CN219286395U - Lead frame copper strip structure of optical coupler - Google Patents
Lead frame copper strip structure of optical coupler Download PDFInfo
- Publication number
- CN219286395U CN219286395U CN202223169949.3U CN202223169949U CN219286395U CN 219286395 U CN219286395 U CN 219286395U CN 202223169949 U CN202223169949 U CN 202223169949U CN 219286395 U CN219286395 U CN 219286395U
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- infrared
- photosensitive
- lead frame
- pins
- end lead
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 16
- 239000010949 copper Substances 0.000 title claims abstract description 16
- 230000003287 optical effect Effects 0.000 title claims abstract description 14
- 239000003292 glue Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000002699 waste material Substances 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The utility model provides a lead frame copper strip structure of an optical coupler, which comprises a strip body, wherein two sides of the strip body in the length direction are provided with strip edges, a plurality of lead frame unit columns which are arranged along the width direction of the strip body are connected between the two strip edges, the lead frame unit columns are uniformly arranged at intervals along the length direction of the strip body, each lead frame unit column comprises an infrared frame unit column and a photosensitive frame unit column which are arranged in parallel, and each infrared frame unit column is formed by connecting a plurality of infrared end lead frames along the width direction of the strip body. The infrared end lead frame and the photosensitive end lead frame are directly mutually connected with each other, when the infrared end lead frame and the photosensitive end lead frame are used, only the edges of the belt are needed to be cut, less waste is needed to be cut, the material utilization rate is improved, and the production cost is reduced.
Description
Technical Field
The utility model relates to the field of optical couplers, in particular to a lead frame copper strip structure of an optical coupler.
Background
An optocoupler is a device that transmits an electrical signal with light as a medium, and generally packages a light emitter (an infrared light emitting diode chip) and a light receiver (a photo-sensitive chip) in the same package. When the input end is powered on, the light emitter emits light, and the light receiver receives the light to generate photocurrent, which flows out from the output end, so that the electric-optical-electric conversion is realized. The lead frame is a key structural member for realizing the electric connection between the lead-out end of the internal circuit of the chip and the outer lead by means of bonding materials to form an electric loop, and plays a role of a bridge connected with an external wire, thereby being an important basic material in the electronic information industry.
Chinese patent CN102306648A discloses an optocoupler, its scheme is, the lead frame copper strips structure of optocoupler divide into infrared end lead frame and photosensitive end lead frame, the slide area plane of infrared end lead frame and photosensitive end lead frame is all perpendicular with the lead frame plane, infrared end lead frame installs infrared light emitting component, photosensitive end lead frame installs photosensitive element, infrared end lead frame and photosensitive end lead frame are fixed in the coplanar, and leave sufficient insulating distance, and photosensitive element just sets up to infrared light emitting component, infrared end lead frame and photosensitive end lead frame's slide area outside cladding an oval transparent colloid, infrared end lead frame, photosensitive end lead frame and transparent colloid parcel are a encapsulation outside the body. The infrared end lead frame and the photosensitive end lead frame are split, the pass band is required to be punched and cut out, if the infrared end lead frame and the photosensitive end lead frame are manufactured separately, the infrared end lead frame and the photosensitive end lead frame are required to be arranged oppositely and are connected with a chip, and then the transparent colloid is coated for mounting, so that the mounting mode is time-consuming and labor-consuming. In order to reduce the workload, the infrared end lead frame and the photosensitive end lead frame are generally placed in a rectangular frame (as shown in the attached drawings of the comparison application), four sides of the rectangular frame are cut out after the rectangular frame is directly provided with a chip, a large amount of waste materials are generated, and the four sides of the rectangular frame are directly cut out to cause lower utilization rate of the copper strips and higher production cost.
Disclosure of Invention
The utility model aims to provide a lead frame copper strip structure of an optical coupler, which can improve the material utilization rate of a copper strip and reduce the production cost.
The application provides the following technical scheme for realizing the technical purposes:
the utility model provides a lead frame copper strips structure of optical coupler, includes the area body, the both sides of area body length direction are the area limit, two be connected with a plurality of lead frame unit columns of arranging along area body width direction between the area limit, lead frame unit column is along the even interval arrangement of area body length direction, lead frame unit column is including parallel arrangement's infrared frame unit column and photosensitive frame unit column, infrared frame unit column is by a plurality of infrared end lead frames along the joining of strips body width direction constitutes, photosensitive frame unit column is by a plurality of photosensitive end lead frames along the joining of strips body width direction constitutes, infrared end lead frame and photosensitive end lead frame quantity the same and the relative arrangement of photosensitive end lead frame, same infrared end lead frame opposite on the lead frame unit column and photosensitive end lead frame's adjacent end are respectively and are the infrared base island and the photosensitive base island that are used for holding up the chip, same infrared end lead frame opposite on the lead frame unit column is the infrared end lead frame opposite on the photosensitive end lead frame unit column is the photosensitive end lead frame opposite the opposite end stitch that is used for the wiring respectively.
In the scheme, the infrared end lead frame and the photosensitive end lead frame are directly mutually connected with each other, when the infrared end lead frame and the photosensitive end lead frame are used, only the strip edges are needed to be cut off, redundant frame structures do not exist outside the infrared end lead frame and the photosensitive end lead frame, when the infrared end lead frame is used, the lead frame unit columns are cut off from the strip body, then the relative positions of the infrared end lead frame and the photosensitive end lead frame can be kept due to the fact that certain strip edges are reserved, at the moment, welding and packaging of chips are carried out, finished products after packaging are cut off from the lead frame unit columns to carry out next group packaging, waste materials needed to be cut in the process are less, the material utilization rate is improved, and the production cost is reduced.
Preferably, the infrared pins of the infrared end lead frame are arranged at intervals in the width direction of the belt body, the photosensitive pins of the photosensitive end lead frame are arranged at intervals in the width direction of the belt body, the infrared pins on the lead frame unit columns and the photosensitive pins on the adjacent lead frame unit columns are arranged in a staggered manner in the width direction of the belt body, and the infrared pins on the lead frame unit columns are inserted into gaps among the photosensitive pins of the adjacent lead frame unit columns.
Preferably, each infrared end lead frame comprises two infrared pins, the distance between two adjacent infrared pins on two adjacent infrared end lead frames is larger than the distance between two adjacent infrared pins on a single infrared end lead frame, the photosensitive end lead frame comprises two photosensitive pins, and the distance between two adjacent photosensitive pins on two adjacent photosensitive end lead frames is larger than the distance between two adjacent photosensitive pins on a single photosensitive end lead frame.
Preferably, the infrared base island is connected with the infrared pins through infrared pins, the photosensitive base island is connected with the photosensitive pins through photosensitive pins, infrared glue clamping holes are formed in the infrared pins, and photosensitive glue clamping holes are formed in the photosensitive pins.
Preferably, the infrared base island comprises two infrared joints connected with an infrared pin, a first straight section perpendicular to the infrared pin is formed between one infrared joint and the infrared pin, a first semicircular notch is formed in the other infrared joint, the photosensitive base island comprises two photosensitive joints connected with a photosensitive pin, a second straight section perpendicular to the photosensitive pin is formed between one photosensitive joint and the photosensitive pin, and a second semicircular notch is formed in the other photosensitive joint.
Preferably, a waist-shaped hole is formed on one end belt edge of the infrared frame unit row, and a round hole is formed on each of the two end belt edges of the photosensitive frame unit row.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is an enlarged view of portion B of FIG. 2;
reference numerals illustrate: 10. a belt edge; 11. a waist-shaped hole; 12. a round hole; 20. a lead frame cell column; 30. an infrared frame unit row; 40. a photosensitive frame cell column; 50. an infrared end lead frame; 51. an infrared base island; 52. an infrared pin; 53. an infrared pin; 54. an infrared glue clamping hole; 55. an infrared joint; 56. a first straight edge section; 57 a first semicircular notch; 60. a photosensitive end lead frame; 61. a photosensitive island; 62. a photosensitive pin; 63. a photosensitive stitch; 64. a photosensitive adhesive clamping hole; 65. a photosensitive joint; 66. a second straight edge section; 67. and a second semicircular notch.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the description of the present utility model, it should be noted that the terms "bottom," "outside," "front-to-back," and the like indicate an orientation or a positional relationship based on the orientation or the positional relationship shown in the state of use of the present application, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
The width direction of the belt body in the present application is the up-down direction in fig. 1, and the length direction of the belt body is the left-right direction in fig. 1.
The utility model provides a lead frame copper strips structure of optical coupler, includes the area body, the both sides of area body length direction are area limit 10, two be connected with between the area limit 10 along the area body width direction a plurality of lead frame unit columns 20 that arrange, lead frame unit column 20 is along the even interval arrangement of area body length direction, lead frame unit column 20 includes parallel arrangement's infrared frame unit column 30 and photosensitive frame unit column 40, infrared frame unit column 30 is formed by a plurality of infrared end lead frame 50 along the area body width direction links up, photosensitive frame unit column 40 is formed by a plurality of photosensitive end lead frame 60 along the area body width direction links up, infrared end lead frame 50 is the same and the relative arrangement of photosensitive end lead frame 60, same infrared end lead frame 50 and photosensitive end lead frame 60's adjacent end are respectively for supporting the infrared base island 51 and photosensitive end pin base 61 of chip, same infrared end lead frame 50 and photosensitive end lead frame 60's opposite end are respectively for infrared end island and photosensitive end 63 of photosensitive end lead frame 60.
In the above scheme, the infrared end lead frame 50 and the photosensitive end lead frame 60 are directly connected with each other, when in use, only the strip edge 10 is needed to be cut off, no redundant frame structure exists outside the infrared end lead frame 50 and the photosensitive end lead frame 60, when in use, the lead frame unit row 20 is cut off from the strip body, then the relative positions of the infrared end lead frame 50 and the photosensitive end lead frame 60 can be kept due to the fact that a certain strip edge 10 is reserved, at the moment, the chip is welded and packaged, then finished products after the packaging are cut off from the lead frame unit row 20 to carry out the next group of packaging, waste materials needed to be cut in the process are less, the material utilization rate is improved, and the production cost is reduced.
Further, the infrared pins 53 of the infrared end lead frame 50 are arranged at intervals in the width direction of the strip, the photosensitive pins 63 of the photosensitive end lead frame 60 are arranged at intervals in the width direction of the strip, the infrared pins 53 of the lead frame unit columns 20 and the photosensitive pins 63 of the adjacent lead frame unit columns 20 are arranged at intervals in the width direction of the strip, and the infrared pins 53 of the lead frame unit columns 20 are inserted into gaps between the photosensitive pins 63 of the adjacent lead frame unit columns 20. Therefore, waste materials at gaps among the pins can be used for cutting and stamping the other group of pins, so that the lead frames are compacter to arrange on the belt body, more lead frames can be formed on the belt body with the same length, the production cost is reduced, and materials are saved.
Further, each of the infrared end lead frames 50 includes two infrared pins 53, the distance between two adjacent infrared pins 53 on two adjacent infrared end lead frames 50 is larger than the distance between two adjacent infrared pins 53 on a single infrared end lead frame 50, the photosensitive end lead frame 60 includes two photosensitive pins 63, and the distance between two adjacent photosensitive pins 63 on two adjacent photosensitive end lead frames 60 is larger than the distance between two adjacent photosensitive pins 63 on a single photosensitive end lead frame 60. This ensures that the photosensitive pins 63 and the infrared pins 53 are arranged at regular intervals across the width of the tape body. Further, the infrared base island 51 is connected with the infrared pin 53 through the infrared pin 52, the photosensitive base island 61 is connected with the photosensitive pin 63 through the photosensitive pin 62, the infrared pin 52 is provided with the infrared glue clamping hole 54, and the photosensitive pin 62 is provided with the photosensitive glue clamping hole 64. Thus, when in injection molding, part of plastic parts are filled into the infrared glue clamping holes 54 and the photosensitive glue clamping holes 64 to form a cylindrical structure, and the cylindrical structure can be clamped with the infrared glue clamping holes 54 and the photosensitive glue clamping holes 64.
Further, the infrared base 51 includes two infrared joints 55 respectively connected to one infrared pin 53, a first straight section 56 perpendicular to the infrared pin 53 is formed between one infrared joint 55 and the infrared pin 52, a first semicircular notch 57 is formed on the other infrared joint 55, the photosensitive base 61 includes two photosensitive joints 65 respectively connected to one photosensitive pin 63, a second straight section 66 perpendicular to the photosensitive pin 63 is formed between one photosensitive joint 65 and the photosensitive pin 62, and a second semicircular notch 67 is formed on the other photosensitive joint 65. The lead frame and the chip therein need to be subjected to injection molding packaging treatment, pins of the lead frame are left outside the injection molding square and then bent, a pulling force is formed on the pins in the bending process to pull the pins, meanwhile, metal pieces and plastics are not tightly attached to each other, and pulling of the pins is transmitted to the pins. The straight edge section is perpendicular to the direction of the pulling force, so that the clamping force between the plastic piece and the straight edge section can be effectively utilized to overcome the pulling force instead of relying on the adhesive force between the plastic piece and the straight edge section, and the pin is prevented from dislocation. The semicircular notch has the same effect.
Further, a waist-shaped hole 11 is formed in the belt edge 10 at one end of the infrared frame unit row 30, and a round hole 12 is formed in the belt edge 10 at both ends of the photosensitive frame unit row 40. For distinguishing and positioning the infrared frame cell array 30 and the photosensitive frame cell array 40, since the infrared frame cell array 30 and the photosensitive frame cell array 40 are very similar and relatively small, the positions of the two and the two can be distinguished by the circular hole 12 and the waist-shaped hole 11.
Although the present disclosure is described above, the scope of protection of the present disclosure is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the disclosure, and these changes and modifications will fall within the scope of the utility model.
Claims (6)
1. A leadframe copper strap structure for an optical coupler, characterized by: the infrared light-sensitive device comprises a belt body, wherein two sides of the length direction of the belt body are provided with a belt edge (10), a plurality of lead frame unit columns (20) which are arranged along the width direction of the belt body are connected between the two belt edges (10), the lead frame unit columns (20) are uniformly arranged at intervals along the length direction of the belt body, each lead frame unit column (20) comprises an infrared frame unit column (30) and a photosensitive frame unit column (40) which are arranged in parallel, each infrared frame unit column (30) is formed by connecting a plurality of infrared end lead frames (50) along the width direction of the belt body, each photosensitive frame unit column (40) is formed by connecting a plurality of photosensitive end lead frames (60) along the width direction of the belt body, the infrared end lead frames (50) and the photosensitive end lead frames (60) are the same in number and are oppositely arranged, the adjacent ends of the infrared end lead frames (50) and the photosensitive end lead frames (60) which are opposite to each other on the lead frame unit column (20) are respectively used for supporting infrared base islands (51) and photosensitive base islands (61) of chips, and the infrared end lead frames (20) are respectively used for connecting the infrared end pins (53) and the opposite ends of the infrared end lead frames (20).
2. The leadframe copper strap structure of an optical coupler of claim 1, wherein: the infrared pins (53) of the infrared end lead frame (50) are arranged at intervals in the width direction of the belt body, the photosensitive pins (63) of the photosensitive end lead frame (60) are arranged at intervals in the width direction of the belt body, the infrared pins (53) of the lead frame unit columns (20) and the photosensitive pins (63) of the adjacent lead frame unit columns (20) are arranged in a staggered manner in the width direction of the belt body, and the infrared pins (53) of the lead frame unit columns (20) are inserted into gaps among the photosensitive pins (63) of the adjacent lead frame unit columns (20).
3. The leadframe copper strap structure of an optical coupler of claim 2, wherein: each infrared end lead frame (50) comprises two infrared pins (53), the distance between two adjacent infrared pins (53) on two adjacent infrared end lead frames (50) is larger than the distance between two adjacent infrared pins (53) on a single infrared end lead frame (50), each photosensitive end lead frame (60) comprises two photosensitive pins (63), and the distance between two adjacent photosensitive pins (63) on two adjacent photosensitive end lead frames (60) is larger than the distance between two adjacent photosensitive pins (63) on a single photosensitive end lead frame (60).
4. The leadframe copper strap structure of an optical coupler of claim 3, wherein: the infrared base island (51) is connected with the infrared pins (53) through the infrared pins (52), the photosensitive base island (61) is connected with the photosensitive pins (63) through the photosensitive pins (62), the infrared pins (52) are provided with infrared glue clamping holes (54), and the photosensitive pins (62) are provided with photosensitive glue clamping holes (64).
5. The leadframe copper strap structure of an optical coupler according to claim 3 or 4, wherein: the infrared base island (51) comprises two infrared joints (55) which are respectively connected with an infrared pin (53), a first straight edge section (56) perpendicular to the infrared pin (53) is formed between the infrared joint (55) and the infrared pin (52), a first semicircular notch (57) is formed in the infrared joint (55), the photosensitive base island (61) comprises two photosensitive joints (65) which are respectively connected with a photosensitive pin (63), a second straight edge section (66) perpendicular to the photosensitive pin (63) is formed between one photosensitive joint (65) and the photosensitive pin (62), and a second semicircular notch (67) is formed in the other photosensitive joint (65).
6. The leadframe copper strap structure of an optical coupler according to claim 1 or 2 or 3 or 4, wherein: one end belt edge (10) of the infrared frame unit row (30) is provided with a waist-shaped hole (11), and two ends belt edges (10) of the photosensitive frame unit row (40) are respectively provided with a round hole (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223169949.3U CN219286395U (en) | 2022-11-28 | 2022-11-28 | Lead frame copper strip structure of optical coupler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223169949.3U CN219286395U (en) | 2022-11-28 | 2022-11-28 | Lead frame copper strip structure of optical coupler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219286395U true CN219286395U (en) | 2023-06-30 |
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ID=86920592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223169949.3U Active CN219286395U (en) | 2022-11-28 | 2022-11-28 | Lead frame copper strip structure of optical coupler |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219286395U (en) |
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- 2022-11-28 CN CN202223169949.3U patent/CN219286395U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Lead frame copper strip structure of optocouplers Effective date of registration: 20231007 Granted publication date: 20230630 Pledgee: Ningbo Yinzhou Rural Commercial Bank Co.,Ltd. Zhonggongmiao Branch Pledgor: NINGBO DEZHOU PRECISION ELECTRONIC CO.,LTD. Registration number: Y2023330002221 |