CN219335653U - Hardware mold cooling structure - Google Patents
Hardware mold cooling structure Download PDFInfo
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- CN219335653U CN219335653U CN202320073477.7U CN202320073477U CN219335653U CN 219335653 U CN219335653 U CN 219335653U CN 202320073477 U CN202320073477 U CN 202320073477U CN 219335653 U CN219335653 U CN 219335653U
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- logical groove
- diaphragm
- riser
- mould
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The utility model relates to the technical field of hardware mold cooling, in particular to a hardware mold cooling structure, which comprises a rectangular box; the lower mould is installed to the up end of rectangle case, the riser is installed to one side of lower mould, riser towards one side slidable mounting of lower mould has the diaphragm, install the bottom of diaphragm with the last mould that the lower mould agrees with, first logical groove has been seted up in the lateral wall of lower mould, set up in the lateral wall of last mould with the second logical groove of first logical groove intercommunication, through rectangle case, cavity, lower mould, first logical groove, last mould, second logical groove, pipe, water pump and the hose that are equipped with, through the cooling water of the interior cavity of water pump extraction rectangle case, then in the second logical groove in the interior of last mould is discharged through the hose, then in the first logical groove through the pipe in the lower mould is discharged, can cool off the metal after the hot melt in lower mould and the last mould with higher speed, shortens the cooling time when the five metals preparation, improves production efficiency.
Description
Technical Field
The utility model relates to the technical field of hardware mold cooling, in particular to a hardware mold cooling structure.
Background
The hardware mould refers to the process of manufacturing parts or products with required shapes by using various presses and special tools arranged on the presses, the special tools are collectively called hardware moulds, the classification of the hardware moulds is various, such as blanking dies, bending dies, deep drawing dies and forming dies, and various tools and products used in our daily production and life have no close relation with the dies.
When the hardware mould is produced, the metal after hot melting is poured into the mould, the metal liquid is limited by the shape of the cavity in the mould, so that the purpose of manufacturing and forming is achieved, but when the existing hardware mould is produced, the metal after hot melting is usually naturally cooled, the waiting time is long, and the production efficiency is reduced.
Disclosure of Invention
The utility model aims to provide a hardware mold cooling structure, which aims to solve the problems that in the prior art, when a hardware mold is produced, hot-melted metal is generally poured into the mold, and the shape of a cavity in the mold is utilized to limit metal liquid so as to achieve the purpose of manufacturing and forming, but in the prior art, when the hardware mold is produced, the metal after the hot melting is generally waited for naturally cooling, the waiting time is long, and thus the production efficiency is reduced.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a hardware mold cooling structure comprises a rectangular box;
the lower mould is installed to the up end of rectangle case, the riser is installed to one side of lower mould, one side slidable mounting of riser towards the lower mould has the diaphragm, install the bottom of diaphragm with the last mould that the lower mould agrees with, first logical groove has been seted up in the lateral wall of lower mould, set up in the lateral wall of last mould with the second logical groove of first logical groove intercommunication is convenient for cool off the five metals.
Preferably, a cavity is formed in the rectangular box, and a round hole for communicating the first through groove and the cavity is formed in the lower die and is used for communicating cooling bins formed in the upper die and the lower die.
Preferably, two circular tubes are symmetrically arranged at the bottom end of the upper die, holes for inserting the circular tubes are formed in the top end of the lower die, and the circular tubes extend into the first through groove and are used for communicating cooling bins formed in the upper die and the lower die.
Preferably, the top of diaphragm has offered the inside vertical hole of intercommunication upper die, in the one end of diaphragm extends into the riser, install the butt in the riser the telescopic link on diaphragm extension top, the one end symmetry construction in the diaphragm extends into the riser has two lugs, set up in the riser and supply the gliding vertical groove of lug for two moulds about the switching.
Preferably, the side face of the rectangular box is provided with a water pump, the top end of the water pump is provided with a hose communicated with the second through groove, and the lower part of the water pump is provided with a bottom pipe communicated with the bottom end inside the cavity for extracting cooling water.
Compared with the prior art, the utility model has the beneficial effects that:
1. the cooling water stored in the cavity in the rectangular box is pumped by the water pump, then discharged into the second through groove in the upper die by the hose, and then discharged into the first through groove in the lower die by the round pipe, so that the metal after hot melting in the lower die and the upper die can be cooled rapidly, the cooling time during hardware manufacturing is shortened, and the production efficiency is improved;
2. through bed die, first logical groove, the round hole, go up mould, second logical groove, pipe, water pump and hose that are equipped with, through installing the first logical groove in two pipe intercommunication bed dies of last mould bottom and the second logical groove in the last mould, can be when bed die and last mould are closed, cool off the five metals is whole, through water pump and hose to the second logical groove in the last mould water supply back, in the water drainage cavity of first logical groove and second logical inslot by the round hole, avoid the phenomenon that the cooling water appears scattering after two moulds about the separation.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the utility model at A-A of FIG. 1;
fig. 3 is an enlarged schematic view of the structure at B in fig. 1 according to the present utility model.
In the figure: 1. a rectangular box; 101. a cavity; 2. a lower die; 201. a first through groove; 202. a round hole; 3. a riser; 301. a telescopic rod; 302. a vertical groove; 4. a cross plate; 401. an upper die; 402. a second through slot; 403. a round tube; 404. a vertical hole; 405. a bump; 5. a water pump; 501. a hose; 502. a bottom tube.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1-3, there is shown: the embodiment is a preferred implementation manner in the technical scheme, and the hardware mold cooling structure comprises a rectangular box 1;
the lower mould 2 is installed to the up end of rectangle case 1, and riser 3 is installed to one side of lower mould 2, and riser 3 is towards one side slidable mounting of lower mould 2 has diaphragm 4, and the last mould 401 that agrees with lower mould 2 is installed to the bottom of diaphragm 4, has seted up first logical groove 201 in the lateral wall of lower mould 2, has seted up the second logical groove 402 with first logical groove 201 intercommunication in the lateral wall of last mould 401.
As shown in fig. 2, a cavity 101 is formed in the rectangular box 1, and a round hole 202 for communicating the first through groove 201 with the cavity 101 is formed in the lower die 2;
as shown in fig. 1 and 2, two circular tubes 403 are symmetrically installed at the bottom end of an upper die 401, holes for inserting the circular tubes 403 are formed at the top end of a lower die 2, and the circular tubes 403 extend into a first through groove 201;
as shown in fig. 2 and 3, a vertical hole 404 communicating with the inside of the upper mold 401 is formed at the top end of the transverse plate 4, one end of the transverse plate 4 extends into the vertical plate 3, a telescopic rod 301 abutting against the top end of the extending part of the transverse plate 4 is mounted in the vertical plate 3, two protruding blocks 405 are symmetrically constructed at one end of the transverse plate 4 extending into the vertical plate 3, and a vertical groove 302 for the protruding blocks 405 to slide is formed in the vertical plate 3;
as shown in fig. 1 and 2, a water pump 5 is installed on the side surface of the rectangular box 1, a hose 501 communicated with the second through groove 402 is installed at the top end of the water pump 5, and a bottom pipe 502 communicated with the bottom end inside the cavity 101 is installed below the water pump 5;
in this embodiment, the telescopic rod 301 is extended, the transverse plate 4 is lowered, so that the lower die 2 and the upper die 401 are engaged, when the molten metal is injected into the lower die 2 and the upper die 401 through the vertical holes 404 on the transverse plate 4, the cavity in the lower die 2 and the upper die 401 is used for limiting and forming the molten metal, the water pump 5 is turned on, the cooling water in the rectangular box 1 is pumped by the bottom pipe 502 and is discharged into the second through groove 402 through the hose 501, the cooling water in the upper die 401 is discharged into the first through groove 201 through the circular pipe 403, and when the cooling water flows into the first through groove 201 and the second through groove 402 through the circular hole 202, the heat of the molten metal is taken away, and the cooling of hardware is accelerated.
The foregoing is a further elaboration of the present utility model in connection with the detailed description, and it is not intended that the utility model be limited to the specific embodiments shown, but rather that a number of simple deductions or substitutions be made by one of ordinary skill in the art without departing from the spirit of the utility model, should be considered as falling within the scope of the utility model as defined in the appended claims.
Claims (5)
1. The hardware mould cooling structure comprises a rectangular box (1);
the method is characterized in that:
the upper end face of rectangle case (1) is installed bed die (2), riser (3) are installed to one side of bed die (2), riser (3) are towards one side slidable mounting of bed die (2) have diaphragm (4), install with bed die (401) that bed die (2) agree with bottom end of diaphragm (4), first logical groove (201) have been seted up in the lateral wall of bed die (2), set up in the lateral wall of bed die (401) with second logical groove (402) of first logical groove (201) intercommunication.
2. The hardware die cooling structure according to claim 1, wherein: a cavity (101) is formed in the rectangular box (1), and a round hole (202) for communicating the first through groove (201) and the cavity (101) is formed in the lower die (2).
3. A hardware die cooling structure according to claim 2, wherein: two circular tubes (403) are symmetrically arranged at the bottom end of the upper die (401), holes for inserting the circular tubes (403) are formed in the top end of the lower die (2), and the circular tubes (403) extend into the first through grooves (201).
4. A hardware mold cooling structure according to claim 3, wherein: the top of diaphragm (4) is offered and is linked together inside vertical hole (404) of mould (401), in the one end of diaphragm (4) extends into riser (3), install the butt in riser (3) telescopic link (301) on diaphragm (4) extension top, the one end symmetry that diaphragm (4) extended into in riser (3) is constructed with two lug (405), set up in riser (3) and supply lug (405) gliding perpendicular groove (302).
5. The hardware die cooling structure according to claim 1, wherein: the side-mounted water pump (5) of rectangle case (1), hose (501) of intercommunication second through groove (402) are installed on the top of water pump (5), bottom pipe (502) of intercommunication cavity (101) inside bottom are installed to the below of water pump (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320073477.7U CN219335653U (en) | 2023-01-10 | 2023-01-10 | Hardware mold cooling structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320073477.7U CN219335653U (en) | 2023-01-10 | 2023-01-10 | Hardware mold cooling structure |
Publications (1)
Publication Number | Publication Date |
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CN219335653U true CN219335653U (en) | 2023-07-14 |
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CN202320073477.7U Active CN219335653U (en) | 2023-01-10 | 2023-01-10 | Hardware mold cooling structure |
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CN (1) | CN219335653U (en) |
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2023
- 2023-01-10 CN CN202320073477.7U patent/CN219335653U/en active Active
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