CN219322795U

CN219322795U - Board card expanding structure of unmanned aerial vehicle sensor

Info

Publication number: CN219322795U
Application number: CN202223157349.5U
Authority: CN
Inventors: 浦晓华; 余俐; 田燕
Original assignee: Kunshan Woben Intelligent Technology Co ltd
Current assignee: Kunshan Woben Intelligent Technology Co ltd
Priority date: 2022-11-28
Filing date: 2022-11-28
Publication date: 2023-07-07
Anticipated expiration: 2032-11-28

Abstract

The utility model relates to the technical field of board cards, in particular to a board card expanding structure of an unmanned aerial vehicle sensor, which comprises a board card, wherein a sealing plate matched with the board card is arranged above the board card, a bottom plate matched with the board card is arranged below the board card, the sealing plate and the bottom plate are mutually matched to fix the board card inside the board card, a first heat conducting pad and a second heat conducting pad for guiding out heat in the board card are respectively arranged in the sealing plate and the bottom plate, and a heat-equalizing plate is arranged inside the sealing plate and the bottom plate.

Description

Board card expanding structure of unmanned aerial vehicle sensor

Technical Field

The utility model relates to the technical field of boards, in particular to a board expansion structure of an unmanned aerial vehicle sensor.

Background

The board card is a printed circuit board, is abbreviated as a PCB, is provided with a lock pin during manufacturing, can be used for controlling the operation of a sensor, is a detection device, can sense measured information, can convert the sensed information into an electric signal or other information output in a required form according to a certain rule, is positioned at the core position of the unmanned aerial vehicle, can ensure normal operation of device functions and navigation, can generate certain heat after the board card of the unmanned aerial vehicle sensor works for a period of time, so that the internal temperature of the board card rises, if the heat is not timely emitted, the temperature is continuously raised, the reliability of the board card can be reduced, therefore, the board card is very important to perform good heat dissipation treatment, and in addition, due to the working characteristics of the unmanned aerial vehicle, parts inside the board card need to be stably installed to prevent deformation and loosening. In view of this, we propose a board expansion structure of unmanned aerial vehicle sensor.

Disclosure of Invention

In order to make up for the defects, the utility model provides a board expansion structure of an unmanned aerial vehicle sensor.

The technical scheme of the utility model is as follows:

the utility model provides a structure is extended to unmanned aerial vehicle sensor's integrated circuit board, includes the integrated circuit board, the integrated circuit board top is provided with rather than assorted shrouding, the integrated circuit board below be provided with rather than assorted bottom plate, the shrouding with the bottom plate mutually support will the integrated circuit board is fixed inside both, just the shrouding with be provided with respectively in the bottom plate will first heat conduction pad and the second heat conduction pad of heat derivation in the integrated circuit board, the shrouding with the inside vapor chamber that is provided with of bottom plate.

Preferably, the shrouding includes the shrouding body, shrouding body lower extreme seted up with integrated circuit board area size assorted seal groove, all seted up the bar groove on the both sides wall on the long limit in the seal groove, equal fixed mounting has the silica gel sealing strip in the bar groove, fixed mounting has a plurality of first heat pads in the middle of the seal groove bottom.

Preferably, the integrated circuit board includes the integrated circuit board body, the four corners department of integrated circuit board body is rectangular form symmetry and has seted up the mounting hole, all be provided with the third bolt rather than matching in the mounting hole.

Preferably, the bottom plate includes the bottom plate body, the upper end of bottom plate body seted up with integrated circuit board area size assorted mounting groove, the equal fixedly connected with fixed block in four corners department in the mounting groove, fixed mounting has a plurality of second heat pads in the middle of the mounting groove bottom, the mounting groove bottom is in symmetrical fixedly connected with a plurality of springs around the second heat pad, the long limit both sides in upper end of bottom plate body are in the mounting groove outside has all been seted up the radiating groove, the degree of depth of radiating groove is greater than the degree of depth of mounting groove, the shrouding body with the equal fixedly connected with connecting block in long limit both sides edge of bottom plate body, all be provided with at least a set of second bolt and second nut on the connecting block, the shrouding body with the spread groove has all been seted up at the both sides edge of bottom plate body, all be provided with at least a set of first bolt and first nut on the spread groove.

Preferably, the first bolt is matched with the first nut, the first bolt respectively penetrates through holes in connecting grooves formed in the sealing plate body and the bottom plate body and is in threaded connection with the first nut, the second bolt is matched with the second nut, and the second bolt respectively penetrates through holes in connecting blocks fixedly connected with the sealing plate body and the bottom plate body and is in threaded connection with the second nut.

Preferably, the third bolts respectively penetrate through the mounting holes to be in threaded connection with holes in the fixed block.

Preferably, the first heat conduction pad and the second heat conduction pad are both silica gel heat conduction pads.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the bottom plate is arranged below the board, the heat conducting pads are fixedly connected in the bottom plate and the sealing plate, heat of the board is transferred into the bottom plate and the sealing plate through the heat conducting pads, the vapor chamber is arranged in the bottom plate and the sealing plate to help absorb the heat, four corners of the board are fixedly arranged in the mounting groove of the bottom plate, and the sealing plate is fixedly connected with the bottom plate, so that the board is suspended and fixed in the bottom plate and the bottom plate, reinforcement and isolation of the board are realized, and deformation caused by mutual collision of the board is avoided.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of a seal plate according to the present utility model;

FIG. 3 is a schematic diagram of a card structure according to the present utility model;

FIG. 4 is a schematic view of the structure of the base plate according to the present utility model;

in the figure:

1. a sealing plate; 2. a board card; 3. a bottom plate;

11. a seal plate body; 12. sealing the groove; 13. a bar-shaped groove; 14. a silica gel sealing strip; 15. a first thermal pad; 16. a connecting groove; 17. a first bolt; 18. a connecting block; 19. a second bolt;

21. a board card body; 22. a mounting hole; 23. a third bolt;

31. a base plate body; 32. a mounting groove; 33. a fixed block; 34. a spring; 35. a second thermal pad; 36. a heat sink; 37. a second nut; 38. a first nut.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Referring to fig. 1-4, the present utility model is described in detail by the following embodiments:

the utility model provides a board of unmanned aerial vehicle sensor expands structure, includes board 2, board 2 top be provided with rather than assorted shrouding 1, board 2 below be provided with rather than assorted bottom plate 3, shrouding 1 and bottom plate 3 mutually support board 2 fix inside both, and shrouding 1 and bottom plate 3 are provided with respectively with the heat in the board 2 first heat conduction pad 15 and the second heat conduction pad 35 of leading out, shrouding 1 and bottom plate 3 inside are provided with the vapor chamber.

The integrated circuit board 2 is fixedly arranged inside the bottom plate 3, the sealing plate 1 is fixedly connected with the bottom plate 3 through bolts, the integrated circuit board 2 is installed, deformation is not easily caused by contact with other external parts, and the heat in the integrated circuit board 2 is transferred to the sealing plate 1 and the bottom plate 3 through the first heat conducting pad 15 and the second heat conducting pad 35 respectively and absorbed through the soaking plates inside the sealing plate 1 and the bottom plate 3.

The sealing plate 1 comprises a sealing plate body 11, sealing grooves 12 matched with the area of the board card 2 are formed in the lower end of the sealing plate body 11, strip-shaped grooves 13 are formed in the two side walls of the long sides in the sealing grooves 12, silica gel sealing strips 14 are fixedly mounted in the strip-shaped grooves 13, and a plurality of first heat conducting pads 15 are fixedly mounted in the middle of the bottoms of the sealing grooves 12.

The board card 2 comprises a board card body 21, mounting holes 22 are symmetrically formed in four corners of the board card body 21 in a rectangular shape, and third bolts 23 matched with the mounting holes 22 are arranged in the mounting holes 22.

The sealing plate 1 is covered on the bottom plate 3, two groups of symmetrical strip-shaped grooves 13 are formed in the side wall of a sealing groove 12 formed in the sealing plate 1, a silica gel sealing strip fixedly mounted in the sealing plate can enable the plate clamp body 21 to be tightly matched with the sealing plate body, a plurality of first bolts 17 respectively penetrate through holes in connecting grooves 16 formed in two sides of the short sides of the sealing plate body 11 and the bottom plate body 31 and are in threaded connection with first nuts 38, a plurality of second bolts 19 respectively penetrate through holes in connecting blocks 18 connected with two sides of the long sides of the sealing plate body 11 and the bottom plate body 31 and are in threaded connection with second nuts 37, the upper end of the plate clamp body 21 is just abutted against the lower surface of the first heat conducting pad 15, heat emitted in the plate clamp body 21 is transferred to the sealing plate body 11 and the bottom plate body 31 through the first heat conducting pad 15 and the second heat conducting pad 35, and heat is rapidly absorbed through the heat equalizing plates arranged in the sealing plate body 11 and the bottom plate body 31, and the temperature of the plate clamp body 21 is reduced.

The bottom plate 3 includes bottom plate body 31, the mounting groove 32 with integrated circuit board 2 area size assorted is offered to bottom plate body 31's upper end, equal fixedly connected with fixed block 33 in four corners department in the mounting groove 32, a plurality of second heat conduction pads 35 of fixed mounting have in the middle of the mounting groove 32 bottom, a plurality of springs 34 of symmetrical fixedly connected with around second heat conduction pad 35 are installed to mounting groove 32 bottom, the radiating groove 36 has all been offered in the upper end long limit both sides of bottom plate body 31 in the mounting groove 32 outside, the degree of depth of radiating groove 36 is greater than the degree of depth of mounting groove 32, the equal fixedly connected with connecting block 18 of long limit both sides edge of bottom of shrouding body 11 and bottom plate body 31, all be provided with at least a set of second bolt 19 and second nut 37 on the connecting block 18, the connecting groove 16 has all been provided with at least a set of first bolt 17 and first nut 38 on the connecting groove 16, the third bolt 23 passes the hole threaded connection on mounting hole 22 and the fixed block 33 respectively, first heat conduction pad 15 and second heat conduction pad 35 all adopt the heat conduction pad.

The third bolts 23 penetrate through holes at four corners of the board body 21 and are respectively in threaded connection with fixing blocks 33 fixedly connected with four corners in the mounting groove 32, and springs 34 fixedly connected with the bottom of the mounting groove 32 are in a compressed state at the moment; the lower extreme of integrated circuit board body 21 is just contradicted at second heat conduction pad 35 upper surface, and the radiating groove 36 of seting up of bottom plate body 31 both sides limit can provide ventilation and heat dissipation and observe the effect of integrated circuit board body 21 state, and when integrated circuit board body 21 need dismantle, the second nut 37 of unscrewing respectively, first nut 38 take off integrated circuit board body 21, unscrews four third bolts 23, utilizes the elasticity thrust of spring 34 can outwards push integrated circuit board body 21 for the dismantlement of integrated circuit board body 21 is more convenient.

The first bolts 17 are matched with the first nuts 38, the first bolts 17 respectively penetrate through holes on connecting grooves 16 formed in the sealing plate body 11 and the bottom plate body 31 to be in threaded connection with the first nuts 38, the second bolts 19 are matched with the second nuts 37, and the second bolts 19 respectively penetrate through holes on connecting blocks 18 fixedly connected with the sealing plate body 11 and the bottom plate body 31 to be in threaded connection with the second nuts 37.

When the integrated circuit board is specifically used, the third bolts 23 penetrate through holes at four corners of the board clamp body 21 and are respectively in threaded connection with the fixing blocks 33 fixedly connected with the four corners in the mounting groove 32, and the springs 34 fixedly connected with the bottom of the mounting groove 32 are in a compressed state at the moment; the lower end of the board card body 21 is just abutted against the upper surface of the second heat conduction pad 35, and the heat dissipation grooves 36 formed on the two side edges of the bottom plate body 31 can provide the functions of ventilation, heat dissipation and observing the state of the board card body 21; the sealing plate 1 is covered on the bottom plate 3, two groups of symmetrical strip-shaped grooves 13 are formed in the side wall of a sealing groove 12 formed in the sealing plate 1, a silica gel sealing strip fixedly installed in the sealing plate can enable the plate clamp body 21 to be tightly matched with the sealing plate body, a plurality of first bolts 17 respectively penetrate through holes in connecting grooves 16 formed in two sides of the short sides of the sealing plate body 11 and the bottom plate body 31 to be in threaded connection with first nuts 38, and a plurality of second bolts 19 respectively penetrate through holes in connecting blocks 18 connected with two sides of the long sides of the sealing plate body 11 and the bottom plate body 31 to be in threaded connection with second nuts 37; at this time, the upper end of the board card body 21 is just abutted against the lower surface of the first heat conducting pad 15, the heat emitted in the board card body 21 is transferred to the sealing board body 11 and the bottom board body 31 by the first heat conducting pad 15 and the second heat conducting pad 35, and the heat-equalizing plates are arranged in the sealing board body 11 and the bottom board body 31, so that the heat can be quickly absorbed, and the temperature of the board card body 21 is reduced; when the board body 21 needs to be disassembled, the second nut 37 and the first nut 38 are screwed down respectively, the board body 21 is taken down, the four third bolts 23 are screwed down, the board body 21 can be pushed outwards by utilizing the elastic thrust of the springs 34, and the board body 21 is convenient to disassemble.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a board of unmanned aerial vehicle sensor expands structure, includes board (2), its characterized in that: the integrated circuit board comprises a board (2), wherein a sealing plate (1) matched with the board is arranged above the board (2), a bottom plate (3) matched with the board is arranged below the board (2), the sealing plate (1) and the bottom plate (3) are mutually matched to fix the board (2) inside the board, a first heat conducting pad (15) and a second heat conducting pad (35) for conducting heat in the board (2) are respectively arranged on the sealing plate (1) and the bottom plate (3), and a heat homogenizing plate is arranged inside the sealing plate (1) and the bottom plate (3).

2. The unmanned aerial vehicle sensor's board card expansion structure of claim 1, wherein: the sealing plate (1) comprises a sealing plate body (11), sealing grooves (12) matched with the area of the board card (2) are formed in the lower end of the sealing plate body (11), strip-shaped grooves (13) are formed in the two side walls of the inner long sides of the sealing grooves (12), silica gel sealing strips (14) are fixedly arranged in the strip-shaped grooves (13), and a plurality of first heat conducting pads (15) are fixedly arranged in the middle of the bottoms of the sealing grooves (12).

3. The unmanned aerial vehicle sensor's board card expansion structure of claim 2, wherein: the integrated circuit board (2) comprises a board body (21), mounting holes (22) are symmetrically formed in four corners of the board body (21) in a rectangular shape, and third bolts (23) matched with the mounting holes (22) are arranged in the mounting holes.

4. The unmanned aerial vehicle sensor's board card expansion structure of claim 3, wherein: the bottom plate (3) comprises a bottom plate body (31), mounting groove (32) matched with the area of the board card (2) is formed in the upper end of the bottom plate body (31), fixed blocks (33) are fixedly connected to four corners in the mounting groove (32), a plurality of second heat conduction pads (35) are fixedly mounted in the middle of the bottom of the mounting groove (32), a plurality of springs (34) are symmetrically and fixedly connected to the periphery of the second heat conduction pads (35) at the bottom of the mounting groove (32), radiating grooves (36) are formed in the outer side of the mounting groove (32) on two sides of the upper end of the bottom plate body (31), the depth of the radiating grooves (36) is larger than that of the mounting groove (32), connecting blocks (18) are fixedly connected to two edges of the long sides of the bottom plate body (31), at least one group of second bolts (19) and second nuts (37) are arranged on the connecting blocks (18), and at least one group of bolts (16) are arranged on two edges of the short sides of the bottom plate body (11) and the edges (31).

5. The unmanned aerial vehicle sensor's board card expansion structure of claim 4, wherein: the first bolt (17) is matched with the first nut (38), the first bolt (17) respectively penetrates through the hole in the connecting groove (16) formed in the sealing plate body (11) and the bottom plate body (31) and is in threaded connection with the first nut (38), the second bolt (19) is matched with the second nut (37), and the second bolt (19) respectively penetrates through the hole in the connecting block (18) fixedly connected with the sealing plate body (11) and is in threaded connection with the second nut (37).

6. The unmanned aerial vehicle sensor's board card expansion structure of claim 4, wherein: the third bolts (23) respectively penetrate through the mounting holes (22) to be in threaded connection with holes in the fixed blocks (33).

7. The unmanned aerial vehicle sensor's board card expansion structure of claim 4, wherein: the first heat conduction pad (15) and the second heat conduction pad (35) are both made of silica gel heat conduction pads.