CN217804230U - Dehumidification intensification structure, air conditioning box and vehicle - Google Patents

Abstract

The application provides dehumidification intensification structure, air conditioning box and vehicle, wherein dehumidification intensification structure includes: the semiconductor wafer comprises a plurality of cold sides and hot sides, the cold sides of the plurality of semiconductor wafers are connected through at least one cold fin, the hot sides of the plurality of semiconductor wafers are connected through at least one hot fin, and the semiconductor wafers can be electrically connected with an external power supply. The application provides a work of dehumidification intensification structure does not receive the restriction of temperature in the car, still can play the effect of refrigeration dehumidification and intensification under the low temperature environment in the car, the cold side can dehumidify the air current that admits air, the hot side can heat the air current that admits air, in order to promote the car interior temperature rapidly, satisfy the endothermic demand of evaporimeter, promote the air conditioner efficiency of heating, whole low temperature environment adaptability is good, stability is good, the reliability problem that long-time work brought under the compressor low temperature has been avoidd, whole system's energy consumption can also be reduced.

Description

Dehumidification intensification structure, air conditioning box and vehicle

Technical Field

The application relates to the technical field of vehicle-mounted air conditioning systems, in particular to a dehumidification warming structure, an air conditioning box and a vehicle.

Background

The current pure electric vehicles mainstream air conditioning case contains evaporimeter, warm braw core structure, and wherein the evaporimeter is used for refrigerating, and the warm braw core is used for heating. In order to improve the driving range of the pure electric vehicle in the low-temperature environment, the dehumidification reheating air-conditioning system is generated at the same time, and the heating power consumption is greatly reduced through internal circulation dehumidification and heating in the low-temperature environment.

However, the existing dehumidification reheating system has the following disadvantages: (1) Under the condition of low-temperature heating, the temperature in the vehicle needs a period of time to rise, and the internal circulation air inlet temperature is low due to the low temperature in the vehicle before the target temperature is reached, so that the heat absorption of an evaporator is insufficient, the working cycle of an air conditioning system is difficult to establish, and the dehumidification and anti-fogging functions cannot be formed; (2) Because the ambient temperature is lower, the compressor is difficult to guarantee its reliability of long-time work at low temperature, can cause the compressor to get into the shutdown protection state and consequently lose the dehumidification function when serious.

Therefore, how to rapidly raise the temperature in the vehicle under the low-temperature heating condition to meet the working temperature requirements of the evaporator and the compressor is an urgent problem to be solved.

SUMMERY OF THE UTILITY MODEL

In view of the above, an object of the present invention is to provide a dehumidification heating structure, an air conditioning box and a vehicle, so as to solve the problems of the background art.

In view of the above, the first aspect of the present application provides a dehumidification temperature rise structure, comprising: the semiconductor wafer comprises a cold side and a hot side, the cold sides of the semiconductor wafers are connected through at least one cold fin, the hot sides of the semiconductor wafers are connected through at least one hot fin, a gap between every two adjacent semiconductor wafers can serve as an airflow channel, airflow contained by the airflow channel sequentially flows through the cold side and the hot side, and the semiconductor wafers can be electrically connected with an external power supply.

Further, the cooling fin is provided with a plurality of, a plurality of the cooling fin interval sets up.

Further, the heat fins are provided with a plurality of heat fins which are arranged at intervals

Further, a plurality of the cold fins and a plurality of the hot fins are arranged in a staggered manner.

Further, the cold fins and/or the hot fins are one or more of wave-shaped structures, strip-shaped structures and sheet-shaped structures.

Further, the cold fin and/or the hot fin are/is of a wavy structure made of a metal material.

Based on same technical concept, this application second aspect provides an air conditioning box, along the air inlet direction in proper order the interval set up evaporimeter, above-mentioned first aspect arbitrary dehumidification intensification structure, heater.

Furthermore, the cold fins of the dehumidification heating structure are arranged close to the evaporator, and the hot fins of the dehumidification heating structure are arranged close to the heater.

Further, still include the air-blower, the air-blower sets up in the evaporimeter is kept away from the dehumidification intensification structure one side.

Based on the same technical concept, a third aspect of the present application provides a vehicle equipped with the air conditioning box of any one of the second aspects.

From the above, according to the dehumidification warming structure, the air conditioning box and the vehicle provided by the application, the work of the dehumidification warming structure is not limited by the temperature in the vehicle, the refrigeration, the dehumidification and the warming can be still realized in a low-temperature environment in the vehicle, the gap between two adjacent semiconductors can be used as an air flow channel, the air flow channel can contain air flow to sequentially flow through the cold side and the hot side, when the air flow flows through the cold side, the cold side can condense water vapor in the air flow to dehumidify the air flow, and when the air flow continuously flows through the hot side, the air flow can absorb heat emitted by the hot side, so that the temperature of the air flow is increased, the temperature in the vehicle is rapidly increased, the heat absorption requirement of an evaporator is met, and the heating efficiency of the air conditioner is improved;

the plurality of semiconductor sheets arranged at intervals provide space for airflow to pass through, the cold fins can transfer cold energy of a cold side to the airflow flowing through the cold fins so as to quickly remove moisture in the airflow and achieve a dehumidification effect, the hot fins can transfer heat of a hot side to the airflow flowing through the hot fins so as to quickly heat the air and achieve a heating effect, and the whole low-temperature environment has good adaptability and good stability;

the dehumidification and temperature rise structure has good dehumidification and rapid temperature rise effects, and can be used in a dehumidification and reheating system of an air conditioner for a vehicle to quickly raise the temperature in the vehicle, so that the reliability problem caused by long-time operation of a compressor at low temperature is avoided, and the energy consumption of the whole system can be reduced.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of a conventional dehumidification-reheat air conditioning system;

FIG. 2 is a schematic perspective view of a dehumidification temperature rise structure according to an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a side of the dehumidification heating structure facing the air inlet according to an embodiment of the present application;

FIG. 4 is a side view of a dehumidification temperature increase structure according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of an air conditioning cabinet according to an embodiment of the present application;

FIG. 6 is another schematic structural diagram of an air conditioning cabinet according to an embodiment of the present application;

fig. 7 is a system architecture diagram of an air conditioning cabinet applied to a dehumidification and reheating system of a vehicle air conditioner according to an embodiment of the present application.

In the figure: 001. an air conditioning compressor; 002. an electronic three-way valve; 003. a first condenser; 004. a condensing fan; 005. an air conditioner side heat expansion valve; 006. an air conditioner blower; 007. an air conditioning evaporator; 008. a second condenser; 009. an air conditioning heater; 0010. a battery-side expansion valve; 0011. a battery-side heat exchanger; 0012. a liquid storage tank;

1. a dehumidification and temperature rise structure; 11. a semiconductor wafer; 111. a cold side; 1111. a cold fin; 112. a hot side; 1121. a heat fin; 2. an evaporator; 3. a heater; 4. a blower; 5. an air conditioning cabinet; 6. a compressor; 7. a third condenser; 8. a third condensing fan; 9. a second air conditioner-side thermal expansion valve; 10. a second battery-side expansion valve; 12. a battery side heat exchanger.

Detailed Description

In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.

Referring to fig. 1, the conventional dehumidifying reheat air conditioning system generally includes an air conditioner compressor 001, an electronic three-way valve 002, a first condenser 003, a condensing fan 004, an air conditioner-side heat expansion valve 005, an air conditioner blower 006, an air conditioner evaporator 007, a second condenser 008, an air conditioner heater 009, a battery-side expansion valve 0010, a battery-side heat exchanger 0011 and a liquid storage tank 0012. The air conditioner blower 006, the air conditioner evaporator 007, the second condenser 008 and the air conditioner heater 009 are all located in an air conditioner box. In the dehumidification reheating mode, an internal and external circulation air door of the air conditioning box is switched to an internal circulation. At this time, the refrigerant flows out of the air conditioner compressor 001, sequentially flows through the electronic three-way valve 002, the second condenser 008, the air conditioner side thermal expansion valve 005, the air conditioner evaporator 007 and the liquid storage tank 0012, then flows back to the air conditioner compressor 001, dehumidifies the intake air flow entering the air conditioner box through the air conditioner evaporator 007, absorbs the compression work of the air conditioner compressor 001 and the heat absorption of the air conditioner evaporator 007 through the second condenser 008, and finally heats the intake air flow through the air conditioner heater 009 to supplement the heat required by heating.

However, as described in the background, such dehumidification and reheat systems have some disadvantages. For example, under low temperature heating conditions, it takes a while for the temperature in the vehicle to rise, and the temperature of the intake air of the internal cycle is low due to the low temperature in the vehicle before the target temperature is reached, so that the heat absorption of the air conditioner evaporator 007 is insufficient, it is difficult to establish the working cycle of the air conditioning system, and the dehumidification and anti-fogging function cannot be formed.

Based on the above problem, the application provides a dehumidification intensification structure 1, air conditioning box 5 and vehicle to realize the quick rise of temperature in the car under the low temperature heating condition, with the operating temperature demand that satisfies evaporimeter 2.

The following further describes embodiments of the present application with reference to the drawings.

Referring to fig. 2, 3 and 4, a first aspect of the present application provides a dehumidification temperature rising structure 1, including: the semiconductor device comprises a plurality of spaced apart semiconductor wafers 11, wherein the semiconductor wafers 11 comprise a cold side 111 and a hot side 112, the cold sides 111 of the semiconductor wafers 11 are all connected by at least one cold fin 1111, the hot sides 112 of the semiconductor wafers 11 are all connected by at least one hot fin 1121, a gap between two adjacent semiconductor wafers 11 can be used as an air flow channel, the air flow channel can allow air flow to sequentially flow through the cold side 111 and the hot side 112, and the semiconductor wafers 11 can be electrically connected with an external power supply.

Specifically, the semiconductor chip 11 may also be referred to as a semiconductor chilling plate, the semiconductor chip 11 is a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material, when the semiconductor chip 11 is electrically connected to an external power source, and when current flows through the semiconductor chip 11, heat transfer occurs between two sides of the semiconductor chip 11, and the heat is transferred from one side to the other side, so that a temperature difference is generated to form the cold side 111 and the hot side 112.

In this application, adopt the semiconductor wafer 11 that a plurality of intervals set up, the cold side 111 of a plurality of semiconductor wafers 11 is located same one side, and the cold side 111 of a plurality of semiconductor wafers 11 forms the cold junction of whole dehumidification intensification structure 1, and the hot side 112 of a plurality of semiconductor wafers 11 forms the hot junction of whole dehumidification intensification structure 1 simultaneously, and then can promote the dehumidification intensification effect of dehumidification intensification structure 1. The semiconductor wafers 11 are arranged at intervals, so that heat dissipation or cold dissipation spaces are formed around each semiconductor wafer 11, and the cold and heat of the semiconductor wafers 11 can be fully utilized.

The cold sides 111 of a plurality of the semiconductor wafers 11 are each connected by at least one cold fin 1111, which 1111 may function to connect and support a plurality of the semiconductor wafers 11. In actual operation, cold energy of the semiconductor cold side 111 is transferred to the cold fins 1111 and then transferred to external air or air flow passing through the cold fins 1111, so that water vapor in the air or the air flow is condensed on the surfaces of the cold side 111 and the cold fins 1111 to achieve the dehumidification effect. One or more cooling fins 1111 may be provided, and the specific number of the cooling fins 1111 is determined according to actual requirements and is not limited herein.

The hot sides 112 of a plurality of the semiconductor wafers 11 are each connected by at least one thermal fin 1121. The heat fins 1121 may function to connect and support a plurality of the semiconductor fins 11. In actual operation, the heat of the hot side 112 of the semiconductor is transferred to the thermal fins 1121, and then transferred to the external air or the airflow flowing through the thermal fins 1121, so that the air or the airflow can absorb the heat of the hot side 112 and the surfaces of the thermal fins 1121 to achieve the purpose of temperature rise, the heat of the hot side 112 and the surfaces of the thermal fins 1121 are fully utilized, and the effect of energy saving is achieved. One or more heat fins 1121 may be provided, and the specific number of the heat fins is determined according to actual requirements, which is not limited herein.

The dehumidification heating structure 1 provided by the application is free from the limitation of the ambient temperature in operation, and is suitable for being used as a dehumidification structure in an automobile air conditioning box 5. During specific implementation, the dehumidification heating structure 1 is arranged in the automobile air conditioning box 5, the cold side 111 of the dehumidification heating structure 1 faces the wind, and the hot side 112 faces the back. In a heating state in winter, an air inlet air door of the air conditioning box 5 rotates to an inner circulation position, semiconductor wafers 11 of the dehumidification and temperature rise structure 1 are all powered on, at the moment, the dehumidification and temperature rise structure 1 works normally, the temperature of a cold side 111 (namely a windward side) is rapidly reduced, and the temperature of a hot side 112 (namely a leeward side) is increased. The air flow in the vehicle flows in from the cold side 111 of the dehumidification and temperature rise structure 1, the water vapor contained in the intake air flow is condensed on the surfaces of the cold side 111 and the cold fins 1111 to achieve the dehumidification effect, the cooled air flow continuously flows to the hot side 112, and the air flow absorbs the heat on the surfaces of the hot side 112 and the hot fins 1121 to further raise the temperature. If the heated airflow can not meet the temperature requirement, the heated airflow continuously flows through other heating devices, is heated to the target temperature, and is blown out of the air conditioning box 5.

The application provides a dehumidification intensification structure 1 does not receive the restriction of the interior temperature of car, still can play the effect of refrigeration dehumidification and intensification under the low temperature environment in the car, and cold side 111 can dehumidify the air current that admits air, and hot side 112 can heat the air current that admits air to promote the interior temperature of car rapidly. Meanwhile, the plurality of semiconductor wafers 11 arranged at intervals provide space for airflow to pass through, the cold fins 1111 can transfer cold energy of the cold side 111 to the airflow flowing through the cold fins 1111 so as to rapidly remove water vapor in the airflow and achieve a dehumidification effect, the hot fins 1121 can transfer heat of the hot side 112 to the airflow flowing through the hot fins 1121 so as to rapidly heat the air and achieve a heating effect, the low-temperature environment has good adaptability and good stability, and the heat of the hot side 112 of the semiconductor wafers 11 can be absorbed, so that an energy-saving effect is achieved.

In some embodiments, the cooling fins 1111 are provided in plurality, and the cooling fins 1111 are arranged at intervals.

Specifically, a plurality of cold fin 1111 distribute uniformly the cold junction of dehumidification intensification structure 1 can transmit away whole dehumidification intensification structure 1's cold volume uniformly, and make full use of cold volume promotes dehumidification efficiency, avoids cold fin 1111 to concentrate on a certain position, causes the unable quick transmission of the position cold volume of not laying cold fin 1111 to go out. The plurality of cooling fins 1111 may have the same or different shape, size, thickness, etc., and are not limited thereto.

When the number of the cold fins 1111 is plural, the number of the hot fins 1121 may be plural, or may be one, and the specific number is determined according to actual requirements, and is not limited herein.

In some embodiments, the heat fins 1121 are provided in plural numbers, and the heat fins 1121 are spaced apart from each other.

Specifically, the plurality of heat fins 1121 are uniformly distributed at the hot end of the dehumidification heating structure 1, so that the heat of the whole dehumidification heating structure 1 can be uniformly transferred out, the heat is fully utilized, and the heat is prevented from being concentrated at a certain position, so that the heat at the position where the heat fins 1121 are not arranged cannot be rapidly transferred out. The plurality of thermal fins 1121 may be identical or different in shape, size, thickness, and the like, and are not limited thereto.

When there are multiple heat fins 1121, there may be multiple cold fins 1111, or there may be one cold fin 1111, and the specific number of cold fins is determined according to actual needs, which is not limited herein.

In some embodiments, the plurality of cold fins 1111 and the plurality of hot fins 1121 are staggered.

Specifically, when the plurality of heat fins 1121 are provided and the plurality of cold fins 1111 are also provided, the plurality of cold fins 1111 and the plurality of heat fins 1121 are arranged in a staggered manner, so that the cold energy and the heat energy of the dehumidification temperature rise structure 1 can be uniformly transferred, and the cold energy or the heat energy at certain positions can not be rapidly transferred.

In some embodiments, the cold fins 1111 and/or the hot fins 1121 are one or more of a wave structure, a stripe structure, and a sheet structure.

Specifically, the cold fins 1111 and/or the hot fins 1121 have one or more of a wave-shaped structure, a strip-shaped structure and a sheet-shaped structure. In practical implementation, the shapes and sizes of the cold fins 1111 and the hot fins 1121 are determined according to actual requirements, and are not limited herein.

In some embodiments, the cold fins 1111 and/or the hot fins 1121 are wavy structures made of a metal material.

Specifically, the cold fins 1111 and/or the hot fins 1121 are made of a metal material, and further, the cold fins 1111 and/or the hot fins 1121 are made of a metal material with good heat dissipation performance, so that the heat dissipation performance or the cold dissipation performance of the cold fins 1111 or the hot fins 1121 can be improved. In this embodiment, the cold fins 1111 and the hot fins 1121 have a corrugated structure made of copper.

The cold fins 1111 and the hot fins 1121 are both wave-shaped structures. Under the condition of the same length, the surface area of the wave-shaped structure is larger, the heat dissipation or cold dissipation area is larger, and the dehumidification effect and the temperature rise effect of the dehumidification and temperature rise structure 1 can be improved.

Based on the same technical concept, in combination with the description of the foregoing embodiments, the second aspect of the present application provides an air conditioning box 5, where the air conditioning box 5 has the corresponding technical effects of the foregoing embodiments, and details are not repeated here.

Referring to fig. 5 and 6, a second aspect of the present application provides an air conditioning box 5, in which an evaporator 2, a dehumidification temperature rising structure 1 of any one of the above first aspects, and a heater 3 are sequentially disposed at intervals along an air intake direction.

Specifically, the cold fins 1111 of the temperature-increasing and dehumidifying structure 1 are disposed close to the evaporator 2, and the hot fins 1121 of the temperature-increasing and dehumidifying structure 1 are disposed close to the heater 3.

In the specific implementation, in the heating state in winter, the air intake door of the air conditioning box 5 rotates to the internal circulation position, the semiconductor wafers 11 of the dehumidification heating structure 1 are all powered on, at this time, the dehumidification heating structure 1 works normally, the temperature of the cold side 111 (i.e., the side close to the evaporator 2) is rapidly reduced, and the temperature of the hot side 112 (i.e., the side far away from the evaporator 2) is increased. The air current in the car enters from the air inlet of the air-conditioning box 5, and passes through the evaporator 2, the dehumidification heating structure 1 and the heater 3 in sequence. The air flow flows in from the cold side 111 of the dehumidification and temperature rise structure 1, the water vapor contained in the intake air flow is condensed on the surfaces of the cold side 111 and the cold fins 1111 to achieve the dehumidification effect, the cooled air flow continuously flows to the hot side 112, and the air flow absorbs the heat on the surfaces of the hot side 112 and the hot fins 1121 to further raise the temperature. The airflow continues to flow to the heater 3, and the heater 3 heats the temperature of the airflow to a target temperature and blows the airflow out of the air conditioning box 5.

Air-conditioning box 5, owing to set up dehumidification intensification structure 1, promoted air-conditioning box 5's dehumidification effect to can utilize the heat of dehumidification intensification structure 1, play energy-conserving effect. Simultaneously, dehumidification intensification structure 1 can not receive microthermal influence in the car, and is quick dehumidifies and intensifies the temperature to the air current in the car, satisfies evaporimeter 2's heat absorption demand, promotes air conditioner heating efficiency.

In some embodiments, the dehumidifying and heating structure further comprises a blower 4, and the blower 4 is disposed on a side of the evaporator 2 away from the dehumidifying and heating structure 1. Specifically, the air blower 4 is arranged close to an air inlet of the air conditioning box 5, air flow in the vehicle enters from the air inlet, sequentially passes through the air blower 4, the evaporator 2, the dehumidification and temperature rise structure 1 and the heater 3, and is blown out from the air outlet after the purposes of dehumidification and temperature rise are achieved.

The dehumidification intensification structure 1 described in this application has good dehumidification and rapid heating's effect simultaneously, and its range of application is extensive. For example, it is applied to a dehumidification reheating system of a vehicle air conditioner, as shown with reference to fig. 7. The dehumidification and reheating system of the vehicle air conditioner includes a compressor 6, a third condenser 7, a third condensing fan 8, a second air conditioner-side heat expansion valve 9, an air conditioning box 5 described in the present application, a second battery-side expansion valve 10, and a second battery-side heat exchanger 12. In the dehumidification and reheating mode, the inside and outside circulation dampers of the air conditioning case 5 are switched to the inside circulation. At this time, the refrigerant flows out of the compressor 6, passes through the third condenser 7, the second air-conditioning-side thermal expansion valve 9, and the evaporator 2 in the air-conditioning box 5 in this order, and then flows back to the compressor 6. The dehumidification warming structure 1 in the air-conditioning box 5 can rapidly dehumidify and warm the air inlet flow entering the air-conditioning box 5, so that the heat absorption requirement of the evaporator 2 is met, and the dehumidification warming structure 1 in the air-conditioning box 5 can rapidly raise the temperature in the vehicle, so that the reliability problem caused by long-time working of the compressor 6 at low temperature is avoided, and the energy consumption of the whole system can be reduced.

Based on the same technical concept, in combination with the description of the foregoing embodiment, the third aspect of the present application provides a vehicle, where the air conditioning box 5 of any one of the foregoing second aspects is installed, and the vehicle has the corresponding technical effects of the foregoing embodiment, and is not described again here.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

Claims (10)

1. A dehumidification and temperature rise structure is characterized by comprising: the semiconductor wafer comprises a cold side and a hot side, the cold sides of the semiconductor wafers are connected through at least one cold fin, the hot sides of the semiconductor wafers are connected through at least one hot fin, a gap between every two adjacent semiconductor wafers can serve as an airflow channel, airflow contained by the airflow channel sequentially flows through the cold side and the hot side, and the semiconductor wafers can be electrically connected with an external power supply.

2. The dehumidifying heating structure as claimed in claim 1, wherein said cooling fin is provided in plurality, and a plurality of said cooling fins are provided at intervals.

3. The dehumidifying heating structure as claimed in claim 1, wherein said heat fin is provided in plurality, and a plurality of said heat fins are provided at intervals.

4. The structure of claim 1, wherein a plurality of said cold fins and a plurality of said hot fins are staggered.

5. The dehumidifying and heating structure of claim 1 wherein the cold fin and/or the hot fin is one or more of a wave-shaped structure, a strip-shaped structure and a sheet-shaped structure.

6. The dehumidifying heating structure as claimed in claim 1, wherein the cold fin and/or the hot fin is a corrugated structure made of a metal material.

7. An air conditioning cabinet, characterized in that, along the air inlet direction, an evaporator, the dehumidification temperature rising structure of any one of claims 1 to 6, and a heater are arranged at intervals in sequence.

8. An air conditioning cabinet as set forth in claim 7 wherein said cold fins of said temperature increasing and dehumidifying structure are disposed adjacent to said evaporator and said hot fins of said temperature increasing and dehumidifying structure are disposed adjacent to said heater.

9. An air conditioning cabinet as set forth in claim 7 further including a blower disposed on a side of said evaporator remote from said dehumidification warming structure.

10. A vehicle, characterized in that an air conditioning box according to any one of claims 7 to 9 is installed.

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