CN219294402U - Stamping strip-shaped wafer splitting machine - Google Patents

Abstract

The utility model discloses a stamping strip-shaped wafer splitting machine, which comprises an equipment main body frame, wherein a lifting mechanism and a cylinder stamping device are arranged on the equipment main body frame, the lifting mechanism is fixedly connected with the equipment main body frame, the cylinder stamping device is fixed on the lifting mechanism, a stamping device and a wafer stamping pressing mechanism are arranged at the lower end of the cylinder stamping device, a wafer guiding device, a wafer supporting table and a wafer conveying device are arranged on the equipment main body frame, the wafer supporting table is used for supporting a wafer, the wafer guiding device is positioned at one end of the wafer supporting table, the wafer conveying device is positioned below the wafer guiding device, and the wafer conveying device is used for pushing the wafer to move.

Description

Stamping strip-shaped wafer splitting machine

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a stamping strip-shaped wafer splitting machine.

Background

In the process flow of preparing the optical chip, after the wafer is subjected to the dicing processing technology, the crystal grains are still fixedly connected together, laser cutting channels exist among the crystal grains, and the single crystal grains are required to be separated from the strip-shaped wafer and then subjected to subsequent technologies such as packaging coupling and the like. The splitting is a process of separating the grains which are fixedly connected together into independent grains by adopting a stamping or rolling mode after slotting the wafer along the cutting street by using laser or a grinding wheel.

The existing splitting operation mostly adopts manual splitting, rolling splitting or punching splitting. The manual breaking efficiency is low, and the effect of breaking the crystal grains with different sizes is poor. The rolling mode splitting means that a certain downward pressure is applied to the wafer after laser scribing by using a glue stick, and the single crystal grain is separated from the wafer by rolling from the surface of the strip-shaped wafer. The splitting quality of the mode is greatly influenced by the motion direction, speed and force of the rubber wheel control, and the splitting method can lead crystal grains on a wafer to be not separated independently when rolling, and the adjacent crystal grains have broken edges and continuous edges caused by collision and extrusion, so that the light flux performance and quality stability of the crystal grains are influenced. The punching splitting mode is to apply a certain impact force between the crystal grain and the cutting path of the crystal grain to split and divide the wafer into independent crystal grains. The splitting mode is less applied to the aspect of strip wafers, and the protection of the side wall of the crystal grain in the splitting process is absent in the use process, so that the risks of abrasion and scratch are brought, and meanwhile, the compatibility of the strip wafers with different sizes is absent. In view of the above problems, a solution is proposed below.

Disclosure of Invention

The utility model aims to provide a stamping strip-shaped wafer splitting machine which has the advantages of improving the splitting efficiency and splitting quality of wafers, enabling all crystal grains on the wafers to be separated independently, improving the yield and stabilizing the chip quality.

The technical aim of the utility model is realized by the following technical scheme:

the utility model provides a punching press strip wafer lobe of a leaf machine, includes equipment main part frame, be equipped with elevating system and cylinder punching press device in the equipment main part frame, elevating system and equipment main part frame fixed connection, cylinder punching press device is fixed on elevating system, elevating system is used for adjusting cylinder punching press device's height to adjust cylinder punching press device's punching press distance, cylinder punching press device's lower extreme is equipped with punching press position adjustment device and wafer punching press hold-down mechanism, punching press position adjustment device is used for adjusting wafer punching press hold-down mechanism's front and back position, so that wafer punching press hold-down mechanism adapts to the wafer size, wafer punching press hold-down mechanism is used for compressing tightly the wafer, so that to the processing of wafer, be equipped with wafer guider, wafer supporting bench and wafer conveyor in the equipment main part frame, the wafer supporting bench is located the below of wafer punching press hold-down mechanism, wafer supporting bench is used for supporting the wafer, wafer guider is located the one end of wafer guider, wafer conveyor is used for promoting the wafer removal, wafer guider is used for guiding the removal direction to make the wafer get into on the wafer supporting bench.

Preferably, the lifting mechanism comprises a rotating hand wheel, a lifting base, a screw rod sliding table and a guide rail sliding block, wherein the rotating hand wheel is installed on the lifting base, the lifting base is fixedly installed on the equipment main body frame through a bolt, the rotating hand wheel is fixedly connected with the top end of the screw rod, the rotating hand wheel is used for driving the screw rod to rotate, the screw rod sliding table is in threaded connection with the screw rod, the screw rod is used for driving the screw rod sliding table to conduct lifting movement, the guide rail sliding block is fixedly connected with the equipment main body frame, and the screw rod sliding table is in sliding connection with one side of the guide rail sliding block.

Preferably, the cylinder stamping device comprises a cylinder support frame, a duplex cylinder, a speed regulating valve and an electromagnetic valve, wherein the cylinder support frame is fixedly connected with a screw rod sliding table, the screw rod sliding table is used for adjusting the height of the cylinder support frame, the duplex cylinder is fixed on the cylinder support frame and is connected with the speed regulating valve through an air pipe, the speed regulating valve is used for adjusting the running speed of the duplex cylinder, the duplex cylinder is connected with the electromagnetic valve through the air pipe, and the electromagnetic valve is used for controlling the running action of the duplex cylinder.

Preferably, the punch position adjusting device comprises a punch supporting table, the upper end face of the punch supporting table is fixedly connected with the output shaft of the duplex cylinder, a small guide rail is fixedly arranged on the lower end face of the punch supporting table, a small guide rail sliding block and a guide rail clamp device are arranged on the small guide rail, a punch compressor support is fixedly arranged at the lower end of the small guide rail sliding block, the guide rail clamp device is fixed on the punch compressor support, and the guide rail clamp device is used for fixing the positions of the small guide rail sliding block and the punch compressor support.

Preferably, the wafer punching press hold-down mechanism includes the buffering support, the upper end and the puncher brace table fixed connection of buffering support, install the punching press head on the buffering support, the closing head is installed to the bottom of buffering support, the rectangle spring has been cup jointed to the closing head periphery, the rectangle spring is used for buffering the pressure to the wafer.

Preferably, the wafer supporting table comprises a base table fixedly connected with the equipment main body frame, a floating table is arranged on the upper end face of the base table and is in sliding connection with the base table, a circular compression spring is arranged in the base table and is placed in a groove of the base table, the circular compression spring is sleeved on a peripheral cylinder of the floating table, the floating table is used for supporting a wafer, and the circular compression spring is used for supporting the floating table.

Preferably, the wafer guiding device comprises a wafer guiding carrying platform, an adjusting plate and a set screw, wherein two waist-shaped grooves are symmetrically formed in the bottom of the wafer guiding carrying platform, the adjusting plate is inserted into the waist-shaped grooves and fixed on two sides of the wafer guiding carrying platform through the waist-shaped grooves, the adjusting plate is in sliding connection with the wafer guiding carrying platform, two side plates are fixedly arranged on the wafer guiding carrying platform, a guide groove is formed between the adjusting plate and the side plates, the adjusting plate is used for adjusting the width of the guide groove, the set screw is located at the end part of the adjusting plate, the set screw is used for fixing the adjusting plate, grooves are formed in the upper rolls of the adjusting plate and the side plates, rotary columns are embedded in the grooves, nylon balls are sleeved on the rotary columns and are used for protecting wafers.

Preferably, the wafer conveying device comprises a linear module and a module support, the linear module is arranged on the module support, the module support is fixedly connected with the equipment main body frame, a screw rod is arranged in the linear module, a stepping motor is arranged at one end of the linear module, a flange is arranged on the stepping motor, the stepping motor is connected with the linear module through the flange, a shaft coupling is connected to an output shaft of the stepping motor, one end of the screw rod is fixedly connected with the shaft coupling, a push rod sliding block is arranged in the linear module, the push rod sliding block is in threaded connection with the screw rod, a wafer push rod is fixedly arranged on the push rod sliding block, a push groove is formed in the wafer guide carrying platform, the upper end of the wafer push rod is positioned in the push groove and is in sliding connection with the push groove, and the wafer push rod is used for pushing the wafer to move.

The beneficial effects of the utility model are as follows:

1. the wafer guide carrier adopts a double-channel symmetrical arrangement structure, the stamping pressing mechanism adopts double-pressing heads for symmetrical installation, two strip wafers can be placed on the wafer guide carrier by one splitting process, and the splitting efficiency is twice that of a single wafer.

2. The groove width of the wafer guide groove can be adjusted through the adjusting plate of the wafer guide carrier so as to adapt to the wafer splitting requirements of different widths, and the equipment splitting compatibility is improved; nylon guide posts are arranged on two sides of the guide groove, so that the wafer side edge is protected while the wafer guide performance is enhanced, the wafer side edge is prevented from being scratched, and the product quality is improved.

3. The wafer conveying process adopts a stamping type wafer splitting method, a linear module performs stepping intermittent pushing movement, a single crystal grain on a wafer is split in the stamping process, all crystal grains on the wafer can be ensured to be separated independently, and collision and extrusion phenomena between adjacent crystal grains can not occur during the splitting, so that edge breakage and edge connection are avoided.

4. The stamping and pressing mechanism integrates stamping action and pressing action, and a buffer device is formed by a compression spring to complete the process of fixing and then stamping, so that the coupling of stamping and pressing actions is enhanced, and the damage to the wafer is reduced while the wafer is rapidly and conveniently cracked.

Drawings

FIG. 1 is a schematic diagram of an embodiment;

FIG. 2 is a schematic view of a position adjusting device of a punch according to an embodiment;

FIG. 3 is a schematic diagram of a wafer press-hold mechanism according to an embodiment;

FIG. 4 is a schematic view of a wafer guide apparatus according to an embodiment;

FIG. 5 is a schematic view of the structure of an exemplary wafer support table;

FIG. 6 is a schematic view of an exemplary wafer handling device;

figure 7 is an enlarged view of the embodiment punch press mechanism and wafer support table in operation.

Reference numerals: 1. an equipment main body frame; 2. a lifting mechanism; 21. rotating a hand wheel; 22. lifting the base; 23. a screw rod; 24. a screw rod sliding table; 25. a guide rail slide block; 3. a cylinder stamping device; 31. a cylinder support; 32. a duplex cylinder; 33. a speed regulating valve; 34. an electromagnetic valve; 4. a punch position adjusting device; 41. a punch support; 42. a small guide rail; 43. a small guide rail slide block; 44. a rail clamp; 45. stamping a compactor bracket; 5. a wafer stamping and pressing mechanism; 51. a buffer bracket; 52. punching heads; 53. a lock nut; 54. a compacting head; 55. a rectangular spring; 6. wafer guide means; 61. a wafer guide stage; 62. an adjusting plate; 63. a rotating column; 64. nylon rollers; 7. a wafer support table; 71. a base station; 72. a circular compression spring; 73. a floating platform; 8. a wafer transport device; 81. a linear module; 82. a module support; 83. a push rod sliding block; 84. a wafer pushing rod; 85. a coupling; 86. a flange; 87. a stepper motor.

Detailed Description

The following description is only of the preferred embodiments of the present utility model, and the scope of the present utility model should not be limited to the examples, but should be construed as falling within the scope of the present utility model. Wherein like parts are designated by like reference numerals. It should be noted that the words "front", "back", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from, respectively, the geometric center of a particular component.

Referring to fig. 1, the present utility model is a stamping strip-shaped wafer splitting machine, which comprises a main frame 1, wherein a lifting mechanism 2 is installed at the upper end of the main frame 1. The lifting mechanism 2 comprises a rotary hand wheel 21, the rotary hand wheel 21 is arranged on a lifting base 22, and the lifting base 22 is fixedly arranged on the equipment main body frame 1 through bolt connection. Through manual operation rotation of the rotating hand wheel 21, the rotating hand wheel 21 drives the screw rod 23 to rotate, and the screw rod 23 rotates to drive the screw rod 23 sliding table to conduct lifting movement. The screw rod 23 sliding table is arranged on the guide rail sliding block 25, and the guide rail sliding block 25 plays a role in supporting and guiding.

The cylinder stamping device 3 provides power support for the splitting action, the cylinder stamping device 3 comprises a cylinder supporting frame 31, and the cylinder supporting frame 31 is arranged on the sliding table of the screw rod 23 through screws. The cylinder support frame 31 moves synchronously along with the lifting mechanism 2, and the lifting mechanism 2 can adjust the height of the cylinder support frame 31, so that the adjustment of the stamping distance is realized.

The double-cylinder 32 is arranged on the cylinder support frame 31, the double-cylinder 32 is connected with the speed regulating valve 33 through an air pipe, and the running speed of the cylinder can be regulated through the speed regulating valve 33; the double cylinder 32 is also connected with an electromagnetic valve 34 through an air pipe, and the electromagnetic valve 34 can control the operation of the double cylinder 32.

Referring to fig. 2, the punch position adjusting apparatus 4 includes a punch support table 41, and the punch support table 41 is mounted on the telescopic rod of the duplex cylinder 32 by screws. The small guide rail 42 is fixedly arranged on the punch support table 41, the small guide rail 42 is provided with the small guide rail sliding block 43 and the guide rail clamp 44, the small guide rail sliding block 43 and the guide rail clamp 44 are connected together by the punch clamp bracket 45 and move on the guide rail at the same time, and the small guide rail sliding block 43, the guide rail clamp 44 and the guide rail clamp bracket are used for adjusting the splitting positions of different crystal grain widths, and after the position adjustment is finished, the set screws of the guide rail clamp 44 are screwed down to fix the split positions.

Referring to fig. 3, the wafer pressing mechanism 5 includes a buffer bracket 51, and the buffer bracket 51 is fixed on the punch support 41 by screws, and the position of the buffer bracket can be adjusted by the punch position adjusting device 4. The buffer holder 51 is provided with a punch 52, and the punch 52 is used for punching the wafer.

The bottom end of the buffer bracket 51 is provided with a pressing head 54, and the periphery of the pressing head 54 is sleeved with a rectangular spring 55. The lock nut 53 can be screwed on the threaded rod of the pressing head 54, the pressing head 54 and the buffer bracket 51 can move relatively, and the rectangular spring 55 between the pressing head 54 and the buffer bracket provides spring force to form a buffer structure.

Referring to fig. 3 and 7, the wafer pressing mechanism 5 is driven by the cylinder pressing device 3 to move up and down, and the head of the pressing head 54 is first contacted with the die. The buffer bracket 51 and the punch 52 continue to move downwards, and the pressing force of the pressing head 54 on the wafer is continuously increased under the action of the rectangular spring 55, so that the wafer is firmly fixed. The punch 52, which continues to move downwardly, now contacts the individual die that is extended, cleaves it from the wafer and the die is ejected from the wafer.

Referring to fig. 4, the wafer guiding device 6 includes a wafer guiding carrier 61, and two waist-shaped grooves are symmetrically formed at the bottom of the wafer guiding carrier 61. The adjusting plates 62 are respectively connected to the left and right sides of the wafer guide stage 61 through waist grooves, and the adjusting plates 62 are movable left and right on the wafer guide stage 61. The two adjusting plates 62 and the two side plates of the wafer guide carrier 61 form two guide grooves, and the width of the guide grooves can be controlled by adjusting the positions of the adjusting plates 62 so as to adapt to wafers with different widths.

The set screw is installed at the end of the adjusting plate 62, and the adjusting plate 62 can be fixed after the position adjustment is completed. The side walls of the wafer guide carrier 61 and the adjusting plate 62 are embedded with a rotary column 63 through a slot, and nylon balls are sleeved on the periphery of the rotary column 63. When the wafer moves in the guide groove, the nylon balls can contact with the wafer side wall for guiding and preventing the wafer side wall from being scratched.

Referring to fig. 5 and 7, the wafer support table 7 includes a base 71, and the base 71 is mounted on the apparatus main body frame 1 by screws. A floating stage 73 and a circular hold-down spring 72 are fitted in the base 71, and the wafer support stage 7 is for supporting a wafer.

When the die separation process is performed to the tail section, since the die separated from the front section is adhered to the blue film, the tail section is carried away with the unseparated wafer under the action of gravity, and the floating platform 73 is used for supporting the die separated from the front section and sinking along with the die under the action of the circular compression spring 72 when the die is punched, so that the normal punching process is ensured.

The wafer conveying device 8 comprises a linear module 81, the linear module 81 is arranged on a module support 82, and the module support 82 is fixed on the equipment main body frame 1. The screw rod 23 of the linear module 81 is connected with a motor shaft of a stepping motor 87 through a coupler 85, and the stepping motor 87 is fixed at the end part of the linear module 81 through a flange 86. A pusher block 83 is fixed to the slider of the linear module 81, a wafer pusher 84 is fixedly mounted to the pusher block 83, and the wafer pusher 84 is movable in a groove formed in the wafer guide stage 61.

The electric control part drives the screw rod 23 of the linear module 81 to rotate by controlling the rotation of the stepping motor 87, so as to control the push rod sliding block 83 to perform linear motion, the push rod sliding block 83 contacts with the strip-shaped wafer, and the accuracy of the motion speed and the position in the process of pushing the wafer by the wafer push rod 84 is further ensured.

Working principle: when the strip-shaped wafer is subjected to splitting processing to obtain the required crystal grains, the film pasting side of the strip-shaped wafer with the surface pasted with the blue film is downwards, the non-film pasting side is upwards, and the strip-shaped wafer is placed in a guide groove in the middle of the wafer guide carrier 61. The guide slot width is adjusted by manually moving the adjustment plate 62 according to the wafer width to constrain the movement of the wafer within the guide slot.

The wafer transport device 8 provides intermittent advance of the strip wafers. By controlling the pulse signal and the running time of the stepping motor 87, the stepping motor 87 intermittently rotates, and the screw rod 23 of the linear module 81 is driven to rotate through the coupler 85, so that the push rod sliding block 83 fixedly connected with the sliding block of the linear module 81 intermittently moves forward. The wafer pushing rod 84 is mounted on the pushing rod slider 83, and the wafer pushing rod 84 can push the strip wafer to intermittently move forward in the guide groove through the waist-shaped groove formed at the bottom of the wafer guide carrier 61.

The cylinder pressing device 3 performs a downward pressing operation in an intermittent stationary state of the strip-shaped wafer. The double cylinder 32 is controlled to extend out through an electromagnetic valve 34, and the wafer punching pressing mechanism 5 is connected with the double cylinder 32 through a punch position adjusting device 4.

In the punching process, the bottom end of the pressing head 54 of the die-punching pressing mechanism 5 is first brought into contact with the surface of the strip die, which is not adhered with the film. Upon further downward movement, the buffer bracket 51 compresses the rectangular spring 55, and the buffer bracket 51 and the pressing head 54 constitute relative movement. At this time, the pressing head 54 presses the strip-shaped wafer under the action of the spring force, so that the strip-shaped wafer is fixed. The punch 52 contacts the die at the end of the strip-shaped wafer to perform a clicking action to drop the die from the strip-shaped wafer. The floating platform 73 of the wafer supporting platform 7 will sink along with the punched crystal grains, so as to ensure that the crystal grains fall off on the wafer smoothly.

After the stamping operation is completed, the duplex air cylinder 32 is retracted under the control of the electromagnetic valve 34, the wafer stamping and pressing mechanism 5 is lifted back to leave the surface of the wafer, and the floating platform 73 is restored to the original state under the action of the circular pressing spring 72, so that the fallen crystal grains and the residual wafer keep the same level under the adhesion of blue film.

Then the wafer conveying device 8 continues to advance the wafer, each advancing stroke is the width of one crystal grain, and the next splitting action cycle is entered, so that each cycle process only carries out splitting action on one crystal grain on the wafer, all crystal grains on the wafer can be ensured to be separated independently, and the adjacent crystal grains are free from edge breakage and edge connection caused by collision and extrusion.

The technical problems, technical solutions and advantageous effects solved by the present utility model have been further described in detail in the above-described embodiments, and it should be understood that the above-described embodiments are only illustrative of the present utility model and are not intended to limit the present utility model, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present utility model should be included in the scope of protection of the present utility model.

Claims (8)

1. The stamping strip-shaped wafer splitting machine comprises an equipment main body frame (1), and is characterized in that a lifting mechanism (2) and a cylinder stamping device (3) are arranged on the equipment main body frame (1), the lifting mechanism (2) is fixedly connected with the equipment main body frame (1), the cylinder stamping device (3) is fixed on the lifting mechanism (2), the lifting mechanism (2) is used for adjusting the height of the cylinder stamping device (3) so as to adjust the stamping distance of the cylinder stamping device (3), the lower end of the cylinder stamping device (3) is provided with a stamping device position adjusting device (4) and a wafer stamping pressing mechanism (5), the stamping device position adjusting device (4) is used for adjusting the front and back positions of the wafer stamping pressing mechanism (5) so as to enable the wafer stamping pressing mechanism (5) to adapt to the wafer size, the wafer stamping pressing mechanism (5) is used for pressing wafers so as to process the wafers, a wafer guide device (6), a wafer supporting table (7) and a wafer conveying device (8) are arranged on the equipment main body frame (1), the wafer supporting table (7) is arranged below the wafer supporting table (7) and is used for supporting the wafer supporting table (7), the wafer conveying device (8) is positioned below the wafer guiding device (6), the wafer conveying device (8) is used for pushing the wafer to move, and the wafer guiding device (6) is used for guiding the moving direction of the wafer so that the wafer can enter the wafer supporting table (7).

2. The stamping strip-shaped wafer splitting machine according to claim 1, wherein the lifting mechanism (2) comprises a rotating hand wheel (21), a lifting base (22), a screw rod (23) sliding table and a guide rail sliding block (25), the rotating hand wheel (21) is installed on the lifting base (22), the lifting base (22) is fixedly installed on the equipment main body frame (1) through bolts, the rotating hand wheel (21) is fixedly connected with the top end of the screw rod (23), the rotating hand wheel (21) is used for driving the screw rod (23) to rotate, the screw rod (23) sliding table is in threaded connection with the screw rod (23), the screw rod (23) is used for driving the screw rod (23) sliding table to perform lifting movement, the guide rail sliding block (25) is fixedly connected with the equipment main body frame (1), and the screw rod (23) sliding table is in sliding connection with one side of the guide rail sliding block (25).

3. The stamping strip-shaped wafer splitting machine according to claim 2, wherein the cylinder stamping device (3) comprises a cylinder support frame (31), a duplex cylinder (32), a speed regulating valve (33) and an electromagnetic valve (34), the cylinder support frame (31) is fixedly connected with a screw rod (23) sliding table, the screw rod (23) sliding table is used for adjusting the height of the cylinder support frame (31), the duplex cylinder (32) is fixed on the cylinder support frame (31), the duplex cylinder (32) is connected with the speed regulating valve (33) through an air pipe, the speed regulating valve (33) is used for adjusting the running speed of the duplex cylinder (32), the duplex cylinder (32) is connected with the electromagnetic valve (34) through an air pipe, and the electromagnetic valve (34) is used for controlling the running action of the duplex cylinder (32).

4. A stamping strip wafer splitting machine according to claim 3, characterized in that the stamping device position adjusting device (4) comprises a stamping device supporting table (41), the upper end surface of the stamping device supporting table (41) is fixedly connected with the output shaft of the duplex cylinder (32), a small guide rail (42) is fixedly arranged on the lower end surface of the stamping device supporting table (41), a small guide rail sliding block (43) and a guide rail clamp (44) are arranged on the small guide rail (42), a stamping clamp bracket (45) is fixedly arranged at the lower end of the small guide rail sliding block (43), the guide rail clamp (44) is fixed on the stamping clamp bracket (45), and the guide rail clamp (44) is used for fixing the positions of the small guide rail sliding block (43) and the stamping clamp bracket (45).

5. The stamping strip-shaped wafer splitting machine according to claim 4, wherein the wafer stamping pressing mechanism (5) comprises a buffering support (51), the upper end of the buffering support (51) is fixedly connected with a stamping device supporting table (41), a stamping head (52) is installed on the buffering support (51), a pressing head (54) is installed at the bottom end of the buffering support (51), a rectangular spring (55) is sleeved on the periphery of the pressing head (54), and the rectangular spring (55) is used for buffering pressure on a wafer.

6. The stamping strip-shaped wafer splitting machine according to claim 5, wherein the wafer supporting table (7) comprises a base table (71), the base table (71) is fixedly connected with the equipment main body frame (1), a floating table (73) is arranged on the upper end face of the base table (71), the floating table (73) is slidably connected with the base table (71), a circular compression spring (72) is arranged in the base table (71), the circular compression spring (72) is placed in a groove of the base table (71), the circular compression spring (72) is sleeved on a peripheral cylinder of the floating table (73), the floating table (73) is used for supporting a wafer, and the circular compression spring (72) is used for supporting the floating table (73).

7. The stamping strip-shaped wafer splitting machine according to claim 6, wherein the wafer guiding device (6) comprises a wafer guiding carrying platform (61), an adjusting plate (62) and a set screw, two waist-shaped grooves are symmetrically formed in the bottom of the wafer guiding carrying platform (61), the adjusting plate (62) is inserted into the waist-shaped grooves and fixed on two sides of the wafer guiding carrying platform (61) through the waist-shaped grooves, the adjusting plate (62) is in sliding connection with the wafer guiding carrying platform (61), two side plates are fixedly arranged on the wafer guiding carrying platform (61), a guiding groove is formed between the adjusting plate (62) and the side plates, the adjusting plate (62) is used for adjusting the width of the guiding groove, the set screw is located at the end of the adjusting plate (62), the set screw is used for fixing the adjusting plate (62), grooves are formed in the adjusting plate (62) and the side plates, rotating columns (63) are embedded in the grooves, and nylon balls are sleeved on the rotating columns (63) and are used for protecting wafers.

8. The stamping strip wafer splitting machine according to claim 7, wherein the wafer conveying device (8) comprises a linear module (81) and a module support (82), the linear module (81) is installed on the module support (82), the module support (82) is fixedly connected with the equipment main body frame (1), a screw rod (23) is arranged in the linear module (81), a stepping motor (87) is arranged at one end of the linear module (81), a flange (86) is arranged on the stepping motor (87), the stepping motor (87) is connected with the linear module (81) through the flange (86), a shaft coupling (85) is connected to an output shaft of the stepping motor (87), one end of the screw rod (23) is fixedly connected with the shaft coupling (85), a push rod sliding block (83) is arranged in the linear module (81), the push rod sliding block (83) is in threaded connection with the screw rod (23), a wafer push rod (84) is fixedly arranged on the push rod sliding block (83), a push groove is formed in the wafer guide carrier (61), and the push rod (84) is connected with the push rod sliding groove.

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