CN219350154U - Equipment for adjusting wafer platform - Google Patents
Equipment for adjusting wafer platform Download PDFInfo
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- CN219350154U CN219350154U CN202223280117.9U CN202223280117U CN219350154U CN 219350154 U CN219350154 U CN 219350154U CN 202223280117 U CN202223280117 U CN 202223280117U CN 219350154 U CN219350154 U CN 219350154U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The utility model relates to a device for adjusting a wafer platform, which comprises a horizontal adjusting mechanism and a distance measuring mechanism, wherein the horizontal adjusting mechanism can be connected with the bottom of the wafer platform, the distance measuring mechanism comprises one or more first distance sensors and a calculating module, the first distance sensors are connected with the calculating module, the first distance sensors are arranged on the upper surface of a cavity cover plate and are used for measuring the distance between the upper surface of the wafer platform and the upper surface of the cavity cover plate and sending the distance to the calculating module, the calculating module is connected with the horizontal adjusting mechanism, the calculating module is used for calculating the adjustment quantity of the horizontal adjusting mechanism to be adjusted according to the distance and sending the adjustment quantity to the horizontal adjusting mechanism to be adjusted, and the number of the first distance sensors is the same as the number of the horizontal adjusting mechanisms. The utility model can automatically adjust the wafer platform to be level, thereby improving the accuracy of adjusting the wafer platform to be level and improving the wafer quality.
Description
Technical Field
The utility model relates to the technical field of semiconductor equipment, in particular to equipment for adjusting a wafer platform.
Background
In semiconductor manufacturing, it is often necessary to transfer a wafer to a process chamber using a robot arm and place the wafer on a wafer stage, the levelness of which is an important factor affecting wafer yield. The prior art generally adjusts the levelness of a wafer stage in the following manner: and installing a horizontal adjusting bolt at the bottom of the cavity, placing a level gauge on the wafer platform, and judging whether the wafer platform is horizontal or not by manually adjusting the position of the bolt and observing the level gauge. The manner of adjusting the levelness of the wafer platform adopted in the prior art has the following disadvantages: the manual adjustment and the manual measurement are combined, so that a large error exists, the quality of wafer production is affected, the manual adjustment and the manual measurement are combined, the cavity is required to be opened for repeated adjustment and measurement, the cavity is easy to pollute, and a large amount of time is consumed.
Disclosure of Invention
The utility model aims to provide equipment for adjusting a wafer platform, which is used for automatically adjusting the wafer platform to be adjusted in level, so that the accuracy of adjusting the wafer platform in level is improved, and the wafer quality is improved.
The aim of the utility model is achieved by adopting the following technical scheme. According to the device for adjusting the wafer platform, which is provided by the utility model, the device comprises a horizontal adjusting mechanism and a distance measuring mechanism, wherein the horizontal adjusting mechanism can be connected with the bottom of the wafer platform, the distance measuring mechanism comprises one or more first distance sensors and a calculating module, the first distance sensors are connected with the calculating module, the first distance sensors are arranged on the upper surface of the cavity cover plate and are used for measuring the distance between the upper surface of the wafer platform and the upper surface of the cavity cover plate, the distances are sent to the calculating module, the calculating module is connected with the horizontal adjusting mechanism, the calculating module is used for calculating the adjustment quantity of the horizontal adjusting mechanism to be adjusted according to the distances, and sending the adjustment quantity to the horizontal adjusting mechanism to be adjusted, and the number of the first distance sensors is the same as that of the horizontal adjusting mechanism.
In some embodiments, the first distance sensor is located on the same vertical line as one or more of the horizontal adjustment mechanisms.
In some embodiments, the ranging mechanism further comprises a second distance sensor coupled to the computing module, the second distance sensor configured to measure a distance between an upper surface of the wafer stage and an upper surface of the cavity cover plate after the wafer stage is leveled and send to the computing module.
In some embodiments, the apparatus for adjusting a wafer stage further comprises a height adjustment mechanism, the calculation module is further connected to the height adjustment mechanism, the calculation module is further configured to calculate a height adjustment value according to a set value of a distance between an upper surface of the wafer stage and a top surface of the chamber and a distance between the upper surface of the wafer stage and an upper surface of the chamber cover plate after being leveled, and send the height adjustment value to the height adjustment mechanism.
In some embodiments, the second distance sensor is disposed on an upper surface of the cavity cover plate.
In some embodiments, the second distance sensor is located on the same vertical line as the height adjustment mechanism.
The beneficial effects of the utility model at least comprise:
the utility model can be connected with the bottom of a wafer platform through the horizontal adjusting mechanism, the ranging mechanism comprises one or more first distance sensors and a calculating module, the first distance sensors are connected with the calculating module, the first distance sensors are arranged on the upper surface of the cavity cover plate and are configured to measure the distance between the upper surface of the wafer platform and the upper surface of the cavity cover plate, the distances are sent to the calculating module, the calculating module is connected with the horizontal adjusting mechanism, the calculating module is configured to calculate the adjusting quantity of the horizontal adjusting mechanism to be adjusted according to the distances, and the adjusting quantity is sent to the horizontal adjusting mechanism to be adjusted, so that the wafer platform can be automatically adjusted to be level, the accuracy of the wafer platform adjusting level is improved, and the wafer quality is improved.
2. The wafer platform is adjusted horizontally by the device, so that the cavity is prevented from being opened to be adjusted and measured repeatedly and repeatedly, and the problems of damage to components in the cavity and pollution of foreign matters to the cavity can be avoided.
The foregoing description is only an overview of the present utility model, and is intended to be implemented in accordance with the teachings of the present utility model, as well as the preferred embodiments thereof, together with the following detailed description of the utility model given in conjunction with the accompanying drawings.
Drawings
Fig. 1 shows a schematic structural view of an apparatus for adjusting a wafer stage according to an embodiment of the present utility model.
Detailed Description
In order to further illustrate the technical means of the present utility model, a detailed description of an apparatus for adjusting a wafer stage according to the present utility model is provided below with reference to the accompanying drawings and preferred embodiments. The following examples are only for more clearly illustrating the technical solution of the present utility model, and therefore are only exemplary and are not intended to limit the scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the term "comprising" in the description of the present application and the claims and in the description of the figures above, and any variants thereof.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the term "connected" should be construed broadly, and may be a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. The meaning of "plurality" is two or more.
As shown in fig. 1, the apparatus for adjusting a wafer stage according to the present utility model includes a height adjustment mechanism 1, one or more horizontal adjustment mechanisms 2, and a ranging mechanism 3, wherein a wafer stage 4 is disposed inside a chamber 5, and in one or more embodiments, the chamber 5 may be configured in a cylindrical shape. The top of the cavity 5 is provided with a cavity cover plate 51, which cavity cover plate 51 may be configured cylindrically in one or more embodiments. The height adjusting mechanism 1 and the horizontal adjusting mechanism 2 are both disposed below the wafer platform 4 in the cavity 5, and the horizontal adjusting mechanism 2 can be connected with the bottom of the wafer platform 4 through lifting motion, so as to be used for adjusting the wafer platform 4 to be horizontal, and it should be noted that, in one or more embodiments, the apparatus for adjusting the wafer platform according to the present utility model includes two horizontal adjusting mechanisms 2. The height adjusting mechanism 1 can be connected with the bottom of the wafer stage 4 through a lifting motion for adjusting the distance of the upper surface of the wafer stage 4 from the top surface of the chamber 5. The distance measuring mechanism 3 comprises one or more first distance sensors 31 and a calculating module (not shown in the figure), wherein the first distance sensors 31 are connected with the calculating module, the first distance sensors 31 are arranged on the upper surface of the cavity cover plate 51, and in one or more embodiments, the device for adjusting the wafer platform according to the utility model comprises two first distance sensors 31. In one or more embodiments, the respective first distance sensors 31 are uniformly disposed right above the wafer stage 4 for measuring a first distance between the upper surface of the wafer stage 4 and the upper surface of the cavity cover plate 51 and transmitting the first distance to the calculation module. In a preferred embodiment, the first distance sensor 31 is located on the same vertical line as the one or more horizontal adjustment mechanisms 2. In some other embodiments, the first distance sensor 31 may not be located on the same vertical line as the one or more horizontal adjustment mechanisms 2. In one or more embodiments, the number of first distance sensors 31 is the same as the number of horizontal adjustment mechanisms 2.
In one or more embodiments, the calculation module is configured for calculating the amount that each level adjustment mechanism 2 to be adjusted needs to be adjusted from different values of the first distance. Specifically, since the wafer stage 4 is not in the horizontal state, the first distances measured by the respective first distance sensors 31 also have different values from each other, one of the first distance sensors 31 is selected as a reference, the value of the first distance measured by the first distance sensor 31 as a reference is used as a reference value of the first distance, and the values of the first distances measured by the first distance sensors 31 other than the first distance sensor 31 as a reference are all adjusted to the reference value of the first distance according to the respective adjustment amounts.
In one or more embodiments, the calculation module is further configured to subtract the thickness of the chamber lid 51 from the first distance measured by each of the first distance sensors 31 to obtain a second distance between the upper surface of the wafer stage 4 and the top surface of the chamber 5. Since the wafer stage 4 is not in a horizontal state, the respective second distances have different values from each other, in this embodiment the calculation module is further configured for calculating the amount of adjustment of the wafer stage 4 from the different values of the second distances. Specifically, in one or more embodiments, one of the first distance sensors 31 may be selected as a reference distance sensor 31, a first distance between the upper surface of the wafer stage 4 and the upper surface of the cavity cover plate 51 measured by the reference first distance sensor 31 is used as a reference first distance, the calculating module subtracts the thickness of the cavity cover plate 51 from the reference first distance to obtain a reference second distance between the upper surface of the wafer stage 4 and the top surface of the cavity 5, and values of the remaining second distances are all adjusted to be the same as the reference second distance according to respective adjustment amounts.
The computing module is respectively connected with each horizontal adjusting mechanism 2 and is used for sending the adjusting quantity to each horizontal adjusting mechanism 2 to be adjusted, and each horizontal adjusting mechanism 2 to be adjusted receives the adjusting quantity and correspondingly adjusts according to the adjusting quantity. Specifically, one of the horizontal adjustment mechanisms 2 is selected as the reference horizontal adjustment mechanism 2, and the remaining horizontal adjustment mechanisms 2 are adjusted to the same position as the reference horizontal adjustment mechanism 2 according to the adjustment amount. In a preferred embodiment, the horizontal adjustment mechanism 2 as a reference is on the same vertical line as the first distance sensor 31 as a reference. In one further embodiment, the reference level adjustment mechanism 2 and the reference first distance sensor 31 may also be displaced to some extent. In a preferred embodiment, all the horizontal adjustment mechanisms 2 are located on the same vertical line in a one-to-one correspondence with the first distance sensors 31, respectively.
In one or more embodiments, if the first distances measured by the first distance sensors 31 are equal or the second distances calculated by the calculating module between the upper surface of the platen 4 and the top surface of the chamber 5 are equal, it is indicated that the platen 4 has been leveled. It will be appreciated that multiple adjustments may be made through the level adjustment mechanism 2, the first distance sensor 31, and the information transfer between the computing modules until the wafer stage 4 is level.
The distance measuring mechanism 3 further comprises a second distance sensor 32, the second distance sensor 32 is connected with the calculating module, and the second distance sensor 32 is arranged on the upper surface of the cavity cover plate 51. In one or more embodiments, the second distance sensor 32 is disposed directly above the platen 4 and configured to measure a first distance between the upper surface of the platen 4 and the upper surface of the chamber lid 51 after the platen 4 is leveled, and send the first distance to the computing module, which subtracts the thickness of the chamber lid 51 from the first distance measured by the second distance sensor 32 to obtain a second distance between the upper surface of the platen 4 and the top surface of the chamber 5. In a preferred embodiment, the second distance sensor 32 is located on the same vertical line as the height adjustment mechanism 1. In some other embodiments, the first distance sensor 32 may also be offset to some extent from the height adjustment mechanism 1.
The calculation module is further connected to the height adjustment mechanism 1, and the calculation module is further configured to calculate a height adjustment value based on a set value of a distance between the upper surface of the wafer stage and the top surface of the chamber and a distance between the upper surface of the wafer stage and the upper surface of the chamber cover plate. Specifically, after the wafer stage 4 is leveled, the second distance sensor 32 measures a first distance between the upper surface of the wafer stage 4 and the upper surface of the cavity cover plate 51, and sends the first distance to the calculation module, the calculation module subtracts the thickness of the cavity cover plate 51 from the first distance measured by the second distance sensor 32 to obtain a second distance between the upper surface of the wafer stage 4 and the top surface of the cavity 5, and the calculation module is further configured to calculate a height adjustment value according to a set value of the distance between the upper surface of the wafer stage 4 and the top surface of the cavity 5 and the second distance after the wafer stage is leveled and the second distance between the upper surface of the wafer stage 4 and the top surface of the cavity 5 is obtained, and send the height adjustment value to the height adjustment mechanism 1, and the height adjustment mechanism 1 drives the wafer stage 4 to be lifted to a specified position according to the height adjustment value. It should be noted that the set value of the distance between the upper surface of the wafer stage 4 and the top surface of the chamber 5 may have different values according to the process and other requirements.
It should be noted that, the height adjusting mechanism 1 and the horizontal adjusting mechanism 2 may both adopt ball screw structures to realize the lifting adjustment of the wafer platform 4. In one or more embodiments, the number of height adjustment mechanisms 1 is the same as the number of second distance sensors 32.
Based on the above-mentioned equipment for adjusting the wafer stage, the utility model also provides a wafer stage adjusting method, which comprises the following steps: s101, selecting one first distance sensor 31 in the first distance sensors 31 as a reference; s102, reading first distances between the upper surface of the wafer platform 4 and the upper surface of the cavity cover plate through each first distance sensor 31 and sending the first distances to the calculation module; and S103, the calculation module calculates the adjustment quantity of the horizontal adjustment mechanism 2 to be adjusted according to the first distance and sends the adjustment quantity to the horizontal adjustment mechanism 2 to be adjusted, and the horizontal adjustment mechanism 2 to be adjusted receives the respective adjustment quantity and adjusts the wafer platform 4 to be horizontal according to the respective adjustment quantity.
In one or more embodiments, step S103 specifically includes: the horizontal adjustment mechanism 2 in the same vertical line as the first distance sensor 31 as a reference does not need to be adjusted; the values of the first distances measured by the first distance sensor 31 serving as the reference are set as reference values of the first distances, and the values of the first distances measured by the first distance sensors 31 other than the first distance sensor 31 serving as the reference are adjusted to the reference values of the first distances by the respective adjustment amounts.
The wafer platform adjusting method of the utility model further comprises the following steps: s104, after the wafer platform 4 is adjusted horizontally, the second distance sensor 32 measures a first distance between the upper surface of the wafer platform 4 and the upper surface of the cavity cover plate 51, and sends the first distance to the calculation module; s105, a calculation module calculates a height adjustment value according to a set value of the distance between the upper surface of the wafer platform and the top surface of the cavity and a first distance between the upper surface of the wafer platform and the upper surface of the cavity cover plate, and sends the height adjustment value to the height adjustment mechanism; s106, the height adjusting mechanism 1 drives the wafer platform 4 to lift to a specified position according to the height adjusting value.
In one or more embodiments, step S105 specifically includes: s1051, the calculating module subtracts the thickness of the cavity cover plate 51 from the first distance measured by the second distance sensor 32 to obtain a second distance between the upper surface of the wafer platform 4 and the top surface of the cavity 5; s1052, the calculating module calculates a height adjustment value according to the set value of the distance between the upper surface of the wafer stage 4 and the top surface of the chamber 5 and the second distance, and sends the height adjustment value to the height adjusting mechanism 1.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to practice the present utility model. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the utility model. Thus, the present utility model is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (4)
1. An apparatus for adjusting a wafer stage, comprising a horizontal adjustment mechanism connectable to a bottom of the wafer stage, and a ranging mechanism including a calculation module and a plurality of first distance sensors connected to the calculation module, the first distance sensors being provided on an upper surface of a chamber cover plate, configured to measure a distance between the upper surface of the wafer stage and the upper surface of the chamber cover plate, and send the distance to the calculation module, the calculation module being connected to the horizontal adjustment mechanism, the calculation module being configured to calculate an adjustment amount of the horizontal adjustment mechanism to be adjusted according to the distance, and send the adjustment amount to the horizontal adjustment mechanism to be adjusted, the number of the first distance sensors being the same as the number of the horizontal adjustment mechanisms;
the horizontal adjusting mechanism is arranged below the wafer platform in the cavity and is connected with the bottom of the wafer platform through lifting movement so as to be used for adjusting the wafer platform to the horizontal state;
the distance measuring mechanism further comprises a second distance sensor, wherein the second distance sensor is connected with the computing module, and is configured to measure the distance between the upper surface of the wafer platform and the upper surface of the cavity cover plate after the wafer platform is adjusted to be horizontal and send the distance to the computing module;
the apparatus for adjusting a wafer stage further includes a height adjustment mechanism, the calculation module is further connected to the height adjustment mechanism, the calculation module is further configured to calculate a height adjustment value according to a set value of a distance between an upper surface of the wafer stage and a top surface of the chamber and a distance between the upper surface of the wafer stage and an upper surface of the chamber cover plate after being leveled, and send the height adjustment value to the height adjustment mechanism.
2. The apparatus for conditioning a wafer platform according to claim 1, wherein the first distance sensor is located on the same vertical line as the horizontal conditioning mechanism.
3. The apparatus for conditioning a wafer table of claim 1, wherein the second distance sensor is disposed on an upper surface of a chamber lid.
4. The apparatus for adjusting a wafer platform according to claim 1, wherein the second distance sensor is located on the same vertical line as the height adjustment mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223280117.9U CN219350154U (en) | 2022-12-07 | 2022-12-07 | Equipment for adjusting wafer platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223280117.9U CN219350154U (en) | 2022-12-07 | 2022-12-07 | Equipment for adjusting wafer platform |
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| Publication Number | Publication Date |
|---|---|
| CN219350154U true CN219350154U (en) | 2023-07-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202223280117.9U Active CN219350154U (en) | 2022-12-07 | 2022-12-07 | Equipment for adjusting wafer platform |
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| CN (1) | CN219350154U (en) |
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- 2022-12-07 CN CN202223280117.9U patent/CN219350154U/en active Active
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