CN218018819U

CN218018819U - A slitter that is used for clear mould of semiconductor plastic envelope mould to glue

Info

Publication number: CN218018819U
Application number: CN202123317275.2U
Authority: CN
Inventors: 刘德强
Original assignee: Shenzhen Shengyuan Semiconductors Co ltd
Current assignee: Shenzhen Shengyuan Semiconductors Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-12-13
Anticipated expiration: 2031-12-27

Abstract

The application relates to a slitter for die cleaning glue of a semiconductor plastic package die, which comprises a rack, a feeding mechanism for sending out the die cleaning glue and a cutting mechanism for receiving the die cleaning glue sent out by the feeding mechanism, wherein the feeding mechanism and the cutting mechanism are arranged on the rack, the feeding mechanism is in a feeding state and a stopping state, the cutting mechanism is in a cutting state and a static state, when the cutting mechanism is in the cutting state, the feeding mechanism is in the stopping state, and when the cutting mechanism is in the static state, the feeding mechanism is in the feeding state; the feeding mechanism comprises a rotating roller and a feeding driving assembly, the rotating roller is used for conveying the mold cleaning glue into the cutting mechanism, the feeding driving assembly is used for driving the rotating roller to rotate, and the rotating roller is rotatably connected to the rack. This application has the effect that improves the cutting accuracy of slitter.

Description

A slitter that is used for clear mould of semiconductor plastic envelope mould to glue

Technical Field

The application relates to the technical field of cutting equipment, in particular to a slitter for removing mold compound of a semiconductor plastic package mold.

Background

The cutting machine is used for cutting and cutting sheets in various industries, does not need any die, is controlled by system software, directly cuts products, and can quickly cut according to received design drawings as long as corresponding parameters are set on an operation platform and corresponding instructions are transmitted to the cutting machine by a computer.

A clear mould glue slitter is one of cutting machines. The mold cleaning glue is a rubber synthetic material for cleaning molds, and is suitable for cleaning semiconductor molds. Clear mould is glued when production, needs set for different width according to different mould needs, cuts clear mould glue to make the clear mould glue after the cutting be applicable to different moulds. At present clear mould is glued and is cut strip machine, feeding mechanism will clear mould and glue and send into cutting mechanism, clear mould is glued and can produce between feeding mechanism and cutting mechanism and pile up the deformation to the adhesive tape length that cuts out differs, thereby influences the cutting accuracy.

Aiming at the related technologies, the defect that the cutting precision of the slitter is not high exists.

SUMMERY OF THE UTILITY MODEL

In order to improve the cutting precision of slitter, this application provides a slitter that is used for clear mould of semiconductor plastic envelope mould to glue.

The application provides a slitter for clear mould of semiconductor plastic envelope mould is glued adopts following technical scheme:

a slitter for semiconductor plastic envelope mould clear mould is glued, includes: the automatic die cleaning machine comprises a rack, a feeding mechanism used for sending out die cleaning glue and a cutting mechanism used for receiving the die cleaning glue sent out by the feeding mechanism, wherein the feeding mechanism and the cutting mechanism are arranged on the rack, the feeding mechanism has a feeding state and a stopping state, the cutting mechanism has a cutting state and a static state, when the cutting mechanism is in the cutting state, the feeding mechanism is in the stopping state, and when the cutting mechanism is in the static state, the feeding mechanism is in the feeding state; the feeding mechanism comprises a rotating roller and a feeding driving assembly, the rotating roller is used for conveying the mold cleaning glue into the cutting mechanism, the feeding driving assembly is used for driving the rotating roller to rotate, and the rotating roller is rotatably connected to the rack.

Through adopting above-mentioned technical scheme, pay-off drive assembly drive live-rollers rotates to make clear mould glue remove along with live-rollers's rotation, and send into the mechanism that cuts with clear mould glue. When cutting, one end of the mold cleaning glue is placed on the rotating roller, the feeding driving assembly drives the rotating roller to rotate, and when the rotating roller rotates, the mold cleaning glue is subjected to the friction force of the rotating roller, so that the mold cleaning glue moves to the cutting mechanism along with the rotation of the rotating roller; when the mold cleaning glue moves to the set cutting length, the feeding mechanism is in a stop state, the rotating roller stops rotating, the mold cleaning glue stops moving, and the cutting mechanism performs cutting motion so that the mold cleaning glue is cut. The cutting mechanism stops moving after finishing one cutting movement, and the next cutting movement is carried out after the rotating roller finishes feeding. The cutting mechanism and the rotating roller move alternately, so that the die cleaning glue cannot be accumulated between the cutting mechanism and the feeding mechanism to influence subsequent cutting, and the cutting precision of the die cleaning glue is improved.

Optionally, the feeding mechanism further comprises a driven roller matched with the rotating roller, a gap for the mold cleaning glue to pass through is formed between the rotating roller and the driven roller, the driven roller is rotatably connected to the rack, and the rotating direction of the driven roller is opposite to that of the rotating roller.

Through adopting above-mentioned technical scheme, during the feeding of feeding mechanism, pay-off drive assembly drive live-rollers rotates, and under the frictional action of live-rollers, clear mould is glued from the clearance process between live-rollers and the driven voller, and clear mould is glued and is removed to cutting mechanism direction, and the driven voller rotates under the frictional action of clear mould is glued. The driven roller is arranged, so that the mold cleaning glue can be clamped in a gap between the driven roller and the driven roller, the friction force borne by the mold cleaning glue is increased, the mold cleaning glue can stably move to the cutting mechanism along with the rotation of the rotating roller, the condition that the feeding mechanism cannot stably feed materials due to insufficient friction force is reduced, and the precision of subsequent cutting is improved; on the other hand, when cutting mechanism cuts, live-rollers and driven voller stop to rotate, and the one end of die cleaning glue is held in the clearance between live-rollers and driven voller and is difficult for removing to make cutting mechanism when doing the cutting motion, die cleaning glue is difficult for squinting, thereby further improves the accuracy of cutting.

Optionally, an adjusting assembly for adjusting the position of the driven roller is arranged on the frame.

Through adopting above-mentioned technical scheme, can adjust the position of driven voller in order to change the size in clearance between driven voller and the drive roll through adjusting part to the clear mould of messenger different thickness is glued and can both be passed through the clearance between live-rollers and the driven voller, thereby is convenient for feeding mechanism to carry the clear mould of different thickness and glues. In addition, the size of the friction force between the die cleaning glue and the rotating roller and the driven roller can be adjusted by changing the size of the gap, so that the driven roller and the rotating roller can clamp the die cleaning glue when the cutting mechanism performs cutting.

Optionally, the frame has a mounting platform, adjusting part includes two backup pads, two the backup pad set up respectively in mounting platform is on a parallel with feeding mechanism direction of delivery's both sides, two the backup pad is provided with the spout respectively, every all slide in the spout and be provided with the slider, the slider is provided with and is used for adjusting the adjusting bolt that the slider removed along the spout, the both ends of live-rollers rotate respectively and connect two sliders in two backup pads.

Through adopting above-mentioned technical scheme, when the clearance between live-rollers and the driven voller need be adjusted, twist adjusting bolt, make the slider remove along the spout to make the driven voller to the direction that is close to or keeps away from the live-rollers remove, thereby be convenient for adjust the size in clearance between live-rollers and the driven voller.

Optionally, the cutting mechanism includes a cutter, a cutter holder for mounting the cutter, and a cutting driving assembly for driving the cutter to perform a cutting motion, the cutter holder is slidably disposed on the frame along a cutting direction of the cutter, a receiving seat for receiving the cutter is fixedly disposed on the frame, the receiving seat is located on one side of a cutting edge of the cutter, and the cutting direction of the cutter is perpendicular to a conveying direction of the feeding mechanism; the cutting driving assembly comprises a cutting motor and an eccentric wheel, an output shaft of the cutting motor is fixedly connected with a shaft hole of the eccentric wheel, and the outer edge of the eccentric wheel is used for pushing the cutter rest to reciprocate along the cutting direction.

By adopting the technical scheme, when the output shaft of the cutting motor rotates, the eccentric wheel rotates along with the output shaft, and the outer edge of the eccentric wheel pushes the cutter rest to do reciprocating motion along the cutting direction, so that the cutter does cutting motion. The cutter completes one cutting motion when the eccentric wheel rotates for one circle. During cutting, the cutter moves towards the direction close to the bearing seat, the die cleaning glue is tightly pressed on the bearing seat by the cutting edge of the cutter, the die cleaning glue is cut off, and then the cutter moves towards the direction far away from the bearing seat, so that the cutter completes one-time cutting action. In the whole cutting process, the rotating direction of the output shaft of the cutting motor does not need to be changed, and the cutter can perform reciprocating cutting motion, so that the cutting of the die cleaning glue is facilitated.

Optionally, a support column for installing the tool rest is arranged on the rack, a guide groove for the tool rest to slide is formed in the support column, the guide groove is formed in the moving direction of the cutter, and a baffle for limiting the tool rest to slide is arranged at the end of the support column.

Through adopting above-mentioned technical scheme, when the knife rest carries out reciprocating motion under the drive of eccentric wheel, the knife rest moves to baffle department, and the baffle can restrict the knife rest and slide, makes the knife rest difficult deviate from the guide way. In addition, the baffle can also reduce the movement of the tool rest caused by inertia, so that the tool rest can stop moving quickly.

Optionally, the rack is provided with a base plate, the base plate is located on one side of the bearing seat far away from the cutter, when the cutter performs cutting action, the cutter holder slides to be in contact with the base plate, and a cushion pad used for being in contact with the cutter holder is arranged on one side of the base plate close to the cutter holder.

Through adopting above-mentioned technical scheme, can produce the striking to the frame contact when the knife rest slides, the setting of blotter can reduce the impact force of knife rest to the frame, reduces the wearing and tearing that produce because of the striking between knife rest and the frame, improves the life of frame and knife rest. In addition, the cushion pad can also reduce the vibration generated by the slitter during operation, thereby reducing the noise.

Optionally, the frame is provided with a discharging table, the discharging table is located on one side, away from the feeding mechanism, of the cutting mechanism, a collecting box is arranged on one side, away from the cutting mechanism, of the discharging table, and the discharging table is provided with a guide surface used for outputting the mold cleaning glue to the collecting box.

Through adopting above-mentioned technical scheme, when the clear mould after cutting is glued from cutting the mechanism output, clear mould is glued and can be removed to the collecting box along the spigot surface, makes clear mould glue be difficult for piling up and is cut the mechanism, and the follow-up cutting motion who cuts the mechanism of being convenient for also is convenient for cut the collection of back clear mould glue.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the feeding driving assembly drives the rotating roller to rotate, and when the rotating roller rotates, the mold cleaning glue is subjected to the friction force of the rotating roller, so that the mold cleaning glue moves to the cutting mechanism along with the rotation of the rotating roller; when the rotating roller stops rotating, the mold cleaning glue stops moving, and the cutting mechanism performs cutting motion so that the mold cleaning glue is cut; after the feeding mechanism carries out feeding action once, the cutting mechanism carries out cutting action once, so that the die cleaning glue cannot be accumulated between the cutting mechanism and the feeding mechanism to influence subsequent cutting, and the cutting precision of the die cleaning glue is improved.

2. Clear mould is glued and can be pressed from both sides tightly in the clearance from between live-rollers and the driven voller, and the frictional force that clear mould was glued increases, makes clear mould glue can steadily move to cutting mechanism along with the rotation of live-rollers, improves the precision that follow-up cut.

3. In the cutting process, the cutting motor drives the eccentric wheel to rotate so that the cutting knife performs cutting action repeatedly, the rotating direction of an output shaft of the cutting motor does not need to be changed, the cutting knife can perform reciprocating cutting motion, and therefore cutting of die cleaning glue is facilitated.

Drawings

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present application;

FIG. 2 is a schematic diagram illustrating a feeding mechanism according to an embodiment of the present application;

fig. 3 is a schematic mechanism diagram showing a cutting mechanism according to an embodiment of the present application;

description of the reference numerals:

1. a frame; 11. mounting a platform; 111. a feed end; 112. a discharge end; 113. an avoidance groove; 12. a side plate; 13. a support pillar; 131. a guide groove; 132. a baffle plate; 14. a substrate; 141. a cushion pad; 15. a discharging table; 151. a guide surface; 16. a collection box; 2. a feeding mechanism; 21. a rotating roller; 22. a driven roller; 23. a feed drive assembly; 231. a driving wheel; 232. a driven wheel; 233. a belt; 234. a feeding stepping motor; 24. an adjustment assembly; 241. a support plate; 2411. a chute; 242. a slider; 243. a limiting plate; 244. adjusting the bolt; 3. a cutting mechanism; 31. a cutter; 32. a tool holder; 321. a cross bar; 322. a vertical rod; 323. abutting against the connecting rod; 324. a reinforcing rod; 325. an arc-shaped contact surface; 33. a bearing seat; 34. a cutting drive assembly; 341. an eccentric wheel; 342. cutting the motor; 4. and a control mechanism.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses a slitter that is used for clear mould of semiconductor plastic envelope mould to glue. Referring to fig. 1, a strip cutting machine for removing mold compound of a semiconductor plastic package mold comprises a rack 1, a feeding mechanism 2 and a cutting mechanism 3, wherein the feeding mechanism 2 has a feeding state and a stopping state, and the cutting mechanism 3 has a cutting state and a static state. When the cutting mechanism 3 is in a cutting state, the feeding mechanism 2 is in a stop state, and when the cutting mechanism 3 is in a static state, the feeding mechanism 2 is in a feeding state.

Referring to fig. 1 and 2, the frame 1 has a horizontally disposed mounting platform 11, the mounting platform 11 is substantially rectangular and has long sides and short sides, the two ends of the two short sides of the mounting platform 11 are a feeding end 111 and a discharging end 112, respectively, and the feeding mechanism 2 is mounted on the mounting platform 11. The feeding mechanism 2 comprises a rotating roller 21 for feeding the mold cleaning glue into the cutting mechanism 3, a driven roller 22 matched with the rotating roller 21 and a feeding driving assembly 23 for driving the rotating roller 21 to rotate, a gap for the mold cleaning glue to pass through is formed between the rotating roller 21 and the driven roller 22, and the rotating direction of the driven roller 22 is opposite to that of the rotating roller 21. The mounting platform 11 is provided with an avoiding groove 113, the avoiding groove 113 is substantially rectangular, the rotating roller 21 is located below the avoiding groove 113, and the driven roller 22 is located above the avoiding groove 113. The mounting platform 11 is provided with two side plates 12, the side plates 12 are substantially rectangular plate-shaped, and the two side plates 12 are respectively vertically arranged on two sides of two long edges of the mounting platform 11. Two ends of the rotating roller 21 are respectively arranged on the two side plates 12 in a penetrating way, and the length direction of the rotating roller 21 is vertical to the feeding direction of the feeding mechanism 2. The driven roller 22 is located above the rotating roller 21 and is parallel to the rotating roller 21.

Referring to fig. 1 and 2, the feeding driving assembly 23 is disposed on one of the side plates 12, and the feeding driving assembly 23 includes a driving wheel 231, a driven wheel 232, a belt 233 wrapped around the driving wheel 231 and the driven wheel 232, and a feeding stepping motor 234 for driving the driving wheel 231 to rotate. The feeding stepping motor 234 is located below the mounting platform 11, the feeding stepping motor 234 is arranged on one side of one of the side plates 12 close to the mounting platform 11, and an output shaft of the feeding stepping motor 234 is coaxially and fixedly connected with the driving wheel 231. The driving wheel 231 and the driven wheel 232 are located on one side of the side plate 12 where the feeding stepping motor 234 is located, which is far away from the mounting platform 11, and the rotating shaft of the rotating roller 21 is coaxially and fixedly connected with the driven wheel 232. When the feeding mechanism 2 is in the feeding state, the feeding stepping motor 234 drives the rotating roller 21 to rotate. The feed stepper motor 234 can set the feed length for a single drive to improve the accuracy of the die cleaning and cutting.

Referring to fig. 1 and 2, an adjusting assembly 24 for adjusting the position of the driven roller 22 is provided on the frame 1, and the adjusting assembly 24 includes two support plates 241, and the support plates 241 are arranged in a substantially rectangular plate shape. The two supporting plates 241 are respectively vertically arranged at the upper ends of the two side plates 12 close to the rotating rollers 21, and the mounting platform 11 is positioned between the two supporting plates 241. Two opposite surfaces of the two supporting plates 241 are respectively provided with a sliding groove 2411, the sliding grooves 2411 are perpendicular to the upper surface of the mounting platform 11, a sliding block 242 for adjusting the lifting of the driven roller 22 is arranged in the sliding grooves 2411, and two ends of the driven roller 22 are respectively rotatably connected with the sliding blocks 242 of the two supporting plates 241. A limiting plate 243 is fixedly arranged at the top of the sliding groove 2411, and the limiting plate 243 is arranged in parallel to the mounting platform 11. Each slider 242 is provided with an adjusting bolt 244 for adjusting the slider 242 to move along the sliding slot 2411. The adjusting bolt 244 vertically penetrates through the limiting plate 243 and is rotatably connected with the limiting plate 243, and one end of the adjusting bolt 244, which is far away from the head of the bolt, is in threaded connection with the top of the slider 242. When the adjusting bolt 244 is rotated, the slider 242 can move along the sliding groove 2411 in a direction approaching or separating from the rotating roller 21 to adjust the distance between the rotating roller 21 and the driven roller 22, so as to adjust the size of the gap, and thus, the mold cleaning glue with different thicknesses can pass through the gap between the rotating roller 21 and the driven roller 22.

When the feeding mechanism 2 is in the feeding state, the feeding stepping motor 234 drives the driving pulley 231 to rotate, and the driving pulley 231 drives the driven pulley 232 to rotate through the belt 233, so that the rotating roller 21 rotates. When the clear mould glue passes through from the clearance between live-rollers 21 and the driven voller 22, under the effect of frictional force, clear mould sticky tape moves driven voller 22 and rotates, clear mould glue by the centre gripping in the clearance between live-rollers 21 and driven voller 22 to make clear mould glue difficult emergence skew in transportation process position, improve the stability of pay-off, be convenient for subsequent cutting.

Referring to fig. 2 and 3, the cutting mechanism 3 is located at the discharging end 112 of the mounting platform 11 and is used for cutting the mold cleaning glue conveyed by the feeding mechanism 2. The cutting mechanism 3 includes a cutting blade 31, a blade holder 32 for mounting the cutting blade 31, and a cutting drive assembly 34 for driving the cutting blade 31 to perform a cutting motion. The knife rest 32 is vertically arranged on one side of the machine frame 1 close to the discharging end 112 of the mounting platform 11, and the knife rest 32 is arranged on the machine frame 1 in a sliding mode along the cutting direction. The tool holder 32 comprises two horizontal rods 321 and two vertical rods 322, wherein the two horizontal rods 321 and the two vertical rods 322 are connected end to end in a rectangular frame. The frame 1 is fixedly provided with a bearing seat 33 for bearing the cutter 31, the bearing seat 33 is horizontally arranged on one side of the cutting edge of the cutter 31, the cutting direction of the cutter 31 is perpendicular to the conveying direction of the feeding mechanism 2, in the embodiment, the cutting edge of the cutter 31 faces downwards, and when the cutter 31 performs cutting movement in the vertical direction, the cutting edge of the cutter 31 moves towards or away from the upper surface of the bearing seat 33.

Referring to fig. 2 and 3, the rack 1 includes two support columns 13 for mounting the tool post 32, and the two support columns 13 are vertically disposed. The base plate 14 is provided at the bottom of the frame 1, and the base plate 14 is provided in a substantially rectangular plate shape. Two support columns 13 are parallel to each other, the bottom end fixing of two support columns 13 sets up in the one side that the upper surface of base plate 14 is close to knife rest 32, and two relative faces of two support columns 13 are provided with respectively and supply the gliding guide way 131 of knife rest 32, and guide way 131 is vertical to be set up. The two vertical bars 322 of the tool holder 32 are slidably disposed in the guide grooves 131 of the two support pillars 13, respectively, the end of each support pillar 13 away from the base plate 14 is provided with a baffle 132 for limiting the sliding of the vertical bar 322, and the end of the guide groove 131 away from the base plate 14 is closed by the baffle 132 to prevent the vertical bar 322 of the tool holder 32 from falling out of the guide groove 131. The cutter 31 is fixedly attached to the cross bar 321 away from the base plate 14, and the cutter 31 performs a cutting motion when the tool holder 32 slides along the guide groove 131. When the cutting edge of the cutting blade 31 slides to contact the upper surface of the receiving seat 33, the cross bar 321 close to the substrate 14 contacts the supporting seat.

Referring to fig. 3, a plurality of buffering pads 141 are spaced apart from one side of the base plate 14 close to the tool holder 32, and the buffering pads 141 are made of a flexible material. When the cross bar 321 close to the substrate 14 slides towards the direction close to the substrate 14, the cushion pad 141 can reduce the impact of the support seat of the tool rest 32, reduce the vibration generated during the operation of the slitter, reduce the operating noise and prolong the service life of the slitter.

Referring to fig. 3, the cutting driving assembly 34 includes an eccentric 341 and a cutting motor 342 for driving the eccentric 341 to rotate, the cutting motor 342 is located below the mounting platform 11, and an output shaft of the cutting motor 342 is coaxially and fixedly connected with the eccentric 341. A butting rod 323 is arranged between the two vertical rods 322 of the tool holder 32, two ends of the butting rod 323 are respectively fixed on the two vertical rods 322, the butting rod 323 is arranged in parallel with the cross rod 321, and the butting rod 323 is located above the cross rod 321 close to the substrate 14. Two reinforcing rods 324 are further arranged between the abutting rod 323 and the cross rod 321 close to the supporting seat, and the reinforcing rods 324 are perpendicular to the abutting rod 323. The eccentric wheel 341 is substantially circular, the eccentric wheel 341 is located between the abutting rod 323 and the cross rod 321 close to the supporting seat, and the outer edge of the eccentric wheel 341 abuts against the abutting rod 323 and the cross rod 321 close to the supporting seat. The side of the abutting rod 323 contacting with the outer edge of the eccentric wheel 341 is provided with an arc-shaped contact surface 325, and the side of the cross rod 321 close to the supporting seat contacting with the outer edge of the eccentric wheel 341 is also provided with an arc-shaped contact surface 325. When the eccentric wheel 341 rotates, the outer edge of the eccentric wheel 341 abuts against the arc contact surface 325, and the outer edge of the eccentric wheel 341 pushes the cutter holder 32 to slide up and down along the guide groove 131, so that the cutter 31 slides up and down to complete the cutting action.

Referring to fig. 1, in order to facilitate the collection of the die cleaning glue after the cutting mechanism 3 cuts, the frame 1 is provided with a discharging table 15, the discharging table 15 is located on one side of the cutter 31 away from the rotating roller 21, and a collecting box 16 for collecting the die cleaning glue is arranged on one side of the discharging table 15 away from the cutter 31. In order to facilitate the mold cleaning glue to slide down to the collecting box 16, the discharging table 15 is provided with an inclined guide surface 151.

Referring to fig. 1, a control mechanism 4 for controlling the movement of the feeding mechanism 2 and the cutting mechanism 3 is further disposed on a side of the frame 1 away from the feeding driving assembly 23, and the control mechanism 4 is substantially a box. The control mechanism 4 is coupled to the feed stepper motor 234 and the cutting motor 342, respectively.

The implementation principle of the slitter for removing the mold compound of the semiconductor plastic package mold is as follows: mold cleaning glue is fed into a gap between the rotating roller 21 and the driven roller 22 from the feeding end 111 of the mounting platform 11, the control mechanism 4 controls the feeding driving assembly 23 to move, and the feeding driving assembly 23 drives the rotating roller 21 to rotate, so that the driven roller 22 rotates; under the friction action of the rotating roller 21 and the driven roller 22, the mold cleaning glue moves towards the cutting mechanism 3; when the mold cleaning glue moves to the bearing seat 33, the feeding mechanism 2 stops feeding, the cutting motor 342 drives the eccentric wheel 341 to rotate, so that the cutter frame 32 drives the cutter 31 to perform cutting motion, after the cutter 31 completes one cutting motion, the cutting motor 342 stops working, and the feeding mechanism 2 performs the next feeding. This application embodiment has reduced the influence that the accumulation that the clear mould glued produced cutting precision through feeding mechanism 2 with cut the cooperation of mechanism 3 to improve and cut the quality.

This detailed description is to be construed as exemplary only and is not intended to limit the scope of the disclosure in any way, wherein like elements are designated by like reference numerals. It should be noted that the words "upper" and "lower" used in the above description refer to directions in the drawings. Therefore, the method comprises the following steps: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a slitter that is used for clear mould of semiconductor plastic envelope mould to glue which characterized in that includes: the automatic die cleaning machine comprises a rack (1), a feeding mechanism (2) used for sending out die cleaning glue and a cutting mechanism (3) used for receiving the die cleaning glue sent out by the feeding mechanism (2), wherein the feeding mechanism (2) and the cutting mechanism (3) are arranged on the rack (1), the feeding mechanism (2) has a feeding state and a stopping state, the cutting mechanism (3) has a cutting state and a static state, when the cutting mechanism (3) is in the cutting state, the feeding mechanism (2) is in the stopping state, and when the cutting mechanism (3) is in the static state, the feeding mechanism (2) is in the feeding state; the feeding mechanism (2) comprises a rotating roller (21) used for conveying the mold cleaning glue into the cutting mechanism (3) and a feeding driving assembly (23) used for driving the rotating roller (21) to rotate, and the rotating roller (21) is rotatably connected to the rack (1).

2. The slitter for die cleaning glue of a semiconductor plastic package die as defined in claim 1, wherein the feeding mechanism (2) further comprises a driven roller (22) for cooperating with the rotating roller (21), a gap for the die cleaning glue to pass through is formed between the rotating roller (21) and the driven roller (22), the driven roller (22) is rotatably connected to the frame (1), and the rotating direction of the driven roller (22) is opposite to the rotating direction of the rotating roller (21).

3. The slitter for die cleaning glue of a semiconductor plastic package die according to claim 2, wherein an adjusting component (24) for adjusting the position of the driven roller (22) is arranged on the frame (1).

4. The slitter for die cleaning glue of a semiconductor plastic package die according to claim 3, wherein the frame (1) is provided with a mounting platform (11), the adjusting assembly (24) comprises two support plates (241), the two support plates (241) are respectively arranged at two sides of the mounting platform (11) parallel to the conveying direction of the feeding mechanism (2), the two support plates (241) are respectively provided with a sliding groove (2411), each sliding groove (2411) is provided with a sliding block (242) in a sliding manner, the sliding block (242) is provided with an adjusting bolt (244) for adjusting the sliding block (242) to move along the sliding groove (2411), and two ends of the rotating roller (21) are respectively connected with the two sliding blocks (242) in the two support plates (241) in a rotating manner.

5. The strip cutting machine for removing the mold compound of the semiconductor plastic package mold according to claim 1, wherein the cutting mechanism (3) comprises a cutter (31), a tool rest (32) for mounting the cutter (31), and a cutting driving assembly (34) for driving the cutter (31) to perform a cutting motion, the tool rest (32) is slidably disposed on the frame (1) along a cutting direction of the cutter (31), a receiving seat (33) for receiving the cutter (31) is fixedly disposed on the frame (1), the receiving seat (33) is located on one side of a cutting edge of the cutter (31), and the cutting direction of the cutter (31) is perpendicular to a conveying direction of the feeding mechanism (2); the cutting driving assembly (34) comprises a cutting motor (342) and an eccentric wheel (341), an output shaft of the cutting motor (342) is fixedly connected with a shaft hole of the eccentric wheel (341), and the outer edge of the eccentric wheel (341) is used for pushing the tool rest (32) to reciprocate along the cutting direction.

6. The slitter for removing the mold compound of the semiconductor plastic package mold according to claim 5, wherein a supporting column (13) for mounting the tool holder (32) is arranged on the frame (1), the supporting column (13) is provided with a guiding groove (131) for the tool holder (32) to slide, the guiding groove (131) is arranged along the moving direction of the cutter (31), and a baffle (132) for limiting the tool holder (32) to slide is arranged at the end of the supporting column (13).

7. The slitter for removing the mold cleaning glue of the semiconductor plastic package mold according to claim 6, wherein the frame (1) is provided with a base plate (14), the base plate (14) is positioned on one side of the bearing seat (33) far away from the cutter (31), the cutter holder (32) slides to be in contact with the base plate (14) when the cutter (31) performs a cutting action, and a buffer pad (141) for being in contact with the cutter holder (32) is arranged on one side of the base plate (14) close to the cutter holder (32).

8. The strip cutting machine for the mold cleaning glue of the semiconductor plastic package mold according to claim 1, characterized in that the rack (1) is provided with a discharging table (15), the discharging table (15) is located at one side of the cutting mechanism (3) far away from the feeding mechanism (2), one side of the discharging table (15) far away from the cutting mechanism (3) is provided with a collecting box (16), and the discharging table (15) is provided with a guide surface (151) for outputting the mold cleaning glue to the collecting box (16).