CN219303615U - Design structure for solving flaking sticky piece of silicon wafer - Google Patents
Design structure for solving flaking sticky piece of silicon wafer Download PDFInfo
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- CN219303615U CN219303615U CN202320001864.XU CN202320001864U CN219303615U CN 219303615 U CN219303615 U CN 219303615U CN 202320001864 U CN202320001864 U CN 202320001864U CN 219303615 U CN219303615 U CN 219303615U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The utility model discloses a design structure for solving the problem of flaking sticky sheets of silicon wafers, which comprises a circulating pipe, a liquid inlet pipe, a slow lifting frame, a circulating pump and a PLC (programmable logic controller). The pipe body of the circulating pipe is provided with a through hole, the slow lifting frame is of a rectangular frame structure, the inner wall of the slow lifting frame is provided with a slow lifting groove, and the circulating pipe is clamped with the slow lifting frame through the slow lifting groove. The liquid inlet pipe is communicated with the circulating pipe. The PLC is electrically connected with the circulating pump. According to the utility model, the liquid in the tank body is disturbed circularly, so that the silicon wafer is kept uniformly dispersed and not bonded, the problem of sticking is solved, reworking is reduced, and the yield of the solar cell is improved.
Description
Technical Field
The utility model relates to the technical fields of texturing, alkali polishing and the like of solar cells, in particular to a design structure for solving the problem of flaking sticky sheets of silicon chips.
Background
With the iteration of battery products in the photovoltaic industry, the market is continually pursuing high efficiency and high power components. In view of cost, silicon wafers are increasingly flaked, from 185 microns to 130 microns, and more likely to be as thin as around 100 microns in the future. As the original silicon wafer becomes thinner, the old equipment and tooling are exposed to a number of problems, such as the problem of sticking to be solved by the utility model. The old frock interval is too narrow, and the silicon chip is very easy to take place the sticky piece in the board, causes a large amount of reworks, also can cause the influence to the yield simultaneously, makes manufacturing cost increase.
Disclosure of Invention
Technical purpose
Aiming at the problem of silicon wafer adhesion caused by existing silicon wafer flaking, the utility model provides a design structure for solving the problem of silicon wafer flaking adhesion.
Technical proposal
In order to achieve the above purpose, the present utility model adopts the following technical scheme.
A design structure for solving the problem of silicon wafer flaking sticky piece comprises a circulating pipe, a liquid inlet pipe, a slow lifting frame, a circulating pump and a PLC controller. The circulating pipe comprises a first circulating branch pipe, a second circulating branch pipe, a third circulating branch pipe, a fourth circulating branch pipe, a fifth circulating branch pipe and a sixth circulating branch pipe, wherein the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are identical in length and are provided with thin pipe structures with through holes, the fifth circulating branch pipe and the sixth circulating branch pipe are identical in length and are uniformly distributed with thin pipe structures with four clamping holes on one side of the pipe body, the top ends of the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are clamped with the fifth circulating branch pipe through the clamping holes of the fifth circulating branch pipe, and the bottom ends of the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are clamped with the sixth circulating branch pipe through the clamping holes of the sixth circulating branch pipe. The liquid inlet is arranged on the pipe body of one side of the fifth circulating branch pipe, which is opposite to the clamping hole, the tail end of the liquid inlet pipe is clamped with the fifth circulating branch pipe through the liquid inlet, the circulating pump is arranged on the pipe body of the liquid inlet pipe, and the liquid inlet pipe is communicated with the circulating pump. The slow lifting frame is of a rectangular frame structure, a slow lifting groove is formed in the inner wall of the slow lifting frame, and the circulating pipe is clamped with the slow lifting frame through the slow lifting groove. The PLC is electrically connected with the circulating pump.
The utility model uses the PLC to control the circulation pump to work, can accurately control the flow rate and the circulation time of the liquid in the circulation pipe, and can uniformly maintain the dispersion state of the silicon wafer and avoid adhesion in the process of continuously circulating the liquid in the circulation pipe.
Further, the circulation pipe is a PVC pipe.
The PVC pipe has the characteristics of high temperature resistance and acid and alkali resistance, and has stable structure, thereby being convenient for uniform and continuous circulation.
Advantageous effects
According to the utility model, the liquid in the tank body is disturbed circularly, so that the silicon wafer is kept uniformly dispersed and not bonded, the problem of sticking is solved, reworking is reduced, and the yield of the solar cell is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
wherein, 1-circulating pipe, 2-feed liquor pipe, 3-slow lifting frame, 4-circulating pump, 5-through-hole.
Detailed Description
For a better understanding of the present utility model, reference will now be made to the accompanying drawings and to the detailed description of the utility model, which are to be taken in conjunction with the accompanying drawings.
A design structure for solving the problem of silicon wafer flaking sticky piece comprises a circulating pipe 1, a liquid inlet pipe 2, a slow lifting frame 3, a circulating pump 4 and a PLC controller. The circulating pipe 1 is a PVC pipe, the circulating pipe 1 comprises a first circulating branch pipe, a second circulating branch pipe, a third circulating branch pipe, a fourth circulating branch pipe, a fifth circulating branch pipe and a sixth circulating branch pipe, the lengths of the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are the same, the pipe body is provided with a thin pipe structure with a through hole 5, the lengths of the fifth circulating branch pipe and the sixth circulating branch pipe are the same, the pipe body is provided with thin pipe structures with four clamping holes uniformly distributed on one side, and the top ends of the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are clamped with the fifth circulating branch pipe through the clamping holes of the fifth circulating branch pipe, and the bottom ends of the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are clamped with the sixth circulating branch pipe through the clamping holes of the sixth circulating branch pipe. The pipe body on one side of the fifth circulation branch pipe opposite to the clamping hole is provided with a liquid inlet, the tail end of the liquid inlet pipe 2 is clamped with the fifth circulation branch pipe through the liquid inlet, the circulation pump 4 is arranged on the pipe body of the liquid inlet pipe 2, and the liquid inlet pipe 2 is communicated with the circulation pump 4. The slow lifting frame 3 is of a rectangular frame structure, a slow lifting groove is formed in the inner wall of the slow lifting frame 3, and the circulating pipe 1 is clamped with the slow lifting frame 3 through the slow lifting groove. The PLC controller is electrically connected with the circulating pump 4.
The foregoing is only a preferred embodiment of the utility model, it being noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present utility model, and such modifications and adaptations are intended to be comprehended within the scope of the utility model.
Claims (2)
1. A design structure for solving silicon chip flaking sticky piece, its characterized in that: comprises a circulating pipe (1), a liquid inlet pipe (2), a slow lifting frame (3), a circulating pump (4) and a PLC controller;
the circulating pipe (1) comprises a first circulating branch pipe, a second circulating branch pipe, a third circulating branch pipe, a fourth circulating branch pipe, a fifth circulating branch pipe and a sixth circulating branch pipe, wherein the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are of the same length and are of a thin pipe structure with through holes (5) arranged on the pipe body, the fifth circulating branch pipe and the sixth circulating branch pipe are of the same length and are of thin pipe structures with four clamping holes uniformly distributed on one side of the pipe body, the top ends of the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are clamped with the fifth circulating branch pipe through the clamping holes of the fifth circulating branch pipe, and the bottom ends of the first circulating branch pipe, the second circulating branch pipe, the third circulating branch pipe and the fourth circulating branch pipe are clamped with the sixth circulating branch pipe through the clamping holes of the sixth circulating branch pipe;
a liquid inlet is formed in a pipe body of one side, opposite to the clamping hole, of the fifth circulating branch pipe, the tail end of the liquid inlet pipe (2) is clamped with the fifth circulating branch pipe through the liquid inlet, the circulating pump (4) is arranged on the pipe body of the liquid inlet pipe (2), and the liquid inlet pipe (2) penetrates through the circulating pump (4);
the slow lifting frame (3) is of a rectangular frame structure, a slow lifting groove is formed in the inner wall of the slow lifting frame (3), and the circulating pipe (1) is clamped with the slow lifting frame (3) through the slow lifting groove;
the PLC is electrically connected with the circulating pump (4).
2. The design structure for solving the problem of flaking the wafer according to claim 1, wherein: the circulating pipe (1) is a PVC pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320001864.XU CN219303615U (en) | 2023-01-03 | 2023-01-03 | Design structure for solving flaking sticky piece of silicon wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202320001864.XU CN219303615U (en) | 2023-01-03 | 2023-01-03 | Design structure for solving flaking sticky piece of silicon wafer |
Publications (1)
Publication Number | Publication Date |
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CN219303615U true CN219303615U (en) | 2023-07-04 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202320001864.XU Active CN219303615U (en) | 2023-01-03 | 2023-01-03 | Design structure for solving flaking sticky piece of silicon wafer |
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CN (1) | CN219303615U (en) |
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2023
- 2023-01-03 CN CN202320001864.XU patent/CN219303615U/en active Active
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