CN219283915U - Semiconductor heat pump dehumidification drying module - Google Patents
Semiconductor heat pump dehumidification drying module Download PDFInfo
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- CN219283915U CN219283915U CN202223437709.7U CN202223437709U CN219283915U CN 219283915 U CN219283915 U CN 219283915U CN 202223437709 U CN202223437709 U CN 202223437709U CN 219283915 U CN219283915 U CN 219283915U
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The utility model provides a semiconductor heat pump dehumidification drying module, which comprises a semiconductor refrigerating sheet, a condensation heat exchanger and a heating heat exchanger; the semiconductor refrigerating sheet comprises a cold end and a hot end, wherein the cold end is connected with the condensation heat exchanger, and the hot end is connected with the heating heat exchanger; when the internal or external fan is started, the air flow sequentially flows through the condensate heat exchanger and the heating heat exchanger. Because the cold quantity of the cold end and the heat quantity of the hot end can be effectively utilized, and the heat quantity released by the condensed water on the condensed water heat exchanger is also utilized by the heating heat exchanger, the heat exchange efficiency is improved, and the dehumidifying and drying module can be applied to drying equipment such as a clothes care machine or a clothes airing machine, so that the time for drying clothes can be shortened, and the waste of resources is avoided.
Description
Technical Field
The utility model relates to the field of dehumidification and drying, in particular to a semiconductor heat pump dehumidification and drying module.
Background
Along with improvement of life quality and acceleration of life rhythm of people, more and more users can directly select corresponding dehumidifying and drying equipment under the condition that clothes are wet, such as a clothes care machine or a clothes airing machine, a drying module is generally arranged in a main machine of a clothes airing machine in terms of the current electric clothes airing machine, the drying module is in a mode that a fan is matched with a PTC heating module, air flow is conveyed by the fan and heated by the drying module, so that the air flow finally blown out from a drying device is accelerated hot air flow, and the clothes on a clothes airing rod are dried by the hot air flow.
However, the waste heat of work by this method is not fully utilized, and thus the energy utilization efficiency is low and the coefficient of heat generation is low. In addition, there is a heating mode, namely, a heat pump drying system is used, which utilizes the dehumidification capability of a heat pump to remove moisture in humid air, and a compressor type heat pump has high heating efficiency and has the dehumidification and drying functions, but has large volume and heavy weight, and is difficult to use on a clothes airing machine.
Accordingly, there is a need in the art for a new solution to the above-mentioned problems.
Disclosure of Invention
The utility model aims to solve the technical problems of overcoming the defects of the prior art, providing a semiconductor heat pump dehumidification drying module and solving the problems of low energy utilization efficiency and low heating coefficient of the existing dehumidification drying equipment, in particular to a clothes care machine or a clothes airing machine.
In order to solve the technical problems, the utility model adopts the basic conception of the technical scheme that:
the utility model aims to provide a semiconductor heat pump dehumidification drying module which comprises a semiconductor refrigerating sheet, a condensation heat exchanger and a heating heat exchanger; the semiconductor refrigerating sheet comprises a cold end and a hot end, wherein the cold end is connected with the condensation heat exchanger, and the hot end is connected with the heating heat exchanger; when the internal or external fan is started, the air flow sequentially flows through the condensate heat exchanger and the heating heat exchanger.
Preferably, the condensation heat exchanger and the heating heat exchanger are heat pipe heat exchangers, the condensation heat exchanger comprises a first pipeline, and the heating heat exchanger comprises a second pipeline; and the cold energy generated by the cold end is conveyed to a first pipeline of the condensate heat exchanger, and the heat generated by the hot end is conveyed to a second pipeline of the heating heat exchanger.
Preferably, the partial pipelines of the condensate heat exchanger and the heating heat exchanger are sleeved with fins.
Preferably, the condensate heat exchanger provided with the fin part, the heating heat exchanger provided with the fin part and the fan are all arranged in parallel.
Preferably, the condensation heat exchanger and the heating heat exchanger are arranged at the air inlet end of the fan.
Preferably, the condensate heat exchanger provided with the fin portion and the heating heat exchanger provided with the fin portion have an overlapping portion along the projection of the first direction, and the heating heat exchanger provided with the fin portion and the projection of the fan along the first direction overlap.
Preferably, the semiconductor refrigeration piece is fixed through a fixing buckle.
Preferably, the heating heat exchanger and the fan are mutually fixed through an end plate.
Preferably, a water receiving tray is arranged at the lower end of the condensate heat exchanger.
Preferably, the heating heat exchanger is further provided with a temperature sensor, and the temperature sensor is connected with the heating heat exchanger in a contact connection mode.
Compared with the prior art, the semiconductor heat pump dehumidification drying module provided by the utility model has the following beneficial effects:
the cold end and the hot end of the semiconductor refrigerating sheet are respectively connected with the condensate heat exchanger and the heating heat exchanger, cold energy and heat energy can be respectively and uniformly conveyed to a first pipeline of the condensate heat exchanger and a second pipeline of the heating heat exchanger, fins are arranged on part of pipelines on the condensate heat exchanger and the heating heat exchanger, and the heat exchange area of the condensate water on the surfaces of the cold end and the hot end of the semiconductor refrigerating sheet, the condensate water on the surfaces of the condensate heat exchanger and the fins is fully utilized by the semiconductor refrigerating sheet module, so that the heat exchange efficiency is improved; when the heat pump dehumidifying and drying module is applied to dehumidifying and drying equipment, such as a clothes care machine, a clothes airing machine and the like, the drying efficiency can be improved, the drying time is shortened, and resource waste is avoided.
The following describes the embodiments of the present utility model in further detail with reference to the accompanying drawings.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments of the present utility model will be briefly described below.
Fig. 1 is a schematic perspective view of a dehumidifying and drying module of a semiconductor heat pump according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a semiconductor heat pump dehumidification drying module in an embodiment of the utility model;
FIG. 3 is an enlarged view of area B in FIG. 2 according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of the working principle of the semiconductor refrigeration sheet in the embodiment of the utility model.
The reference numerals in the figures illustrate: 1-a semiconductor refrigeration piece; 2-a condensate heat exchanger; 3-heating a heat exchanger; 4-a fan; 5-cold end; 6-hot end; 7-fixing buckles; 8-a first pipeline; 9-a second pipeline; 10-end plates; 11-a water receiving disc; 12-temperature sensor.
Detailed Description
Embodiments of the present utility model are described below with reference to the drawings in the present utility model. It should be understood that the embodiments described below with reference to the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present utility model, and the technical solutions of the embodiments of the present utility model are not limited.
As shown in fig. 1, the solid arrow direction in the figure indicates the flow direction of the air flow;
as shown in fig. 2, the direction of the dashed arrow in the figure represents the first direction.
As shown in fig. 1-3, in this embodiment, a semiconductor heat pump dehumidification drying module is provided, which includes a semiconductor refrigeration sheet 1, a condensation heat exchanger 2 and a heating heat exchanger 3; the semiconductor refrigerating sheet 1 comprises a cold end 5 and a hot end 6, wherein the cold end 5 is connected with the condensation heat exchanger 2, and the hot end 6 is connected with the heating heat exchanger 3; when the internal or external fan 4 is started, the air flow sequentially passes through the condensate heat exchanger 2 and the heating heat exchanger 3. The air flow driven by the fan 4 firstly flows through the condensation heat exchanger 2, the air flow is cooled and dried, then flows through the heating heat exchanger 3, the air flow is heated, and finally the air flow is blown out from the air outlet.
As shown in the working schematic diagram of the semiconductor refrigerating sheet in fig. 4, the semiconductor refrigerating sheet 1, also called a thermoelectric refrigerating sheet, utilizes the Peltier effect of semiconductor materials, and when direct current passes through a couple formed by connecting two different semiconductor materials in series, the two ends of the couple can absorb heat and release heat respectively, so that the purpose of refrigeration can be realized. The refrigerating technology for producing negative thermal resistance features no moving parts and high reliability.
When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer is generated between two ends, and the heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end and a hot end. When the cold and hot ends reach a certain temperature difference, the two heat transfer amounts are equal, an equilibrium point is reached, the forward and reverse heat transfer amounts are offset, and in general, the temperature difference of the cold and hot ends of the semiconductor refrigerating sheet can reach 40-65 degrees, so when the water vapor is condensed on the condensation heat exchanger 2, the heat is released, and the heat can be transferred to the hot end 6 of the semiconductor refrigerating sheet 1, so that the heating efficiency is higher.
The condensate heat exchanger 2 and the heating heat exchanger 3 are heat pipe heat exchangers, the condensate heat exchanger 2 comprises a first pipeline 8, and the heating heat exchanger 3 comprises a second pipeline 9; the cold energy generated by the cold end 5 is transmitted to a first pipeline 8 of the condensate heat exchanger 2, and the heat energy generated by the hot end 6 is transmitted to a second pipeline 9 of the heating heat exchanger 3. The heat pipe is a heat transfer component with high heat conduction performance, and transfers heat through evaporation and condensation of working medium in the totally-enclosed vacuum tube shell, and has the advantages of extremely high heat conduction, good isothermicity, arbitrary change of heat transfer areas at the cold side and the hot side, long-distance heat transfer, temperature control and the like.
This also enables the cold of the cold end 5 to be conveyed uniformly to the first pipe 8 of the condensate heat exchanger 2; the heat of the warm end 6 is evenly transferred to the second pipe 9 of the heating heat exchanger 3. The area of the condensed water and the heating area is wider and uniform, and the phenomena of condensed water, poor heating effect and the like are avoided. Further, fins are sleeved on part of pipelines of the condensate heat exchanger 2 and the heating heat exchanger 3, so that the condensate and heating area is increased, and the fins can be arranged to extend along the air flow direction, so that the heat exchange efficiency is higher.
The fan 4 is respectively parallel to the condensate heat exchanger 2 provided with the fin parts and the heating heat exchanger 3 provided with the fin parts, and the fan 4 is arranged on one side of the heating heat exchanger 3 far away from the condensate heat exchanger 2. The fan 4 can adopt a through-flow fan, and the air flow of the fan 4 directly enters the fan 4 in the radial direction, so that the fan has the advantages of small volume, light weight, low noise, low power consumption, simplicity and convenience in installation and the like. The fan 4 provides power for the air flow, drives the air to flow to the condensation heat exchanger 2 and the heating heat exchanger 3 in sequence, and enables the air flow to condense water first and then heat. Wherein the heating heat exchanger 3 and the fan 4 are mutually fixed through an end plate 10.
In order to enlarge the heated area as much as possible and improve the dehumidification and drying efficiency, the condensation heat exchanger 2 and the heating heat exchanger 3 are arranged at the air inlet end of the fan 4; there is an overlapping portion of the condensate heat exchanger 2 provided with the fin portion and the projection of the heating heat exchanger 3 provided with the fin portion in the first direction, and the projection of the heating heat exchanger 3 provided with the fin portion and the fan 4 in the first direction overlaps.
Wherein, the semiconductor refrigeration piece 1 is fixed by a fixing buckle 7. In order to achieve the best effect, the semiconductor refrigerating sheet 1 can be fixed on one side of the fan 4 through the fixing buckle 7, so that the lengths of the unused condensate heat exchanger 2 and the unused heating heat exchanger 3 can be reduced, the cost is saved, and the cold and heat can be transferred more efficiently.
The lower extreme of the condensation heat exchanger 2 is provided with a water receiving disc 11, and when the water receiving disc 11 is used for receiving air flow and passes through the condensation heat exchanger 2, condensation is carried out on the pipeline and the fins of the condensation heat exchanger 2 to form water drops, and the water drops fall downwards under the action of gravity, so that other devices are prevented from being polluted or damped by the water drops. In addition, a certain water outlet or drain pipe can be arranged on the water receiving disc 11, which is beneficial to the concentrated discharge of water drops.
The heating heat exchanger 3 is further provided with a temperature sensor 12, and the temperature sensor 12 is connected to the heating heat exchanger 3 by a contact connection. The temperature sensor 12 can be selected from a sheet shape and attached to a pipeline or a fin of the heating heat exchanger 3, so that the temperature sensor is simple and convenient to install and easy to replace or disassemble; the temperature sensor 12 is used for monitoring the temperature of the heating heat exchanger 3, is also beneficial to better controlling the temperature of the air flow discharged by the heating heat exchanger 3, namely, the drying temperature, can also protect the heating heat exchanger 3 and the semiconductor refrigerating sheet 1, can also increase auxiliary heating devices such as heating wires, can be arranged on one side of the heating heat exchanger 3, increases the contact area between the heating wires and the air flow, is convenient for quick heating, has low heating wire cost, is convenient to replace, assemble and disassemble, can also be an infrared heater or an electromagnetic heater, and improves the drying efficiency.
In addition, the utility model can be applied to equipment for dehumidifying and drying, such as a clothes care machine, a clothes airing machine and the like.
The present utility model will be described in detail with reference to specific examples.
In the specific embodiment, the cross flow fan provides power for air to form air flow, the air flow firstly passes through the condensation heat exchanger 2 along the air channel, and the semiconductor refrigeration sheet 1 is further arranged on one side of the fan 4, because the condensation heat exchanger is a heat pipe heat exchanger, the cold energy of the cold end 5 of the semiconductor refrigeration sheet 1 can be uniformly transmitted to the first pipeline 8 of the condensation heat exchanger 2, and when the cold energy is transmitted to the upper air channel of the condensation heat exchanger 2, the air can be pre-dehumidified; when the cold energy is conveyed to the lower air duct of the condensate heat exchanger 2, the gas treated by the condensate heat exchanger 2 can be further dehumidified; in the embodiment, any treatment mode is adopted, and under the condition that the dehumidification amount of the condensate heat exchanger 2 is constant, the dryness of the gas flowing through the condensate heat exchanger 2 at the subsequent time can be improved, and the dehumidification effect is improved. The air flow passes through the condensation heat exchanger 2 and then passes through the heating heat exchanger 3, and the heating heat exchanger 3 is a heat pipe heat exchanger, so that the heat of the hot end 6 of the semiconductor refrigeration sheet 1 is transmitted to the heating heat exchanger 3 through the second pipeline 9. When the heat is transmitted to the heating heat exchanger 3 and the air duct is upward, the entering gas can be preheated; when the air duct of the heating heat exchanger 3 is downward, the temperature of the gas processed by the heating heat exchanger 3 can be further raised; under the condition that the heating amplitude of the heating heat exchanger 3 is constant, any treatment mode is adopted in the embodiment to raise the temperature of the finally-flowing air flow so as to shorten the drying time.
The cold end 5 of the semiconductor heat pump refrigerating sheet 1 can uniformly convey cold to the first pipeline 8 of the condensate heat exchanger 2, and in a specific embodiment, the cold end can extend from one end to the other end of the condensate heat exchanger 2 in the transverse, vertical or even diagonal directions, so as to more uniformly transfer the cold to the whole condensate heat exchanger 2. Similarly, the hot end 6 of the semiconductor heat pump cooling fin 1 can uniformly convey the cold to the second pipeline 9 of the heating heat exchanger 3, and specifically can extend from one end to the other end of the heating heat exchanger 3 in the transverse, vertical or even diagonal directions, so that the heat can be more uniformly transferred to the whole heating heat exchanger 3. In short, the extending directions of the first and second pipes 8 and 9 may be set so as to uniformly distribute the cooling capacity and the heat energy.
In addition, can also cover on the partial pipeline of congeal water heat exchanger 2 and heating heat exchanger 3 and establish the fin, the fin can set up at intervals, sets up the interval and the rule of arranging of fin according to the law of heat conduction, and the direction of extension is along the flow direction of air current, and the heat transfer area can be increased in the setting of fin, improves heat exchange efficiency.
The semiconductor refrigerating sheet 1 can be fixed by using the fixing buckle 7, the fixing buckle 7 can be made of a heat conducting material preferentially, and the semiconductor heat pump refrigerating sheet 1 is fixed on one side of the fan 4 through the fixing buckle 7.
The heat pump dehumidification drying module can further comprise more than one semiconductor refrigerating sheet 1, a large semiconductor refrigerating sheet assembly can be formed by a plurality of semiconductor refrigerating sheets 1, for example, grooves can be formed in the plurality of semiconductor refrigerating sheets 1 by using plates, the grooves are embedded in the plurality of semiconductor refrigerating sheets 1, and the plates have good heat conductivity.
The cold end 5 and the hot end 6 of the semiconductor refrigeration sheet 1 are respectively connected with the condensate heat exchanger 2 and the heating heat exchanger 3, cold and heat can be respectively and evenly conveyed to a first pipeline 8 of the condensate heat exchanger 2 and a second pipeline 9 of the heating heat exchanger 3, fins are arranged on part of pipelines on the condensate heat exchanger 2 and the heating heat exchanger 3, and the heat exchange area of the condensate water and the heat exchange area of the fins on the surfaces of the condensate heat exchanger 2 and the cold end 5 and the hot end 6 of the semiconductor refrigeration sheet 1 are fully utilized by the semiconductor refrigeration sheet; when the heat pump dehumidifying and drying module is applied to dehumidifying and drying equipment, such as a clothes care machine, a clothes airing machine and the like, the drying efficiency can be improved, the drying time is shortened, and resource waste is avoided; the temperature sensor 12 is also arranged to protect the semiconductor refrigerating sheet 1, so that the service life of the semiconductor refrigerating sheet 1 is prolonged, and resource waste is avoided.
In summary, not all aspects of the utility model are described: thereafter, any modifications, substitutions, upgrades, etc. made within the spirit of the inventive subject matter are included within the scope of the present utility model.
Claims (9)
1. The semiconductor heat pump dehumidification drying module is characterized by comprising a semiconductor refrigerating sheet, a condensation heat exchanger and a heating heat exchanger;
the semiconductor refrigerating sheet comprises a cold end and a hot end, wherein the cold end is connected with the condensation heat exchanger, and the hot end is connected with the heating heat exchanger;
when an internal or external fan is started, airflow sequentially flows through the condensate heat exchanger and the heating heat exchanger;
the fan is a through-flow fan;
the semiconductor refrigerating sheet is fixed on one side of the fan through a fixing buckle.
2. The semiconductor heat pump dehumidification drying module of claim 1, wherein the condensate heat exchanger and the heating heat exchanger are heat pipe heat exchangers, the condensate heat exchanger comprising a first pipeline, the heating heat exchanger comprising a second pipeline;
and the cold energy generated by the cold end is conveyed to a first pipeline of the condensate heat exchanger, and the heat generated by the hot end is conveyed to a second pipeline of the heating heat exchanger.
3. The semiconductor heat pump dehumidification drying module according to claim 2, wherein fins are sleeved on part of pipelines of the condensation heat exchanger and the heating heat exchanger.
4. A semiconductor heat pump dehumidification drying module according to claim 3, wherein the condensate heat exchanger provided with the fin portion, the heating heat exchanger provided with the fin portion and the blower fan are all disposed in parallel.
5. The semiconductor heat pump dehumidification drying module of claim 1, wherein the condensation heat exchanger and the heating heat exchanger are disposed at an air inlet end of the blower.
6. A semiconductor heat pump dehumidification drying module according to claim 3, wherein the condensate heat exchanger provided with a fin portion and the heating heat exchanger provided with a fin portion have an overlapping portion in a projection in a first direction, and the heating heat exchanger provided with a fin portion overlaps with a projection of the fan in the first direction.
7. The semiconductor heat pump dehumidification drying module of claim 1, wherein the heating heat exchanger and the blower are secured to each other by an end plate.
8. The semiconductor heat pump dehumidification drying module according to claim 1, wherein a water receiving tray is arranged at the lower end of the condensation heat exchanger.
9. The semiconductor heat pump dehumidification drying module according to claim 1, wherein a temperature sensor is further arranged on the heating heat exchanger, and the temperature sensor is connected with the heating heat exchanger in a contact connection mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223437709.7U CN219283915U (en) | 2022-12-21 | 2022-12-21 | Semiconductor heat pump dehumidification drying module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223437709.7U CN219283915U (en) | 2022-12-21 | 2022-12-21 | Semiconductor heat pump dehumidification drying module |
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| Publication Number | Publication Date |
|---|---|
| CN219283915U true CN219283915U (en) | 2023-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223437709.7U Active CN219283915U (en) | 2022-12-21 | 2022-12-21 | Semiconductor heat pump dehumidification drying module |
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| CN (1) | CN219283915U (en) |
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- 2022-12-21 CN CN202223437709.7U patent/CN219283915U/en active Active
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