back both ends of encapsulation shell 1 run through and have seted up second cell body 4, mounting panel 5 activity sets up in the inner wall of second cell body 4, the lower extreme inner wall fixed mounting of encapsulation shell 1 has discrete device body 17, the upper and lower both ends of mounting panel 5 run through and have seted up third cell body 8, the inner wall fixed mounting of third cell body 8 has third heat conduction copper billet 9, the lower extreme of third heat conduction copper billet 9 is laminated mutually with the upper end of discrete device body 17, the upper end of third heat conduction copper billet 9 is laminated mutually with the lower extreme of first heat conduction copper billet 3.

In order to improve the heat dissipation effect of the device, the left end and the right end of the package shell 1 are fixedly provided with second heat conduction copper blocks 6, the second heat conduction copper blocks 6 are in an L-shaped structure, the lower end of each second heat conduction copper block 6 is in the same plane with the lower end of the package shell 1, the left end and the right end of each discrete device body 17 are fixedly provided with heat conduction plates 14, the left end and the right end of each heat conduction plate 14 are fixedly provided with heat conduction copper frames 15, the upper ends of the heat conduction plates 14 and the upper ends of the heat conduction copper frames 15 are in the same plane, the upper ends of the heat conduction plates 14 and the upper ends of the discrete device bodies 17 are in the same plane, one end of each heat conduction copper frame 15 away from the center of each discrete device body 17 is connected with one end, close to the center of each discrete device body 17, of each heat conduction plate 14 and each heat conduction copper frame 15 can guide heat on each discrete device body 17 to each second heat conduction copper block 6, and therefore the heat dissipation effect of the device can be improved.

In order to quickly fix the mounting plate 5 on the packaging shell 1, the edges of four corners at the upper end and the lower end of the mounting plate 5 are penetrated and provided with first screw grooves 10, the edges of four corners at the upper end of the packaging shell 1 are fixedly provided with second screw grooves 13, the inner wall of each second screw groove 13 is provided with a bolt 7 in a threaded manner, the bolts 7 penetrate through the second screw grooves 13 and are arranged on the inner wall of each first screw groove 10 in a threaded manner, the bolts 7 are arranged on the inner walls of each second screw groove 13 and each first screw groove 10 in a threaded manner, and the mounting plate 5 can be quickly fixed on the packaging shell 1.

In order to improve the heat dissipation effect on the discrete device body 17, the front end and the rear end of the package housing 1 are penetrated and provided with the fourth groove body 11, the inner wall of the fourth groove body 11 is fixedly provided with the fourth heat conduction copper block 12, the front end and the rear end of the fourth heat conduction copper block 12 are in the same plane with the front end and the rear end of the package housing 1, the front end and the rear end of the discrete device body 17 are fixedly provided with the fifth heat conduction copper block 16 which is uniformly distributed, the front end and the rear end of the fifth heat conduction copper block 16 are attached to the inner wall of the front end and the rear end of the package housing 1, and the fifth heat conduction copper block 16 can conduct heat on the discrete device body 17 to the fourth heat conduction copper block 12, so that the heat dissipation effect on the discrete device body 17 can be improved.

The schematic perspective structure of the package 1 of the discrete device heat dissipation apparatus is shown in fig. 3, and the schematic internal perspective structure of the package 1 is shown in fig. 4.

When the discrete device heat dissipation device of the technical scheme is used, the mounting plate 5 is placed on the inner wall of the second groove body 4, the bolts 7 are installed on the inner walls of the second spiral groove 13 and the first spiral groove 10 in a threaded mode, the mounting plate 5 can be quickly fixed on the packaging shell 1, at the moment, the lower end of the third heat-conducting copper block 9 is attached to the upper end of the discrete device body 17, the upper end of the third heat-conducting copper block 9 is attached to the lower end of the first heat-conducting copper block 3, heat generated by the discrete device body 17 in operation is transferred to the first heat-conducting copper block 3 through the third heat-conducting copper block 9, large-area heat dissipation can be achieved, heat generated by the discrete device body 17 in operation is also transferred to the second heat-conducting copper block 6 from the heat-conducting plate 14 and the heat-conducting copper frame 15, and the fifth heat-conducting copper block 16 can transfer the heat on the discrete device body 17 to the fourth heat-conducting copper block 12, so that the heat dissipation effect on the discrete device body 17 can be improved.

Claims

1. The discrete device heat dissipation device comprises a packaging shell and a mounting plate movably arranged in the packaging shell; the packaging structure is characterized in that a first groove body is formed in the upper end of the packaging shell in a penetrating mode, a first heat conducting copper block is fixedly installed on the inner wall of the first groove body, a second groove body is formed in the front end and the rear end of the packaging shell in a penetrating mode, the mounting plate is movably arranged on the inner wall of the second groove body, a discrete device body is fixedly installed on the inner wall of the lower end of the packaging shell, a third groove body is formed in the upper end and the lower end of the mounting plate in a penetrating mode, a third heat conducting copper block is fixedly installed on the inner wall of the third groove body, the lower end of the third heat conducting copper block is attached to the upper end of the discrete device body, and the upper end of the third heat conducting copper block is attached to the lower end of the first heat conducting copper block.

2. The heat dissipating device of claim 1 wherein the package housing has second thermally conductive copper blocks fixedly mounted at both the left and right ends, the second thermally conductive copper blocks having an "L" configuration, and the lower ends of the second thermally conductive copper blocks being coplanar with the lower ends of the package housing.

3. The discrete device heat dissipating device according to claim 1, wherein the edges of four corners of the upper and lower ends of the mounting plate are provided with first screw grooves in a penetrating manner, the edges of four corners of the upper end of the package housing are provided with second screw grooves in a fixed manner, the inner walls of the second screw grooves are provided with bolts in a threaded manner, and the bolts penetrate through the second screw grooves and are arranged on the inner walls of the first screw grooves in a threaded manner.

4. The heat dissipating device of claim 1 wherein the front and back ends of the package housing are penetrated by a fourth slot, a fourth thermally conductive copper block is fixedly mounted on the inner wall of the fourth slot, and the front and back ends of the fourth thermally conductive copper block are coplanar with the front and back ends of the package housing.

5. The heat dissipating device of claim 1 wherein the front and back ends of the discrete device body are each fixedly provided with a fifth heat conductive copper block uniformly distributed, and the front and back ends of the fifth heat conductive copper block are attached to the inner walls of the front and back ends of the package housing.

6. The heat dissipating device of claim 1 wherein the left and right ends of the discrete device body are each fixedly provided with a heat conductive plate, the left and right ends of the heat conductive plate are each fixedly provided with a heat conductive copper frame, and the upper ends of the heat conductive plates and the upper ends of the heat conductive copper frames are in the same plane.

7. The heat dissipating apparatus of claim 6 wherein the upper end of the thermally conductive plate is coplanar with the upper end of the discrete device body and the end of the thermally conductive copper frame distal from the center of the discrete device body is connected to the end of the second thermally conductive copper block proximal to the center of the discrete device body.