CN219286659U

CN219286659U - Phased array antenna based on step encapsulation

Info

Publication number: CN219286659U
Application number: CN202320158386.3U
Authority: CN
Inventors: 朱艾嵘; 高宏涛
Original assignee: Nanjing Panda Handa Technology Co Ltd
Current assignee: Nanjing Panda Handa Technology Co Ltd
Priority date: 2023-02-09
Filing date: 2023-02-09
Publication date: 2023-06-30
Anticipated expiration: 2033-02-09

Abstract

The utility model discloses a phased array antenna based on step packaging, which comprises a shell, an antenna housing, an antenna, a TR assembly module, a fan assembly, a guard antenna, a power module, a zeroing module and a lightning protection module, wherein the antenna is arranged on the shell; the TR assembly module is formed by fixedly mounting an upper cover plate, a lower cover plate and a PCB in the middle of the upper cover plate and the lower cover plate through a plurality of groups of screws; step and beveling are arranged at the circle of the upper cover plate and the lower cover plate, gold plating treatment is locally adopted for the aluminum alloy, and tin seal welding is carried out to seal the PCB; the antenna, the satellite antenna and the TR assembly module are connected with each other through the holes, the antenna connector is connected with the TR assembly module in a direct-connection manner, the sealing gasket is arranged on the contact surface of the SMP joint, the aluminum alloy is locally plated with gold in the holes, and tin sealing welding is carried out during installation to seal the TR assembly module in a circle around. The utility model improves the sealing performance, the heat dissipation performance, the reliability and the production efficiency of the phased array antenna.

Description

Phased array antenna based on step encapsulation

Technical Field

The utility model relates to the technical field of structural part design of satellite communication antennas, in particular to a phased array antenna based on step packaging.

Background

A phased array antenna refers to an antenna in which the pattern shape is changed by controlling the feed phase of radiating elements in the array antenna. The control phase can change the direction of the maximum value of the antenna pattern so as to achieve the purpose of beam scanning.

Because the application environment of the phased array antenna is complex and changeable, under the severe condition of the thermal environment, a fan needs to be installed on the shell of the phased array antenna, and a vent hole is formed to form an air channel, so that the antenna is in an airtight environment. However, when the antenna is subjected to a damp-heat test, the tightness of the equipment needs to be ensured, and as the TR component module and each antenna connector are directly connected in an opposite-plug manner and are limited by the structural size, the existing phased array antenna has the following problems: how to ensure the sealing of the opening at the joint of the antenna and the assembly and the tightness of the circumference of the TR assembly module.

Disclosure of Invention

The utility model aims to provide a phased array antenna based on a step type package, which can ensure tightness and heat dissipation simultaneously.

The technical solution for realizing the purpose of the utility model is as follows: a phased array antenna based on step packaging comprises an antenna housing, an antenna, a TR assembly module, a fan assembly, a satellite antenna, a shell, a power module, a zeroing module, a shell bottom plate and a bottom sealing plate;

the shell, the shell bottom plate and the antenna housing form a frame of the phased array antenna, the shell is a circumferential frame, the antenna housing is arranged at the top of the frame, and the shell bottom plate is arranged at the bottom of the frame; the side wall of the shell is provided with a hole, and the inner wall of the shell is provided with a fan assembly;

the antenna, the TR assembly module, the satellite antenna, the power module, the zeroing module and the antenna are sequentially arranged in the phased array antenna frame from top to bottom, and the lower surface of the shell bottom plate is provided with a bottom sealing plate;

the TR assembly module is formed by fixedly mounting an upper cover plate, a lower cover plate and a PCB in the middle of the upper cover plate and the lower cover plate through a plurality of groups of screws; step and beveling are arranged at the circle of the upper cover plate and the lower cover plate, gold plating treatment is locally adopted for the aluminum alloy, and tin seal welding is carried out to seal the PCB;

the antenna, the satellite antenna and the TR assembly module are connected with each other through the holes, the antenna connector is connected with the TR assembly module in a direct-connection manner, the sealing gasket is arranged on the contact surface of the SMP joint, the aluminum alloy is locally plated with gold in the holes, and tin sealing welding is carried out during installation to seal the TR assembly module in a circle around.

Further, a lightning protection module is arranged above the power module and the zeroing module.

Further, the upper cover plate of the TR assembly module has a size of 272mm x 2.5mm, the lower cover plate has a size of 182mm x 8.2mm, and the pcb has a size of 178.6mm x 2.4mm.

Further, steps are arranged at a circle of structural parts of an upper cover plate and a lower cover plate of the TR assembly module, wherein the side edge of the lower cover plate is a three-stage step, and the side edge of the upper cover plate is a one-stage step; a PCB is placed on the first-stage step of the lower cover plate, the thickness of the PCB is the same as the height of the second-stage step, and the range of the second-stage step is the same as the size of the PCB; the third step has the same height as the step of the upper cover plate, and the third step and the upper cover plate are matched with each other to seal the PCB; the side thickness of the upper cover plate is larger than the thickness of the second step of the side of the lower cover plate, so that the upper cover plate presses the PCB, and the PCB is fixed in a press-fit manner.

Further, the matching parts of the upper cover plate and the lower cover plate structural member are provided with a tolerance of 0.1mm, and chamfering is carried out at the outermost side.

Compared with the prior art, the utility model has the remarkable advantages that: (1) Each module is independent and universal, and can be independently designed, produced and transplanted, so that the reliability and the production efficiency of the product are improved, and the method is better suitable for the characteristics of small product batch and multiple types; (2) The sealing performance is good, the heat dissipation performance is high, and under the conditions of severe environment and limited size, the sealing performance of the product can be ensured, and the problems of damp heat and the like can be better solved.

Drawings

Fig. 1 is a schematic structural diagram of a phased array antenna based on step package according to the present utility model.

Fig. 2 is a schematic diagram of the explosive structure of the present utility model.

Fig. 3 is a schematic structural view of the TR assembly module in the present utility model.

Fig. 4 is a partial enlarged view of a coupling portion of an upper cover plate and a lower cover plate of the TR assembly module of the present utility model.

Fig. 5 is an enlarged view of a portion of the TR assembly module and antenna combining section in the present utility model.

Description of the embodiments

It is easy to understand that various embodiments of the present utility model can be envisioned by those of ordinary skill in the art without altering the true spirit of the present utility model in light of the present teachings. Accordingly, the following detailed description and drawings are merely illustrative of the utility model and are not intended to be exhaustive or to limit or restrict the utility model.

Various exemplary embodiments of the present utility model will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the utility model, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.

The utility model discloses a phased array antenna based on step packaging, which comprises an antenna housing 1, an antenna 2, a TR assembly module 3, a fan assembly 4, a satellite antenna 5, a shell 6, a power module 7, a zeroing module 8, a shell bottom plate 9 and a bottom sealing plate 10;

the shell 6, the shell bottom plate 9 and the radome 1 form a frame of the phased array antenna, the shell 6 is a circumferential frame, the radome 1 is arranged at the top of the frame, and the shell bottom plate 9 is arranged at the bottom of the frame; the side wall of the shell 6 is provided with a hole, and the inner wall is provided with a fan assembly 4;

the antenna 2, the TR assembly module 3, the satellite antenna 5, the power module 7, the zeroing module 8 and the antenna are sequentially arranged in the frame of the phased array antenna from top to bottom, and the lower surface of the shell bottom plate 9 is provided with a bottom sealing plate 10;

the TR assembly module 3 is formed by fixedly mounting an upper cover plate 3-1, a lower cover plate 3-2 and a PCB 3-3 in the middle of the upper cover plate and the lower cover plate through a plurality of groups of screws; steps are arranged at the circle of the upper cover plate 3-1 and the lower cover plate 3-2, beveling is carried out, gold plating treatment is locally adopted on the aluminum alloy, and tin seal welding is carried out to seal the PCB 3-3;

the antenna 2, the sanitary antenna 5 and the TR assembly module 3 are provided with holes at the joint, so that the antenna connector is connected with the TR assembly module 3 in a direct-connection manner through opposite insertion, a sealing gasket is arranged on the contact surface of the SMP joint, aluminum alloy is locally plated with gold in the holes, tin sealing welding is carried out during installation, and the TR assembly module 3 is sealed in a circle around.

As a specific embodiment, a lightning protection module is arranged above the power module 7 and the zeroing module 8.

The size of an upper cover plate 3-1 of the TR assembly module 3 is 272mm x 2.5mm, the size of a lower cover plate 3-2 is 182mm*182mm*8.2mm,PCB 3-3, and the size of the lower cover plate is 178.6mm x 2.4mm.

As a specific implementation manner, steps are arranged at a circle of structural members of an upper cover plate 3-1 and a lower cover plate 3-2 of the TR assembly module 3, wherein the side edge of the lower cover plate 3-2 is a three-level step, and the side edge of the upper cover plate 3-1 is a one-level step; the PCB 3-3 is placed on the first-stage step of the lower cover plate 3-2, the thickness of the PCB 3-3 is the same as the height of the second-stage step, and the range of the second-stage step is the same as the size of the PCB 3-3; the third step has the same height as the step of the upper cover plate 3-1, and the third step and the upper cover plate are matched with each other to seal the PCB 3-3; the side thickness of the upper cover plate 3-1 is larger than the thickness of the second step of the side of the lower cover plate 3-2, so that the upper cover plate 3-1 presses the PCB 3-3, and the PCB 3-3 is fixed by press-fitting.

As a specific embodiment, the matching parts of the structural members of the upper cover plate 3-1 and the lower cover plate 3-2 are provided with a tolerance of 0.1mm, and the outermost side is chamfered.

As a specific implementation mode, the SMP contact surface of the TR assembly module is provided with a sealing gasket, and the sealing gasket is used for enabling the upper cover plate of the TR assembly module to be fully pressed with the SMP in screw fastening assembly, so that the tightness of the assembly is ensured.

The utility model relates to a phased array antenna packaging method based on step packaging, which comprises the following steps:

step 1, designing the sizes of an upper cover plate and a lower cover plate according to the sizes of PCBs, and designing the sizes of the side steps of the upper cover plate and the side steps of the lower cover plate;

step 2, producing an upper cover plate and a lower cover plate according to the design size, and carrying out gold plating treatment on the step part;

step 3, mounting the TR assembly module;

and 4, soldering the joint between the upper cover plate and the lower cover plate, firmly welding the beveled part, and ensuring the tightness.

As a specific embodiment, the TR assembly module in step 3 is installed as follows:

firstly, the PCB is mounted on the lower cover plate, the PCB is completely placed in the first step of the side edge of the lower cover plate, then the upper cover plate is mounted on the PCB, and the first step of the side edge of the upper cover plate compresses the PCB and the lower cover plate.

The utility model will be described in further detail with reference to the drawings and the specific examples.

Examples

The phased array antenna based on step packaging in the embodiment is characterized in that the TR assembly module 3 is formed by fixedly mounting an upper cover plate 3-1, a lower cover plate 3-2 and an intermediate PCB 3-3 through a plurality of groups of screws, and a plurality of groups of antenna connectors are connected with the TR assembly module 3 in a direct-connection opposite-insertion mode.

The circumference of the box body of the TR assembly module 3 cannot adopt a sealing ring mode due to limited structural size, so that the box body cannot be completely sealed. Therefore, steps are designed and beveled at the round of structural parts of the upper cover plate 3-1 and the lower cover plate 3-2 of the TR assembly module 3, gold plating treatment is locally adopted on the aluminum alloy, and tin seal welding is carried out, so that the tightness of the aluminum alloy is ensured.

The antenna and the TR assembly module 3 are provided with holes at the joint, so that the connectors are directly connected in opposite insertion, a sealing pad is designed on the SMP contact surface, aluminum alloy is also locally plated with gold in the holes, and tin sealing welding is performed during installation, so that the tightness of the sealing pad is ensured.

As shown in fig. 1, a composition diagram of the phased array antenna based on the step package of the present embodiment is shown.

As shown in fig. 2, an exploded view of the phased array antenna based on the step package according to the present embodiment shows a method for installing components, including a radome 1, an antenna 2, a TR module 3, a fan assembly 4, a satellite antenna 5, a housing 6, a power module 7, a zeroing module 8, a housing bottom plate 9, a bottom sealing plate 10, and other structural members.

As shown in fig. 3, the upper cover plate 3-1 of the TR assembly module 3 is a thin plate with a size of 272mm x 2.5mm, the lower cover plate 3-2 is a housing with a size of 182mm x 8.2mm, and the size of the PCB 3-3 is 178.6mm x 2.4mm. The PCB 3-3 is embedded in the lower cover plate 3-2 of the TR component module 3, and under the requirement of guaranteeing that the unilateral tolerance of 0.2mm of the PCB 3-3 can be installed, the unilateral structural member of the lower cover plate 3-2 of the TR component module 3 is only 1.5mm in thickness, small in size distance and incapable of adopting a sealing ring mode, so that the peripheral edges can not be completely sealed although a plurality of groups of screw holes are fixedly installed.

As shown in fig. 4, steps are designed at a circle of structural members of the upper cover plate 3-1 and the lower cover plate 3-2 of the TR assembly module 3, so that the upper cover plate 3-1 presses the PCB 3-3, a tolerance of 0.1mm is designed at a matching part of the two structural members, and chamfering is performed at the outermost side. Not all materials can be soldered to achieve a connection, only a portion of the metal has better solderability. Therefore, the periphery of the structural member aluminum alloy is partially subjected to gold plating treatment, and tin seal welding is carried out, so that the tightness of the structural member aluminum alloy is ensured. The chamfer design is to prevent solder overflow.

As shown in fig. 5, the multiple sets of antenna connectors SMP and TR assembly modules 3 are directly connected by inserting the multiple sets of antenna connectors into the multiple sets of antenna connectors through the holes, and the size of the holes in the structural members is always larger than the outermost diameter of the SMP due to the tolerance of assembly, so that the structural members cannot be completely sealed. The sealing gasket is designed on the SMP contact surface at the bottom TR assembly module 3, so that the upper cover plate 3-1 of the TR assembly module 3 can be fully pressed with the SMP in screw fastening assembly. And the aluminum alloy is also subjected to local gold plating treatment in the hole, and the tin seal welding operation is performed during installation, so that the tightness of the aluminum alloy is ensured.

It should be appreciated that in the above description of exemplary embodiments of the utility model, various features of the utility model are sometimes described in the context of a single embodiment or with reference to a single figure in order to streamline the utility model and aid those skilled in the art in understanding the various aspects of the utility model. The present utility model should not, however, be construed as including features that are essential to the patent claims in the exemplary embodiments.

Claims

1. The phased array antenna based on the step type packaging is characterized by comprising an antenna housing (1), an antenna (2), a TR assembly module (3), a fan assembly (4), a satellite antenna (5), a shell (6), a power module (7), a zeroing module (8), a shell bottom plate (9) and a bottom sealing plate (10);

the phased array antenna comprises a shell (6), a shell bottom plate (9) and an antenna housing (1), wherein the shell (6) is a circumferential frame, the antenna housing (1) is arranged at the top of the frame, and the shell bottom plate (9) is arranged at the bottom of the frame; the side wall of the shell (6) is provided with a hole, and the inner wall is provided with a fan assembly (4);

the antenna (2), the TR assembly module (3), the satellite antenna (5), the power module (7), the zeroing module (8) and the antenna are sequentially arranged inside a frame of the phased array antenna from top to bottom, and a bottom sealing plate (10) is arranged on the lower surface of a shell bottom plate (9);

the TR assembly module (3) is formed by fixedly installing an upper cover plate (3-1), a lower cover plate (3-2) and a PCB (3-3) in the middle of the upper cover plate and the lower cover plate through a plurality of groups of screws; a step is arranged at one circle of the upper cover plate (3-1) and the lower cover plate (3-2) and is chamfered, gold plating treatment is locally adopted for the aluminum alloy, and tin seal welding is carried out to seal the PCB (3-3);

the antenna (2), the satellite antenna (5) and the TR assembly module (3) are provided with holes at the joint, so that the antenna connector is connected with the TR assembly module (3) in a direct-connection manner, a sealing pad is arranged on the contact surface of the SMP joint, local gold plating is carried out on aluminum alloy in the holes, tin sealing welding is carried out during installation, and the TR assembly module (3) is sealed in a circle around.

2. The phased array antenna based on step package according to claim 1, characterized in that a lightning protection module is arranged above the power module (7) and the zeroing module (8).

3. The phased array antenna of claim 1, wherein the TR assembly module (3) has an upper cover (3-1) dimension of 272mm x 2.5mm, a lower cover (3-2) dimension of 182mm x 8.2mm, and a pcb (3-3) dimension of 178.6mm x 2.4mm.

4. The phased array antenna based on step packaging according to claim 1, wherein steps are arranged at a circle of structural members of an upper cover plate (3-1) and a lower cover plate (3-2) of the TR assembly module (3), wherein the side edge of the lower cover plate (3-2) is a three-level step, and the side edge of the upper cover plate (3-1) is a one-level step; the PCB (3-3) is placed on the first-stage step of the lower cover plate (3-2), the thickness of the PCB (3-3) is the same as the height of the second-stage step, and the range of the second-stage step is the same as the size of the PCB (3-3); the third step has the same height as the step of the upper cover plate (3-1), and the third step and the upper cover plate are matched with each other to seal the PCB (3-3); the side thickness of the upper cover plate (3-1) is larger than the thickness of the second step of the side of the lower cover plate (3-2), so that the upper cover plate (3-1) presses the PCB (3-3), and the PCB (3-3) is fixed by press fitting.

5. A phased array antenna based on step package according to claim 1, characterized in that the upper cover plate (3-1) and lower cover plate (3-2) structural member mating parts are provided with a 0.1mm tolerance and bevelled at the outermost side.